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市場調查報告書
商品編碼
1179879

全球電路材料市場2023-2030

Global Circuit Materials Market - 2023-2030
出版日期: | 出版商: DataM Intelligence | 英文 230 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

市場概覽

全球電路材料市場預計將出現顯著增長。

在兩層導電材料（通常由銅製成）之間放置一種堅固、高度絕緣的介電材料，例如玻璃纖維。 機械層是最外層。 玻璃纖維板作為印刷電路板的基礎。 每面貼有導電銅板。 電路材料包括連接到電子電路並為電子電路提供機械支撐的元件，也稱為電子產品中使用的電路板。 安裝在印刷電路板上的電路材料使復雜電路的製造商和設計人員能夠提供高性能的解決方案。 電路材料還具有更高的可靠性和更好的功能。 可以焊接和製造用於多層、單面、雙面、柔性和剛性-柔性等應用的薄型高密度電線。 電路材料也廣泛用於無源開關盒等電子元器件。

市場動態

電路材料通常是平面層壓複合材料，其內表面或外表面隱藏有銅電路層，由非導電基材製成。 高密度應用範圍從具有 1 或 2 個銅層的基本應用到具有 50 層或更多層的複雜應用。 隨著電子行業的快速增長，印刷線路板材料市場有望實現健康增長。 預計物聯網 (IoT) 等技術進步的興起將在預測期內提振對印刷電路板的需求。

高性能材料提高柔性和剛性電路 PCB 的穩健性

薄膜、層壓板、光刻膠、金屬化等都是材料類型。 銅薄聚□亞胺層壓板、環氧樹脂溶液、丙烯酸和聚□胺基粘合劑、乾膜光刻膠和絲網印刷油墨等材料被用作電路中的基材。 常用的PCB基材包括FR-1、G-10、PTFE、氧化鋁和Kapton。 CTE、PTFE 和 CEM 等材料用於層壓板。 如果高性能不是關鍵的 PCB 屬性，輕質聚酯等材料可能是不錯的選擇。

電路材料在高溫應用中的使用

為了滿足消費電子和電信行業的小型化需求，PCB 需要具有更高的電路密度。 適當的材料選擇可以提高產量並降低製造成本。 信號完整性對於 PCB 必須在高溫和高壓條件下可靠運行的汽車應用中的安全至關重要。 汽車中的基板和組件需要在更小的空間內集成更多功能，因此能夠實現緊湊且極其可靠設計的材料變得越來越重要。 因此，用於高溫應用的電路材料越來越多，市場不斷擴大。

例如，對於石油、汽車、軍事、航空航天和醫療保健領域使用的高溫柔性電路，杜邦在高溫材料方面的專業知識使其成為絕佳選擇。 Cirexx 使用杜邦先進的機械、加工技術和高溫材料來生產可在 250度C 以上的溫度下運行的最先進的柔性電路。 杜邦的全聚□亞胺 Pyralux HT 材料系統提供所有柔性電路材料中最高的額定溫度。

但電路材料市場受制於銅的獲取難度大，替代品眾多，市場拓展困難重重。 電路材料的採用也可能會減少，因為替代品很容易獲得，而且消費者更願意生產環保和節能的產品。 在預測期內，這些因素可能會在一定程度上限制市場增長。

COVID-19 影響分析

由於 COVID-19 的影響，全球許多國家實施了封鎖措施，這對電路材料市場造成了衝擊。 由於暫時關閉業務，對這些產品的需求受到了影響。 汽車行業的印刷電路板市場受停工影響最大，給電路材料市場造成了財務損失。 行動限制擾亂了銅等材料的供應鏈。 大流行期間也限制了進出口，因此很難獲得材料。

內容

第 1 章全球電路材料市場-研究方法和範圍

  • 調查方法
  • 調查目的和範圍

第 2 章全球電路材料市場 - 市場定義和概述

第 3 章全球電路材料市場-執行摘要

  • 按材料類別細分的市場
  • 按基礎材料劃分的市場細分
  • 按外層細分的市場
  • 按應用劃分的市場細分
  • 按地區劃分的市場細分

第四章全球電路材料市場-市場動態

  • 市場影響因素
    • 司機
      • 在高溫應用中使用電路材料
    • 約束因素
      • 銅供應短缺限制了市場增長
    • 商機
    • 影響分析

