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全球異質整合市場 - 2024-2031

Global Heterogeneous Integration Market - 2024-2031

出版日期: 2024年06月05日 | 出版商:

DataM Intelligence | 英文 180 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

概述

全球異質整合市場將於2023年達到9億美元，預計2031年將達到102億美元，2024-2031年預測期間複合年成長率為35.7%。

資料中心、科學研究和模擬等應用程式對高效能運算解決方案的需求不斷成長，推動了異質整合的需求。結合 CPU、GPU 和記憶體組件的整合解決方案可為要求苛刻的運算工作負載提供能源效率、卓越的效能和可擴展性。半導體技術的不斷進步，包括莫耳定律縮放、3D 整合、先進封裝技術和新材料，推動了異質整合的創新。半導體製造商和代工廠投資研發，開發先進製程、封裝解決方案和整合方法，推動市場成長。

消費者對異質整合不斷成長的需求有助於推動預測期內的市場成長。例如，2023 年 7 月 13 日，Camtek Ltd 收到了來自一級製造商的 42 個系統訂單，用於異構整合、HBM 和扇出應用。大部分訂單用於高頻寬記憶體（HBM）和異質整合晶片組模組的製造。晶片組模組是提升運算能力的重要組件。

由於異質整合各產業的研發支出不斷成長，北美成為市場的主導地區。電子、航空航太、資訊科技、製造和醫療保健等廣泛技術產業的研發支出被大量吸引到北美。研發專案集中在提高整合能力和開發異質整合的封裝方法。

動力學

半導體技術的快速進步

半導體技術的進步允許更高的整合密度，並使更多的元件能夠整合到更小的空間中。這對於異質整合尤其重要，其中不同類型的元件需要整合到單一套件或系統中。更高的整合密度可提高整合解決方案的整體效能、功能和效率。半導體的進步有助於元件的小型化，從而可以創建緊湊的設備。這對於需要攜帶式和節省空間的解決方案的應用非常有利，例如行動裝置和汽車電子產品。異質整合利用這些小型化趨勢來創建更小但更強大的整合系統。

主要參與者在新產品發布中的舉措不斷增加有助於推動預測期內的市場成長。例如，2023年5月16日，iDEAL Semiconductor在市場上推出了SuperQ技術。它有助於減少太陽能電池板、資料中心、電動車和馬達驅動等各種應用中的功率損耗。其效率的提高有助於減少碳足跡。

不斷發展的智慧製造和工業 4.0 計劃

智慧製造和工業 4.0 專案推動了整合工業物聯網解決方案的日益普及。感測器、執行器、控制器、通訊模組和資料處理單元必須經常整合到一個連貫的系統中以實施這些解決方案。異質整合使得工業領域的組件無縫整合、預測性維護和流程最佳化成為可能。

工業4.0非常強調整個生產過程的資料整合。透過異質整合，分析驅動的決策和不同系統的整合變得更加容易。整合系統可以收集多個來源的資料並對其採取行動，從而提高智慧工廠的效率和生產力。根據半導體產業協會的資料，到 2025 年，全球將安裝超過 750 億台物聯網設備。全球物聯網半導體元件市場預計將以 19% 的複合年成長率成長，到 2025 年將達到 800 億美元。

整合的複雜性

將不同組件與不同技術、外形尺寸和功能整合的複雜性通常會導致更高的開發成本。投資異質整合解決方案的公司可能會產生與專業設計工具、整合技術專業知識、原型設計、測試、驗證和設計迭代相關的費用。較高的開發成本可能會阻止一些公司採用異質整合，特別是那些研發預算有限或對成本敏感的應用程式的公司。

異質整合的複雜性可能會導致整合解決方案的開發週期和上市時間更長。設計、測試、最佳化和驗證複雜的整合系統需要精心規劃、跨職能團隊之間的協作以及迭代設計迭代。開發時間的延遲可能會影響市場競爭力、錯失機會以及在快速發展的行業中緩慢採用異質整合解決方案。

