半導體製造研究回顧：2024 年

預計到 2029年終全球小晶片市場規模將從 2023 年的 53 億美元成長至 428 億美元，預測期間的複合年成長率為 41.9%。

全球薄膜和超薄膜市場規模預計將從 2023 年的 206 億美元成長到 2028年終的 388 億美元，複合年成長率為 13.5%。

預計到 2028年終全球物聯網晶片市場規模將達到 3,755 億美元，從 2022 年的 1,861 億美元成長至 14.3% 的複合年成長率。

本研究評論包括BCC Research在2024年發布的有關晶片、薄膜和超薄膜、物聯網晶片、高速資料轉換器和印刷基板的報告的亮點和摘錄，並提供了每個市場的全面概述、市場影響因素和市場機會的分析、法律制度、新興技術和技術發展趨勢、市場規模趨勢和預測，以及各個細分市場和地區的詳細分析。

目錄

第 1 章 簡介

• 研究審查範圍

2. 全球小晶片市場（SMC137A）

• 小晶片
• 市場展望
• 研究範圍
• 市場摘要
• 市場動態
• 新興技術
• 細分分析
• 區域分析
• 結論
• Chiplet市場概覽
• 市場推動要素
• 高效能運算
• 市場限制/挑戰
• 技術純熟勞工短缺
• 市場機會
• 持續投資半導體產業
• 監管狀態
• 北美洲
• 新興技術
• 異質整合
• 按處理器分類的 Chiplet 市場
• CPU
• 圖形處理單元
• 現場可程式閘陣列
• AI-ASIC 協處理器
• 申請處理單位
• Chiplet 市場按區域細分
• 北美洲
• 歐洲
• 亞太地區
• 世界其他地區

3. 世界薄膜及超薄膜市場、技術及材料（SMC057D）

• 薄膜和超薄膜
• 市場展望
• 研究範圍
• 市場摘要
• 技術進步與應用
• 市場動態與成長要素
• 未來趨勢和發展
• 細分分析
• 區域見解和新興市場
• 結論
• 薄膜和超薄膜市場概況
• 市場推動要素
• 全球製造業資本投資增加
• 市場限制
• 薄膜污染的影響
• 市場機會
• 技術進步和新產品開發
• 主要新興技術和市場趨勢
• 基於雷射的定向能量沉積
• 薄膜和超薄膜市場按材料細分
• 金屬
• 電介質
• 化合物
• 其他
• 薄膜和超薄膜市場按區域分類
• 北美洲
• 歐洲
• 亞太地區
• 世界其他地區
• 薄膜和超薄膜產業的永續性：ESG 視角
• 薄膜和超薄膜市場的關鍵 ESG 議題
• ESG績效分析
• ESG 在薄膜和超薄膜市場的現狀
• 全球薄膜和超薄膜市場的 ESG 實踐
• BCC的結語

第4章 全球物聯網晶片市場（SMC135A）

• 物聯網晶片
• 市場展望
• 研究範圍
• 市場摘要
• 物聯網晶片市場概覽
• 市場推動要素
• 對基於物聯網的車輛的需求不斷增加
• 市場限制
• 安全和隱私問題
• 市場機會
• 引進新興技術
• 物聯網晶片市場按最終用戶產業細分
• 衛生保健
• 消費性電子產品
• 車
• 建築自動化
• 產業
• 其他
• 物聯網晶片市場區域分佈
• 北美洲
• 歐洲
• 亞太地區
• 世界其他地區
• 物聯網晶片產業的永續性：ESG 視角
• 物聯網晶片市場的 ESG 議題
• 物聯網晶片：ESG 效能分析
• BCC的結語

第 5 章 高速資料轉換器：世界市場及成長預測（SMC136A）

• 高速資料轉換器
• 市場展望
• 市場摘要
• 技術進步與應用
• 高速資料轉換器的市場動態與成長要素
• 細分分析
• 區域見解和新興市場
• 結論
• 技術概述
• 高速資料轉換器的當前和未來市場概述
• 市場推動要素
• 醫學影像應用的興起
• 市場挑戰
• 低功耗、高速資料轉換器的開發
• 市場機會
• 自動駕駛汽車的興起
• 新興技術和發展
• 半導體技術的微型化與不斷改進
• 高速資料轉換器市場按類型細分
• 類比數位轉換器 (ADC)
• 數位類比轉換器 (DAC)
• 高速資料轉換器市場按地區細分
• 北美洲
• 歐洲
• 亞太地區
• 世界其他地區
• 高速資料轉換器產業的永續性：ESG 視角
• ESG績效分析
• 全球市場 ESG 現狀
• 高速資料轉換器市場的 ESG 實踐
• BCC的結語

