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市場調查報告書
商品編碼
1584609

全球 IC 封裝焊球市場：按類型、應用、地區、趨勢分析、競爭格局、預測，2019-2030 年

Solder Ball in Integrated Circuit Packaging Market, By Type; By Application; By Region (North America, Europe, Asia Pacific, Latin America, Middle East and Africa ), Global Trend Analysis, Competitive Landscape & Forecast, 2019-2030
出版日期: | 出版商: Blueweave Consulting | 英文 470 Pages | 商品交期: 2-3個工作天內

價格
簡介目錄

至2030年，全球IC封裝用焊球市場將超過1,570億美元

由於微型電子設備中積體電路的需求增加、半導體製造的擴張、先進封裝、物聯網的快速採用和汽車電子應用，全球 IC 封裝焊球市場正在蓬勃發展。

領先的策略諮詢和市場研究公司 BlueWeave Consulting 在最近的一項研究中估計，2023 年全球 IC 封裝焊球市場規模將達到 753 億美元。 BlueWeave預測，在2024-2030年的預測期內，全球IC封裝用焊球市場規模將以11.20%的複合年成長率成長，到2030年將達到1572億美元。由於電子設備的小型化、半導體技術的進步、5G、物聯網和人工智慧的採用、溫度控管的增強以及汽車和消費電子領域不斷擴大的趨勢，需求不斷成長，推動了全球 IC 封裝焊球市場的發展。這些因素有助於實現可靠的電氣連接，並增加對 IC 封裝焊球的需求。

機會 - 對高性能電子設備的需求增加

由於 5G、AI（人工智慧）和 IoT（物聯網）的進步推動了對高性能電子設備的需求不斷成長，全球 IC 封裝焊球市場正在經歷快速成長。焊球對於將半導體裝置連接到印刷電路基板（PCB）以提高導熱性、電氣連接性和裝置效率至關重要，並且正在推動通訊、消費性電子和汽車行業的市場擴張。

地緣政治緊張局勢加劇對全球 IC 封裝焊球市場的影響

地緣政治緊張局勢的加劇可能會對全球焊球市場產生重大影響，導致供應鏈中斷、原料短缺以及晶片製造商的成本增加。主要樞紐之間的緊張局勢、不可預測的法規環境以及經濟放緩導致的需求波動可能會進一步限制市場成長和製造商的盈利。

BGA 應用領域引領全球 IC 封裝焊球市場

按應用分類，BGA（球柵陣列）領域在全球 IC 封裝焊球市場中佔有最大佔有率。 BGA因其高密度封裝和提供高效散熱的能力而被廣泛應用，使其適合先進的封裝電子產品。 BGA 在注重小型化和性能的消費性電子、IT、通訊和汽車產業的普及，增強了 BGA 的優勢。其他封裝技術，如晶片級封裝（CSP）和晶圓級晶片級封裝（WLCSP）也在成長，但仍無法與BGA的廣泛使用和市場佔有率相符。

競爭格局

全球IC封裝焊球市場競爭非常激烈，許多公司都在爭取更大的市場佔有率。這些公司正在利用各種策略，例如增加研發活動投資、併購、合資、聯盟、許可協議以及新產品和服務發布，以進一步鞏固其在全球IC封裝焊球市場的地位。

該報告的詳細分析提供了有關全球IC封裝焊球市場的成長潛力、未來趨勢和統計數據的資訊。它還涵蓋了推動市場總規模預測的因素。該報告致力於提供全球IC封裝焊球市場的最新技術趨勢以及產業見解，以幫助決策者做出策略決策。此外，我們也分析了市場的成長動力、挑戰和競爭力。

目錄

第1章 研究框架

第 2 章執行摘要

第3章 IC 封裝用焊球的全球市場洞察

  • 產業價值鏈分析
  • DROC分析
    • 生長促進因子
      • 電子設備的小型化
      • 半導體產業的成長
      • 電子設備在各行業的使用增加
    • 抑制因素
      • 環境問題
      • 成本壓力
    • 機會
      • 對高性能電子設備的需求不斷成長
      • 焊球製造的技術進步
    • 任務
      • 來自替代互連技術的競爭
      • 供應鏈中斷
  • 科技進步/最新趨勢
  • 法律規範
  • 波特五力分析

