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市場調查報告書
商品編碼
1569407

全球晶圓背面研磨膠帶市場規模研究，按類型（UV 固化、非 UV）、晶圓尺寸（6 英寸、8 英寸、12 英寸、其他）以及 2022-2032 年區域預測

Global Wafer Backgrinding Tape Market Size Study, by Type (UV Curable, Non-UV), by Wafer Size (6-Inch, 8-Inch, 12-Inch, Others), and Regional Forecasts 2022-2032
出版日期: | 出版商: Bizwit Research & Consulting LLP | 英文 285 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2023年全球晶圓背磨膠帶市場價值約為2.3006億美元，預計在2024-2032年預測期內將以超過4.5%的健康成長率成長。晶圓背面研磨是關鍵的半導體製造步驟，對於減少晶圓厚度以實現積體電路的堆疊和高密度封裝至關重要。該工藝包括在組裝前研磨晶圓背面以達到所需的厚度，從而確保設備的緊湊性和性能。對晶圓製造的需求不斷成長以及研磨過程中對晶圓表面保護的日益關注正在推動市場的成長。此外，在智慧技術和設備興起的推動下，半導體產業不斷擴張，進一步推動了對晶圓背面研磨膠帶的需求。

晶圓製造需求的成長是半導體和資料中心市場成長的主要動力。隨著技術的進步和對電子設備（從智慧型手機到高效能運算系統）的需求的增加，對先進晶圓製造的需求也在增加。晶圓製造對於生產為這些設備供電的半導體晶片至關重要。然而，由於從非紫外線固化背面研磨膠帶轉向紫外線固化背面研磨膠帶，市場面臨挑戰，這往往會增加晶圓製造的總體成本，從而可能限制市場成長。儘管存在這些挑戰，但在晶圓製造設備和材料投資增加的推動下，市場仍將成長，特別是在中國、台灣和韓國等半導體產業快速發展的發展中地區。

全球晶圓背磨膠帶市場研究涵蓋的關鍵區域包括亞太地區、北美、歐洲、拉丁美洲、中東和非洲以及世界其他地區。就收入而言，亞太地區是全球晶圓背磨膠帶市場的主導地區。該地區市場的成長歸因於其廣泛的半導體製造業以及日本、韓國和中國等國家主要參與者的存在等因素。該地區成熟的電子產業和對半導體裝置的高需求推動了背磨膠帶的大量消耗，而背磨膠帶對於晶圓減薄製程至關重要。然而，由於技術進步和半導體研發投資增加，預計北美市場在預測期內將以最快的速度成長。美國在這​​一成長中處於領先地位，這得益於對高效能運算和電子產品的需求激增，這反過來又增加了對高效能晶圓背面研磨解決方案的需求。

目錄

第 1 章：全球晶圓背面研磨膠帶市場執行摘要

  • 全球晶圓背磨膠帶市場規模及預測（2022-2032）
  • 區域概要
  • 分部摘要
    • 按類型
    • 按晶圓尺寸
  • 主要趨勢
  • 經濟衰退的影響
  • 分析師推薦與結論

第 2 章：全球晶圓背面研磨膠帶市場定義與研究假設

  • 研究目的
  • 市場定義
  • 研究假設
    • 包含與排除
    • 限制
    • 供給側分析
      • 可用性
      • 基礎設施
      • 監管環境
      • 市場競爭
      • 經濟可行性（消費者的角度）
    • 需求面分析
      • 監理框架
      • 技術進步
      • 環境考慮
      • 消費者意識和接受度
  • 估算方法
  • 研究涵蓋的年份
  • 貨幣兌換率

第 3 章：全球晶圓背磨膠帶市場動態

  • 市場促進因素
    • 晶圓製造需求增加
    • 更重視研磨過程中晶圓表面的保護
    • 半導體產業的成長
  • 市場挑戰
    • 增加從非 UV 固化背面研磨膠帶帶到 UV 固化背面研磨膠帶的轉變
    • 與晶圓製造相關的高營運成本
  • 市場機會
    • 加大晶圓製造設備及材料投資
    • 印度和菲律賓等新興國家的機會不斷增加

第 4 章：全球晶圓背磨膠帶市場產業分析

  • 波特的五力模型
    • 供應商的議價能力
    • 買家的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭競爭
    • 波特五力模型的未來方法
    • 波特的 5 力影響分析
  • PESTEL分析
    • 政治的
    • 經濟
    • 社會的
    • 技術性
    • 環境的
    • 合法的
  • 頂級投資機會
  • 最佳制勝策略
  • 顛覆性趨勢
  • 產業專家視角
  • 分析師推薦與結論