第 6 章 印刷電路基板：技術與全球市場（SMC103D）

• 印刷基板
• 市場展望
• 研究範圍
• 市場摘要
• 技術進步與應用
• 印刷基板市場動態
• 細分分析
• 區域見解和新興市場
• 結論
• 當前和未來的市場
• 市場推動要素
• 擴大自動駕駛汽車 (AV) 和電動車的使用
• 市場挑戰
• 技術複雜性不斷增加，持續創新的壓力不斷增加
• 市場機會
• 軟性和穿戴式電子產品的進步
• 新興科技和趨勢
• 3D 列印
• 基板市場細分：按類型
• 單層
• 雙層
• 多層
• 高密度互連 (HDI)
• 基板市場區域分佈
• 北美洲
• 歐洲
• 亞太地區
• 世界其他地區
• PCB 產業永續性：ESG 視角
• PCB行業ESG現狀
• PCB 產業的 ESG 實踐
• BCC的結語

第7章 附錄

The global market for chiplets was valued at $5.3 billion in 2023 and is expected to reach $42.8 billion by the end of 2029, at a compound annual growth rate (CAGR) 41.9% from 2024 through 2029.

The global market for thin and ultrathin films is expected to grow from $20.6 billion in 2023 to $38.8 billion by the end of 2028, at a compound annual growth (CAGR) of 13.5% from 2023 to 2028.

The global market for Internet of Things (IoT) chips was valued at $186.1 billion in 2022 and is expected to reach $375.5 billion by the end of 2028, at a compound annual growth (CAGR) of 14.3% from 2023 to 2028.

Research Review Scope

This review report comprehensively analyzes key market trends, technological advancements, and emerging opportunities across various semiconductor segments. It covers the role of chiplets, high-speed data converters, Internet of Things (IoT) chips, printed circuit boards (PCBs), and thin/ultrathin films in next-generation electronics, emphasizing their impact on artificial intelligence (AI), high-performance computing (HPC), 5G technology, automotive applications including electric vehicles (EVs) and autonomous vehicles (AVs), and industrial automation.

Additionally, the review examines market drivers, challenges, growth forecasts, supply chain dynamics, geopolitical influences, and investment trends affecting semiconductor industry. It highlights the increasing demand for modular chiplet integration, IoT connectivity, high-speed data processing, and advanced PCB technologies while addressing regulatory, security, and sustainability challenges. This structured analysis offers valuable insights into the evolving semiconductor landscape and the critical factors driving its transformation .

Research Reviews from BCC Research provide market professionals with concise market coverage within a specific research category. This 2024 Semiconductor Manufacturing Research Review provides a sampling of the type of quantitative market information, analysis, and guidance that BCC Research has been developing since its inception in 1971 to help its customers make informed business decisions. This Research Review includes highlights and excerpts from the following reports published by BCC Research in 2024:

• SMC137A Global Chiplets Market
• SMC057D Global Markets, Technologies and Materials for Thin and Ultrathin Films
• SMC135A Global IoT Chips Market
• SMC136A High-speed Data Converters: Global Markets and Growth Forecast
• SMC103D Printed Circuit Boards: Technologies and Global Markets

After you survey the excerpts in this Research Review, we encourage you to follow up on these topics by checking out the full market research reports associated with each topic. BCC Research looks forward to serving your market intelligence needs in the future.

