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市場調查報告書
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1570866

鐵電RAM市場、機會、成長動力、產業趨勢分析與預測,2024-2032年

Ferroelectric Ram Market, Opportunity, Growth Drivers, Industry Trend Analysis and Forecast, 2024-2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 210 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2023 年全球鐵電 RAM 市值為 4.522 億美元,預計 2024 年至 2032 年複合年成長率將超過 5%。 FeRAM 等非揮發性記憶體技術具有至關重要的優勢,因為即使在斷電後也能保留資料。此功能在許多現代應用中至關重要。傳統 RAM 一旦斷電就會丟失資料,而 FeRAM(鐵電 RAM)無需持續供電即可保留其訊息

2023 年 7 月,英飛凌在其汽車鐵電 RAM 系列中推出了一款新裝置。鐵電隨機存取記憶體 (FRAM) 作為一種非揮發性記憶體脫穎而出,融合了 RAM 和 ROM 的優點。與一旦斷電就會遺失資料的傳統 RAM 不同,FRAM 會像唯讀記憶體 (ROM) 一樣保留其資訊。這項獨特的功能使 FRAM 成為優先考慮資料持久性的應用程式的首選。

FeRAM 市場的另一個顯著趨勢是汽車電子產品中越來越多的採用。目前,具有先進駕駛輔助系統 (ADAS)、資訊娛樂功能和眾多感測器的車輛需要快速、可靠的記憶體解決方案。 FeRAM 具有無需電源即可保留資料的獨特能力,加上其快速的讀寫速度,使其成為這些汽車應用的主要候選者。此外,隨著產業轉向電動和自動駕駛汽車,對強大記憶體解決方案的需求激增,鞏固了 FeRAM 在汽車行業技術進步中的作用。

整個產業分為類型、儲存密度、應用、最終用途產業和地區。

市場將類型分為獨立式 FRAM 和嵌入式 FRAM,後者預計在預測期內將以 5% 的複合年成長率成長。嵌入式鐵電 RAM (FRAM) 將非揮發性記憶體功能直接整合到微控制器和處理器等半導體設備。這種整合提高了效能並最大限度地減少了設備的實體佔用空間。

記憶體密度類別包括高達 16Kb、32Kb 至 128Kb、256Kb 至 1Mb、2​​Mb 至 8Mb 以及高於 8Mb。資料2032 年,2Mb 至資料細分市場預計將達到 1 億美元。它們非常適合先進的工業控制系統、汽車資訊娛樂系統和複雜的醫療設備,在這些設備中,快速且有效率的資料處理和儲存至關重要。

到 2023 年,北美將引領全球鐵電 RAM 市場,其佔有率將超過 40%。美國是主要參與者,在半導體研發方面投入大量資金。此外,該地區對智慧技術和物聯網應用的關注營造了有利於 FeRAM 採用的環境。

目錄

第 1 章:方法與範圍

第 2 章:執行摘要

第 3 章:產業洞察

  • 產業生態系統分析
  • 供應商矩陣
  • 利潤率分析
  • 技術與創新格局
  • 專利分析
  • 重要新聞和舉措
  • 監管環境
  • 衝擊力
    • 成長動力
      • 對非揮發性記憶體解決方案的需求不斷成長
      • 汽車業的採用率提高
      • 政府及產業支持
      • 物聯網和穿戴式裝置的擴展
      • 鐵電材料的進展
    • 產業陷阱與挑戰
      • 生產成本高
      • 來自新興儲存技術的競爭
  • 成長潛力分析
  • 波特的分析
  • PESTEL分析

第 4 章:競爭格局

  • 介紹
  • 公司市佔率分析
  • 競爭定位矩陣
  • 戰略展望矩陣

第 5 章:市場估計與預測:按類型,2021 - 2032

  • 主要趨勢
  • 獨立式鐵電記憶體
  • 嵌入式鐵電記憶體

第 6 章:市場估計與預測:按記憶體密度,2021 - 2032 年

  • 主要趨勢
  • 高達 16Kb
  • 32Kb 至 128Kb
  • 256Kb 至 1Mb
  • 2Mb 至 8Mb
  • 8Mb以上

第 7 章:市場估計與預測:按應用分類,2021 - 2032

  • 主要趨勢
  • 高級駕駛輔助系統(ADAS)
  • 電池管理系統(BMS)
  • CT掃描
  • 用戶端設備 (CPE)
  • 智慧公用電錶
  • 穿戴式裝置
  • 其他