第 5 章：全球晶圓背磨膠帶市場規模與預測：按類型 - 2022-2032

  • 細分儀表板
  • 全球晶圓背磨膠帶市場：類型收入趨勢分析，2022 年和 2032 年
    • 紫外線固化
    • 非紫外線

第 6 章：全球晶圓背磨膠帶市場規模與預測：依晶圓尺寸 - 2022-2032

  • 細分儀表板
  • 全球晶圓背磨膠帶市場：2022 年和 2032 年晶圓尺寸收入趨勢分析
    • 6吋
    • 8寸
    • 12英吋
    • 其他

第 7 章：全球晶圓背磨膠帶市場規模及預測：按地區 - 2022-2032

  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 西班牙
    • 義大利
    • 歐洲其他地區
  • 亞太
    • 中國
    • 印度
    • 日本
    • 澳洲
    • 韓國
    • 亞太地區其他地區
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地區
  • 中東和非洲
    • 沙烏地阿拉伯
    • 南非
    • 中東和非洲其他地區

第 8 章：競爭情報

  • 重點企業SWOT分析
  • 頂級市場策略
  • 公司簡介
    • AI Technology Inc.
      • 關鍵訊息
      • 概述
      • 財務（視數據可用性而定）
      • 產品概要
      • 市場策略
    • Furukawa Electric Co. Ltd.
    • AMC Co. Ltd.
    • Denka Company Limited
    • Pantech Tape Co. Ltd.
    • Force-One Applied Materials
    • Minitron Elektronik GmbH
    • Nitto Denko Corporation
    • Mitsui Chemicals Inc.
    • Lintec of America Inc. (Lintec Corporation)
    • Sumitomo Bakelite
    • Ultron Systems
    • Nippon Pulse Motor
    • Loadpoint Limited
    • NEPTCO

第 9 章：研究過程

  • 研究過程
    • 資料探勘
    • 分析
    • 市場預測
    • 驗證
    • 出版
  • 研究屬性
簡介目錄

Global Wafer Backgrinding Tape Market is valued at approximately USD 230.06 Million in 2023 and is anticipated to grow with a healthy growth rate of more than 4.5% over the forecast period 2024-2032. Wafer backgrinding is a crucial semiconductor fabrication step, essential for reducing wafer thickness to enable stacking and high-density packaging of integrated circuits. This process involves grinding the backside of the wafer to achieve the desired thickness before assembly, ensuring the device's compactness and performance. The growing demand for wafer fabrication and the increased focus on wafer surface protection during the grinding process are driving the market's growth. Additionally, the expanding semiconductor industry, propelled by the rise in smart technologies and devices, further fuels the demand for wafer backgrinding tapes.

The rise in the need for wafer fabrication is a major driver for growth in the semiconductor and data center markets. As technology advances and demand for electronic devices, from smartphones to high-performance computing systems, increases so does the need for advanced wafer fabrication. Wafer fabrication is crucial for producing the semiconductor chips that power these devices. However, the market faces challenges due to the shift from non-UV to UV curable backgrinding tapes, which tends to increase the overall cost of wafer manufacturing, potentially restraining market growth. Despite these challenges, the market is poised to grow, driven by increasing investments in wafer fabrication equipment and materials, particularly in developing regions such as China, Taiwan, and South Korea, where the semiconductor industry is rapidly advancing.

The key regions considered for the Global Wafer Backgrinding Tape Market study include Asia Pacific, North America, Europe, Latin America, Middle East & Africa, and Rest of the World. Asia Pacific is a dominating region in the Global Wafer Backgrinding Tape Market in terms of revenue. The market growth in the region is being attributed to factors including its extensive semiconductor manufacturing industry and the presence of major players in countries like Japan, South Korea, and China. The region's established electronics sector and high demand for semiconductor devices drive significant consumption of backgrinding tape, which is essential for wafer thinning processes. Whereas, the market in North America is anticipated to grow at the fastest rate over the forecast period fueled by advancements in technology and increasing investments in semiconductor research and development. The U.S. is leading this growth, supported by a surge in demand for high-performance computing and electronics, which in turn boosts the need for efficient wafer backgrinding solutions.

