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商品編碼

1375386

全球半導體組裝和測試外包（OSAT）的成長機會

Global Outsourced Semiconductor Assembly and Test Growth Opportunities

出版日期: 2023年10月13日 | 出版商:

Frost & Sullivan | 英文 161 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄

先進封裝的日益普及以及對具有成本效益的 ATP 解決方案的需求推動了成長

本研究分析了全球半導體組裝和測試外包 (OSAT) 市場。由於各行業擴大採用先進封裝技術，OSAT 市場預計將顯著成長。 OSAT 是一家專門為整合設備製造商 (IDM)、代工廠和無晶圓廠晶片製造商提供組裝、測試和封裝 (ATP) 服務的第三方供應商。我們提供先進和傳統包裝和檢測方面的專業知識，受益於大批量製造能力的規模經濟。透過將後端製造流程外包給 OSAT，晶片製造商可以專注於其核心競爭力，從而縮短週轉時間和上市時間。

該研究重點關注提供封裝和檢驗服務的 OSAT 和代工廠，不包括具有內部封裝能力的 IDM。 OSAT 和 Foundry 根據 ATP 服務產生的收益深入研究市場估計和預測。它對最終用戶產業進行了深入分析，並概述了 OSAT 透過先進封裝技術實現電動車、5G 部署和物聯網 (IoT) 等變革趨勢的潛力。此外，我們也檢驗了產業整合和地緣政治因素對 OSAT 市場的影響。

研究的主要目的是確定該領域產生的成長機會，並評估加速或阻礙市場成長的因素。研究了基於最終用戶行業、封裝技術、互連類型和地區的細分市場。該研究包括與 OSAT 生態系統中的行業專家和相關人員討論中獲得的見解，並輔以二次研究，並提供了到 2027 年的市場規模估計和成長預測。主要亮點包括對區域需求模式的洞察以及對每個最終用戶部門的 OSAT 機會的全面分析。此外，我們也研究資本支出趨勢、OSAT 設施分佈和 OSAT 價值鏈。它還包括競爭分析並提供主要企業的市場佔有率。

分析範圍
半導體封裝技術的分類
OSAT價值鏈的主要參與企業
按最終用戶細分
小晶片的興起
WBG 半導體封裝趨勢
混合鍵合
主要競爭
成長指標
生長促進因子
促生長因子分析
成長抑制因素
成長抑制因素分析
預測假設
收益預測
按最終用戶分類的收益預測
按包裝類型分類的收益預測
收益預測（按互連類型）
封裝互連技術 -全球OSAT、IDM、晶圓代工市場佔有率
按地區分類的收益預測
OSAT 設施（按地區）
收益預測分析
價格趨勢和預測分析
競爭環境
收益佔有率
收益佔有率分析
OSAT形勢- 資本支出趨勢
OSAT形勢- 前 25 家純 OSAT 公司分析
全球著名 ATMP 投資
2020-2023年ATMP投資形勢
OSAT 成功秘訣
競爭分析
併購分析

印度的 OSAT形勢與機遇

印度半導體產業
印度的半導體政策
收益預測 - 印度 ATMP 現狀
收益預測分析 – ATMP 市場
印度的 OSAT 機會
印度 ATMP形勢- 當前情況
印度ATMP產能
印度 ATMP 產業的發展

OSAT 中的人工智慧

OSAT 智慧製造實施的主要支柱
半導體封裝和檢測中的 AI/ML
OSAT/ATMP形勢現有且潛在的 AI/ML 解決方案
著名的 ATMP AI/ML 解決方案 - 影響分析儀表板
案例#1：用於高效 OSAT 營運的端到端軟體解決方案
案例#2：採用 PDF 解決方案的 Exensio OSAT

成長機會分析 - 行動消費性電子產品

成長指標
收益預測
收益預測（按互連類型）
按包裝類型分類的收益預測
按地區分類的收益預測
預測分析
適用於 5G 的 AiP
智慧型手機 RF FEM、天線和封裝技術與網路生成的演變
競爭環境
收益佔有率

成長機會分析 -通訊/基礎設施

成長指標
收益預測
收益預測（按互連類型）
按包裝類型分類的收益預測
按地區分類的收益預測
預測分析
全球 5G 採用 - 2021 年和 2025 年
競爭環境
收益佔有率

成長機會分析 -汽車/交通

成長指標
收益預測
收益預測（按互連類型）
按包裝類型分類的收益預測
按地區分類的收益預測
預測分析
競爭環境
收益佔有率

成長機會分析 - 其他

成長指標
收益預測
收益預測（按互連類型）
按包裝類型分類的收益預測
按地區分類的收益預測
預測分析
競爭環境
收益佔有率

OSAT 的永續性

半導體生態系統關於永續性和循環經濟的五個主要趨勢
半導體生態系統與聯合國永續發展目標之間的合作對於為脫碳鋪路至關重要
OSAT 的關鍵永續性因素
聯合國永續發展目標
Amkor Technology
ASE Technology

成長機會宇宙

成長機會 1：HI 的驗證與檢驗
成長機會2：工業4.0提高報酬率和效率
成長機會3：上下游策略配合措施
成長機會4：半導體封裝中的3D列印
成長機會5：數位轉型，有效應對衝擊
成長機會六：併購

下一步

簡介目錄

Product Code: K901-26

Increasing Adoption of Advanced Packaging and the Need for Cost-effective ATP Solutions will Fuel Transformational Growth

This study analyzes the global outsourced semiconductor assembly and test (OSAT) market, which is set to experience substantial growth driven by the increasing adoption of advanced packaging technology across various industries. OSATs are third-party providers that specialize in assembly, testing, and packaging (ATP) services and cater to integrated device manufacturers (IDMs), foundries, and fabless chip manufacturers. They offer expertise in both advanced and conventional packaging and testing, benefiting from economies of scale due to their high-volume manufacturing capabilities. By outsourcing backend manufacturing processes to OSATs, chip manufacturers can focus on their core competencies and experience faster turnaround times and reduced time-to-market.

