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市場調查報告書
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1621886

射頻連接器市場機會、成長促進因素、產業趨勢分析與 2024 - 2032 年預測

RF Connectors Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 200 Pages | 商品交期: 2-3個工作天內

價格
簡介目錄

2023 年全球射頻連接器市場價值為 320 億美元,預計 2024 年至 2032 年複合年成長率為 7.7%。射頻連接器可實現更快的資料傳輸並提高效率。隨著資料速率的提高,對可靠射頻連接器的需求變得至關重要,尤其是在企業網路中,管理大量資料需要強大且無縫的連接。這些連接器對於整合交換器、路由器和安全設備等網路設備至關重要,從而實現各種系統之間的順暢通訊。即使在充滿挑戰的環境中,卓越的強度和靈活性也能確保可靠、一致的連結。

此外,其在高頻下表現良好的能力使其成為 5G 等先進通訊技術的首選。隨著各行業擴大尋求兼具耐用性和高性能的連接器,射頻元件中對鈹銅的需求正在穩步成長,從而推動了其市場的快速擴張。市場依安裝類型分為邊緣安裝、通孔安裝、面板安裝、PCB安裝等。 PCB 安裝細分市場預計到 2032 年將達到 229 億美元,成為成長最快的細分市場。

PCB 安裝連接器廣泛應用於電信、汽車、消費性電子和航太等產業。這些連接器能夠將射頻連接器直接有效地整合到印刷電路板上,使其成為當今緊湊型高性能電子設備中不可或缺的一部分。就材料而言,鈹銅是成長最快的細分市場,預計2024 年至2032 年複合年成長率為9.2%。 ,使其成為高需求應用的理想選擇在電信、航太和軍事領域的應用。鈹銅的強度和靈活性確保即使在惡劣的環境下也能實現一致、可靠的連接。

市場範圍
開始年份 2023年
預測年份 2024-2032
起始值 320 億美元
預測值 618 億美元
複合年成長率 7.7%

由於航太、電信業和汽車的強勁需求,2023 年美國將佔據北美射頻連接器市場 77.9% 的佔有率。 5G 網路部署的推動以及軍事和國防通訊系統的進步,極大增加了對高效能射頻連接器的需求。此外,主要製造商的存在和無線通訊技術的持續創新正在推動市場成長。然而,來自替代無線連接解決方案的競爭日益激烈,對傳統射頻連接器製造商保持市場佔有率構成了挑戰。

目錄

第 1 章:方法與範圍

第 2 章:執行摘要

第 3 章:產業洞察

  • 產業生態系統分析
    • 影響價值鏈的因素
    • 利潤率分析
    • 干擾
    • 未來展望
    • 製造商
    • 經銷商
  • 供應商格局
  • 利潤率分析
  • 重要新聞和舉措
  • 監管環境
  • 衝擊力
    • 成長動力
      • 將 112 G PAM4 連接擴展到企業網路
      • 增加對現代通訊網路的投資
      • 對可靠連接解決方案的需求不斷增加。
      • V2X 和 ADAS 技術的採用。
      • 需要高性能、堅固的連接器
    • 產業陷阱與挑戰
      • 先進的設計需要專門的專業知識和資源。
      • 激烈的競爭導致定價壓力。
  • 成長潛力分析
  • 波特的分析
  • PESTEL分析

第 4 章:競爭格局

  • 介紹
  • 公司市佔率分析
  • 競爭定位矩陣
  • 戰略展望矩陣

第 5 章:市場估計與預測:依產品類型,2021-2032

  • 主要趨勢
  • BNC 連接器
  • SMA連接器
  • MCX/MMCX 連接器
  • N 型連接器
  • TNC連接器
  • F 型連接器
  • 超高頻連接器
  • QMA連接器
  • 其他(例如 SMB、SMC、SMP)

第 6 章:市場估計與預測:依頻率範圍,2021-2032 年

  • 主要趨勢
  • 低頻(< 1 GHz)
  • 中頻(1-6 GHz)
  • 高頻(> 6 GHz)

第 7 章:市場估計與預測:按安裝類型,2021-2032 年

  • 主要趨勢
  • 邊緣安裝
  • 通孔
  • 面板安裝
  • PCB安裝
  • 其他

第 8 章:市場估計與預測:按材料分類,2021-2032 年

  • 主要趨勢
  • 黃銅
  • 鈹銅
  • 不銹鋼
  • 其他

第 9 章:市場估計與預測:依電鍍分類,2021-2032 年

  • 主要趨勢
  • 金子
  • 其他

第 10 章:市場估計與預測:依應用分類,2021-2032

  • 主要趨勢
  • 無線基礎設施
  • 測試和測量設備
  • 衛星通訊
  • 廣播設備
  • 天線系統
  • 物聯網設備
  • 醫療器材
  • 其他

