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市場調查報告書
商品編碼
1616683

電子熱管理材料市場機會、成長動力、產業趨勢分析及 2024 年至 2032 年預測

Electronic Thermal Management Materials Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 to 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 200 Pages | 商品交期: 2-3個工作天內

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簡介目錄

全球電子熱管理材料市場將於2023 年達到64 億美元,預計2024 年至2032 年複合年成長率為7.5%。內的最佳溫度。這些材料在消費性電子、汽車、航太、醫療保健和電信等各個領域都至關重要。它們有助於電子設備基板之間的有效散熱。透過最大限度地減少接觸電阻,ETMM 不僅可以提高電子設備的性能和使用壽命,還可以確保遵守操作規範。

各行業(尤其是汽車和醫療保健領域)電子設備使用量的激增推動了 ETMM 的需求。這種趨勢在發展中地區尤其明顯,將在預測期內大幅提高市場收入。隨著汽車、航太、醫療保健和消費性電子等行業對先進電子設備的需求日益成長,電子熱管理材料 (ETMM) 市場正在強勁成長。隨著電子設備變得更加緊湊和強大,有效的熱管理解決方案的緊迫性也越來越大。

這種需求刺激了各種 ETMM 產品的創建和採用,包括熱界面材料 (TIM)、間隙填充物、導熱膏和相變材料,所有這些產品都旨在最佳化散熱並確保電子元件的最佳性能。整個產業分為產品、應用和區域。對市場導電漿料領域的預測顯示這是一個重要的里程碑,預計 2024 年至 2032 年複合年成長率將達到 8.2%。性方面的關鍵作用。預測表明,到2032 年,電子熱管理材料市場的消費品應用領域將成長至19 億美元,2024 年至2032 年複合年成長率將繼續保持8.2%。需求的推動,包括智慧型手機、平板電腦和穿戴式裝置。

市場範圍
開始年份 2023年
預測年份 2024-2032
起始值 64 億美元
預測值 128 億美元
複合年成長率 7.5%

這些設備需要高效的熱管理才能達到最佳效能和使用壽命。隨著消費者傾向於更強大、更緊湊和功能豐富的設備,有效散熱的緊迫性日益增強,從而推動了該領域對熱管理材料的需求。亞太地區電子熱管理材料產業將顯著成長,預計到2023 年市場價值將達到45 億美元。需求。亞太地區以中國、日本和韓國等主要電子製造中心為主導,正在加大智慧型手機、平板電腦和電動車等設備的生產。

目錄

第 1 章:方法與範圍

第 2 章:執行摘要

第 3 章:產業洞察

  • 產業生態系統分析
    • 主要製造商
    • 經銷商
    • 全行業利潤率
  • 產業影響力
    • 成長動力
    • 市場挑戰
    • 市場機會
      • 新機遇
      • 成長潛力分析
  • 原料景觀
    • 製造趨勢
    • 技術演進
      • 永續製造
        • 綠色實踐
        • 脫碳
    • 原料的永續性
    • 價格趨勢(美元/噸),2021 - 2032
  • 法規和市場影響
  • 波特的分析
  • PESTEL分析

第 4 章:競爭格局

  • 公司市佔率分析
  • 競爭定位矩陣
  • 戰略展望矩陣

第 5 章:市場規模與預測:按產品分類,2021-2032 年

  • 主要趨勢
  • 導電漿料
    • 環氧樹脂
    • 丙烯酸纖維
  • 導電膠帶
  • 相變材料
    • 石蠟
    • 鹽水合物
    • 其他
  • 間隙填充物
    • 矽酮
    • 非矽膠
  • 潤滑脂
    • 矽酮
    • 非矽膠
  • 其他

第 6 章:市場規模與預測:按應用分類,2021-2032 年

  • 主要趨勢
  • 消費品
  • 航太
  • 汽車
  • 衛生保健
  • 電信
  • 其他

第 7 章:市場規模與預測:按地區分類,2021-2032 年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 義大利
    • 西班牙
    • 歐洲其他地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲
    • 亞太地區其他地區
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 阿根廷
    • 拉丁美洲其他地區
  • MEA
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非
    • MEA 的其餘部分

第 8 章:公司簡介

  • 3M
  • Parker Chomerics
  • Boyd
  • European Thermodynamics
  • Dr Dietrich Muller Gmbh,
  • Wacker AG
  • Darcoid company
  • Laird PLC
  • Lord Corporation
  • Amerasia International (AI) Technology Inc
  • Henkel AG & Company
  • Marian Inc
  • Honeywell International Inc
  • Dupont
簡介目錄
Product Code: 3780

The Global Electronic Thermal Management Materials Market reached USD 6.4 billion in 2023 and is projected to grow at a CAGR of 7.5% from 2024 to 2032. Electronic thermal management materials (ETMM) are pivotal in today's electronics to ensure optimal temperatures within electronic assemblies. These materials are vital across diverse sectors, including consumer electronics, automotive, aerospace, healthcare, and telecommunications. They facilitate efficient heat dissipation between electronic device substrates. By minimizing contact resistance, ETMM not only boosts the performance and lifespan of electronic devices but also guarantees adherence to operational specifications.

Driving the demand for ETMM is the surging use of electronic devices across industries, notably in automotive and healthcare. This trend, especially pronounced in developing regions, is set to substantially elevate the market revenue during the forecast period. As industries like automotive, aerospace, healthcare, and consumer electronics increasingly demand advanced electronic devices, the electronic thermal management materials (ETMM) market is witnessing robust growth. With electronic devices becoming more compact and powerful, the urgency for effective thermal management solutions intensifies.

