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市場調查報告書
商品編碼
1615969

外延片市場機會、成長促進因素、產業趨勢分析及2024-2032年預測

Epitaxial Wafer Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024-2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 210 Pages | 商品交期: 2-3個工作天內

價格
簡介目錄

2023年全球外延片市場價值為48億美元,預計2024年至2032年複合年成長率將超過13%。著推動外延片市場。隨著消費性電子、汽車和電信等產業的擴張,對高效、緊湊的半導體元件的需求不斷增加。需求的激增推動了外延晶圓的採用,外延晶圓以其卓越的電氣性能和熱穩定性而聞名。再生能源正在推動外延晶圓的需求顯著增加。

整個外延晶圓產業根據晶圓類型、晶圓尺寸、最終用途、應用、沉積方法和地區進行分類。市場依沉積方法分類,包括分子束外延(MBE)、化學氣相沉積(CVD)、金屬有機化學氣相沉積(MOCVD)、液相外延(LPE)等。值得注意的是,分子束外延 (MBE) 領域預計在預測期內複合年成長率將超過 15%。分子束外延 (MBE) 在外延晶圓市場中脫穎而出,因其能夠生產具有原子級精度和純度的外延層而聞名。

MBE 通常用於研發,在製造專用半導體裝置(包括量子點、雷射二極體和高電子遷移率電晶體 (HEMT))方面也至關重要。依最終用途產業細分,市場涵蓋半導體製造、光電子、電力電子、光伏電池等,包括 LED 製造。半導體製造領域預計將主導全球市場,預計到 2032 年收入將超過 50 億美元。在這一領域,外延片有助於製造高品質、無缺陷的層,增強電晶體、二極體和積體電路等裝置的電氣性能。

市場範圍
開始年份 2023年
預測年份 2024-2032
起始值 48億美元
預測值 150 億美元
複合年成長率 13%

2023年,亞太地區引領全球外延片市場,比重超過30%。亞太地區由中國、日本、韓國和台灣等半導體製造強國主導,是電子產品生產的巨頭。從消費性電子產品到汽車和電信等產業,對外延片的需求強勁。在電動車(EV) 和再生能源投資的推動下,5G 基礎設施的迅速推出,擴大了對先進半導體裝置的需求,推動了亞太地區外延片市場的成長。的巨額投資鞏固該地區在這一領域的主導地位。

目錄

第 1 章:方法與範圍

第 2 章:執行摘要

第 3 章:產業洞察

  • 產業生態系統分析
  • 供應商矩陣
  • 利潤率分析
  • 技術與創新格局
  • 專利分析
  • 重要新聞和舉措
  • 監管環境
  • 衝擊力
    • 成長動力
      • 對先進半導體元件的需求不斷成長
      • 電動車 (EV) 市場的成長
      • 光子學和光電子學的進步
      • 擴大採用化合物半導體
      • 增加半導體製造投資
    • 產業陷阱與挑戰
      • 製造成本高
      • 技術挑戰和複雜性
  • 成長潛力分析
  • 波特的分析
  • PESTEL分析

第 4 章:競爭格局

  • 介紹
  • 公司市佔率分析
  • 競爭定位矩陣
  • 戰略展望矩陣

第 5 章:市場估計與預測:按晶圓類型,2021-2032 年

  • 主要趨勢
  • 矽基外延晶圓
  • 砷化鎵 (GaAs) 外延晶圓
  • 碳化矽 (SiC) 外延晶圓
  • 氮化鎵 (GaN) 外延晶圓
  • 其他材料

第 6 章:市場估計與預測:依晶圓尺寸,2021-2032 年

  • 主要趨勢
  • 2吋晶圓
  • 4吋晶圓
  • 6吋晶圓
  • 8吋晶圓
  • 12吋晶圓
  • 其他尺寸

第 7 章:市場估計與預測:按應用分類,2021-2032 年

  • 主要趨勢
  • 消費性電子產品
  • 汽車
  • 工業的
  • 電信
  • 衛生保健
  • 國防和航太
  • 其他

第 8 章:市場估計與預測:依沉積法,2021-2032

  • 主要趨勢
  • 化學氣相沉積(CVD)
  • 分子束外延 (MBE)
  • 金屬有機化學氣相沉積(MOCVD)
  • 液相外延 (LPE)
  • 其他沉積技術