Major market player included in this report are:

  • AI Technology Inc.
  • Furukawa Electric Co. Ltd.
  • AMC Co. Ltd.
  • Denka Company Limited
  • Pantech Tape Co. Ltd.
  • Force-One Applied Materials
  • Minitron Elektronik GmbH
  • Nitto Denko Corporation
  • Mitsui Chemicals Inc.
  • Lintec of America Inc. (Lintec Corporation)
  • Sumitomo Bakelite
  • Ultron Systems
  • Nippon Pulse Motor
  • Loadpoint Limited
  • NEPTCO

The detailed segments and sub-segment of the market are explained below:

By Type

  • UV Curable
  • Non-UV

By Wafer Size

  • 6-Inch
  • 8-Inch
  • 12-Inch
  • Others

By Region:

  • North America
  • U.S.
  • Canada
  • Europe
  • UK
  • Germany
  • France
  • Spain
  • Italy
  • ROE
  • Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • RoAPAC
  • Latin America
  • Brazil
  • Mexico
  • Rest of Latin America
  • Middle East & Africa
  • Saudi Arabia
  • South Africa
  • RoMEA

Years considered for the study are as follows:

  • Historical year - 2022
  • Base year - 2023
  • Forecast period - 2024 to 2032

Key Takeaways:

  • Market Estimates & Forecast for 10 years from 2022 to 2032.
  • Annualized revenues and regional level analysis for each market segment.
  • Detailed analysis of geographical landscape with Country level analysis of major regions.
  • Competitive landscape with information on major players in the market.
  • Analysis of key business strategies and recommendations on future market approach.
  • Analysis of competitive structure of the market.
  • Demand side and supply side analysis of the market.

Table of Contents

Chapter 1. Global Wafer Backgrinding Tape Market Executive Summary

  • 1.1. Global Wafer Backgrinding Tape Market Size & Forecast (2022- 2032)
  • 1.2. Regional Summary
  • 1.3. Segmental Summary
    • 1.3.1. By Type
    • 1.3.2. By Wafer Size
  • 1.4. Key Trends
  • 1.5. Recession Impact
  • 1.6. Analyst Recommendation & Conclusion

Chapter 2. Global Wafer Backgrinding Tape Market Definition and Research Assumptions

  • 2.1. Research Objective
  • 2.2. Market Definition
  • 2.3. Research Assumptions
    • 2.3.1. Inclusion & Exclusion
    • 2.3.2. Limitations
    • 2.3.3. Supply Side Analysis
      • 2.3.3.1. Availability
      • 2.3.3.2. Infrastructure
      • 2.3.3.3. Regulatory Environment
      • 2.3.3.4. Market Competition
      • 2.3.3.5. Economic Viability (Consumer's Perspective)
    • 2.3.4. Demand Side Analysis
      • 2.3.4.1. Regulatory frameworks
      • 2.3.4.2. Technological Advancements
      • 2.3.4.3. Environmental Considerations
      • 2.3.4.4. Consumer Awareness & Acceptance
  • 2.4. Estimation Methodology
  • 2.5. Years Considered for the Study
  • 2.6. Currency Conversion Rates

Chapter 3. Global Wafer Backgrinding Tape Market Dynamics

  • 3.1. Market Drivers
    • 3.1.1. Rise in need for wafer fabrication
    • 3.1.2. Increase in focus on wafer surface protection during grinding process
    • 3.1.3. Growth in the semiconductor industry
  • 3.2. Market Challenges
    • 3.2.1. Increase in shift from non-UV to UV curable backgrinding tapes
    • 3.2.2. High operational costs associated with wafer manufacturing
  • 3.3. Market Opportunities
    • 3.3.1. Increase in investment in wafer fabrication equipment and materials
    • 3.3.2. Growing opportunities in emerging countries like India and the Philippines

Chapter 4. Global Wafer Backgrinding Tape Market Industry Analysis

  • 4.1. Porter's 5 Force Model
    • 4.1.1. Bargaining Power of Suppliers
    • 4.1.2. Bargaining Power of Buyers
    • 4.1.3. Threat of New Entrants
    • 4.1.4. Threat of Substitutes
    • 4.1.5. Competitive Rivalry
    • 4.1.6. Futuristic Approach to Porter's 5 Force Model
    • 4.1.7. Porter's 5 Force Impact Analysis
  • 4.2. PESTEL Analysis
    • 4.2.1. Political
    • 4.2.2. Economical
    • 4.2.3. Social
    • 4.2.4. Technological
    • 4.2.5. Environmental
    • 4.2.6. Legal
  • 4.3. Top investment opportunity
  • 4.4. Top winning strategies
  • 4.5. Disruptive Trends
  • 4.6. Industry Expert Perspective
  • 4.7. Analyst Recommendation & Conclusion

