切割膠帶材料的全球市場2024

切割膠帶市場經歷了顯著成長，預計到 2030 年將達到約 20 億美元，複合年增長率約為 6%，而 2022 年為 10 億美元。半導體技術的不斷進步、消費性電子產品的使用不斷增加以及電子產品小型化的持續趨勢都促進了對切割膠帶的需求。

本報告提供切割膠帶材料市場詳細評估，並深入探討以下幾點:

產品概要

切割膠帶的功能定義

• UV硬化型切割膠帶
• 非UV硬化型切割膠帶等

切割膠帶的全球市場概要

切割膠帶材料的現在(2022年)與預測(2030年)的全球市場相關洞察。包括對影響市場成長和材料選擇的主要趨勢和驅動因素的分析。

全球市場的各材料類型市場區隔

主要切割膠帶全球市場細分化:UV硬化型切割膠帶，非UV硬化型切割膠帶等

剝離特性，粘著力，含均一性，一貫性等的參數相關之客戶迴響，材料選擇主要的選擇標準或性能參數

競爭概要:

主要的競爭企業的簡介和Nitto Denko, LINTEC, Furukawa Electric, Denka, Sumitomo Bakelite等的主要企業的競爭形勢的分析。

專利概要:

過去4-5年主要的轉讓處的主要專利系列的分析。還有專利的調查對象，也包含討論中的材料，相關用途相關洞察。

市場展望

在廣泛的二次和初步研究驗證的支持下，本報告還提供了對市場前景及其影響因素的權威看法。

目錄

第1章 簡介

• 報告概要
• 產品焦點
• 調查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蝕刻
• 摻雜
• CMP
• 切割
• 引線接合法
• 包裝

第3章 價值鏈概要

第4章 市場概要

第5章 詳細市場評估

• 切割膠帶

第5章 專利概要

第6章 市場展望

第7章 市場展望附錄

The Dicing tape market is poised for remarkable growth, projected to reach approximately USD 2 billion by 2030, with a compelling CAGR of approximately 6% from a value of USD 1 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for dicing tape.

This report provides a deep-dive into the following points in this detailed assessment of the Dicing tape materials market:

Product Overview

Defining the functions of the Dicing tape:

• UV Curable Dicing Tape
• Non-UV Curable Dicing Tape, etc.

Global Dicing Tape Market overview

Insight on current (2022) and forecasted (2030) global market for dicing tape materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key dicing tape – UV Curable Dicing Tape, Non-UV Curable Dicing Tape, etc

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Release Properties, Adhesion Strength, Uniformity, and Consistency

Competition overview:

Key competitor profiles and analyzing the competitor landscape of major companies including Nitto Denko, LINTEC, Furukawa Electric, Denka, Sumitomo Bakelite, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration and the associated applications.

Market Outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Dicing Tape

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Dicing Tape Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Dicing Tape
• Table 6.1: Patent Publications by Geography - Dicing Tape
• Table 6.2: Patent Listing - Dicing Tape

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Dicing Tape Materials Market
• Chart 5.1.2: Global Dicing Tape Materials Market, By Material
• Chart 6.1: Patent Publication Trend - Dicing Tape