光罩材料的全球市場2024

光掩模市場正在經歷顯著成長，預計將從 2022 年的 20 億美元增長到 2030 年的超過 30 億美元，複合年增長率約為 5%。半導體技術的不斷進步、消費性電子產品的使用增加以及電子產品小型化的持續趨勢都促進了對光掩模材料的需求。

本報告提供光罩材料市場詳細評估，並深入探討以下幾點:

產品概要

光罩材料所使用的主要材料概要

• 石英
• 鈉鹽石灰

光罩材料的全球市場概要

混雜光罩的全球市場的現狀(2022年)與預測(2030年)相關資料，市場趨勢與推動因素的分析解說。

各材料類型全球市場市場區隔

所使用的主要各材料的全球市場市場區隔-石英，鈉鹽石灰

材料選擇的關鍵選擇標準或性能參數，包括客戶對圖案保真度、缺陷密度和對準精度等參數的回饋

競爭概要:

主要的競爭企業的簡介和SK-Electronics, Toppan Photomask, 廈門 Powerway Advanced Material, Nippon Filcon, KLA Corporation等10公司以上的競爭形勢分析。

專利概要:

過去4-5年主要的專利轉讓處的主要專利系列分析。還有專利的研究焦點，討論中的材料，相關應用相關洞察也包含。

市場展望

在廣泛的二次和初步研究驗證的支持下，本報告還提供了對市場前景及其影響因素的權威看法。

目錄

第1章 簡介

• 報告概要
• 產品焦點
• 調查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蝕刻
• 摻雜
• CMP
• 切割
• 引線接合法
• 包裝

第3章 價值鏈概要

第4章 市場概要

第5章 詳細市場評估

• 光罩

第5章 專利概要

第6章 市場展望

第7章 市場展望附錄

The Photomask market is poised for remarkable growth, projected to surpass USD 3 billion by 2030, with a CAGR of approximately 5% from a value of USD 2 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for photomask materials

This report provides a deep-dive into the following points in this detailed assessment of the Photomask materials market:

Product Overview

Overview on the key materials used as photomask material:

• Quartz
• Soda Lime

Global Photomask Materials Market Overview

Insight on current (2022) and forecasted (2030) global market for Photomask including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used – Quartz, Soda Lime.

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Pattern Fidelity, Defect density, Alignment accuracy, etc.

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 10+ companies including SK-Electronics, Toppan Photomask, Xiamen Powerway Advanced Material, Nippon Filcon, KLA Corporation, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration and the associated applications

Market outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Photomask

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Photomask Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Photomask
• Table 6.1: Patent Publications by Geography - Photomask
• Table 6.2: Patent Listing - Photomask

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Photomask Materials Market
• Chart 5.1.2: Global Photomask Materials Market, By Material
• Chart 6.1: Patent Publication Trend - Photomask