第 11 章:市場估計與預測:依最終用途產業,2021-2032 年

  • 主要趨勢
  • 電信
  • 航太與國防
  • 消費性電子產品
  • 汽車
  • 工業的
  • 資訊科技與網路
  • 衛生保健
  • 其他

第 12 章:市場估計與預測:按地區分類,2021-2032 年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 俄羅斯
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲
  • 拉丁美洲
    • 巴西
    • 墨西哥
  • MEA
    • 南非
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國

第 13 章:公司簡介

  • Amphenol Corporation
  • Anritsu Corporation
  • AVX Corporation
  • Belden Inc.
  • Bomar Interconnect Products, Inc.
  • Carlisle Interconnect Technologies
  • Corning Optical Communications
  • Delta Electronics, Inc.
  • Digi-Key Electronics
  • Hirose Electric Co., Ltd.
  • HUBER+SUHNER
  • JAE (Japan Aviation Electronics Industry, Ltd.)
  • Johanson Technology, Inc.
  • L-com Global Connectivity
  • Molex, LLC
  • Pasternack Enterprises Inc.
  • Radiall SA
  • RF Industries, Ltd.
  • Rosenberger Hochfrequenztechnik GmbH & Co. KG
  • Samtec Inc.
  • Smiths Interconnect
  • TE Connectivity Ltd.
  • WL Gore & Associates, Inc.
簡介目錄
Product Code: 11948

The Global RF Connectors Market was valued at USD 32 billion in 2023 and is projected to grow at a CAGR of 7.7% from 2024 to 2032. A major factor driving this growth is the extension of 112G PAM4 connection in enterprise networks, which demands high-performance RF connectors for faster data transmission and improved efficiency. As data rates increase, the need for reliable RF connectors becomes essential, especially in enterprise networking, where managing large data volumes requires robust and seamless connectivity. These connectors are vital for integrating networking devices such as switches, routers, and security appliances, enabling smooth communication across various systems. The exceptional strength and flexibility ensure reliable, consistent connections, even in challenging environments.

Furthermore, its capacity to perform well at high frequencies makes it a preferred choice in advanced communication technologies such as 5G. As industries increasingly seek connectors that combine durability with high performance, the necessity for beryllium copper in RF components is steadily growing, fueling its rapid market expansion. The market is categorized by mounting type into edge mount, through-hole, panel mount, PCB mount, and others. The PCB mount segment is expected to reach USD 22.9 billion by 2032, making it the fastest-growing segment.

PCB mount connectors are extensively used across industries such as telecommunications, automotive, consumer electronics, and aerospace. These connectors enable efficient integration of RF connectors straight onto printed circuit boards, making them indispensable in today's compact and high-performance electronic devices. In terms of material, beryllium copper is the fastest-growing segment, with an expected CAGR of 9.2% between 2024 and 2032. Its superior mechanical and electrical properties, including excellent conductivity, durability, and corrosion resistance, make it ideal for high-demand applications in telecommunications, aerospace, and military sectors. Beryllium copper's strength and flexibility ensure consistent and reliable connections, even in harsh environments.

Market Scope
Start Year2023
Forecast Year2024-2032
Start Value$32 Billion
Forecast Value$61.8 Billion
CAGR7.7%

The U.S. held a 77.9% share of the North America RF connectors market in 2023, backed by strong needs across the aerospace, telecommunications industries, and automotive. The push towards 5G network deployment, alongside advancements in military and defense communication systems, has sharply increased the demand for high-performance RF connectors. Furthermore, the presence of key manufacturers and ongoing innovations in wireless communication technology are fueling market growth. However, growing competition from alternative wireless connectivity solutions poses a challenge for traditional RF connector manufacturers to retain their market share.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definitions
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculations
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry synopsis, 2021-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Factor affecting the value chain
    • 3.1.2 Profit margin analysis
    • 3.1.3 Disruptions
    • 3.1.4 Future outlook
    • 3.1.5 Manufacturers
    • 3.1.6 Distributors
  • 3.2 Supplier landscape
  • 3.3 Profit margin analysis
  • 3.4 Key news & initiatives
  • 3.5 Regulatory landscape
  • 3.6 Impact forces
    • 3.6.1 Growth drivers
      • 3.6.1.1. Expansion of 112 G PAM4 connectivity into enterprise networks
      • 3.6.1.2 Increased investment in modern communication networks
      • 3.6.1.3 Increased demand for reliable connectivity solutions.
      • 3.6.1.4. Adoption in V2 X and ADAS technologies.
      • 3.6.1.5 Need for high-performance, rugged connectors
    • 3.6.2 Industry pitfalls & challenges
      • 3.6.2.1 Advanced designs require specialized expertise and resources.
      • 3.6.2.2 Intense competition leads to pricing pressures.
  • 3.7 Growth potential analysis
  • 3.8 Porter's analysis
  • 3.9 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Product Type, 2021-2032 (USD Billion)