第5章全球電路材料市場-行業分析

  • 波特的五力分析
  • 供應鏈分析
  • 定價分析
  • 監管分析

第 6 章全球電路材料市場 - COVID-19 分析

  • COVID-19 市場分析
    • COVID-19 之前的市場情景
    • COVID-19 的當前市場情景
    • COVID-19 後或未來情景
  • COVID-19 期間的價格動態
  • 供需範圍
  • 大流行期間與市場相關的政府舉措
  • 製造商的戰略舉措
  • 總結

第 7 章全球電路材料市場 - 按材料類別分類

  • 基材
  • 導電材料
  • 外層

第 8 章全球電路材料市場 - 按基礎材料分類

  • 玻璃纖維-環氧樹脂
  • 紙苯酚
  • CEM
  • 聚□亞胺
  • 其他

第 9 章全球電路材料市場 - 按外層分類

  • 液態墨水光固化阻焊膜 (LIPSM)
  • 乾膠片照片圖像
  • 其他

第 10 章全球電路材料市場 - 按應用

  • 通訊領域
  • 工業電子
  • 汽車
  • 航空航天與國防
  • 其他

第 11 章全球電路材料市場-按地區

  • 北美
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 意大利
    • 俄羅斯
    • 其他歐洲
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他南美洲
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 澳大利亞
    • 其他亞太地區
  • 中東和非洲

第 12 章全球電路材料市場-競爭格局

  • 競爭場景
  • 市場情況/份額分析
  • 併購分析

第 13 章全球電路材料市場-公司概況

  • 生益科技有限公司
    • 公司簡介
    • 產品組合和說明
    • 主要亮點
    • 財務摘要
  • Kingboard Laminates Holdings
  • ITEQ Corporation
  • Dowdupont
  • Jinan Guoji Technology Co., Ltd.
  • Eternal Materials Co., Ltd.
  • Rogers Corporation
  • Taiflex Scientific Co., Ltd.
  • Isola Group
  • Nikkan Induatries Co., Ltd.

第 14 章全球電路材料市場 - 關鍵考慮因素

第15章全球電路材料市場-DataM

簡介目錄
Product Code: DMMA6112

Market Overview

The global circuit materials market reached US$ XX million in 2022 and is projected to record significant growth by reaching up to US$ XX million by 2030, growing at a CAGR of XX% during the forecast period (2023-2030).

A strong, insulating dielectric material like fiberglass is between two layers of conductive material typically made of copper. The mechanical layer is the outermost layer. A fiberglass sheet serves as the foundation for printed circuit boards. Each side has conductive copper sheets attached to it. Circuit materials include components connected to an electronic circuit, also known as a circuit board, used in electric appliances to provide mechanical support. Circuit materials mounted on the printed circuit board allow producers and designers of complex circuits to offer high-performance solutions. In addition, circuit materials offer higher reliability and better functional performance. They make it possible to fabricate thin, higher-density electric interconnects soldered for use in multilayered, single- and double-sided, flexible and rigid-flexible applications. Products like passive switch boxes made of electronics frequently use circuit materials.

Market Dynamics

Typically, circuit materials are flat laminated composites with layers of copper circuitry concealed internally or on external surfaces, made of non-conductive substrate materials. In high-density applications, they can be as basic as one or two copper layers or as complex as 50 layers or more. Due to the electronics industry's rapid growth, it is anticipated that the market for printed circuit board materials will grow at a healthy rate. It is anticipated that increased technological advancements, such as the Internet of Things (IoT), will increase PCB demand during the forecast period.

High-performance materials to improve the robustness of PCBs for flexible and rigid circuits

Films, laminates, photoresists and metallization are types of materials. Electric circuits use thin copper polyimide laminates, epoxy solutions, acrylic and polyamide-based adhesives and other materials like dry film photoresist and screen-printed inks as substrates. Substrates for PCBs are frequently made of FR-1, G-10, PTFE, alumina and Kapton, among other materials. CTE, PTFE and CEM, among other materials, are used to create laminates. A material like lightweight polyester is probably a good option when high performance is not a crucial PCB characteristic.