第 8 章:市場估計與預測:按最終用途產業,2021 - 2032 年

  • 主要趨勢
  • 汽車
  • 消費性電子產品
  • 能源和公用事業
  • 衛生保健
  • 工業的
  • 資訊科技和電信
  • 其他

第 9 章:市場估計與預測:按地區分類,2021 - 2032 年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 歐洲其他地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳新銀行
    • 亞太地區其他地區
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地區
  • MEA
    • 阿拉伯聯合大公國
    • 南非
    • 沙烏地阿拉伯
    • MEA 的其餘部分

第 10 章:公司簡介

  • ActivAirTech, Inc.
  • Anaren, Inc.
  • Antenova Ltd.
  • Cypress Semiconductor Corporation
  • Digi-Key Electronics
  • Everspin Technologies, Inc.
  • Ferroelectric Memory Company
  • Fujitsu Limited
  • Future Electronics
  • Honeywell International, Inc.
  • Infineon Technologies AG
  • International Business Machines Corporation (IBM)
  • Laird Technologies, Inc.
  • LAPIS Semiconductor Co., Ltd. (Rohm Semiconductor)
  • Pulse Electronics Corporation
  • Ralec Electronic Co., Ltd.
  • Ramtron International Corporation
  • Samsung Electronics Co., Ltd.
  • SK Hynix Inc.
  • Symetrix Corporation
  • Tamura Corporation
  • Texas Instruments Incorporated
  • Toshiba Corporation
  • TriQuint Semiconductor, Inc.
  • TX Marine Messsysteme GmbH
簡介目錄
Product Code: 10671

The Global Ferroelectric RAM Market was valued at USD 452.2 million in 2023 and is projected to indicate a CAGR of over 5% from 2024 to 2032. A primary catalyst for this growth is the surging demand for non-volatile memory solutions. Non-volatile memory technologies, like FeRAM, offer a crucial advantage as they retain data even after a power loss. This capability is vital in many modern applications. While traditional RAM loses its data once powered off, FeRAM (ferroelectric RAM) maintains its information without a continuous power supply

In July 2023, Infineon introduced a new device to its lineup of automotive ferroelectric RAMs. Ferroelectric random-access memory (FRAM) stands out as a non-volatile memory, merging the advantages of both RAM and ROM. Unlike conventional RAM, which loses data once power is cut, FRAM retains its information akin to read-only memory (ROM). This distinctive feature positions FRAM as a preferred choice in applications prioritizing data persistence.

Another notable trend in the FeRAM market is growing adoption in automotive electronics. Currently vehicles, with their advanced driver-assistance systems (ADAS), infotainment features, and numerous sensors, demand swift and reliable memory solutions. FeRAM's unique ability to retain data without power, combined with its rapid read and write speeds, makes it a prime candidate for these automotive applications. Furthermore, as the industry pivots towards electric and autonomous vehicles, the demand for robust memory solutions surges, solidifying FeRAM's role in the automotive sector's technological advancements.

The overall industry is divided into type, memory density, application, end-use industry and region.

The market categorizes types into stand-alone FRAM and embedded FRAM, with the latter projected to grow at a CAGR of 5% during the forecast period. Embedded ferroelectric RAM (FRAM) integrates non-volatile memory capabilities directly into semiconductor devices like microcontrollers and processors. This integration boosts performance and minimizes the device's physical footprint.

Memory density categories include Up to 16Kb, 32Kb to 128Kb, 256Kb to 1Mb, 2Mb to 8Mb, and Above 8Mb. The 2Mb to 8Mb segment is anticipated to reach USD 100 million by 2032. Devices in the 2Mb to 8Mb FRAM segment cater to applications demanding extensive data storage and intricate data management. They are ideal for advanced industrial control systems, automotive infotainment, and sophisticated medical devices, where swift and efficient data processing and storage are paramount.

North America led the global ferroelectric RAM market with a share exceeding 40% in 2023. The region's dominance is fueled by technological innovations and robust demand across sectors like aerospace, healthcare, and telecommunications. The U.S., a key player, invests heavily in semiconductor R&D. Moreover, the region's focus on smart technologies and IoT applications fosters an environment conducive to FeRAM adoption.