將組件與不同的介面、協定、工作電壓和熱曲線整合帶來了技術挑戰。確保整合組件的兼容性、訊號完整性、供電、熱管理和可靠性需要全面的工程專業知識和創新的解決方案。克服整合挑戰會增加開發過程的複雜性，並可能需要定製或解決方法，進一步增加開發時間和成本。

The growing need for high-performance computing solutions in applications such as data centers, scientific research and simulation drives the demand for heterogeneous integration. Integrated solutions combining CPUs, GPUs and memory components offer energy efficiency, superior performance and scalability for demanding computing workloads. Growing advancements in semiconductor technologies, including Moore's Law scaling, 3D integration, advanced packaging techniques and new materials, fuel innovation in heterogeneous integration. Semiconductor manufacturers and foundries invest in R&D to develop advanced processes, packaging solutions and integration methodologies, driving market growth.

Growing consumer demand for heterogeneous integration helps to boost market growth over the forecast period. For instance, on July 13, 2023, Camtek Ltd, received an order of 42 Systems from Tier-1 Manufacturers for Heterogeneous Integration, HBM and Fan-out Applications. Most of the orders are for High Bandwidth Memory (HBM) and the manufacture of chipset modules for heterogeneous integration. The chipset module is an important component in enhancing computing power.

North America is a dominating region in the market due to the growing research and development expenditure by various industries of heterogeneous integration. Research and development expenditures across a wide range of technological industries such as electronics, aerospace, IT, manufacturing and healthcare are heavily attracted to North America. Research and development projects concentrate on improving integration capabilities and developing packaging methods for heterogeneous integration.

Dynamics

Rapid Advancements in Semiconductor Technologies

Technological Advancements in semiconductors allow for higher integration densities and enable more Component to be integrated into smaller spaces. The is particularly important for heterogeneous integration, where different types of Component need to be integrated into a single package or system. Higher integration densities improve the overall performance, functionality and efficiency of integrated solutions. Semiconductor advancements contribute to the miniaturization of Component, making it possible to create compact devices. The is beneficial for applications that require portable and space-efficient solutions like mobile devices and automotive electronics. Heterogeneous integration leverages these miniaturization trends to create smaller yet powerful integrated systems.

Growing major key player's initiatives in the new product launches helps to boost market growth over the forecast period. For instance, on May 16, 2023, iDEAL Semiconductor launched SuperQ Technology in the market. It helps to reduce power loss in various applications such as solar panels, data centers, electric vehicles and motor drives. Its elevated efficiency helps to reduce carbon footprint.

Growing Smart Manufacturing and Industry 4.0 Initiatives

The growing adoption of integrated industrial IoT solutions is boosted by smart manufacturing and Industry 4.0 projects. Sensors, actuators, controllers, communication modules and data processing units must frequently be integrated into a coherent system to implement these solutions. Heterogeneous integration makes it possible for Component to be seamlessly integrated, predictive maintenance and process optimization in industry.

Industry 4.0 places a strong emphasis on data integration throughout the production process. Analytics-driven decision-making and the integration of diverse systems are made easier by heterogeneous integration. Integrated systems can gather and act upon data from multiple sources, leading to improved efficiency and productivity in smart factories. According to the Semiconductor Industry Association data, by 2025, over 75 billion installed IoT devices globally. The global IoT semiconductor component market is slated to grow at a CAGR of 19% to US$80 billion in 2025.

Complexity of Integration

The complexity of integrating diverse Component with varying technologies, form factors and functionalities often leads to higher development costs. Companies investing in heterogeneous integration solutions may incur expenses related to specialized design tools, expertise in integration techniques, prototyping, testing, validation and iteration of designs. The higher development costs can deter some companies from adopting heterogeneous integration, particularly those with limited R&D budgets or cost-sensitive applications.