This demand has spurred the creation and adoption of diverse ETMM products, including thermal interface materials (TIMs), gap fillers, thermal pastes, and phase change materials, all aimed at optimizing heat dissipation and ensuring peak performance of electronic components. The overall industry is segmented into product, application, and region. Projections for the conductive paste segment of the market indicate a significant milestone, with expectations to record a CAGR of 8.2% from 2024 to 2032. This surge is fueled by the rising demand for high-performance electronic components in sectors like automotive, consumer electronics, and telecommunications, underscoring the pivotal role of conductive pastes in thermal management and electrical conductivity. Forecasts suggest that the consumer goods application segment in the electronic thermal management materials market will grow to USD 1.9 billion by 2032, continuing at a CAGR of 8.2% from 2024 to 2032. This growth is spurred by the rising demand for sophisticated consumer electronics, including smartphones, tablets, and wearables.

Market Scope
Start Year2023
Forecast Year2024-2032
Start Value$6.4 Billion
Forecast Value$12.8 Billion
CAGR7.5%

These devices necessitate efficient thermal management for optimal performance and longevity. As consumers gravitate towards more powerful, compact, and feature-rich devices, the urgency for effective heat dissipation intensifies, driving the demand for thermal management materials in this segment. Asia Pacific is set to witness remarkable growth in the electronic thermal management materials sector, with projections valuing the market at USD 4.5 billion in 2023. This surge is largely attributed to the region's booming demand for consumer electronics, automotive innovations, and strides in industrial automation. Dominated by major electronics manufacturing hubs like China, Japan, and South Korea, the Asia Pacific is ramping up production of devices, such as smartphones, tablets, and electric vehicles.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definition
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculation
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360° synopsis

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Key manufacturers
    • 3.1.2 Distributors
    • 3.1.3 Profit margins across the industry
  • 3.2 Industry impact forces
    • 3.2.1 Growth drivers
    • 3.2.2 Market challenges
    • 3.2.3 Market opportunity
      • 3.2.3.1 New opportunities
      • 3.2.3.2 Growth potential analysis
  • 3.3 Raw material landscape
    • 3.3.1 Manufacturing trends
    • 3.3.2 Technology evolution
      • 3.3.2.1 Sustainable manufacturing
        • 3.3.2.1.1 Green practices
        • 3.3.2.1.2 Decarbonization
    • 3.3.3 Sustainability in raw materials
    • 3.3.4 Pricing trends (USD/Ton), 2021 - 2032
      • 3.3.4.1 North America
      • 3.3.4.2 Europe
      • 3.3.4.3 Asia Pacific
      • 3.3.4.4 Latin America
      • 3.3.4.5 Middle East & Africa
  • 3.4 Regulations & market impact
  • 3.5 Porter's analysis
  • 3.6 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Company market share analysis
  • 4.2 Competitive positioning matrix
  • 4.3 Strategic outlook matrix

Chapter 5 Market Size and Forecast, By Product, 2021-2032 (USD Billion, Kilo Tons)

  • 5.1 Key trends
  • 5.2 Conductive paste
    • 5.2.1 Silicon
    • 5.2.2 Epoxy
    • 5.2.3 Acrylic
  • 5.3 Conductive tape
  • 5.4 Phase change materials
    • 5.4.1 Paraffin
    • 5.4.2 Salt hydrate
    • 5.4.3 Others
  • 5.5 Gap fillers
    • 5.5.1 Silicone
    • 5.5.2 Non-silicone
  • 5.6 Greases
    • 5.6.1 Silicone
    • 5.6.2 Non-silicone
  • 5.7 Others

Chapter 6 Market Size and Forecast, By Application, 2021-2032 (USD Billion, Kilo Tons)

  • 6.1 Key trends
  • 6.2 Consumer goods
  • 6.3 Aerospace
  • 6.4 Automotive
  • 6.5 Healthcare
  • 6.6 Telecom
  • 6.7 Others

Chapter 7 Market Size and Forecast, By Region, 2021-2032 (USD Billion, Kilo Tons)

  • 7.1 Key trends
  • 7.2 North America
    • 7.2.1 U.S.
    • 7.2.2 Canada
  • 7.3 Europe
    • 7.3.1 Germany
    • 7.3.2 UK
    • 7.3.3 France
    • 7.3.4 Italy
    • 7.3.5 Spain
    • 7.3.6 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 China
    • 7.4.2 India
    • 7.4.3 Japan
    • 7.4.4 South Korea
    • 7.4.5 Australia
    • 7.4.6 Rest of Asia Pacific
  • 7.5 Latin America
    • 7.5.1 Brazil
    • 7.5.2 Mexico
    • 7.5.3 Argentina
    • 7.5.4 Rest of Latin America
  • 7.6 MEA
    • 7.6.1 Saudi Arabia
    • 7.6.2 UAE
    • 7.6.3 South Africa
    • 7.6.4 Rest of MEA

Chapter 8 Company Profiles

  • 8.1 3M
  • 8.2 Parker Chomerics
  • 8.3 Boyd
  • 8.4 European Thermodynamics
  • 8.5 Dr Dietrich Muller Gmbh,
  • 8.6 Wacker AG
  • 8.7 Darcoid company
  • 8.8 Laird PLC
  • 8.9 Lord Corporation
  • 8.10 Amerasia International (AI) Technology Inc
  • 8.11 Henkel AG & Company
  • 8.12 Marian Inc
  • 8.13 Honeywell International Inc
  • 8.14 Dupont