Use of circuit materials in high-temperature applications

To meet the demands of the consumer electronics and telecom industries' drive toward miniaturization, PCBs must have a higher circuit density. The right material selection increases yield while reducing manufacturing costs. Signal integrity is crucial for safety in automotive applications, where PCBs must operate dependably under conditions of high temperature and high voltage. The need for more functionality to fit into a smaller space as boards and components in vehicles raises the significance of materials that enable small, extremely reliable designs. Because of this, the market is growing as more circuit materials are used in high-temperature applications.

For Instance, Due to its expertise in high-temperature materials, DuPont is the best choice for high-temperature flex circuits, which are usually utilized in the oil, automotive, military, aerospace and healthcare sectors. Cirexx creates state-of-art flex circuits that can function in temperatures higher than 250°C (482°F) using advanced machinery, fabrication techniques and high-temperature materials from DuPont. The DuPont all-polyimide Pyralux HT material system provides any flex circuit material's highest temperature operating rating.

However, the market for circuit materials will be constrained by the less availability of copper, whereas a plethora of substitutes will make market expansion difficult. The market's availability of alternatives and consumers' preference for producing eco-friendly and energy-efficient goods can also reduce the adoption of circuit materials. During the foreseeable period, these factors may, to some extent, limit the market growth.

COVID-19 Impact Analysis

The lockdown imposed in numerous nations around the world has harmed the market for circuit material as a result of COVID-19. Due to temporary business closures, the demand for these products has been impacted. The printed board market in the automotive industry had been most negatively impacted by the shutdown, with financial losses to the circuit material market. The movement restrictions disrupted the copper and other material supply chain. During the pandemic, imports and exports were also restricted, which led to the less availability of materials.

Segment Analysis

The global circuit materials market is segmented based on material class, substrate, outer layer, application and region.

Growing sales of electric vehicles generate excellent growth prospects for PCBs and bolster the demand for circuit materials

With an emphasis on autonomous and electric vehicles, the PCB industry in the automotive sector will experience rapid growth. The identical sensors and other components needed for an automobile's reliable operation are held together by printed circuit boards. Electronic components and circuit boards are being created with more and more circuit materials. Automobiles, communication, smart and aerospace electronics all use circuit materials. Global EV sales increased by 108% from 2020 to 6,75 million units in 2021. Compared to 2020, the global share of EVs (BEV & PHEV) in light vehicle sales was 8,3%. Sales of all EVs were 71% BEVs and 29% PHEVs. Only 4,7% more cars were sold globally in 2020 than during the crisis year. The remarkable growth in EV sales generates a tremendous demand for circuit materials globally.

Geographical Analysis

The global circuit materials market is segmented based on material class, substrate, outer layer, application and region.

Growing usage of IOTs, high powerboards and other electronic appliances in the region help to expand the circuit materials market in Asia-Pacific

The "Make in India" initiative has boosted India's consumer electronics manufacturing sector and increased the production of electronic components for various uses. The demand for electronics is expected to rise in the coming years, driving the growth of the electronic manufacturing industries in developing nations. Due to the highly developed electronics industries in China, Japan and South Korea, as well as ongoing investments made in the region to advance automotive technology and electronic manufacturing, Asia-Pacific is predicted to dominate the global market. India exported electronic goods worth $11.7 billion in FY21. In May 2021, exports of electronic goods totaled USD 950.17 million.

Competitive Landscape

Leading companies are focusing on technological advancements in the electronics industry. The primary focus areas include product launches, collaborations, strategic mergers and acquisitions. The major players in the market are Shengyi Technology Co., Ltd., Kingboard Laminates Holdings, ITEQ Corporation, Dowdupont, Jinan Guoji Technology Co., Ltd., Eternal Materials Co., Ltd., Rogers Corporation, Taiflex Scientific Co., Ltd., Isola Group and Nikkan Industries Co., Ltd.

