晶圓載體材料的全球市場2024年

晶圓載體材料市場正經歷顯著成長，預計將從 2022 年的 5 億美元成長到 2030 年的 8 億美元以上，複合年增長率約為 6%。半導體技術的不斷進步、消費性電子產品的使用不斷增加以及電子產品小型化的持續趨勢都促進了對晶圓處理組件的需求。

本報告提供晶圓搬送零件材料市場詳細評估，並深入探討以下幾點:

產品概要

主要晶圓搬送零件的功能主要的使用材料定義

• 晶圓pod
• 晶圓盒式錄音帶
• 晶圓船艇等

晶圓搬送零件的全球市場概要

全球晶圓傳輸組件市場的當前（2022 年）和預測（2030 年）見解，包括影響市場成長和材料選擇的主要趨勢和驅動因素分析

各材料類型的全球市場市場區隔

聚合物，金屬，陶瓷，複合材料等，所使用的主要各材料的全球市場市場區隔

化學惰性，剛性，含導電性等的參數相關之客戶迴響，材料選擇的主要選擇標準或性能參數

競爭概要:

主要的競爭企業的簡介和Entegris, Epak, Shin Etsu, Miraial, Gudeng Precision Industrial等15公司以上的競爭形勢分析。

專利概要:

過去4～5年主要的專利轉讓處的主要專利系列分析。還有專利的研究焦點，討論中的材料，相關應用相關洞察也包含。

市場展望:

在廣泛的二次和初步研究驗證的支持下，本報告還提供了對市場前景及其影響因素的權威看法。

目錄

第1章 簡介

• 報告概要
• 產品焦點
• 調查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蝕刻
• 摻雜
• CMP
• 切割
• 引線接合法
• 包裝

第3章 價值鏈概要

第4章 市場概要

第5章 詳細市場評估

• 晶圓載體

第5章 專利概要

第6章 市場展望

第7章 市場展望附錄

The Wafer Carrying Component materials market is poised for remarkable growth, projected to surpass USD 800 million by 2030, with a CAGR of approximately 6% from a value of USD 500 million in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for wafer-carrying components.

This report provides a deep-dive into the following points in this detailed assessment of the wafer-carrying component materials market

Product Overview

Defining the functions and the key materials used for major wafer-carrying components

• Wafers Pod
• Wafers Cassette
• Wafers Boat, etc.

Global Wafer Carrying Component Materials Market Overview

Insight into the current (2022) and forecasted (2030) global market for Wafer Carrying Component Materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used – Polymers, Metals, Ceramics, Composites, etc.

Key Selection criteria or Performance Parameters for material selection including voice of customer on parameters such as chemical inertness, stiffness, conductivity, etc.

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 15+ companies including Entegris, Epak, Shin Etsu, Miraial, Gudeng Precision Industrial, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration, and the associated applications.

Market Outlook:

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Wafer Carrier

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Wafer Carrier Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Wafer Carrier
• Table 6.1: Patent Publications by Geography - Wafer Carrier
• Table 6.2: Patent Listing - Wafer Carrier

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Wafer Carrier Materials Market
• Chart 5.1.2: Global Wafer Carrier Materials Market, By Material
• Chart 6.1: Patent Publication Trend - Wafer Carrier