Table of Contents

Chapter 1 Methodology and Scope

  • 1.1 Market scope and definition
  • 1.2 Base estimates and calculations
  • 1.3 Forecast calculation
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360° synopsis, 2021 - 2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Vendor matrix
  • 3.3 Profit margin analysis
  • 3.4 Technology and innovation landscape
  • 3.5 Patent analysis
  • 3.6 Key news and initiatives
  • 3.7 Regulatory landscape
  • 3.8 Impact forces
    • 3.8.1 Growth drivers
      • 3.8.1.1 Rising demand for non-volatile memory solutions
      • 3.8.1.2 Increased adoption in automotive industry
      • 3.8.1.3 Government and industrial support
      • 3.8.1.4 Expansion in IoT and wearable devices
      • 3.8.1.5 Advancements in ferroelectric materials
    • 3.8.2 Industry pitfalls and challenges
      • 3.8.2.1 High production costs
      • 3.8.2.2 Competition from emerging memory technologies
  • 3.9 Growth potential analysis
  • 3.10 Porter's analysis
    • 3.10.1 Supplier power
    • 3.10.2 Buyer power
    • 3.10.3 Threat of new entrants
    • 3.10.4 Threat of substitutes
    • 3.10.5 Industry rivalry
  • 3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates and Forecast, By Type, 2021 - 2032 (USD Million)

  • 5.1 Key Trends
  • 5.2 Stand-alone FRAM
  • 5.3 Embedded FRAM

Chapter 6 Market Estimates and Forecast, By Memory Density, 2021 - 2032 (USD Million)

  • 6.1 Key Trends
  • 6.2 Up to 16Kb
  • 6.3 32Kb to 128Kb
  • 6.4 256Kb to 1Mb
  • 6.5 2Mb to 8Mb
  • 6.6 Above 8Mb

Chapter 7 Market Estimates and Forecast, By Application, 2021 - 2032 (USD Million)

  • 7.1 Key Trends
  • 7.2 Advanced driver assistance system (ADAS)
  • 7.3 Battery management system (BMS)
  • 7.4 CT-Scan
  • 7.5 Customer premise equipment (CPE)
  • 7.6 Smart utility meter
  • 7.7 Wearable device
  • 7.8 Others

Chapter 8 Market Estimates and Forecast, By End-Use Industry, 2021 - 2032 (USD Million)

  • 8.1 Key Trends
  • 8.2 Automotive
  • 8.3 Consumer electronics
  • 8.4 Energy and utility
  • 8.5 Healthcare
  • 8.6 Industrial
  • 8.7 IT and telecommunication
  • 8.8 Others

Chapter 9 Market Estimates and Forecast, By Region, 2021 - 2032 (USD Million)

  • 9.1 Key trends
  • 9.2 North America
    • 9.2.1 U.S.
    • 9.2.2 Canada
  • 9.3 Europe
    • 9.3.1 UK
    • 9.3.2 Germany
    • 9.3.3 France
    • 9.3.4 Italy
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 China
    • 9.4.2 India
    • 9.4.3 Japan
    • 9.4.4 South Korea
    • 9.4.5 ANZ
    • 9.4.6 Rest of Asia Pacific
  • 9.5 Latin America
    • 9.5.1 Brazil
    • 9.5.2 Mexico
    • 9.5.3 Rest of Latin America
  • 9.6 MEA
    • 9.6.1 UAE
    • 9.6.2 South Africa
    • 9.6.3 Saudi Arabia
    • 9.6.4 Rest of MEA

Chapter 10 Company Profiles

  • 10.1 ActivAirTech, Inc.
  • 10.2 Anaren, Inc.
  • 10.3 Antenova Ltd.
  • 10.4 Cypress Semiconductor Corporation
  • 10.5 Digi-Key Electronics
  • 10.6 Everspin Technologies, Inc.
  • 10.7 Ferroelectric Memory Company
  • 10.8 Fujitsu Limited
  • 10.9 Future Electronics
  • 10.10 Honeywell International, Inc.
  • 10.11 Infineon Technologies AG
  • 10.12 International Business Machines Corporation (IBM)
  • 10.13 Laird Technologies, Inc.
  • 10.14 LAPIS Semiconductor Co., Ltd. (Rohm Semiconductor)
  • 10.15 Pulse Electronics Corporation
  • 10.16 Ralec Electronic Co., Ltd.
  • 10.17 Ramtron International Corporation
  • 10.18 Samsung Electronics Co., Ltd.
  • 10.19 SK Hynix Inc.
  • 10.20 Symetrix Corporation
  • 10.21 Tamura Corporation
  • 10.22 Texas Instruments Incorporated
  • 10.23 Toshiba Corporation
  • 10.24 TriQuint Semiconductor, Inc.
  • 10.25 TX Marine Messsysteme GmbH