Dowdupont

Overview: DuPont is headquartered in U.S. with a total of 109 manufacturing facilities across 31 nations and employs about 36,500 people globally. The company operates in all regions, including the Americas, Europe, Asia-Pacific and Middle East & Africa. Its portfolio includes specialty chemicals and downstream goods for the water management, electronics and communication, construction, automotive and safety and protection sectors.

Product Portfolio:

  • Polyimide Film: DuPontTM Kapton B polyimide film demonstrates an excellent balance of physical, chemical and electrical properties with superior dimensional stability over a broad temperature range. In industrial motor and generator applications, Kapton CRC is typically used as magnet wire, turn-to-turn strand, coil, slot liner and ground insulation materials.

Key Development: On January 21, 2022, The expansion project at DuPont Interconnect Solutions' manufacturing facility in Circleville, Ohio, was completed. With the $ 250 million investment, Kapton polyimide film and Pyralux flexible circuit materials production would be increased, ensuring a dedicated supply to meet the rising global demand in DuPont's target markets of the automotive, consumer electronics, specialized industrial and defense.

Why Purchase the Report?

  • To visualize the global circuit materials market segmentation based on material class, substrate, outer layer, application and region, as well as understand key commercial assets and players.
  • Identify commercial opportunities in the global circuit materials market by analyzing trends and co-development.
  • Excel data sheet with numerous data points of circuit materials market-level with all segments.
  • PDF report consisting of cogently put together market analysis after exhaustive qualitative interviews and in-depth market study.
  • Product mapping available as excel consisting of key products of all the major market players.

The global circuit materials market report would provide approximately 69 tables, 71 figures and 230 Pages.

Target Audience 2023

  • Manufacturers/ Buyers
  • Industry Investors/Investment Bankers
  • Research Professionals
  • Emerging Companies

Table of Contents

1. Global Circuit Materials Market - Methodology and Scope

  • 1.1. Research Methodology
  • 1.2. Research Objective and Scope of the Report

2. Global Circuit Materials Market - Market Definition and Overview

3. Global Circuit Materials Market - Executive Summary

  • 3.1. Market Snippet by Material Class
  • 3.2. Market Snippet by Substrate
  • 3.3. Market Snippet by Outer Layer
  • 3.4. Market Snippet by Application
  • 3.5. Market Snippet by Region

4. Global Circuit Materials Market-Market Dynamics

  • 4.1. Market Impacting Factors
    • 4.1.1. Drivers
      • 4.1.1.1. Use of circuit materials in high-temperature applications
      • 4.1.1.2. XX
    • 4.1.2. Restraints
      • 4.1.2.1. Less Supply of copper will limit the market growth
      • 4.1.2.2. XX
    • 4.1.3. Opportunity
      • 4.1.3.1. XX
    • 4.1.4. Impact Analysis

5. Global Circuit Materials Market - Industry Analysis

  • 5.1. Porter's Five Forces Analysis
  • 5.2. Supply Chain Analysis
  • 5.3. Pricing Analysis
  • 5.4. Regulatory Analysis

6. Global Circuit Materials Market - COVID-19 Analysis

  • 6.1. Analysis of COVID-19 on the Market
    • 6.1.1. Before COVID-19 Market Scenario
    • 6.1.2. Present COVID-19 Market Scenario
    • 6.1.3. After COVID-19 or Future Scenario
  • 6.2. Pricing Dynamics Amid COVID-19
  • 6.3. Demand-Supply Spectrum
  • 6.4. Government Initiatives Related to the Market During Pandemic
  • 6.5. Manufacturers Strategic Initiatives
  • 6.6. Conclusion

7. Global Circuit Materials Market - By Material Class

  • 7.1. Introduction
    • 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material Class
    • 7.1.2. Market Attractiveness Index, By Material Class
  • 7.2. Substrate*
    • 7.2.1. Introduction
    • 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 7.3. Conducting Material
  • 7.4. Outer Layer

8. Global Circuit Materials Market - By Substrate

  • 8.1. Introduction
    • 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Substrate
    • 8.1.2. Market Attractiveness Index, By Substrate
  • 8.2. Fiberglass-Epoxy*
    • 8.2.1. Introduction
    • 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 8.3. Paper-Phenolic
  • 8.4. CEM
  • 8.5. Polyimide
  • 8.6. Others

