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市場調查報告書
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1540729

6G 無線技術半導體的成長機會

Growth Opportunities in Semiconductors for 6G Wireless Technology

出版日期: | 出版商: Frost & Sullivan | 英文 68 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

人工智慧晶片組和化合物半導體發揮變革性作用,實現下一代蜂窩無線電技術營運和經濟目標

無線通訊系統依靠 PA 、 LNA 和收發器(統稱為 RF FEM)等半導體組件來處理無線電單元 (RU)、基頻單元 (BBU) 和網路核心之間的訊號,以確保客戶接收到訊號。資料的無線訊號。

通訊系統依賴其他半導體組件,例如天線積體電路 (IC)、包絡追蹤器、微處理器、類比設備和光學組件來根據需要處理訊號。儘管技術從 2G 發展到 5G,但無線通訊中使用的半導體類型並沒有太大變化。然而,對半導體元件的性能要求不斷提高。因此,設計、材料、製造和封裝技術隨著每一代新一代無線通訊的發展而發展。

隨著5G無線技術進入部署階段,產業領導者已開始討論下一代無線技術(6G)的發展,預計於2030年開始早期商業化。 6G 的到來標誌著通訊的新時代,它提供了超越資料的新服務。這項研究重點關注邊緣的分散式和聯合學習、邊緣和核心之間的協作推理、終端設備的自主能力、利用人工智慧開發以人性化的通訊服務、通訊通訊、運算、感測、控制等幾個接取網路。

為了開發 6G,產業相關人員正在共同努力規劃每個子技術的組件和構建塊,以促進下一代無線技術的發展。與相關人員的早期討論已經達成共識,需要具有高效能功能(運算和射頻)的先進半導體來實現高速資料傳輸和高頻率。

目錄

策略要務

  • 為什麼成長如此困難?
  • The Strategic Imperative 8(TM)
  • 關鍵策略要務對 6G 半導體產業的影響
  • 成長機會推動Growth Pipeline Engine(TM)

6G 半導體成長機會分析 - 6G 概述

  • 主要發現
  • 分析範圍
  • 6G - 蜂窩演進概述和理想的 6G 網路特性
  • 為什麼是6G?為什麼是現在?
  • 6G商用藍圖
  • 6G - 整合技術藍圖
  • 生長促進因子
  • 成長抑制因素
  • 6G生態系統

6G半導體成長機會分析-AI處理器半導體

  • 為什麼人工智慧處理器對於 6G 至關重要
  • 將 AI 融入 RAN 打造通訊的未來 - ORAN 基礎設施
  • 6G網路基礎設施中的人工智慧——AI-RAN的興起
  • 邊緣運算
  • 6G 中的邊緣人工智慧—潛在應用領域
  • 6G 網路中邊緣 AI 晶片組的重點關注領域
  • 了解當前處理器以評估 6G 要求 -主要企業和產品
  • 6G 中的 AI – 如何決定運算效能要求
  • 矽光電(SiPh) 的到來
  • 6G網路人工智慧半導體的區域競爭力
  • 使 6G 技術成為現實的顯著發展、舉措、活動和合作
  • 半導體公司對人工智慧的重大投資
  • 6G人工智慧半導體生態系統
  • 未來五年預估的研究活動
  • 6G 中的人工智慧—網路安全和永續性的重要性

6G 半導體的成長機會 - RF Semiconductors

成長機會領域 - 按地區分類的 6G 研究計劃

成長機會宇宙 - 6G 半導體必不可少的關鍵應用及其背景

  • 6G 半導體 - 機會背景,依主要應用分類:AV/智慧製造
  • 6G 半導體 - 機會背景,按主要應用分類:醫療保健、智慧城市
  • 應用簡介-工業元宇宙
  • 應用簡介 - 行動性

成長機會宇宙

  • 成長機會 1 - 核心與邊緣的認知智慧
  • 成長機會 2 – 專用晶片組
  • 成長機會3-利用政府資金與政策
  • 材料清單
  • 免責聲明
簡介目錄
Product Code: K979-30

AI Chipsets and Compound Semiconductors Will Play a Transformational Role, Enabling the Operational and Economic Targets of Next-gen Cellular Wireless Technology

Wireless communication systems rely on semiconductor components, such as PAs, LNAs, and transceivers (together known as RF FEMs), to process signals to and from the radio unit (RU), baseband unit (BBU), and the network core to ensure customers receive the radio signals that carry the data and services.

The communication system relies on other semiconductor components, such as antenna integrated circuits (ICs), envelope trackers, microprocessors, analog devices, and optical components, to process signals as necessary. The type of semiconductors that wireless telecom communication uses has not changed much with the 2G to 5G evolution of technologies. However, the semiconductor components' performance requirements have increased. Hence, the designs, materials, manufacturing, and packaging technologies have evolved with each new wireless communication generation.