第4章全球IC封裝焊球市場：行銷策略

第5章全球IC封裝焊球市場：價格分析

第6章全球 IC 封裝焊球市場：區域分析

  • 全球 IC 封裝焊球市場，區域分析，2023 年
  • 全球IC封裝焊球市場、市場吸引力分析，2024-2030年

第7章 全球IC封裝用焊球市場概況

  • 2019-2030年市場規模及預測
    • 按金額
  • 市場佔有率及預測
    • 按類型
      • 鉛焊球
      • 無鉛焊球
    • 按申請
      • BGA
      • CSP,WLCSP
      • 其他
    • 按地區
      • 北美洲
      • 歐洲
      • 亞太地區 (APAC)
      • 拉丁美洲 (LATAM)
      • 中東和非洲 (MEA)

第8章 北美IC封裝焊球市場

  • 2019-2030年市場規模及預測
    • 按金額
  • 市場佔有率及預測
    • 按類型
    • 按申請
    • 按國家/地區
      • 美國
      • 加拿大

第9章歐洲IC封裝焊球市場

  • 2019-2030年市場規模及預測
    • 按金額
  • 市場佔有率及預測
    • 按類型
    • 按申請
    • 按國家/地區
      • 德國
      • 英國
      • 義大利
      • 法國
      • 西班牙
      • 比利時
      • 俄羅斯
      • 荷蘭
      • 其他歐洲國家

第10章亞太IC封裝焊球市場

  • 2019-2030年市場規模及預測
    • 按金額
  • 市場佔有率及預測
    • 按類型
    • 按申請
    • 按國家/地區
      • 中國
      • 印度
      • 日本
      • 韓國
      • 澳洲和紐西蘭
      • 印尼
      • 馬來西亞
      • 新加坡
      • 越南
      • 亞太地區其他地區

第11章拉丁美洲IC封裝焊球市場

  • 2019-2030年市場規模及預測
    • 按金額
  • 市場佔有率及預測
    • 按類型
    • 按申請
    • 按國家/地區
      • 巴西
      • 墨西哥
      • 阿根廷
      • 秘魯
      • 其他拉丁美洲

第12章 中東及非洲IC封裝焊球市場

  • 2019-2030年市場規模及預測
    • 按金額
  • 市場佔有率及預測
    • 按類型
    • 按申請
    • 按國家/地區
      • 沙烏地阿拉伯
      • 阿拉伯聯合大公國
      • 卡達
      • 科威特
      • 南非
      • 奈及利亞
      • 阿爾及利亞
      • 其他中東/非洲

第13章競爭格局

  • 主要參與者及其產品列表
  • 2023年全球IC封裝焊球企業市場佔有率分析
  • 透過管理參數進行競爭基準基準化分析
  • 重大策略發展（合併、收購、聯盟等）

第14章 地緣政治緊張局勢加劇對全球IC封裝焊球市場的影響

第15章 公司簡介（公司簡介、財務矩陣、競爭格局、關鍵人員、主要競爭對手、聯絡方式、策略展望、SWOT分析）

  • Amtech
  • Alpha Assembly Solutions
  • Kester Solder
  • Senju Metal
  • Taiyo Nippon Sanso
  • Kucera Corporation
  • Nippon Electric Glass
  • Showa Denko
  • Alent Technologies
  • Umicore
  • Indium Corporation
  • 其他主要企業

第16章 主要策略建議

第17章調查方法

簡介目錄
Product Code: BWC24766

Global Solder Ball in Integrated Circuit Packaging Market Set to Surpass USD 157 Billion by 2030

Global Solder Ball in Integrated Circuit Packaging Market is thriving due to a rising demand for integrated circuits in miniaturized electronic devices, expansion in semiconductor manufacturing, advancements in packaging, rapid adoption of IoT, and automotive electronics applications.

BlueWeave Consulting, a leading strategic consulting and market research firm, in its recent study, estimated Global Solder Ball in Integrated Circuit Packaging Market size by value at USD 75.30 billion in 2023. During the forecast period between 2024 and 2030, BlueWeave expects Global Solder Ball in Integrated Circuit Packaging Market size to expand at a CAGR of 11.20% reaching a value of USD 157.20 billion by 2030. Global Solder Ball in Integrated Circuit (IC) Packaging Market is expanding due to an increasing demand for miniaturized electronic devices, adoption of advancements in semiconductor technology, 5G, IoT, AI, enhanced thermal management, and growing trends in the automotive electronics and consumer electronics sector. These factors contribute to reliable electrical connections and increased demand for solder balls in IC packaging.

