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市場調查報告書
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1620559

直接晶片液體冷卻市場機會、成長促進因素、產業趨勢分析與預測 2024 - 2032 年

Direct-to-Chip Liquid Cooling Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 210 Pages | 商品交期: 2-3個工作天內

價格
簡介目錄

全球資料直接液體冷卻市場將於 2023 年達到 15 億美元,預計 2024 年至 2032 年將以 20.3% 的複合年成長率成長。的。該市場根據組件分為 CPU、GPU、ASIC 和記憶體。其中,CPU 冷卻領域預計到 2032 年將實現超過 20.6% 的複合年成長率。 CPU 的液體冷卻解決方案有單相和兩相設計,可在散發運行過程中產生的熱量方面提供卓越的性能。

這些解決方案利用液體比傳統空氣冷卻方法更有效吸收和傳遞熱量的能力。在考慮冷卻解決方案的類型時,直接晶片液體冷卻分為單相和兩相系統。到 2032 年,單相冷卻領域預計將達到 41 億美元,這主要歸功於其效率和簡單性。這種冷卻方法採用閉迴路設計,使用水或水-乙二醇混合物等液體來吸收關鍵部件的熱量並將其帶走。

液體在這些組件中循環,在再循環之前將吸收的熱量傳遞到冷卻機構,例如散熱器。這種簡單可靠的設計使單相冷卻成​​為許多尋求有效熱管理而又無需過多費用的營運商的經濟高效的解決方案。在美國,直接晶片液冷市場在 2023 年佔據了資料 % 的主導佔有率。隨著組織專注於最佳化其IT 基礎設施,他們正在採用液體冷卻,因為它能夠直接在晶片層級管理熱量,從而提高性能和可靠性。持續冷卻的過渡技術。遵守這些法規以及節省營運成本的潛力,有助於更廣泛地轉向先進的冷卻解決方案。

市場範圍
開始年份 2023年
預測年份 2024-2032
起始值 15億美元
預測值 81 億美元
複合年成長率 20.3%

目錄

第 1 章:方法與範圍

第 2 章:執行摘要

第 3 章:產業洞察

  • 產業生態系統分析
    • 影響價值鏈的因素
    • 利潤率分析
    • 干擾
    • 未來展望
    • 製造商
    • 經銷商
  • 供應商格局
  • 利潤率分析
  • 重要新聞和舉措
  • 監管環境
  • 衝擊力
    • 成長動力
      • 注意能源效率
      • 增加資料中心密度
      • 更加重視永續性
      • 高效能運算的需求不斷成長
    • 產業陷阱與挑戰
      • 初始投資成本高
      • 維護和操作的複雜性
  • 成長潛力分析
  • 波特的分析
  • PESTEL分析

第 4 章:競爭格局

  • 介紹
  • 公司市佔率分析
  • 競爭定位矩陣
  • 戰略展望矩陣

第 5 章:市場估計與預測:按冷卻解決方案類型,2021-2032 年

  • 主要趨勢
  • 單相液冷
  • 兩相液冷

第 6 章:市場估計與預測:按組件冷卻,2021-2032 年

  • 主要趨勢
  • CPU散熱
  • GPU冷卻
  • 專用積體電路冷卻
  • 記憶體冷卻
  • 其他部件冷卻

第 7 章:市場估計與預測:按液體冷卻劑類型,2021-2032 年

  • 主要趨勢
  • 水性冷卻劑
  • 介電液
  • 礦物油
  • 工程流體

第 8 章:市場估計與預測:按應用分類,2021-2032 年

  • 主要趨勢
  • 伺服器
  • 工作站
  • 邊緣運算設備
  • 超電腦
  • 遊戲電腦
  • 其他

第 9 章:市場估計與預測:依最終用途產業,2021-2032 年

  • 主要趨勢
  • 資料中心
  • 高效能運算 (HPC)
  • 人工智慧/機器學習系統
  • 遊戲和電子競技
  • 電信
  • 金融服務
  • 醫療保健和生命科學
  • 石油和天然氣
  • 汽車(用於電動車電池)
  • 航太和國防

第 10 章:市場估計與預測:按地區分類,2021-2032 年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 俄羅斯
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲
  • 拉丁美洲
    • 巴西
    • 墨西哥
  • MEA
    • 南非
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國

第 11 章:公司簡介

  • Asetek
  • Alfa Laval
  • CoolIT Systems
  • Cisco Systems, Inc.
  • Danfoss A/S
  • DCX The Liquid Cooling Company
  • DUG Technology
  • Fujitsu Limited
  • Green Revolution Cooling (GRC)
  • Huawei Technologies Co., Ltd.
  • Iceotope Technologies Ltd.
  • Inspur Systems
  • LiquidCool Solutions
  • LiquidStack
  • Rittal GmbH & Co. KG
  • Schneider Electric
  • STULZ GmbH
  • Super Micro Computer, Inc.
  • Vertiv Group Corp.
簡介目錄
Product Code: 11960

The Global Direct-To-Chip Liquid Cooling Market reached USD 1.5 billion in 2023 and is projected to grow at a remarkable CAGR of 20.3% from 2024 to 2032. This growth is primarily driven by data center operators' increasing emphasis on reducing energy consumption, leading to a greater adoption of energy-efficient cooling solutions. The market, based on the components, is segmented into CPUs, GPUs, ASICs, and memory. Among these, the CPU cooling segment is expected to achieve an impressive CAGR of over 20.6% through 2032. Given that CPUs play a crucial role in high-performance computing systems, effective thermal management is essential. Liquid cooling solutions for CPUs are available in both single-phase and two-phase designs, offering superior performance in dissipating heat generated during operations.