Chapter 5. Global Wafer Backgrinding Tape Market Size & Forecasts by Type 2022-2032

  • 5.1. Segment Dashboard
  • 5.2. Global Wafer Backgrinding Tape Market: Type Revenue Trend Analysis, 2022 & 2032 (USD Million)
    • 5.2.1. UV Curable
    • 5.2.2. Non-UV

Chapter 6. Global Wafer Backgrinding Tape Market Size & Forecasts by Wafer Size 2022-2032

  • 6.1. Segment Dashboard
  • 6.2. Global Wafer Backgrinding Tape Market: Wafer Size Revenue Trend Analysis, 2022 & 2032 (USD Million)
    • 6.2.1. 6-Inch
    • 6.2.2. 8-Inch
    • 6.2.3. 12-Inch
    • 6.2.4. Others

Chapter 7. Global Wafer Backgrinding Tape Market Size & Forecasts by Region 2022-2032

  • 7.1. North America Wafer Backgrinding Tape Market
    • 7.1.1. U.S. Wafer Backgrinding Tape Market
      • 7.1.1.1. Type breakdown size & forecasts, 2022-2032
      • 7.1.1.2. Wafer Size breakdown size & forecasts, 2022-2032
    • 7.1.2. Canada Wafer Backgrinding Tape Market
  • 7.2. Europe Wafer Backgrinding Tape Market
    • 7.2.1. U.K. Wafer Backgrinding Tape Market
    • 7.2.2. Germany Wafer Backgrinding Tape Market
    • 7.2.3. France Wafer Backgrinding Tape Market
    • 7.2.4. Spain Wafer Backgrinding Tape Market
    • 7.2.5. Italy Wafer Backgrinding Tape Market
    • 7.2.6. Rest of Europe Wafer Backgrinding Tape Market
  • 7.3. Asia-Pacific Wafer Backgrinding Tape Market
    • 7.3.1. China Wafer Backgrinding Tape Market
    • 7.3.2. India Wafer Backgrinding Tape Market
    • 7.3.3. Japan Wafer Backgrinding Tape Market
    • 7.3.4. Australia Wafer Backgrinding Tape Market
    • 7.3.5. South Korea Wafer Backgrinding Tape Market
    • 7.3.6. Rest of Asia Pacific Wafer Backgrinding Tape Market
  • 7.4. Latin America Wafer Backgrinding Tape Market
    • 7.4.1. Brazil Wafer Backgrinding Tape Market
    • 7.4.2. Mexico Wafer Backgrinding Tape Market
    • 7.4.3. Rest of Latin America Wafer Backgrinding Tape Market
  • 7.5. Middle East & Africa Wafer Backgrinding Tape Market
    • 7.5.1. Saudi Arabia Wafer Backgrinding Tape Market
    • 7.5.2. South Africa Wafer Backgrinding Tape Market
    • 7.5.3. Rest of Middle East & Africa Wafer Backgrinding Tape Market

Chapter 8. Competitive Intelligence

  • 8.1. Key Company SWOT Analysis
  • 8.2. Top Market Strategies
  • 8.3. Company Profiles
    • 8.3.1. AI Technology Inc.
      • 8.3.1.1. Key Information
      • 8.3.1.2. Overview
      • 8.3.1.3. Financial (Subject to Data Availability)
      • 8.3.1.4. Product Summary
      • 8.3.1.5. Market Strategies
    • 8.3.2. Furukawa Electric Co. Ltd.
    • 8.3.3. AMC Co. Ltd.
    • 8.3.4. Denka Company Limited
    • 8.3.5. Pantech Tape Co. Ltd.
    • 8.3.6. Force-One Applied Materials
    • 8.3.7. Minitron Elektronik GmbH
    • 8.3.8. Nitto Denko Corporation
    • 8.3.9. Mitsui Chemicals Inc.
    • 8.3.10. Lintec of America Inc. (Lintec Corporation)
    • 8.3.11. Sumitomo Bakelite
    • 8.3.12. Ultron Systems
    • 8.3.13. Nippon Pulse Motor
    • 8.3.14. Loadpoint Limited
    • 8.3.15. NEPTCO

Chapter 9. Research Process

  • 9.1. Research Process
    • 9.1.1. Data Mining
    • 9.1.2. Analysis
    • 9.1.3. Market Estimation
    • 9.1.4. Validation
    • 9.1.5. Publishing
  • 9.2. Research Attributes