The intricate nature of heterogeneous integration can result in longer development cycles and time-to-market for integrated solutions. Designing, testing, optimizing and validating complex integrated systems require meticulous planning, collaboration among cross-functional teams and iterative design iterations. Delays in development timelines can impact market competitiveness, missed opportunities and slower adoption of heterogeneous integration solutions in rapidly evolving industries.

Integrating Component with different interfaces, protocols, operating voltages and thermal profiles presents technical challenges. Ensuring compatibility, signal integrity, power delivery, thermal management and reliability across integrated Component requires thorough engineering expertise and innovative solutions. Overcoming integration challenges adds complexity to the development process and may require customizations or workarounds, further contributing to development time and costs.

Segment Analysis

The global heterogeneous integration market is segmented based on component, design, end-user and region.

Advanced Manufacturing & Multi-Chip Integration Component is Dominating in the Market

Based on the component, the heterogeneous integration market is segmented into advanced manufacturing & multi chip integration, integrated photonics, integrated power electronics, mems and sensor integration, 5g and rf and analog mixed signal.

Modern manufacturing methods enable electrical components to be made smaller while maintaining their functionality. By combining several chips or components into a single package, multichip integration (MCI) approaches can reduce package size and increase efficiency. The complexity of electronic devices is making it increasingly necessary to integrate many functionalities into constrained spaces. Processors, memory, sensors and other components combined more easily because of advanced manufacturing and MCI, resulting in highly integrated systems with better functionality and performance.

Improved heat management in electronic systems is supported by MCI techniques and advanced production procedures. The technologies help address thermal issues in high-performance electronics by incorporating cooling solutions, heat dissipation structures and thermal interfaces right into the package. Long-term cost savings can result from advanced manufacturing and MCI techniques, despite the initial infrastructure and R&D costs. Through component reduction, assembly process simplification and increased dependability, these technologies help lower the total cost of electronic systems.

Geographical Penetration

North America is Dominating the Heterogeneous Integration Market

Having a high concentration of top semiconductor businesses, producers of electronic Component, academic institutions and technical inventors, North America has a strong technological ecosystem. The creation of cutting-edge heterogeneous integration solutions is encouraged by this environment, along with innovation and collaboration. The region is home of some of the largest semiconductor manufacturers. The creation of heterogeneous integration solutions depends on the semiconductor integration techniques and technologies that these companies invented.

Growing Government funding for heterogeneous integration helps to boost regional market growth over the forecast period. For instance, on May 17, 2022, UCLA and SEMI announced that they won a US$ 300,000 grant from U.S. Department of Commerce's National Institute of Standards and Technology for the production of a roadmap for advanced packaging technologies.

Competitive Landscape

The major global players in the market include ASE TECHNOLOGY HOLDING, Intel, Etron Technology, EV Group, Taiwan Semiconductor Manufacturing Company Limited, Applied Materials, Inc., Semi, Micross, Skywater Technology and Silicon Austria Labs GmbH.

COVID-19 Impact Analysis

As global shortage of raw materials, the pandemic caused disruptions in globally supply chains. The complex supply chain of electronic Component and materials is necessary for heterogeneous integration. Many manufacturing facilities and production lines were temporarily shut down or operated at reduced capacity due to restrictions, lockdowns and safety protocols. The led to production slowdowns and challenges in meeting demand for heterogeneous integration solutions, impacting market growth and delivery schedules.

The pandemic-induced changes in consumer behavior, remote working trends, digitalization initiatives and healthcare requirements influenced the demand for heterogeneous integration solutions. Increased demand for telecommunication equipment, data centers, IoT devices, healthcare electronics and e-commerce platforms led to shifts in demand patterns within the heterogeneous integration market. The shift to remote work and virtual collaboration posed challenges for companies involved in heterogeneous integration, particularly in terms of project management, engineering collaboration, prototyping and testing. Remote work setups impacted productivity, innovation cycles and the development of new integrated solutions, requiring adjustments and digital transformation efforts.