Opportunity - Rising Demand for High-Performance Electronic Devices

Global Solder Ball in Integrated Circuit (IC) Packaging Market is experiencing a surge in growth, due to an increasing demand for high-performance electronic devices, driven by advancements in 5G, AI (artificial intelligence), and IoT (Internet of Things). Solder balls are crucial for connecting semiconductor devices to PCBs (printed circuit boards), enhancing thermal conductivity, electrical connectivity, and device efficiency, driving market expansion in telecommunications, consumer electronics, and automotive industries.

Impact of Escalating Geopolitical Tensions on Global Solder Ball in Integrated Circuit Packaging Market

Escalating geopolitical tensions could significantly impact Global Solder Ball in Integrated Circuit Packaging Market, leading to supply chain disruptions, shortages of raw materials, and increased costs for chipmakers. Strained relations between major hubs, unpredictable regulatory environments, and fluctuating demand due to economic slowdowns could further limit market growth and profitability for manufacturers.

BGA Application Segment Leads Global Solder Ball in IC Packaging Market

Ball Grid Array (BGA) segment holds the largest share of Global Solder Ball in Integrated Circuit Packaging Market by application. BGA is widely used due to its ability to provide high-density packaging and efficient heat dissipation, making it suitable for advanced electronic devices. Its popularity in consumer electronics, telecommunications, and automotive industries, where miniaturization and performance are critical, drives its dominance. Other packaging technologies like Chip Scale Package (CSP) and Wafer Level Chip Scale Package (WLCSP) are growing but do not yet match BGA's widespread application and market share.

Competitive Landscape

Global Solder Ball in Integrated Circuit Packaging Market is fiercely competitive, with numerous companies vying for a larger market share. Major companies in the market include Amtech, Alpha Assembly Solutions, Kester Solder, Senju Metal, Taiyo Nippon Sanso, Kucera Corporation, Nippon Electric Glass, Showa Denko, Alent Technologies, Umicore, and Indium Corporation. These companies use various strategies, including increasing investments in their R&D activities, mergers and acquisitions, joint ventures, collaborations, licensing agreements, and new product and service releases to further strengthen their position in Global Solder Ball in Integrated Circuit Packaging Market.

The in-depth analysis of the report provides information about growth potential, upcoming trends, and statistics of Global Solder Ball in Integrated Circuit Packaging Market. It also highlights the factors driving forecasts of total market size. The report promises to provide recent technological trends in Global Solder Ball in Integrated Circuit Packaging Market and industry insights to help decision-makers make sound strategic decisions. Further, the report also analyzes the growth drivers, challenges, and competitive dynamics of the market.

Table of Contents

1. Research Framework

  • 1.1. Research Objective
  • 1.2. Product Overview
  • 1.3. Market Segmentation

2. Executive Summary

3. Global Solder Ball in Integrated Circuit Packaging Market Insights

  • 3.1. Industry Value Chain Analysis
  • 3.2. DROC Analysis
    • 3.2.1. Growth Drivers
      • 3.2.1.1. Miniaturization of Electronic Devices
      • 3.2.1.2. Growth in Semiconductor Industry
      • 3.2.1.3. Increasing Use of Electronic Devices in Various Industries
    • 3.2.2. Restraints
      • 3.2.2.1. Environmental Concerns
      • 3.2.2.2. Cost Pressures
    • 3.2.3. Opportunities
      • 3.2.3.1. Rising Demand for High-Performance Electronic Devices
      • 3.2.3.2. Technological Advancements in Solder Ball Production
    • 3.2.4. Challenges
      • 3.2.4.1. Competition from Alternative Interconnect Technologies
      • 3.2.4.2. Supply Chain Disruptions
  • 3.3. Technological Advancements/Recent Developments
  • 3.4. Regulatory Framework
  • 3.5. Porter's Five Forces Analysis
    • 3.5.1. Bargaining Power of Suppliers
    • 3.5.2. Bargaining Power of Buyers
    • 3.5.3. Threat of New Entrants
    • 3.5.4. Threat of Substitutes
    • 3.5.5. Intensity of Rivalry