  • 5.1 Key trends
  • 5.2 BNC connectors
  • 5.3 SMA connectors
  • 5.4 MCX/MMCX connectors
  • 5.5 N-Type connectors
  • 5.6 TNC connectors
  • 5.7 F-Type connectors
  • 5.8 UHF connectors
  • 5.9 QMA connectors
  • 5.10 Others (e.g., SMB, SMC, SMP)

Chapter 6 Market Estimates & Forecast, By Frequency Range, 2021-2032 (USD Billion)

  • 6.1 Key trends
  • 6.2 Low frequency (< 1 GHz)
  • 6.3 Medium frequency (1-6 GHz)
  • 6.4 High frequency (> 6 GHz)

Chapter 7 Market Estimates & Forecast, By Mounting Type, 2021-2032 (USD Billion)

  • 7.1 Key trends
  • 7.2 Edge mount
  • 7.3 Through hole
  • 7.4 Panel mount
  • 7.5 PCB mount
  • 7.6 Others

Chapter 8 Market Estimates & Forecast, By Material, 2021-2032 (USD Billion)

  • 8.1 Key trends
  • 8.2 Brass
  • 8.3 Beryllium copper
  • 8.4 Stainless steel
  • 8.5 Aluminum
  • 8.6 Others

Chapter 9 Market Estimates & Forecast, By Plating, 2021-2032 (USD Billion)

  • 9.1 Key trends
  • 9.2 Gold
  • 9.3 Silver
  • 9.4 Nickel
  • 9.5 Others

Chapter 10 Market Estimates & Forecast, By Application, 2021-2032 (USD Billion)

  • 10.1 Key trends
  • 10.2 Wireless infrastructure
  • 10.3 Test & measurement equipment
  • 10.4 Satellite communication
  • 10.5 Broadcast equipment
  • 10.6 Antenna systems
  • 10.7 IoT devices
  • 10.8 Medical devices
  • 10.9 Others

Chapter 11 Market Estimates & Forecast, By End Use Industry, 2021-2032 (USD Billion)

  • 11.1 Key trends
  • 11.2 Telecommunications
  • 11.3 Aerospace & defense
  • 11.4 Consumer electronics
  • 11.5 Automotive
  • 11.6 Industrial
  • 11.7 IT & networking
  • 11.8 Healthcare
  • 11.9 Others

Chapter 12 Market Estimates & Forecast, By Region, 2021-2032 (USD Billion)

  • 12.1 Key trends
  • 12.2 North America
    • 12.2.1 U.S.
    • 12.2.2 Canada
  • 12.3 Europe
    • 12.3.1 UK
    • 12.3.2 Germany
    • 12.3.3 France
    • 12.3.4 Italy
    • 12.3.5 Spain
    • 12.3.6 Russia
  • 12.4 Asia Pacific
    • 12.4.1 China
    • 12.4.2 India
    • 12.4.3 Japan
    • 12.4.4 South Korea
    • 12.4.5 Australia
  • 12.5 Latin America
    • 12.5.1 Brazil
    • 12.5.2 Mexico
  • 12.6 MEA
    • 12.6.1 South Africa
    • 12.6.2 Saudi Arabia
    • 12.6.3 UAE

Chapter 13 Company Profiles

  • 13.1 Amphenol Corporation
  • 13.2 Anritsu Corporation
  • 13.3 AVX Corporation
  • 13.4 Belden Inc.
  • 13.5 Bomar Interconnect Products, Inc.
  • 13.6 Carlisle Interconnect Technologies
  • 13.7 Corning Optical Communications
  • 13.8 Delta Electronics, Inc.
  • 13.9 Digi-Key Electronics
  • 13.10 Hirose Electric Co., Ltd.
  • 13.11 HUBER+SUHNER
  • 13.12 JAE (Japan Aviation Electronics Industry, Ltd.)
  • 13.13 Johanson Technology, Inc.
  • 13.14 L-com Global Connectivity
  • 13.15 Molex, LLC
  • 13.16 Pasternack Enterprises Inc.
  • 13.17 Radiall SA
  • 13.18 RF Industries, Ltd.
  • 13.19 Rosenberger Hochfrequenztechnik GmbH & Co. KG
  • 13.20 Samtec Inc.
  • 13.21 Smiths Interconnect
  • 13.22 TE Connectivity Ltd.
  • 13.23 W.L. Gore & Associates, Inc.