第 9 章:市場估計與預測:依最終用途產業,2021-2032 年

  • 主要趨勢
  • 半導體製造
  • 光電
  • 電力電子
  • 光伏電池
  • 其他

第 10 章:市場估計與預測:按地區分類,2021-2032 年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 歐洲其他地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳新銀行
    • 亞太地區其他地區
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地區
  • MEA
    • 阿拉伯聯合大公國
    • 南非
    • 沙烏地阿拉伯
    • MEA 的其餘部分

第 11 章:公司簡介

  • Advanced Wireless Semiconductor Company (AWSC)
  • AXT, Inc.
  • Cree, Inc. (Now Wolfspeed, Inc.)
  • Epistar Corporation
  • Freiberger Compound Materials GmbH
  • GlobalWafers Co., Ltd.
  • IQE plc
  • NanoSystec GmbH
  • Nichia Corporation
  • Saint-Gobain
  • Shin-Etsu Chemical Co., Ltd.
  • Siltronic AG
  • Sino-American Silicon Products Inc. (SAS)
  • SK Siltron
  • Soitec
  • SUMCO Corporation
  • Sumitomo Electric Industries, Ltd.
  • Topsil Semiconductor Materials A/S
  • WaferPro
  • Wafer World, Inc.
  • Xiamen Powerway Advanced Material Co., Ltd.
簡介目錄
Product Code: 11214

The Global Epitaxial Wafer Market was valued at USD 4.8 billion in 2023 and is projected to grow at a CAGR exceeding 13% from 2024 to 2032. The surging demand for advanced semiconductor devices, including high-performance integrated circuits (ICs) and power devices, significantly propels the epitaxial wafer market. As sectors like consumer electronics, automotive, and telecommunications expand, the demand for efficient and compact semiconductor components intensifies. This surge in demand fuels the adoption of epitaxial wafers, known for their superior electrical properties and thermal stability. Renewable energy sources are driving a notable uptick in the demand for epitaxial wafers.

The overall epitaxial wafer industry is classified based on type of wafer, wafer size, end-use, application, deposition method, and region. The market, categorized by deposition methods, includes Molecular Beam Epitaxy (MBE), Chemical Vapor Deposition (CVD), Metalorganic Chemical Vapor Deposition (MOCVD), Liquid Phase Epitaxy (LPE), among others. Notably, the Molecular Beam Epitaxy (MBE) segment is anticipated to witness a CAGR surpassing 15% during the forecast period. Molecular Beam Epitaxy (MBE) stands out in the epitaxial wafer market, celebrated for its capability to produce epitaxial layers with atomic-level precision and purity.

Commonly employed in research and development, MBE is also pivotal in crafting specialized semiconductor devices, including quantum dots, laser diodes, and high-electron-mobility transistors (HEMTs). Segmented by end-use industry, the market encompasses semiconductor manufacturing, optoelectronics, power electronics, photovoltaic cells, and others, including LED manufacturing. The semiconductor manufacturing domain is poised to dominate the global market, projecting revenues exceeding USD 5 billion by 2032. As foundational elements for a myriad of semiconductor devices, epitaxial wafers play a pivotal role in the expansive semiconductor manufacturing industry. Within this sector, epitaxial wafers are instrumental in crafting high-quality, defect-free layers, bolstering the electrical properties of devices like transistors, diodes, and integrated circuits.

Market Scope
Start Year2023
Forecast Year2024-2032
Start Value$4.8 Billion
Forecast Value$15 Billion
CAGR13%

In 2023, the Asia-Pacific region led the global epitaxial wafer market, commanding a share exceeding 30%. Dominated by semiconductor manufacturing powerhouses like China, Japan, South Korea, and Taiwan, the Asia-Pacific region is a titan in electronics production. Industries ranging from consumer electronics to automotive and telecommunications drive a robust demand for epitaxial wafers. The swift rollout of 5G infrastructure, bolstered by investments in electric vehicles (EVs) and renewable energy, amplifies the demand for advanced semiconductor devices, propelling the epitaxial wafer market's growth in Asia-Pacific.Furthermore, government initiatives and hefty investments in semiconductor fabrication facilities solidify the region's dominance in this arena.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definition
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculation
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360° synopsis, 2021-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Vendor matrix
  • 3.3 Profit margin analysis
  • 3.4 Technology & innovation landscape
  • 3.5 Patent analysis
  • 3.6 Key news and initiatives
  • 3.7 Regulatory landscape
  • 3.8 Impact forces
    • 3.8.1 Growth drivers
      • 3.8.1.1 Rising demand for advanced semiconductor devices
      • 3.8.1.2 Growth in electric vehicles (EVs) market
      • 3.8.1.3 Advancements in photonics and optoelectronics
      • 3.8.1.4 Growing adoption of compound semiconductors
      • 3.8.1.5 Increasing investments in semiconductor manufacturing
    • 3.8.2 Industry pitfalls & challenges
      • 3.8.2.1 High manufacturing costs
      • 3.8.2.2 Technological challenges and complexity
  • 3.9 Growth potential analysis
  • 3.10 Porter's analysis
    • 3.10.1 Supplier power
    • 3.10.2 Buyer power
    • 3.10.3 Threat of new entrants
    • 3.10.4 Threat of substitutes
    • 3.10.5 Industry rivalry
  • 3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Type of Wafer, 2021-2032 (USD Million & Units)