4. Global Solder Ball in Integrated Circuit Packaging Market: Marketing Strategies

5. Global Solder Ball in Integrated Circuit Packaging Market: Pricing Analysis

6. Global Solder Ball in Integrated Circuit Packaging Market: Geographical Analysis

  • 6.1. Global Solder Ball in Integrated Circuit Packaging Market, Geographical Analysis, 2023
  • 6.2. Global Solder Ball in Integrated Circuit Packaging Market, Market Attractiveness Analysis, 2024-2030

7. Global Solder Ball in Integrated Circuit Packaging Market Overview

  • 7.1. Market Size & Forecast, 2019-2030
    • 7.1.1. By Value (USD Million)
  • 7.2. Market Share & Forecast
    • 7.2.1. By Type
      • 7.2.1.1. Lead Solder Balls
      • 7.2.1.2. Lead Free Solder Balls
    • 7.2.2. By Application
      • 7.2.2.1. BGA
      • 7.2.2.2. CSP & WLCSP
      • 7.2.2.3. Others
    • 7.2.3. By Region
      • 7.2.3.1. North America
      • 7.2.3.2. Europe
      • 7.2.3.3. Asia Pacific (APAC)
      • 7.2.3.4. Latin America (LATAM)
      • 7.2.3.5. Middle East and Africa (MEA)

8. North America Solder Ball in Integrated Circuit Packaging Market

  • 8.1. Market Size & Forecast, 2019-2030
    • 8.1.1. By Value (USD Million)
  • 8.2. Market Share & Forecast
    • 8.2.1. By Type
    • 8.2.2. By Application
    • 8.2.3. By Country
      • 8.2.3.1. United States
      • 8.2.3.1.1. By Type
      • 8.2.3.1.2. By Application
      • 8.2.3.2. Canada
      • 8.2.3.2.1. By Type
      • 8.2.3.2.2. By Application

9. Europe Solder Ball in Integrated Circuit Packaging Market

  • 9.1. Market Size & Forecast, 2019-2030
    • 9.1.1. By Value (USD Million)
  • 9.2. Market Share & Forecast
    • 9.2.1. By Type
    • 9.2.2. By Application
    • 9.2.3. By Country
      • 9.2.3.1. Germany
      • 9.2.3.1.1. By Type
      • 9.2.3.1.2. By Application
      • 9.2.3.2. United Kingdom
      • 9.2.3.2.1. By Type
      • 9.2.3.2.2. By Application
      • 9.2.3.3. Italy
      • 9.2.3.3.1. By Type
      • 9.2.3.3.2. By Application
      • 9.2.3.4. France
      • 9.2.3.4.1. By Type
      • 9.2.3.4.2. By Application
      • 9.2.3.5. Spain
      • 9.2.3.5.1. By Type
      • 9.2.3.5.2. By Application
      • 9.2.3.6. Belgium
      • 9.2.3.6.1. By Type
      • 9.2.3.6.2. By Application
      • 9.2.3.7. Russia
      • 9.2.3.7.1. By Type
      • 9.2.3.7.2. By Application
      • 9.2.3.8. The Netherlands
      • 9.2.3.8.1. By Type
      • 9.2.3.8.2. By Application
      • 9.2.3.9. Rest of Europe
      • 9.2.3.9.1. By Type
      • 9.2.3.9.2. By Application

10. Asia Pacific Solder Ball in Integrated Circuit Packaging Market

  • 10.1. Market Size & Forecast, 2019-2030
    • 10.1.1. By Value (USD Million)
  • 10.2. Market Share & Forecast
    • 10.2.1. By Type
    • 10.2.2. By Application
    • 10.2.3. By Country
      • 10.2.3.1. China
      • 10.2.3.1.1. By Type
      • 10.2.3.1.2. By Application
      • 10.2.3.2. India
      • 10.2.3.2.1. By Type
      • 10.2.3.2.2. By Application
      • 10.2.3.3. Japan
      • 10.2.3.3.1. By Type
      • 10.2.3.3.2. By Application
      • 10.2.3.4. South Korea
      • 10.2.3.4.1. By Type
      • 10.2.3.4.2. By Application
      • 10.2.3.5. Australia & New Zealand
      • 10.2.3.5.1. By Type
      • 10.2.3.5.2. By Application
      • 10.2.3.6. Indonesia
      • 10.2.3.6.1. By Type
      • 10.2.3.6.2. By Application
      • 10.2.3.7. Malaysia
      • 10.2.3.7.1. By Type
      • 10.2.3.7.2. By Application
      • 10.2.3.8. Singapore
      • 10.2.3.8.1. By Type
      • 10.2.3.8.2. By Application
      • 10.2.3.9. Vietnam
      • 10.2.3.9.1. By Type
      • 10.2.3.9.2. By Application
      • 10.2.3.10. Rest of APAC
      • 10.2.3.10.1. By Type
      • 10.2.3.10.2. By Application

