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1398976

保持領先地位-半導體產業分析超值套件(2023):報告(7 卷)-台灣,中國和全球IC設計製造(代工,記憶體)和IC OSAT產業洞察,供應鏈

Stay Ahead - 2023 Semiconductor Industry Research Value Pack: 7 Reports Bundle Encompasses IC Design, IC Manufacturing (Foundry, Memory) and IC OSAT Industry Insights and Supply Chains in Taiwan, China, and the World
出版日期: | 出版商: MIC - Market Intelligence & Consulting Institute | 英文 80 Pages | 訂單完成後即時交付

價格

執行摘要

本報告包全面分析全球、中國及台灣IC設計、IC製造（晶圓代工、記憶體）、IC OSAT（半導體封裝及測試外包）產業，以及各供應鏈結構及最新動態（2022-2023）。

儘管面臨高通膨、俄烏戰爭等不利因素，2022年全球半導體產業仍將維持兩位數成長。這一趨勢受到上半年銷售成長以及網路和資料中心晶片銷售強勁的支持。受整體宏觀經濟環境影響，預計2023年全球半導體市場規模將下降10.1%至5,161億美元。內存IC產業今年受到的影響尤其嚴重。幸運的是，自2023年第一季以來，全球主要儲存IC製造商都實施了減產控制並穩定了出貨價格。預計年增率為46.3%的儲存IC產業，2024年市場規模將達到1,343億美元，2025年和2026年將持續高成長，年成長率分別為38.7%和13.1%。預計預計該行業將成為未來三年全球半導體市場成長的主要推動力。

目錄

全球IC設計產業：概況（2022年）與發展（2023年）

第一章 全球IC設計產業發展（2022年）

  • 全球10強IC設計公司排名（2022年）
  • IC設計產業整體表現（2022年）

第二章 主要IC設計公司業務發展狀況（2022年）

  • Qualcomm、MediaTek
  • Nvidia、AMD
  • Broadcom、Marvell

第三章 全球IC設計產業發展（2023年）

  • 由於智慧型手機和PC市場復甦延遲，2023年下半年前景不確定
  • 人工智慧應用的興起為雲端伺服器和邊緣運算晶片帶來機遇

附錄

  • 公司名單
  • 全球半導體代工產業：概況（2022年）與發展（2023年）

第一章 全球鑄造產業概況（2022年）

  • 全球半導體代工市場規模（2022年）
  • 全球10大半導體代工廠排名（2022年）
  • 半導體代工產業整體表現（2022年）

第二章 主要半導體代工廠發展趨勢（2022年）

  • TSMC
  • Samsung
  • UMC、PSMC、Vanguard
  • SMIC
  • GlobalFoundries

第三章 全球半導體代工產業發展（2023年）

  • 晶圓代工營運預計2023年上半年觸底，但2023年下半年復甦步伐仍不確定性
  • Intel全新IFS商業模式改變全球半導體代工格局

附錄

  • 公司名單
  • 全球IC封裝測驗產業：概況（2022年）與發展（2023年）

第一章 全球封測產業概況（2022年）

  • 全球IC封測產業市場規模及前10家OSAT排名（2022年）
  • 全球IC封裝測試產業整體表現（2022年）

第二章 主要封測企業經營績效（2022年）

  • ASE Holdings、PTI、KYEC
  • Amkor、JCET

第三章 全球封測產業展望

  • 隨著消費性電子產品需求下滑，OSAT 將重點轉向汽車晶片
  • 領導企業加速開發先進封裝技術，因應 HPC 和 AI 應用的新興趨勢

附錄

  • 公司名單
  • 中國IC設計產業發展及主要企業

第一章 中國IC設計產業概況

  • IC設計產業市場規模趨勢
  • IC設計產業企業分佈
    • IC設計公司數量趨勢
    • IC設計公司分佈：依規模
    • IC設計產品分佈：依類別

第二章 我國主要IC設計公司發展狀況

  • Huawei HiSilicon
  • Unisoc
  • GigaDevice
  • Will Semiconductor

第三章我國IC設計業的發展

  • 中國積體電路自給率
  • EDA 出口禁令的後續影響

第 4 章 MIC 視角

附錄

  • 公司名單
  • 中國IC封測產業發展及主要企業

第一章 中國積體電路封測產業發展

  • 中國IC封測產業市場規模及近期變化
  • 中國IC封測產業企業區域分佈

第二章 本國主要IC封測企業發展狀況

  • 中國IC封測企業：10強企業排名
  • 中國封測企業：近期業績前三名
    • JCET
    • Tongfu Microelectronics
    • Huatian Technology

