市場調查報告書
商品編碼
1426957
半導體組裝設備市場 - 按類型(晶片鍵合機、焊線機、包裝設備)、按應用(IDM、OSAT)、按最終用途(消費電子、醫療保健、工業自動化、汽車、A&D)預測2024 - 2032年Semiconductor Assembly Equipment Market - By Type (Die Bonders, Wire Bonders, Packaging Equipment), By Application (IDMs, OSAT), By End Use (Consumer Electronics, Healthcare, Industrial Automation, Automotive, A&D) Forecast 2024 - 2032 |
由於技術進步,2024 年至 2032 年間,半導體組裝設備市場的CAGR預計將超過 9%。對半導體製造流程創新的不懈追求正在推動更先進組裝設備的開發。這包括能夠處理更小和更複雜組件的設備,從而提高半導體組裝過程的效率和生產率。
此外,智慧型手機、平板電腦和智慧型裝置等消費性電子產品的需求不斷成長,正在推動產業成長。根據 GSMA Intelligence 的報告,2022 年全球智慧型手機用戶約 56 億,平板電腦用戶約 12.8 億。
全球半導體組裝設備產業根據類型、應用、最終用途和地區進行細分。
由於先進的封裝解決方案能夠滿足不斷變化的需求,晶片鍵合機領域預計將獲得成長動力,並在 2032 年之前實現強勁的CAGR。隨著半導體元件變得更加複雜和緊湊,晶片焊接機有助於將單個半導體元件精確地放置和焊接到基板上。這種精度等級對於實現小型化和提高整體設備性能非常重要。
在現代汽車中先進半導體技術不斷整合的推動下,預計汽車領域在 2024 年和 2032 年將出現顯著的CAGR。隨著汽車製造商轉向電動和自動駕駛汽車,需要半導體元件來支援感測器、人工智慧驅動系統和連接解決方案等複雜功能。汽車行業半導體應用的激增推動了對能夠滿足可靠性、耐用性和精度嚴格要求的專業組裝設備的需求。
由於主要半導體製造商的強勢存在以及對研發的重視,北美半導體組裝設備市場將在 2024 年至 2032 年間大幅成長。該地區對這些措施的承諾促進了半導體組裝過程的持續進步。此外,對半導體製造活動回流的日益關注增強了國內半導體生產能力,加速了北美產業的成長。
Semiconductor Assembly Equipment Market is set to record a CAGR of over 9% between 2024 and 2032, owing to the technological advancements. The relentless pursuit of innovation in semiconductor manufacturing processes is driving the development of more advanced assembly equipment. This includes equipment capable of handling smaller and more complex components, leading to enhanced efficiency and productivity in the semiconductor assembly process.
Additionally, the surging demand for consumer electronics, such as smartphones, tablets, and smart devices, is propelling the industry growth. As per the reports from GSMA Intelligence, there were around 5.60 billion smart phone users, and around 1.28 billion tablet users in 2022 across the globe.
The worldwide semiconductor assembly equipment industry is segmented on the basis of type, application, end use, and region.
Die bonder segment is slated to gain momentum and record a strong CAGR through 2032, due to advanced packaging solutions for the evolving needs. As semiconductor devices become more complex and compact, die bonder helps in precisely placing and bonding individual semiconductor components onto substrates. This level of precision is important for achieving miniaturization and for enhancing overall device performance.
Automotive segment is anticipated to observe a significant CAGR during 2024 and 2032, driven by the rising integration of advanced semiconductor technologies in modern vehicles. As the automakers shift towards electric and autonomous vehicles, there is a demand for semiconductor components to power sophisticated features such as sensors, AI-driven systems, and connectivity solutions. This surge in semiconductor adoption within the automotive sector drives the need for specialized assembly equipment capable of meeting the stringent requirements for reliability, durability, and precision.
North America semiconductor assembly equipment market will grow substantially between 2024 and 2032, attributed to the strong presence of major semiconductor manufacturers and an emphasis on R&D. The region's commitment towards the initiatives fosters a continuous cycle of advancements in semiconductor assembly processes. Moreover, the growing focus on reshoring semiconductor manufacturing activities bolsters domestic semiconductor production capabilities, accelerating the industry growth in North America.