These solutions leverage the liquid's ability to absorb and transfer heat more efficiently than traditional air cooling methods. When considering the types of cooling solutions, direct-to-chip liquid cooling is categorized into single-phase and two-phase systems. The single-phase cooling segment is projected to reach USD 4.1 billion by 2032, largely due to its efficiency and simplicity. This cooling method utilizes a closed-loop design, employing liquids like water or water-glycol mixtures to absorb and transport heat away from critical components.

The liquid circulates through these components, transferring the absorbed heat to a cooling mechanism, such as a radiator before it recirculates. This straightforward and reliable design makes single-phase cooling a cost-effective solution for many operators seeking effective heat management without excessive expenses. In the United States, the direct-to-chip liquid cooling market held a dominant 77.9% share in 2023. The demand for these liquid cooling solutions is significantly driven by the rapid expansion of cloud services and the increasing presence of data centers. As organizations focus on optimizing their IT infrastructure, they are adopting liquid cooling for its capability to manage heat directly at the chip level, thereby enhancing performance and reliability.Additionally, U.S. regulatory initiatives aimed at promoting energy efficiency are encouraging the transition to these sustainable cooling technologies. Compliance with these regulations, along with the potential for operational cost savings, is contributing to a broader shift toward advanced cooling solutions.

Market Scope
Start Year2023
Forecast Year2024-2032
Start Value$1.5 Billion
Forecast Value$8.1 Billion
CAGR20.3%

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definitions
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculations
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry synopsis, 2021-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Factor affecting the value chain
    • 3.1.2 Profit margin analysis
    • 3.1.3 Disruptions
    • 3.1.4 Future outlook
    • 3.1.5 Manufacturers
    • 3.1.6 Distributors
  • 3.2 Supplier landscape
  • 3.3 Profit margin analysis
  • 3.4 Key news & initiatives
  • 3.5 Regulatory landscape
  • 3.6 Impact forces
    • 3.6.1 Growth drivers
      • 3.6.1.1 Focus on energy efficiency
      • 3.6.1.2 Increasing data center density
      • 3.6.1.3 Increased focus on sustainability
      • 3.6.1.4 Rising demand for high-performance computing
    • 3.6.2 Industry pitfalls & challenges
      • 3.6.2.1 High initial investment costs
      • 3.6.2.2 Complexity of maintenance and operations
  • 3.7 Growth potential analysis
  • 3.8 Porter's analysis
  • 3.9 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Cooling Solution Type, 2021-2032 (USD Million)

  • 5.1 Key trends
  • 5.2 Single-phase liquid cooling
  • 5.3 Two-phase liquid cooling

Chapter 6 Market Estimates & Forecast, By Component Cooled, 2021-2032 (USD Million)

  • 6.1 Key trends
  • 6.2 CPU cooling
  • 6.3 GPU cooling
  • 6.4 ASIC cooling
  • 6.5 Memory cooling
  • 6.6 Other component cooling

Chapter 7 Market Estimates & Forecast, By Liquid Coolant Type, 2021-2032 (USD Million)

  • 7.1 Key trends
  • 7.2 Water-based coolants
  • 7.3 Dielectric fluids
  • 7.4 Mineral oils
  • 7.5 Engineered fluids

Chapter 8 Market Estimates & Forecast, By Application, 2021-2032 (USD Million)

  • 8.1 Key trends
  • 8.2 Servers
  • 8.3 Workstations
  • 8.4 Edge computing devices
  • 8.5 Supercomputers
  • 8.6 Gaming PCs
  • 8.7 Others

Chapter 9 Market Estimates & Forecast, By End Use Industry, 2021-2032 (USD Million)

  • 9.1 Key trends
  • 9.2 Data centers
  • 9.3 High-performance computing (HPC)
  • 9.4 Artificial intelligence/machine learning systems
  • 9.5 Gaming and eSports
  • 9.6 Telecommunications
  • 9.7 Financial services
  • 9.8 Healthcare and life sciences
  • 9.9 Oil and gas
  • 9.10 Automotive (for electric vehicle batteries)
  • 9.11 Aerospace and defense

Chapter 10 Market Estimates & Forecast, By Region, 2021-2032 (USD Million)

  • 10.1 Key trends
  • 10.2 North America
    • 10.2.1 U.S.
    • 10.2.2 Canada
  • 10.3 Europe
    • 10.3.1 UK
    • 10.3.2 Germany
    • 10.3.3 France
    • 10.3.4 Italy
    • 10.3.5 Spain
    • 10.3.6 Russia
  • 10.4 Asia Pacific
    • 10.4.1 China
    • 10.4.2 India
    • 10.4.3 Japan
    • 10.4.4 South Korea
    • 10.4.5 Australia
  • 10.5 Latin America
    • 10.5.1 Brazil
    • 10.5.2 Mexico
  • 10.6 MEA
    • 10.6.1 South Africa
    • 10.6.2 Saudi Arabia
    • 10.6.3 UAE

Chapter 11 Company Profiles

  • 11.1 Asetek
  • 11.2 Alfa Laval
  • 11.3 CoolIT Systems
  • 11.4 Cisco Systems, Inc.
  • 11.5 Danfoss A/S
  • 11.6 DCX The Liquid Cooling Company
  • 11.7 DUG Technology
  • 11.8 Fujitsu Limited
  • 11.9 Green Revolution Cooling (GRC)
  • 11.10 Huawei Technologies Co., Ltd.
  • 11.11 Iceotope Technologies Ltd.
  • 11.12 Inspur Systems
  • 11.13 LiquidCool Solutions
  • 11.14 LiquidStack
  • 11.15 Rittal GmbH & Co. KG
  • 11.16 Schneider Electric
  • 11.17 STULZ GmbH
  • 11.18 Super Micro Computer, Inc.
  • 11.19 Vertiv Group Corp.