  • 5.1 Key trends
  • 5.2 Silicon-based epi wafers
  • 5.3 Gallium arsenide (GaAs) epi wafers
  • 5.4 Silicon carbide (SiC) epi wafers
  • 5.5 Gallium nitride (GaN) epi wafers
  • 5.6 Other materials

Chapter 6 Market Estimates & Forecast, By Wafer Size, 2021-2032 (USD Million & Units)

  • 6.1 Key trends
  • 6.2 2-inch wafers
  • 6.3 4-inch wafers
  • 6.4 6-inch wafers
  • 6.5 8-inch wafers
  • 6.6 12-inch wafers
  • 6.7 Other sizes

Chapter 7 Market Estimates & Forecast, By Application, 2021-2032 (USD Million & Units)

  • 7.1 Key trends
  • 7.2 Consumer electronics
  • 7.3 Automotive
  • 7.4 Industrial
  • 7.5 Telecommunications
  • 7.6 Healthcare
  • 7.7 Defense and aerospace
  • 7.8 Others

Chapter 8 Market Estimates & Forecast, By Deposition Method, 2021-2032 (USD Million & Units)

  • 8.1 Key trends
  • 8.2 Chemical vapor deposition (CVD)
  • 8.3 Molecular beam epitaxy (MBE)
  • 8.4 Metalorganic chemical vapor deposition (MOCVD)
  • 8.5 Liquid phase epitaxy (LPE)
  • 8.6 Other deposition techniques

Chapter 9 Market Estimates & Forecast, By End Use Industry, 2021-2032 (USD Million & Units)

  • 9.1 Key trends
  • 9.2 Semiconductor manufacturing
  • 9.3 Optoelectronics
  • 9.4 Power electronics
  • 9.5 Photovoltaic cells
  • 9.6 Others

Chapter 10 Market Estimates & Forecast, By Region, 2021-2032 (USD Million & Units)

  • 10.1 Key trends
  • 10.2 North America
    • 10.2.1 U.S.
    • 10.2.2 Canada
  • 10.3 Europe
    • 10.3.1 UK
    • 10.3.2 Germany
    • 10.3.3 France
    • 10.3.4 Italy
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 China
    • 10.4.2 India
    • 10.4.3 Japan
    • 10.4.4 South Korea
    • 10.4.5 ANZ
    • 10.4.6 Rest of Asia Pacific
  • 10.5 Latin America
    • 10.5.1 Brazil
    • 10.5.2 Mexico
    • 10.5.3 Rest of Latin America
  • 10.6 MEA
    • 10.6.1 UAE
    • 10.6.2 South Africa
    • 10.6.3 Saudi Arabia
    • 10.6.4 Rest of MEA

Chapter 11 Company Profiles

  • 11.1 Advanced Wireless Semiconductor Company (AWSC)
  • 11.2 AXT, Inc.
  • 11.3 Cree, Inc. (Now Wolfspeed, Inc.)
  • 11.4 Epistar Corporation
  • 11.5 Freiberger Compound Materials GmbH
  • 11.6 GlobalWafers Co., Ltd.
  • 11.7 IQE plc
  • 11.8 NanoSystec GmbH
  • 11.9 Nichia Corporation
  • 11.10 Saint-Gobain
  • 11.11 Shin-Etsu Chemical Co., Ltd.
  • 11.12 Siltronic AG
  • 11.13 Sino-American Silicon Products Inc. (SAS)
  • 11.14 SK Siltron
  • 11.15 Soitec
  • 11.16 SUMCO Corporation
  • 11.17 Sumitomo Electric Industries, Ltd.
  • 11.18 Topsil Semiconductor Materials A/S
  • 11.19 WaferPro
  • 11.20 Wafer World, Inc.
  • 11.21 Xiamen Powerway Advanced Material Co., Ltd.