Russia-Ukraine War Impact Analysis

Global supply chains are disrupted by geopolitical tensions between the countries which have an impact on the distribution and travel of raw materials and Component. The availability and cost of vital Component used in integrated systems are impacted in the case of the heterogeneous integration market by disruptions in the semiconductor supply chain and logistics brought on by the conflict between Russia and Ukraine. Market turbulence and uncertainty are frequently caused by geopolitical tensions as investors and companies respond to geopolitical risks and incidents. In the heterogeneous integration market and close industries, uncertainty affects decisions regarding investments and causes volatility in market trends, demand and investment patterns.

Geopolitical events influence currency exchange rates. Currency fluctuations affect import/export costs, international trade, pricing strategies and profitability for companies operating in the global heterogeneous integration market, especially those with exposure to affected currencies. Geopolitical tensions result in regulatory changes, trade restrictions, sanctions or export policies that impacted the operations and business environment for companies in the heterogeneous integration market. Changes in trade policies or regulatory frameworks can affect market access, trade relationships, compliance requirements and business continuity planning for industry players.

By Component

Advanced Manufacturing & Multi Chip Integration
Integrated Photonics
Integrated Power Electronics
MEMS and Sensor Integration
5G, RF and Analog Mixed Signal

By Design

Co-Design
Modeling & Simulation

By End-User

Semiconductor and Electronics
IT and Telecommunications
Automotive and Transportation
Healthcare and Life Sciences
Manufacturing and Industrial
Aerospace and Defense
Others

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- Germany
- UK
- France
- Italy
- Spain
- Rest of Europe
South America
- Brazil
- Argentina
- Rest of South America
Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific
Middle East and Africa

Key Developments

On February 21, 2024, Intel Foundry and Cadence collaborated to enable Heterogeneous Integration with EMIB Packaging Technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures.
On September 20, 2023, ITRI led a global semiconductor collaboration for heterogeneous integration to pioneer pilot production solutions. Leading semiconductor companies from Taiwan and throughout the globe are brought together by Alliance to offer a wide range of services, including package design, testing and verification, as well as pilot production.
On July 10, 2023, Applied Materials, Inc. advanced heterogeneous chip integration with new technologies for hybrid bonding and through-silicon vias. It helps chipmakers integrate chipsets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs).

Why Purchase the Report?

To visualize the global heterogeneous integration market segmentation based on component, design, end-user and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of heterogeneous integration market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Product mapping available as excel consisting of key products of all the major players.

The global heterogeneous integration market report would provide approximately 62 tables, 57 figures and 180 Pages.

Target Audience 2024

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1.Methodology and Scope

1.1.Research Methodology
1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

3.1.Snippet by Component
3.2.Snippet by Design
3.3.Snippet by End-User
3.4.Snippet by Region

4.Dynamics

4.1.Impacting Factors
- 4.1.1.Drivers
  - 4.1.1.1.Rapid Advancements in Semiconductor Technologies
  - 4.1.1.2.Growing Smart Manufacturing and Industry 4.0 Initiatives
- 4.1.2.Restraints
  - 4.1.2.1.Complexity of Integration
- 4.1.3.Opportunity
- 4.1.4.Impact Analysis

5.Industry Analysis

5.1.Porter's Five Force Analysis
5.2.Supply Chain Analysis
5.3.Pricing Analysis
5.4.Regulatory Analysis
5.5.Russia-Ukraine War Impact Analysis
5.6.DMI Opinion

6.COVID-19 Analysis

6.1.Analysis of COVID-19
- 6.1.1.Scenario Before COVID-19
- 6.1.2.Scenario During COVID-19
- 6.1.3.Scenario Post COVID-19
6.2.Pricing Dynamics Amid COVID-19
6.3.Demand-Supply Spectrum
6.4.Government Initiatives Related to the Market During Pandemic
6.5.Manufacturers Strategic Initiatives
6.6.Conclusion