第三章 產業展望

  • 國家積體電路產業投資基金效應
  • 中美衝突與與中國脫鉤的影響
  • 先進製程技術失敗後中國將重點轉向汽車半導體

附錄

  • 公司名單
  • 台灣半導體產業格局：2023年及以後
  • 台灣在全球半導體產業的地位與發展
  • 台灣半導體產業重點領域發展
  • 台灣半導體產業主要動態（2023年第三季起）

第一章 半導體產業發展

  • 積體電路設計
    • 旺季表現未達預期（2023年下半年）
    • 隨著人工智慧熱潮持續，IC設計公司向多種應用領域多元化發展
  • 積體電路製造
    • 晶圓代工前景謹慎：訂單能見度低
    • 預計2023年第四季至2024年上半年內存需求和供應將保持穩定。
  • IC封裝/檢驗
    • 消費市場動能恢復，旺季影響
    • HPC和AI應用新趨勢對先進封裝和測試的需求持續成長

附錄

  • 公司名單
Product Code: SCRPT23112401

Executive Summary

This pack offers comprehensive insights into the IC design, IC manufacturing (foundry, memory), and IC OSAT (Outsourced Semiconductor Assembly and Testing) sectors, covering global, Taiwan, and China, along with their respective supply chains for the period 2022-2023 and beyond.

Despite adverse factors such as high inflation rates and the Russia-Ukraine war, the global semiconductor industry sustained double-digit growth throughout 2022, supported by higher revenue in the first half and robust sales of networking and data center chips. In 2023, the global semiconductor market is expected to have declined by 10.1% to US$516.1 billion under the influence of the overall macroeconomic environment. Among them, the memory IC sector has been the most affected this year. Fortunately, since the first quarter of 2023, major global memory IC manufacturers have implemented production reduction controls, stabilizing shipment prices. With an expected year-on-year growth of 46.3%, the memory IC sector is anticipated to reach US$134.3 billion in 2024 and continue high growth in 2025 and 2026, with year-on-year growth rates of 38.7% and 13.1%, respectively. This sector is expected to be a major driving force for the global semiconductor market growth in the next three years.

Table of Contents

  • 2022 Recap and 2023 Development of the Global IC Design Industry

1.Development of the Global IC Design Industry in 2022

  • 1.1 Ranking of Global Top Ten IC Design Companies in 2022
  • 1.2 IC Design Industry's Overall Performance in 2022

2. Major IC Design Companies' Business Operations in 2022

  • 2.1 Qualcomm & MediaTek
  • 2.2 Nvidia & AMD
  • 2.3 Broadcom & Marvell

3.Development of the Global IC Design Industry in 2023

  • 3.1 Uncertain Outlook for 2H23 Due to Slow Recovery in the Smartphone and PC Markets
  • 3.2 Rise of AI Applications Driving Opportunities for Cloud Server and Edge Computing Chips

Appendix

  • List of Companies
  • 2022 Recap and 2023 Development of the Worldwide Semiconductor Foundry Industry

1.Global Foundry Industry Recap 2022

  • 1.1 Global Semiconductor Foundry Market Size in 2022
  • 1.2 Top Ten Global Semiconductor Foundry Rankings in 2022
  • 1.3 Overall Performance of the Semiconductor Foundry Industry in 2022

2. Development Trends of Major Semiconductor Foundries in 2022

  • 2.1 TSMC
  • 2.2 Samsung
  • 2.3 UMC, PSMC, Vanguard
  • 2.4 SMIC
  • 2.5 GlobalFoundries

3. Global Semiconductor Foundry Industry Development in 2023

  • 3.1 Foundry Operations Expected to Bottom Out in 1H23, Recovery Pace Remains Uncertain in 2H23
  • 3.2 Intel’s New IFS Business Model to Change the Global Semiconductor Foundry Landscape

Appendix

  • List of Companies
  • 2022 Recap and 2023 Development of the Global IC Packaging and Testing Industry

1. Recap of the Global IC Packaging and Testing Industry in 2022

  • 1.1 Market Size and Top Ten OSAT Rankings in the Global IC Packaging and Testing Industry in 2022
  • 1.2 Overall Performance of the Global IC Packaging and Testing Industry in 2022

2.Operational Performance of Major OSAT Companies in 2022

  • 2.1 ASE Holdings, PTI, KYEC
  • 2.2 Amkor, JCET

3. Outlook for the Global IC Packaging and Testing Industry

  • 3.1 OSATs Shifting Focus to Automotive Chips While Consumer Electronics Demand Weakening
  • 3.2 Leading Players Accelerate Advanced Packaging Technology Development to Meet Emerging HPC and AI Application Trends

Appendix

  • List of Companies
  • Development of the IC Design Industry and Major Players in China

1.Overview of the IC Design Industry in China

  • 1.1 Changes in the Market Size of the IC Design Industry
  • 1.2 Distribution of IC Design Industry Players
    • 1.2.1 Changes in the Number of IC Design Companies
    • 1.2.2 Distribution of IC Design Industry Players by Scale
    • 1.2.3 Distribution of IC Design Products by Category