Table of Contents

Chapter 1 Foreword

• Research Review Scope

Chapter 2 Global Chiplets Market (SMC137A)

• Chiplets
• Market Outlook
• Scope of the Report
• Market Summary
• Market Dynamics
• Emerging Technologies
• Segmental Analysis
• Regional Analysis
• Conclusion
• Market Overview of Chiplets
• Market Driver
• High-Performance Computing
• Market Restraint/Challenge
• Shortage of Skilled Labor
• Market Opportunity
• Continuing Investment in the Semiconductor Industry
• Regulatory Landscape
• North America
• Emerging Technologies
• Heterogeneous Integration
• Market Breakdown of Chiplets by Processor
• CPUs
• Graphics Processing Units
• Field-Programmable Gate Arrays
• AI-ASIC Coprocessors
• Application Processing Units
• Market Breakdown of Chiplets by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World

Chapter 3 Global Markets, Technologies and Materials for Thin and Ultrathin Films (SMC057D)

• Thin and Ultrathin Films
• Market Outlook
• Scope of Report
• Market Summary
• Technological Advancements and Applications
• Market Dynamics and Growth Factors
• Future Trends and Developments
• Segmental Analysis
• Regional Insights and Emerging Markets
• Conclusion
• Market Overview of Thin and Ultrathin Films
• Market Driver
• Growing Global Fabrication Equipment Spending
• Market Restraint
• Implications of Thin-Film Contamination
• Market Opportunity
• Technological Advancements and New Product Development
• Key Emerging Technology and Market Trend
• Laser-Based Directed Energy Deposition
• Market Breakdown of Thin and Ultrathin Films by Material
• Metal
• Dielectric
• Compounds
• Others
• Market Breakdown of Thin and Ultrathin Films by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Sustainability in Thin and Ultrathin Films Industry: An ESG Perspective
• Key ESG Issues in Thin and Ultrathin Films Market
• ESG Performance Analysis
• Current Status of ESG in the Thin and Ultrathin Films Market
• ESG Practices in the Global Thin and Ultrathin Films Market
• Concluding Remarks from BCC Research

Chapter 4 Global IoT Chips Market (SMC135A)

• IoT Chips
• Market Outlook
• Scope of Report
• Market Summary
• Market Overview of IoT Chips
• Market Driver
• Growing Demand for IoT-based Vehicles
• Market Restraint
• Security and Privacy Concerns
• Market Opportunity
• Implementation of Emerging Technologies
• Market Breakdown of IoT Chips by End-use Industry
• Healthcare
• Consumer Electronics
• Automotive
• Building Automation
• Industrial
• Others
• Market Breakdown of IoT Chips by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Sustainability in IoT Chips Industry: An ESG Perspective
• ESG Issues in the IoT Chip Market
• IoT Chip ESG Performance Analysis
• Concluding Remarks from BCC Research

Chapter 5 High-speed Data Converters: Global Markets and Growth Forecast (SMC136A)

• High-speed Data Converters
• Market Outlook
• Market Summary
• Technological Advancements and Applications
• Market Dynamics and Growth Factors of High-speed Data Converters
• Segmental Analysis
• Regional Insights and Emerging Markets
• Conclusion
• Technology Overview
• Current and Future Market Overview of High-speed Data Converters
• Market Driver
• Widespread Adoption of Medical Imaging Applications
• Market Challenge
• Developing Low-Power High-Speed Data Converters
• Market Opportunity
• Rise of Autonomous Vehicles
• Emerging Technologies and Developments
• Miniaturization and Continuous Improvements in Semiconductor Technologies
• Market Breakdown of High-Speed Data Converters by Type
• A/D Converters (ADC)
• D/A Converters (DAC)
• Market Breakdown of High-Speed Data Converters by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Sustainability in High-Speed Data Converters Industry: An ESG Perspective
• ESG Performance Analysis
• Current Status of ESG in the Global Market
• ESG Practices in the High-Speed Data Converters Market
• Concluding Remarks from BCC Research

Chapter 6 Printed Circuit Boards: Technologies and Global Markets (SMC103D)

• Printed Circuit Boards
• Market Outlook
• Scope of Report
• Market Summary
• Technological Advances and Applications
• Market Dynamics of Printed Circuit Boards
• Segmental Analysis
• Regional Insights and Emerging Markets
• Conclusion
• Current and Future Market
• Market Driver
• Growing Use of Autonomous Vehicles (AVs) and EVs
• Market Challenge
• Increasing Technological Complexity and Pressure to Continuously Innovate
• Market Opportunity
• Advancements in Flexible and Wearable Electronics
• Emerging Technologies and Trends
• 3D Printing
• Market Breakdown of Printed Circuit Boards by PCB Type
• Single-layer
• Double-layer
• Multilayer
• High-density Interconnect (HDI)
• Market Breakdown of Printed Circuit Boards by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Sustainability in the PCB Industry: An ESG Perspective
• Status of ESG in the PCB Industry
• ESG Practices in the PCB Industry
• Concluding Remarks from BCC Research