9. Global Circuit Materials Market - By Outer Layer

  • 9.1. Introduction
    • 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Outer Layer
    • 9.1.2. Market Attractiveness Index, By Outer Layer
  • 9.2. Liquid Ink Photoimageable Solder Mask (LIPSM)*
    • 9.2.1. Introduction
    • 9.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 9.3. Dry Film Photoimageable
  • 9.4. Others

10. Global Circuit Materials Market - By Application

  • 10.1. Introduction
    • 10.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.1.2. Market Attractiveness Index, By Application
  • 10.2. Communications*
    • 10.2.1. Introduction
    • 10.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 10.3. Industrial Electronics
  • 10.4. Automotive
  • 10.5. Aerospace & Defense
  • 10.6. Others

11. Global Circuit Materials Market - By Region

  • 11.1. Introduction
    • 11.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
    • 11.1.2. Market Attractiveness Index, By Region
  • 11.2. North America
    • 11.2.1. Introduction
    • 11.2.2. Key Region-Specific Dynamics
    • 11.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material Class
    • 11.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Substrate
    • 11.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Outer Layer
    • 11.2.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 11.2.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 11.2.7.1. U.S.
      • 11.2.7.2. Canada
      • 11.2.7.3. Mexico
  • 11.3. Europe
    • 11.3.1. Introduction
    • 11.3.2. Key Region-Specific Dynamics
    • 11.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material Class
    • 11.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Substrate
    • 11.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Outer Layer
    • 11.3.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 11.3.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 11.3.7.1. Germany
      • 11.3.7.2. UK
      • 11.3.7.3. France
      • 11.3.7.4. Italy
      • 11.3.7.5. Russia
      • 11.3.7.6. Rest of Europe
  • 11.4. South America
    • 11.4.1. Introduction
    • 11.4.2. Key Region-Specific Dynamics
    • 11.4.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material Class
    • 11.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Substrate
    • 11.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Outer Layer
    • 11.4.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 11.4.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 11.4.7.1. Brazil
      • 11.4.7.2. Argentina
      • 11.4.7.3. Rest of South America
  • 11.5. Asia-Pacific
    • 11.5.1. Introduction
    • 11.5.2. Key Region-Specific Dynamics
    • 11.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material Class
    • 11.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Substrate
    • 11.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Outer Layer
    • 11.5.6. Market Size Analysis and Y-o-Y Growth Analysis (%) By Application
    • 11.5.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 11.5.7.1. China
      • 11.5.7.2. India
      • 11.5.7.3. Japan
      • 11.5.7.4. Australia
      • 11.5.7.5. Rest of Asia-Pacific
  • 11.6. Middle East and Africa
    • 11.6.1. Introduction
    • 11.6.2. Key Region-Specific Dynamics
    • 11.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material Class
    • 11.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Substrate
    • 11.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Outer Layer
    • 11.6.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application

12. Global Circuit Materials Market - Competitive Landscape

  • 12.1. Competitive Scenario
  • 12.2. Market Positioning/Share Analysis
  • 12.3. Mergers and Acquisitions Analysis

13. Global Circuit Materials Market- Company Profiles

  • 13.1. Shengyi Technology Co., Ltd.*
    • 13.1.1. Company Overview
    • 13.1.2. Product Portfolio and Description
    • 13.1.3. Key Highlights
    • 13.1.4. Financial Overview
  • 13.2. Kingboard Laminates Holdings
  • 13.3. ITEQ Corporation
  • 13.4. Dowdupont
  • 13.5. Jinan Guoji Technology Co., Ltd.
  • 13.6. Eternal Materials Co., Ltd.
  • 13.7. Rogers Corporation
  • 13.8. Taiflex Scientific Co., Ltd.
  • 13.9. Isola Group
  • 13.10. Nikkan Induatries Co., Ltd.

LIST NOT EXHAUSTIVE

14. Global Circuit Materials Market- Premium Insights

15. Global Circuit Materials Market- DataM

  • 15.1. Appendix
  • 15.2. About Us and Services
  • 15.3. Contact Us