2. Development of Major IC Design Companies in China

  • 2.1 Huawei HiSilicon
  • 2.2 Unisoc
  • 2.3 GigaDevice
  • 2.4 Will Semiconductor

3. Development of the IC Design Industry in China

  • 3.1 Independent IC Supply Rate in China
  • 3.2 The Subsequent Impact of the EDA Ban

4.MIC Perspective

Appendix

  • List of Companies
  • Development of the China IC Packaging and Testing Industry and Key Players

1.Development of China IC Packaging and Testing Industry

  • 1.1 Market Size and Recent Changes in China's IC Packaging and Testing Industry
  • 1.2 Regional Distribution of IC Packaging and Testing Industry Players in China

2.Development of major IC Packaging and Testing Players in China

  • 2.1 Ranking of the Top-10 Chinese IC Packaging and Testing Companies
  • 2.2 Recent Performance of the Top-3 Chinese IC Packaging and Testing Companies
    • 2.2.1 JCET
    • 2.2.2 Tongfu Microelectronics
    • 2.2.3 Huatian Technology

3.Outlook for the Industry

  • 3.1 Effects of National Integrated Circuit Industry Investment Fund
  • 3.2 Impact of US-China Conflict and Decoupling from China
  • 3.3 China Shifting Focus to Automotive Semiconductors Following Obstacles in Advanced Process Technology

Appendix

  • List of Companies
  • Taiwanese Semiconductor Industry Landscape, 2023 and Beyond
  • Taiwan's Global Position and Development in the Semiconductor Industry
  • Development of Taiwan's Major Semiconductor Industry Sectors
  • Key Developments in the Taiwan Semiconductor Industry, 3Q 2023 and Beyond

1.Development of the Semiconductor Industry

  • 1.1 IC Design
    • 1.1.1 Peak Season Performance Fails to Meet Expectations in 2H23
    • 1.1.2 IC Design Firms Diversify into Multiple Applications amid Continued AI Boom
  • 1.2 IC Manufacturing
    • 1.2.1 Wafer Foundry Outlook Cautious due to Low Order Visibility
    • 1.2.2 Memory Supply and Demand Expected to Stabilize during 4Q23 to 1H24
  • 1.3 IC Packaging and Testing
    • 1.3.1 Peak Season Effect Depending on Consumer Market Momentum Pickups
    • 1.3.2 Emerging Trends in HPC and AI Applications Continue to Drive Demand for Advanced Packaging and Testing

Appendix

  • List of Companies

List of Tables

  • 2022 Recap and 2023 Development of the Global IC Design Industry
  • Table 1 Ranking of Global Top Ten IC Design Companies in 2022
  • 2022 Recap and 2023 Development of the Worldwide Semiconductor Foundry Industry
  • Table 1: Top Ten Global Semiconductor Foundry Rankings in 2022
  • 2022 Recap and 2023 Development of the Global IC Packaging and Testing Industry
  • Table 1 Global Top Ten OSAT Rankings in 2022
  • Development of the China IC Packaging and Testing Industry and Key Players
  • Table 1 Ranking of the Top-10 Chinese IC Packaging and Testing Companies in 2022

