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市場調查報告書
商品編碼
1490876
全球可剝離黏劑的成長機會Global De-bondable Adhesives Growth Opportunities |
維修、再利用和回收趨勢以及關鍵需求推動產業擴張
可釋放黏劑被定義為透過施加外部刺激而有利於去除黏劑的黏劑,從而允許在醫療應用中拆卸部件或組件或從皮膚上去除黏劑產品。
隨著各種最終用途產業對材料回收和再利用等永續實踐的需求不斷增加,剝離材料、零件和組件的需求處於最前沿。此外,使用無損壞且無麻煩的拆卸過程臨時拆卸零件以進行維護和修理的趨勢日益明顯。可剝離黏劑技術對於實現這些產業和消費者目標至關重要。因此,研究和開發計劃旨在開發超音波、紫外線、電、熱、化學、雷射和磁等消融技術和方法。快速成長的消費者群體正在推動各行業的需求,包括消費性電子和電器、汽車和運輸、包裝和醫療保健,從而促進了離型黏劑應用的強勁成長。
此分析包括消費性電子/電器、包裝、醫療保健、汽車/運輸、建築、紡織、軍事、能源和其他行業最終用途(例如太陽能、風力發電、半導體和工業機械應用組合)。黏劑的需求前景。它還描述了所使用的主要消融刺激,包括紫外線、熱、電、化學、磁性、超音波和雷射。
鑑於最終用途工業應用、消費量佔有率、全球消費量和收益預測估計中討論的需求不斷上升,可剝離黏劑的需求前景是動態的。
Repair, Reuse, and Recycle Trends and Critical Needs Fuel Industry Expansion
De-bondable adhesives are defined as adhesives that enable the disassembling of parts and components or detaching the adhesive product from the skin in healthcare applications by facilitating adhesive de-bonding on demand through the application of an external stimulus.
With the rising need for sustainable practices such as recycling and reusing materials across diverse end-use industry applications, the need to de-bond materials, components, and parts is paramount. Furthermore, temporary disassembly of components for maintenance and repair using damage-free and less tedious disassembly processes is also a growing trend. De-bondable adhesive technologies are vital enablers in achieving these industry and consumer goals. As a result, R&D initiatives target the development of de-bonding technologies and methods, such as ultrasound, UV light, electrical, thermal, chemical, laser, and magnetic. A fast-growing consumer population is driving demand across various industries, including consumer electronics and electrical appliances, automotive and transportation, packaging, and healthcare, contributing to the robust use of de-bondable adhesive applications.
This analysis covers the demand outlook for de-bondable adhesives across consumer electronics and electrical appliances, packaging, healthcare, automotive and transportation, construction, textiles, military, and energy and other industrial end-use applications (e.g., solar PV, wind energy, semiconductor, and industrial machinery applications combined). It also discusses the main de-bonding stimuli used, such as UV-light, thermal, electrical, chemical, magnetic, ultrasound, and laser.
The demand outlook for de-bondable adhesives is dynamic, given the growing requirements discussed for each end-use industry application, volume consumption share, global volume consumption, and revenue forecast estimates.