11. Latin America Solder Ball in Integrated Circuit Packaging Market

  • 11.1. Market Size & Forecast, 2019-2030
    • 11.1.1. By Value (USD Million)
  • 11.2. Market Share & Forecast
    • 11.2.1. By Type
    • 11.2.2. By Application
    • 11.2.3. By Country
      • 11.2.3.1. Brazil
      • 11.2.3.1.1. By Type
      • 11.2.3.1.2. By Application
      • 11.2.3.2. Mexico
      • 11.2.3.2.1. By Type
      • 11.2.3.2.2. By Application
      • 11.2.3.3. Argentina
      • 11.2.3.3.1. By Type
      • 11.2.3.3.2. By Application
      • 11.2.3.4. Peru
      • 11.2.3.4.1. By Type
      • 11.2.3.4.2. By Application
      • 11.2.3.5. Rest of LATAM
      • 11.2.3.5.1. By Type
      • 11.2.3.5.2. By Application

12. Middle East & Africa Solder Ball in Integrated Circuit Packaging Market

  • 12.1. Market Size & Forecast, 2019-2030
    • 12.1.1. By Value (USD Million)
  • 12.2. Market Share & Forecast
    • 12.2.1. By Type
    • 12.2.2. By Application
    • 12.2.3. By Country
      • 12.2.3.1. Saudi Arabia
      • 12.2.3.1.1. By Type
      • 12.2.3.1.2. By Application
      • 12.2.3.2. UAE
      • 12.2.3.2.1. By Type
      • 12.2.3.2.2. By Application
      • 12.2.3.3. Qatar
      • 12.2.3.3.1. By Type
      • 12.2.3.3.2. By Application
      • 12.2.3.4. Kuwait
      • 12.2.3.4.1. By Type
      • 12.2.3.4.2. By Application
      • 12.2.3.5. South Africa
      • 12.2.3.5.1. By Type
      • 12.2.3.5.2. By Application
      • 12.2.3.6. Nigeria
      • 12.2.3.6.1. By Type
      • 12.2.3.6.2. By Application
      • 12.2.3.7. Algeria
      • 12.2.3.7.1. By Type
      • 12.2.3.7.2. By Application
      • 12.2.3.8. Rest of MEA
      • 12.2.3.8.1. By Type
      • 12.2.3.8.2. By Application

13. Competitive Landscape

  • 13.1. List of Key Players and Their Offerings
  • 13.2. Global Solder Ball in Integrated Circuit Packaging Company Market Share Analysis, 2023
  • 13.3. Competitive Benchmarking, By Operating Parameters
  • 13.4. Key Strategic Developments (Mergers, Acquisitions, Partnerships, etc.)

14. Impact of Escalating Geopolitical Tensions on Global Solder Ball in Integrated Circuit Packaging Market

15. Company Profiles (Company Overview, Financial Matrix, Competitive Landscape, Key Personnel, Key Competitors, Contact Address, Strategic Outlook, and SWOT Analysis)

  • 15.1. Amtech
  • 15.2. Alpha Assembly Solutions
  • 15.3. Kester Solder
  • 15.4. Senju Metal
  • 15.5. Taiyo Nippon Sanso
  • 15.6. Kucera Corporation
  • 15.7. Nippon Electric Glass
  • 15.8. Showa Denko
  • 15.9. Alent Technologies
  • 15.10. Umicore
  • 15.11. Indium Corporation
  • 15.12. Other Prominent Players

16. Key Strategic Recommendations

17. Research Methodology

  • 17.1. Qualitative Research
    • 17.1.1. Primary & Secondary Research
  • 17.2. Quantitative Research
  • 17.3. Market Breakdown & Data Triangulation
    • 17.3.1. Secondary Research
    • 17.3.2. Primary Research
  • 17.4. Breakdown of Primary Research Respondents, By Region
  • 17.5. Assumptions & Limitations

*Financial information of non-listed companies can be provided as per availability.

**The segmentation and the companies are subject to modifications based on in-depth secondary research for the final deliverable.