7.By Component

7.1.Introduction
- 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 7.1.2.Market Attractiveness Index, By Component
7.2.Advanced Manufacturing & Multi Chip Integration*
- 7.2.1.Introduction
- 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3.Integrated Photonics
7.4.Integrated Power Electronics
7.5.MEMS and Sensor Integration
7.6.5G, RF and Analog Mixed Signal Embedded Bridge

8.By Design

8.1.Introduction
- 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
- 8.1.2.Market Attractiveness Index, By Design
8.2.Co-Design *
- 8.2.1.Introduction
- 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3.Modeling & Simulation

9.By End-User

9.1.Introduction
- 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 9.1.2.Market Attractiveness Index, By End-User
9.2.Semiconductor and Electronics*
- 9.2.1.Introduction
- 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3.IT and Telecommunications
9.4.Automotive and Transportation
9.5.Healthcare and Life Sciences
9.6.Manufacturing and Industrial
9.7.Aerospace and Defense
9.8.Others

10.By Region

10.1.Introduction
- 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 10.1.2.Market Attractiveness Index, By Region
10.2.North America
- 10.2.1.Introduction
- 10.2.2.Key Region-Specific Dynamics
- 10.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 10.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
- 10.2.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.2.6.1.U.S.
  - 10.2.6.2.Canada
  - 10.2.6.3.Mexico
10.3.Europe
- 10.3.1.Introduction
- 10.3.2.Key Region-Specific Dynamics
- 10.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 10.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
- 10.3.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.3.6.1.Germany
  - 10.3.6.2.UK
  - 10.3.6.3.France
  - 10.3.6.4.Italy
  - 10.3.6.5.Spain
  - 10.3.6.6.Rest of Europe
10.4.South America
- 10.4.1.Introduction
- 10.4.2.Key Region-Specific Dynamics
- 10.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 10.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
- 10.4.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.4.6.1.Brazil
  - 10.4.6.2.Argentina
  - 10.4.6.3.Rest of South America
10.5.Asia-Pacific
- 10.5.1.Introduction
- 10.5.2.Key Region-Specific Dynamics
- 10.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 10.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
- 10.5.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.5.6.1.China
  - 10.5.6.2.India
  - 10.5.6.3.Japan
  - 10.5.6.4.Australia
  - 10.5.6.5.Rest of Asia-Pacific
10.6.Middle East and Africa
- 10.6.1.Introduction
- 10.6.2.Key Region-Specific Dynamics
- 10.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 10.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Design
- 10.6.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

11.Competitive Landscape

11.1.Competitive Scenario
11.2.Market Positioning/Share Analysis
11.3.Mergers and Acquisitions Analysis

12.Company Profiles

12.1.ASE TECHNOLOGY HOLDING*
- 12.1.1.Company Overview
- 12.1.2.Product Portfolio and Description
- 12.1.3.Financial Overview
- 12.1.4.Key Developments
12.2.Intel
12.3.Etron Technology
12.4.EV Group
12.5.Taiwan Semiconductor Manufacturing Company Limited
12.6.Applied Materials, Inc.
12.7.Semi
12.8.Micross
12.9.Skywater Technology
12.10.Silicon Austria Labs GmbH

LIST NOT EXHAUSTIVE

13.Appendix

13.1.About Us and Services
13.2.Contact Us

02-2729-4219

+886-2-2729-4219

License/價格

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FAQ

全球異質整合市場 - 2024-2031

Global Heterogeneous Integration Market - 2024-2031

目錄

第 1 章：方法與範圍

第 2 章：定義與概述

第 3 章：執行摘要

第 4 章：動力學

第 5 章：產業分析

第 6 章：COVID-19 分析

第 7 章：按組件

第 8 章：設計

第 9 章：最終用戶

第 10 章：按地區

第 11 章：競爭格局

第 12 章：公司簡介

第 13 章：附錄