Chapter 7 Appendix

• Methodology
• Analyst's Credentials

List of Tables

• Table 1 : Global Market for Chiplets, by Region, Through 2029
• Table 2 : Global Market for Chiplets, by Processor, Through 2029
• Table 3 : Global Market for Chiplets, by Region, Through 2029
• Table 4 : Global Market for Thin and Ultrathin Films, by Material, Through 2028
• Table 5 : Global Market for Thin and Ultrathin Films, by Material, Through 2028
• Table 6 : Global Market for Thin and Ultrathin Films, by Region, Through 2028
• Table 7 : Environmental Impact
• Table 8 : Social Impact
• Table 9 : Governance Impact
• Table 10 : Global Thin and Ultrathin Films Market, ESG Risk Ratings Metric, 2022
• Table 11 : Global Market for IoT Chips, by End-use Industry, Through 2028
• Table 12 : Global Market for IoT Chips, by End-use Industry, Through 2028
• Table 13 : Global Market for IoT Chips, by Region, Through 2028
• Table 14 : Environmental Metrics for the IoT Chip Market
• Table 15 : Social Metrics for the IoT Chip Market
• Table 16 : Governance Metrics for the IoT Chip Market
• Table 17 : Global Market for High-Speed Data Converters, by Type, Through 2029
• Table 18 : Global Market for High-Speed Data Converters, by Type, Through 2029
• Table 19 : Global Market Volume for High-Speed Data Converters, by Type, Through 2029
• Table 20 : Global Market for High-Speed Data Converters, by Region, Through 2029
• Table 21 : Global Market Volume for High-Speed Data Converters, by Region, Through 2029
• Table 22 : Environmental Metrics for the High-Speed Data Converters Market
• Table 23 : Social Metrics for the High-Speed Data Converters Market
• Table 24 : Governance Metrics for the High-Speed Data Converters Market
• Table 25 : ESG Risk Ratings Metric, by Company, 2022
• Table 26 : Global Market for Printed Circuit Boards, by PCB Type, Through 2029
• Table 27 : Global Market for PCBs, by PCB Type, Through 2029
• Table 28 : Global Market for PCBs, by Region, Through 2029
• Table 29 : ESG Risk Ratings, by Company, 2023

List of Figures

• Figure 1 : Global Market Shares of Chiplets, by Region, 2023
• Figure 2 : Emerging Chiplet Technologies
• Figure 3 : Global Market Shares of Chiplets, by Processor, 2023
• Figure 4 : Global Market Shares of Chiplets, by Region, 2023
• Figure 5 : Global Market Shares of Thin and Ultrathin Films, by Material, 2022
• Figure 6 : Front-End Fabrication Equipment Spending, 2020-2024
• Figure 7 : Global Market Shares of Thin and Ultrathin Films, by Material, 2022
• Figure 8 : Global Market Shares of Thin and Ultrathin Films, by Region, 2022
• Figure 9 : Global Market Shares of IoT Chips, by End-use Industry, 2022
• Figure 10 : Global Market Shares of IoT Chips, by End-use Industry, 2022
• Figure 11 : Global Market Shares of IoT Chips, by Region, 2022
• Figure 12 : Global Market Shares of High-Speed Data Converters, by Type, 2023
• Figure 13 : Global Market Shares of High-Speed Data Converters, by Type, 2023
• Figure 14 : Global Market Volume Shares of High-Speed Data Converters, by Type, 2022
• Figure 15 : Global Market Shares of High-Speed Data Converters, by Region, 2023
• Figure 16 : Global Market Volume Shares of High-Speed Data Converters, by Region, 2023
• Figure 17 : Global Market Shares of Printed Circuit Boards, by PCB Type, 2023
• Figure 18 : Global Market Shares of PCBs, by PCB Type, 2023
• Figure 19 : Global Market Shares of PCBs, by Region, 2023