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市場調查報告書
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1535579

下一代非揮發性記憶體市場 - 按產品(FeRAM、PCM、MRAM、ReRAM)、按應用(消費電子、醫療保健、汽車和運輸、工業、企業)和預測,2024 年 - 2032 年

Next Generation Non Volatile Memory Market - By Product (FeRAM, PCM, MRAM, ReRAM), By Application (Consumer Electronics, Healthcare, Automotive & Transportation, Industrial, Enterprises) & Forecast, 2024 - 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 220 Pages | 商品交期: 2-3個工作天內

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簡介目錄

受高速資料存取需求增加以及資料安全性和可靠性需求增加的推動,全球下一代非揮發性記憶體市場將於 2024 年至 2032 年間以 8% 的複合年成長率擴張。由於人工智慧、雲端運算和物聯網等領域的應用需要快速且有效率的資料檢索,先進的非揮發性記憶體解決方案至關重要。這些技術提供快速的存取速度,同時即使在電源中斷期間也能確保資料的完整性和安全性。效能和可靠性的結合推動了下一代非揮發性記憶體解決方案在各行業的採用。

例如,富士通於 2023 年 8 月推出了“MB85RC512LY”,這是一款具有 I2C 介面的汽車級 512Kbit FeRAM,可在 125°C 下提供高密度和可靠性。此 FeRAM 可確保低電流消耗和高耐用性,非常適合 ADAS 等工業和汽車應用。該產品的低電流消耗和高耐用性可滿足工業和汽車應用的關鍵要求,包括高級駕駛員輔助系統 (ADAS)。這項創新凸顯了市場向更強大、更專業的記憶體解決方案發展的趨勢,並強化了非揮發性內存在先進技術領域日益成長的作用。

下一代非揮發性記憶體產業根據產品、應用和地區進行分類。

到 2032 年,FeRAM 細分市場將顯著成長,這歸因於其相對於其他記憶體類型的獨特優勢。鐵電 RAM (FeRAM) 提供高速資料存取、低功耗和出色的耐用性,使其成為需要快速、可靠的記憶體解決方案的應用的理想選擇。它適用於醫療設備、汽車系統和工業設備,推動了其採用。隨著這些行業對高效、強大的記憶體解決方案的需求日益成長,FeRAM 的卓越性能確保了其在市場中的突出地位。

由於先進電子設備在車輛中的整合度不斷提高,到 2032 年,汽車和運輸業將經歷重大轉型。隨著車輛變得更加互聯和自主,它們需要高性能、可靠的記憶體解決方案來進行資料儲存和即時處理。非揮發性記憶體具有對於資訊娛樂系統、導航和高級駕駛員輔助系統 (ADAS) 等汽車應用至關重要的耐用性和快速存取速度。對複雜汽車技術不斷成長的需求推動了該領域的可觀成長。

在高度重視技術創新和先進電子產品的推動下,歐洲下一代非揮發性記憶體市場從 2024 年到 2032 年將錄得顯著的複合年成長率。該地區強勁的汽車和工業部門推動了對高性能記憶體解決方案的巨大需求。此外,歐洲在研發方面的大量投資,加上政府對技術創新的支持政策,增強了其產業影響力。歐洲在將先進儲存技術融入各種應用方面佔據主導地位,這鞏固了其作為全球市場主要貢獻者的地位。

目錄

第 1 章:範圍與方法

  • 市場範圍和定義
  • 基本估計和計算
  • 預測參數
  • 數據來源
    • 基本的
    • 中學
      • 付費來源
      • 公共來源

第 2 章:執行摘要

第 3 章:產業洞察

  • 產業生態系統分析
  • 供應商矩陣
  • 技術與創新格局
  • 專利分析
  • 重要新聞和舉措
  • 監管環境
  • 衝擊力
    • 成長動力
      • 資料儲存需求不斷成長
      • 技術進步
      • 物聯網設備的使用不斷成長
      • 邊緣運算快速成長
      • 汽車電子對非揮發性記憶體的需求成長
    • 產業陷阱與挑戰
      • 開發成本高
      • 製造挑戰
  • 成長潛力分析
  • 波特的分析
  • PESTEL分析

第 4 章:競爭格局

  • 公司市佔率分析
  • 競爭定位矩陣
  • 戰略展望矩陣

第 5 章:市場估計與預測:依產品分類,2021 - 2032 年

  • 主要趨勢
  • 鐵隨機記憶體
  • 相變材料
  • 磁隨機記憶體
  • 記憶體

第 6 章:市場估計與預測:依應用分類,2021 - 2032

  • 主要趨勢
  • 消費性電子產品
  • 衛生保健
  • 汽車與運輸
  • 工業的
  • 企業

第 7 章:市場估計與預測:按地區分類,2021 - 2032 年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 歐洲其他地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳新銀行
    • 亞太地區其他地區
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地區
  • MEA
    • 阿拉伯聯合大公國
    • 沙烏地阿拉伯
    • 南非
    • MEA 的其餘部分

第 8 章:公司簡介

  • Adesto Technologies
  • Avalanche Technology, Inc.
  • Crossbar Inc.
  • Cypress Semiconductor Corporation
  • Everspin Technologies, Inc.
  • Fujitsu Ltd
  • IBM Corporation
  • Intel Corporation
  • Micron Technology, Inc.
  • Samsung Electronics Co. Ltd.
  • Sandisk Corporation
  • SK Hynix Inc
  • Toshiba Corporation
  • Winbond Electronics Corporation
簡介目錄
Product Code: 9734

Global Next Generation Non Volatile Memory Market will expand at an 8% CAGR between 2024 and 2032, fueled by the increased demand for high-speed data access and the heightened need for data security and reliability. As applications in sectors like AI, cloud computing, and IoT require rapid and efficient data retrieval, advanced non-volatile memory solutions are essential. These technologies provide fast access speeds while ensuring data integrity and security even during power interruptions. This combination of performance and reliability drives the adoption of next-generation non-volatile memory solutions across various industries.

