晶圓基板的全球市場2024年

晶圓基板市場正在經歷顯著成長，預計將從 2022 年的 150 億美元增長到 2030 年的超過 250 億美元，複合年增長率約為 6.5%。半導體技術的不斷進步、消費性電子產品的使用不斷增加以及電子產品小型化的持續趨勢正在推動對晶圓基板的需求。

本報告提供晶圓基板市場詳細評估，並深入探討以下幾點:

產品概要

作為晶圓基板所使用的主要材料概要

• 矽
• 碳化矽
• 砷化鎵
• 氮化鎵等

晶圓基板的全球市場概要

晶圓基板的全球市場的現在(2022年)及預測(2030年)相關的洞察。對影響市場成長和材料選擇的主要趨勢和驅動因素的分析。

各材料類型的全球市場市場區隔

矽，矽碳化物，鎵砷，氮化鎵等，所使用的主要各材料的全球市場市場區隔

純度，缺陷率，每含晶片的成本等，客戶的迴響的材料選擇主要的選擇標準或性能參數

競爭概要:

分析Sumco、Siltronic、SK Siltron、Episil Precision、Soitec等10多家公司的主要競爭對手概況及競爭格局。

專利概要:

過去 4-5 年主要受讓人公司對超過 15 個專利族的分析。它還包括對專利研究重點、正在考慮的材料以及相關應用的見解。

市場展望

在廣泛的二次和初步研究驗證的支持下，本報告還提供了對市場前景及其影響因素的權威看法。

目錄

第1章 簡介

• 報告概要
• 產品焦點
• 調查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蝕刻
• 摻雜
• CMP
• 切割
• 引線接合法
• 包裝

第3章 價值鏈概要

第4章 市場概要

第5章 詳細市場評估

• 晶圓基板

第5章 專利概要

第6章 市場展望

第7章 市場展望附錄

The Wafer Substrate market is poised for remarkable growth, projected to surpass USD 25 billion by 2030, with a compelling CAGR of approximately 6.5% from a value of USD 15 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for Wafer Substrate.

This report provides a deep dive into the following points in this detailed assessment of Wafer Substrate Market:

Product Overview

Overview of key materials used as wafer substrate:

• Silicon
• Silicon Carbide
• Gallium Arsenide
• Gallium Nitride, etc.

Global Wafer Substrate Market Overview

Insight into the current (2022) and forecasted (2030) global market for Wafer Substrate including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used – Silicon, Silicon Carbide, Gallium Arsenide, Gallium Nitride, etc.,

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Purity, Defect Rate, Cost per chip, etc.

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 10+ companies including Sumco, Siltronic, SK Siltron, Episil Precision, Soitec, etc.

Patent overview:

Analyzing about 15+ patent families by key assignees in the last 4-5 years. Report also includes insights on the research focus of the patents, materials under consideration and the associated applications.

Market outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Wafer Substrate

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Wafer Substrate Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Wafer Substrate
• Table 6.1: Patent Publications by Geography - Wafer Substrate
• Table 6.2: Patent Listing - Wafer Substrate

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Wafer Substrate Market
• Chart 5.1.2: Global Wafer Substrate Market, By Material
• Chart 6.1: Patent Publication Trend - Wafer Substrate