Because 5G wireless technology is in the deployment stage, industry leaders have begun discussions about developing the next-gen wireless technology (6G) and plan to begin early commercialization in 2030. The dawn of 6G will represent a new era of communication that will provide new services beyond data. The study discusses distributed and federated learning at the edge, co-inferencing between edge and core, autonomous functioning of end devices, the development of AI-powered human-centric telecom services, joint communication, computing, sensing, and control, and several other concepts, which represent a transformation from radio access network (RAN) architecture to services.

To develop 6G, industry stakeholders are collaborating to plan the components and building blocks of each sub-technology that will lead to the development of the next-gen wireless technology. Initial stakeholder discussions are leading to an understanding that advanced semiconductors with high-performance capabilities (in computing and RF) will be necessary to enable high-speed data transfer and operate at high frequencies.

  • This analysis aims to understand the changes expected in 6G wireless communication from a context of the semiconductor industry, with specific focus on RAN, and the edge.
  • From a component perspective, the analysis focuses on the AI-processors, and the key RF components required at the network RAN and the edge.
  • The analysis does not cover the changes expected in discrete, analog, memory, optical, and sensing products.
  • It aims to provide a qualitative view based on the developments during the study period and is subject to change in the future.
  • It does not aim to provide a quantitative overview of the market potential.

Table of Contents

Strategic Imperatives

  • Why is it Increasingly Difficult to Grow?
  • The Strategic Imperative 8™
  • The Impact of the Top 3 Strategic Imperatives on the 6G Semiconductors Industry
  • Growth Opportunities Fuel the Growth Pipeline Engine™

Growth Opportunity Analysis in Semiconductors for 6G-6G Overview

  • Primary Findings
  • Scope of Analysis
  • 6G-Overview of Cellular Evolution and Desired 6G Network Characteristics
  • Why 6G? Why Now?
  • 6G Roadmap to Commercialization
  • 6G-Integrated Technology Roadmap
  • Growth Drivers
  • Growth Restraints
  • 6G Ecosystem

Growth Opportunity Analysis in Semiconductors for 6G-AI-Processor Semiconductors

  • Why are AI Processors Critical for 6G?
  • Infusing AI into RAN for the Future of Telecom-Open Radio Access Network (ORAN) Infrastructure
  • AI in 6G Network Infrastructure-Emergence of AI-RAN
  • Edge Computing
  • Edge AI in 6G-Potential Application Universe
  • Primary Focus Areas for Edge AI Chipsets in the 6G Network
  • Understanding Current Processors to Evaluate 6G Requirements- Primary Companies and Products
  • AI in 6G-How to Determine Compute Performance Requirements
  • The Coming of Silicon Photonics (SiPh)
  • Regional Competency of AI Semiconductors for 6G Networking
  • Notable Developments, Initiatives, Activities, and Collaborations to Realize 6G Technology
  • Notable Investments in AI by Semiconductor Companies
  • The AI-Semiconductor Ecosystem for 6G
  • Expected Research Efforts in the Next 5 Years
  • AI in 6G-The Significance of Cybersecurity and Sustainability

6G Semiconductor Growth Opportunity-RF Semiconductors

  • RF Semiconductors in 6G-Enabling 100 GHz and Higher Operational Frequencies
  • RF Semiconductors in 6G-Process Node Trajectory
  • RF Semiconductors in 6G-Exploring Materials Beyond Si
  • RF Semiconductors in 6G-Exploring Materials Beyond Si: GaN
  • RF Semiconductors in 6G-Exploring Materials Beyond Si: InP
  • RF Semiconductors in 6G-Advanced Packaging Technologies
  • RF Semiconductors in 6G-GaN and InP Gaining R&D Traction for Application in Next-gen Wireless Technology
  • RF in 6G-Primary Products Enabling the Research and Development of 6G
  • RF in 6G Investments and R&D Initiatives that Semiconductor Companies Have Announced
  • RF in 6G-Primary Regional Initiatives and Investments
  • RF in 6G-Ultra-wide Bandgap (UWBG) Semiconductors
  • The AI Semiconductor Ecosystem in 6G

Growth Opportunity Universe-6G Research Initiatives by Region

  • 6G Research and Collaboration Initiatives by Primary Regions
  • 6G Patent Applications by Region (2019-2021)

Growth Opportunity Universe-Key Applications and Context of the imperative for 6G Semiconductors

  • Semiconductors for 6G-Context of Opportunities by Primary Applications: AVs and Smart Manufacturing
  • Semiconductors for 6G-Context of Opportunity by Primary Applications: Healthcare and Smart Cities
  • Application Profile-Industry Metaverse
  • Application Profile-Mobility

Growth Opportunity Universe

  • Growth Opportunity 1-Cognitive Intelligence at the Core and Edge
  • Growth Opportunity 2-Application-specific Chipsets
  • Growth Opportunity 3-Leverage Government Funding and Policies
  • List of Exhibits
  • Legal Disclaimer