For instance, in August 2023, Fujitsu introduced the "MB85RC512LY," an automotive-grade 512Kbit FeRAM with an I2C interface, offering high density and reliability at 125°C. This FeRAM ensures low current consumption and high endurance, ideal for industrial and automotive applications like ADAS. The product's low current consumption and high endurance address critical requirements for industrial and automotive applications, including Advanced Driver-Assistance Systems (ADAS). This innovation underscores the market trend towards more robust, specialized memory solutions and reinforces the growing role of non-volatile memory in advanced technology sectors.

The next-generation non-volatile memory industry is divided based on product, application, and region.

The FeRAM segment will witness a notable surge by 2032, attributed to its unique advantages over other memory types. Ferroelectric RAM (FeRAM) offers high-speed data access, low power consumption, and excellent endurance, making it ideal for applications requiring rapid, reliable memory solutions. Its suitability for use in medical devices, automotive systems, and industrial equipment drives its adoption. As these sectors increasingly demand efficient and robust memory solutions, FeRAM's superior performance ensures its prominent position in the market.

The automotive & transportation segment will undergo a significant transformation through 2032 due to the growing integration of advanced electronics in vehicles. As vehicles become more connected and autonomous, they require high-performance, reliable memory solutions for data storage and real-time processing. Non volatile memory offers durability and fast access speeds essential for automotive applications such as infotainment systems, navigation, and advanced driver-assistance systems (ADAS). This increasing demand for sophisticated automotive technology drives decent growth in this segment.

Europe next generation non volatile memory market will record a remarkable CAGR from 2024 to 2032, propelled by its strong emphasis on technological innovation and advanced electronics. The region's robust automotive and industrial sectors drive considerable demand for high-performance memory solutions. Additionally, Europe's substantial investments in research and development, coupled with supportive government policies for technological innovations, enhance its industry reach. Europe's dominance in incorporating advanced memory technologies across diverse applications reinforces its position as a key contributor to the global market.

Table of Contents

Chapter 1 Scope & Methodology

  • 1.1 Market scope & definition
  • 1.2 Base estimates & calculations
  • 1.3 Forecast parameters
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360° synopsis, 2024 - 2032
  • 2.2 Business trends
    • 2.2.1 Total addressable market (TAM), 2024-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Vendor matrix
  • 3.3 Technology & innovation landscape
  • 3.4 Patent analysis
  • 3.5 Key news and initiatives
  • 3.6 Regulatory landscape
  • 3.7 Impact forces
    • 3.7.1 Growth drivers
      • 3.7.1.1 Increasing demand for data storage
      • 3.7.1.2 Technological advancement
      • 3.7.1.3 Growing usage of IoT devices
      • 3.7.1.4 Rapid growth of edge computing
      • 3.7.1.5 Rise in demand for non-volatile memory in automotive electronics
    • 3.7.2 Industry pitfalls & challenges
      • 3.7.2.1 High development costs
      • 3.7.2.2 Manufacturing challenges
  • 3.8 Growth potential analysis
  • 3.9 Porter's analysis
    • 3.9.1 Supplier power
    • 3.9.2 Buyer power
    • 3.9.3 Threat of new entrants
    • 3.9.4 Threat of substitutes
    • 3.9.5 Industry rivalry
  • 3.10 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Company market share analysis
  • 4.2 Competitive positioning matrix
  • 4.3 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Product, 2021 - 2032 (USD Million)

  • 5.1 Key trends
  • 5.2 FeRAM
  • 5.3 PCM
  • 5.4 MRAM
  • 5.5 ReRAM

Chapter 6 Market Estimates & Forecast, By Application, 2021 - 2032 (USD Million)

  • 6.1 Key trends
  • 6.2 Consumer electronics
  • 6.3 Healthcare
  • 6.4 Automotive & transportation
  • 6.5 Industrial
  • 6.6 Enterprises

Chapter 7 Market Estimates & Forecast, By Region, 2021 - 2032 (USD Million)

  • 7.1 Key trends
  • 7.2 North America
    • 7.2.1 U.S.
    • 7.2.2 Canada
  • 7.3 Europe
    • 7.3.1 UK
    • 7.3.2 Germany
    • 7.3.3 France
    • 7.3.4 Italy
    • 7.3.5 Spain
    • 7.3.6 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 China
    • 7.4.2 India
    • 7.4.3 Japan
    • 7.4.4 South Korea
    • 7.4.5 ANZ
    • 7.4.6 Rest of Asia Pacific
  • 7.5 Latin America
    • 7.5.1 Brazil
    • 7.5.2 Mexico
    • 7.5.3 Rest of Latin America
  • 7.6 MEA
    • 7.6.1 UAE
    • 7.6.2 Saudi Arabia
    • 7.6.3 South Africa
    • 7.6.4 Rest of MEA

Chapter 8 Company Profiles

  • 8.1 Adesto Technologies
  • 8.2 Avalanche Technology, Inc.
  • 8.3 Crossbar Inc.
  • 8.4 Cypress Semiconductor Corporation
  • 8.5 Everspin Technologies, Inc.
  • 8.6 Fujitsu Ltd
  • 8.7 IBM Corporation
  • 8.8 Intel Corporation
  • 8.9 Micron Technology, Inc.
  • 8.10 Samsung Electronics Co. Ltd.
  • 8.11 Sandisk Corporation
  • 8.12 SK Hynix Inc
  • 8.13 Toshiba Corporation
  • 8.14 Winbond Electronics Corporation