2024 年全球引線框架材料市場

引線框架材料市場預計將經歷顯著成長，從 2022 年的 30 億美元增加到 2030 年的 45 億美元以上，複合年增長率約為 5%。半導體技術的不斷進步、消費性電子產品的使用不斷增加以及電子產品小型化趨勢的不斷增強，都促進了對引線框架材料的需求。

本報告透過深入研究以下幾點，對引線框架材料市場進行了詳細評估：

產品概要

引線框架主要材料定義

• 銅及銅合金
• 錢
• 鈀
• 銀
• 鉑
• 鋁
• 鐵鎳合金等

全球半導體封裝材料市場概況

對目前（2022 年）和預測（2030 年）全球引線框架材料市場的見解。包括對影響市場成長和材料選擇的主要趨勢和驅動因素的分析。

依材料類型劃分的全球市場細分

依所用關鍵材料劃分的全球市場細分 - 銅及銅合金、金、鋁、鈀、銀、鉑等。

材料選擇的關鍵選擇標準或性能參數，包括客戶對引線框架設計、熱管理、尺寸精度等參數的回饋。

競爭概況：

主要競爭對手概況及Mitsui High-tec, Inc, Shinko Electric Industries Co., Ltd, Chang Wah Technology Co., Ltd, Wiegel Tool Works, Inc, Seaki Precision Co.,Ltd等10餘家企業競爭態勢分析。

專利概述：

過去 4-5 年主要專利權人對主要同族專利的分析。它還包括對專利研究重點、正在考慮的材料以及相關應用的見解。

市場展望

該報告經過廣泛的二次和初步研究驗證，也對市場前景及其影響因素提供了權威的看法。

目錄

第一章簡介

• 報告概述
• 產品焦點
• 調查方法

第二章 流程概述

• 薄膜成型
• 光刻法
• 蝕刻
• 興奮劑
• 化學機械拋光
• 切塊
• 引線鍵合
• 打包

第三章價值鏈概述

第四章市場概況

第五章 詳細市場評估

• 引線框架

第五章 專利概述

第六章市場展望

第七章 市場展望 附錄

The Lead Frame materials market is poised for remarkable growth, projected to surpass USD 4.5 billion by 2030, with a compelling CAGR of approximately 5% from a value of USD 3 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for lead frame materials.

This report provides a deep-dive into the following points in this detailed assessment of lead frame materials market:

Product Overview

Defining the key materials used for lead frames:

• Copper & Copper alloys
• Gold
• Palladium
• Silver
• Platinum
• Aluminum
• Iron-nickel alloys, etc.

Global Semiconductor Packaging Materials Market overview

Insight on current (2022) and forecasted (2030) global market for Lead Frame Materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used – Copper & Copper alloys, Gold, Aluminum, Palladium, Silver, Platinum, etc.

Key Selection criteria or Performance Parameters for material selection including voice of customer on parameters such as Lead Frame Design, Thermal Management, Dimensional Accuracy, etc.

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 10+ companies including Mitsui High-tec, Inc, Shinko Electric Industries Co., Ltd, Chang Wah Technology Co., Ltd, Wiegel Tool Works, Inc, Seaki Precision Co.,Ltd, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The Report also includes insights on the research focus of the patents, materials under consideration and the associated applications.

Market outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Lead Frame

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Lead Frame Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Lead Frame
• Table 6.1: Patent Publications by Geography - Lead Frame
• Table 6.2: Patent Listing - Lead Frame

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Lead Frame Materials Market
• Chart 5.1.2: Global Lead Frame Materials Market, By Material
• Chart 6.1: Patent Publication Trend - Lead Frame