This study focuses on pure-play OSATs and foundries offering packaging and testing services, excluding IDMs with in-house packaging capabilities. The research delves into market estimates and forecasts based on the revenue generated by OSATs and foundries through ATP services. The study analyzes end-user industries in detail, outlining the potential OSATs hold for enabling transformative trends like electric mobility, 5G deployments, and the Internet of Things (IoT) through advanced packaging technologies. Additionally, it examines the impact of industry consolidation and geopolitical factors on the OSAT market.

The primary goal of this study is to identify growth opportunities emerging from this space and assess factors that may accelerate or hinder market growth. It examines market segments based on end-user industries, packaging technology, interconnect type, and geography. The research includes findings from discussions with industry experts and stakeholders in the OSAT ecosystem, complemented by secondary research, to estimate market size and forecast growth up to 2027. Some of the key study highlights include insights into demand patterns across different regions and a comprehensive analysis of each end-user sector's OSAT opportunities. Additionally, the study examines the capital expenditure trend, the distribution of OSAT facilities, and the value chain of OSAT. The report also contains a competitive analysis, providing market shares for major players.

Strategic Imperatives

Why is it Increasingly Difficult to Grow?
The Strategic Imperative 8™
The Impact of the Top 3 Strategic Imperatives on the Outsourced Semiconductor Assembly and Test (OSAT) Industry
Growth Opportunities Fuel the Growth Pipeline Engine™

Growth Opportunity Analysis

Scope of Analysis
Classification of Semiconductor Packaging Technology
Key Participants in the OSAT Value Chain
Segmentation by End Users
The Rise of Chiplets
Packaging Trends in Wide-bandgap (WBG) Semiconductors
Hybrid Bonding
Key Competitors
Growth Metrics
Growth Drivers
Growth Driver Analysis
Growth Restraints
Growth Restraint Analysis
Forecast Assumptions
Revenue Forecast
Revenue Forecast by End User
Revenue Forecast by Packaging Type
Revenue Forecast by Interconnect Type
Packaging Interconnect Technologies-Global Market Share of OSATs, IDMs, and Foundries
Revenue Forecast by Region
OSAT Facilities by Region
Revenue Forecast Analysis
Pricing Trends and Forecast Analysis
Competitive Environment
Revenue Share
Revenue Share Analysis
OSAT Landscape-Capex Trend
OSAT Landscape-Analysis of Top 25 Pure-play OSATs
Notable ATMP Investments Globally
ATMP Investment Landscape, 2020-2023
OSATs' Recipe for Success
Analysis of Competition
M&A Analysis

Indian OSAT Landscape and Opportunities

Indian Semiconductor Industry
Indian Semiconductor Policy
Revenue Forecast-Indian ATMP Landscape
Revenue Forecast Analysis-ATMP Market
Indian OSAT Opportunities
Indian ATMP Landscape-Current Scenario
India ATMP Capabilities
Developments in the Indian ATMP Sector

AI in OSATs

Key Pillars for Implementation of Smart Manufacturing in OSATs
AI/ML in Semiconductors Packaging and Testing
Existing and Potential AI/ML Solutions for the OSATs/ATMP Landscape
Notable AI/ML Solutions for ATMP-Impact Analysis Dashboard
Case #1: End-to-End Software Solution for Efficient OSAT Operations
Case #2: Exensio OSAT by PDF Solutions

Growth Opportunity Analysis-Mobile & Consumer Electronics

Growth Metrics
Revenue Forecast
Revenue Forecast by Interconnect Type
Revenue Forecast by Packaging Type
Revenue Forecast by Region
Forecast Analysis
AiP for 5G
Evolution of RF FEM, Antenna, and Packaging Technology in Smartphones with Network Generations
Competitive Environment
Revenue Share

Growth Opportunity Analysis-Telecom & Infrastructure

Growth Metrics
Revenue Forecast
Revenue Forecast by Interconnect Type
Revenue Forecast by Packaging Type
Revenue Forecast by Region
Forecast Analysis
Global 5G Adoption-2021 and 2025
Competitive Environment
Revenue Share

Growth Opportunity Analysis-Automotive & Transportation

Growth Metrics
Revenue Forecast
Revenue Forecast by Interconnect Type
Revenue Forecast by Packaging Type
Revenue Forecast by Region
Forecast Analysis
Competitive Environment
Revenue Share

Growth Opportunity Analysis-Others

Growth Metrics
Revenue Forecast
Revenue Forecast by Interconnect Type
Revenue Forecast by Packaging Type
Revenue Forecast by Region
Forecast Analysis
Competitive Environment
Revenue Share

Sustainability in OSATs

Top 5 Trends in the Semiconductor Ecosystem for Sustainability and the Circular Economy
Semiconductor Ecosystem Alignment with UN SDGs Critical to Paving the Path to Decarbonization
Key Sustainability Factors for OSATs
UN SDGs
Amkor Technology
ASE Technology