List of Figures

  • 2022 Recap and 2023 Development of the Global IC Design Industry
  • Figure 1 Leading IC Design Companies' Changes in Inventory Turnover Days, 1Q21 - 1Q23
  • Figure 2 Leading IC Design Companies' Revenue Changes, 1Q22 - 1Q23
  • Figure 3 Qualcomm's 2022 Revenue by Product Line
  • Figure 4 MediaTek's 2022 Revenue by Product Line
  • Figure 5 Nvidia's 2022 Revenue by Product Line
  • Figure 6 AMD's 2022 Revenue by Product Line
  • Figure 7 Broadcom's 2022 Revenue by Semiconductor Solutions Product Line
  • Figure 8 Marvell's 2022 Revenue by Product Line
  • 2022 Recap and 2023 Development of the Worldwide Semiconductor Foundry Industry
  • Figure 1 Comparison of Major Foundries’ Gross Margin Changes, 2021 - 2022
  • Figure 2 TSMC’s Revenue Changes by Product Applications, 2021-2022
  • Figure 3 Samsung’s Revenue Changes by Business Segments, 2021-2022
  • Figure 4 UMC’s Revenue Changes by Product Applications, 2021-2022
  • Figure 5 PSMC’s Revenue Changes by Product Applications, 2021-2022
  • Figure 6 Vanguard’s Revenue Changes by Product Applications, 2020-2021
  • Figure 7 SMIC’s Revenue Changes by Product Applications, 2021-2022
  • Figure 8 GlobalFoundries’ Revenue Changes by Product Applications, 2021-2022
  • Figure 9 Intel's IDM 2.0 Business Model
  • 2022 Recap and 2023 Development of the Global IC Packaging and Testing Industry
  • Figure 1: Revenue Changes of Major OSAT Companies, 1Q22 - 2Q23
  • Figure 2: Gross Margin Changes of Major OSAT Companies, 1Q22 - 2Q23
  • Figure 3: ASE ATM’s Revenue Changes by Product Application, 2020 - 2022
  • Figure 4: ASE ATM’s Revenue Changes by Packaging & Testing Product Portfolio, 2020 - 2022
  • Figure 5: PTI's Revenue Changes by Services, 2020 - 2022
  • Figure 6: PTI's Revenue Changes by Products, 2020 - 2022
  • Figure 7: KYEC's Revenue Changes by Process Nodes, 2020 - 2022
  • Figure 8: KYEC's Revenue Changes by Product Applications, 2020 - 2022
  • Figure 9: Amkor's Revenue Changes by Packaging & Testing Types, 2020 - 2022
  • Figure 10: Amkor's Revenue Changes by End Product Applications, 2020 - 2022
  • Figure 11: JCET's Revenue Changes by End-Product Applications, 2021 - 2022
  • Figure 12: Revenue Changes in Major OSAT Companies' Computing Business in 2022
  • Development of the IC Design Industry and Major Players in China
  • Figure 1. Shipment Value of the Semiconductor Industry in China, 2017-2021
  • Figure 2. IC Design Market Size and Changes in China, 2017-2022
  • Figure 3. Changes in the number of IC Design Companies in China from 2016 to 2022
  • Figure 4. Scale Distribution of IC Design Industry in China in 2022
  • Figure 5. Distribution of IC Design Product Revenue and Number of IC Design Companies in China
  • Figure 6. GigaDevice’s Financial Report Performance from the First Quarter of 2021 to the Third Quarter of 2022
  • Figure 7. GigaDevice's Revenue Proportion of Each Product Line, 1H 2020 - 1H 2022
  • Figure 8. Will Semiconductor's Financial Report Performance, 1Q 2021 - 3Q2022
  • Figure 9. Revenue Proportion of Will Semiconductor’s Product Lines in 2019-2021
  • Figure 10. Changes in IC Self-Sufficiency Rate in China, 2010-2026
  • Development of the China IC Packaging and Testing Industry and Key Players
  • Figure 1 Chinese IC Packaging and Testing Shipment Value, 2018-2022
  • Figure 2 Regional Distribution of IC Packaging and Testing Brands in China
  • Figure 3 Financial Information of JCET, 2018-2022
  • Figure 4 Revenue of JCET by Product Application, 2021-2022
  • Figure 5 Financial Information of Tongfu Microelectronics, 2018-2022
  • Figure 6 Financial Information of Huatian Technology, 2018-2022

List of Topics

Development of the global, China, and Taiwan IC design industry in 2022-2023, covering respective company rankings, their performance overview in 2022, and development strategies of major players such as Qualcomm, MediaTek, Nvidia, AMD, Broadcom, Marvell, Huawei Hisilicon, Unisoc, GigaDevice, Will Semiconductor, etc.

Development of the global and Taiwan semiconductor foundry industry in 2022-2023, addressing respective foundry rankings, their performance overview in 2022, and development strategies of key players such as TSMC, Samsung, UMC, PSMC, VSI (Vanguard), SMIC, GlobalFoundries, etc.

Development of the global, China, and Taiwan IC OSAT (Outsourced Semiconductor Assembly and Testing) industry in 2022-2023, including respective foundry rankings, their performance overview, and development strategies of key players such as ASE, PTI, KYEC, Amkor, JCET, Tongfu Microelectronics, Huatian Technology, etc.

Companies covered

Alchip
Amazon
AMD
Amkor
Apple
Ardentec
ASE Group
ASEN Semiconductors
Baidu
Biren
Bitmain
Cadence
Geely
Bosch
Broadcom
China Wafer Level
Chipmore Technology
ChipMOS
Chrysler
DB HiTek
Dell
Denso
Episil
Faraday
FlipChip International
FocalTech
Ford
Forehope Electronic
Formosa Advanced
General Motors
GigaDevice
Global Unichip
GlobalFoundries
Google
Hana Microelectronics
Himax
HiSilicon
Hongxin Semiconductor
HP
HSMC
Huawei
Jinan Quanxin
Macronix
Hua Hong Semiconductor
Huahong Group
Huatian Technology
Infineon
Intel
Inventec
JCET
Kore Semiconductor
KYEC
Lingsen Precision
Macronix
Marvell
MediaTek
MediaTek
Micron
OmniVision
Qualcomm
RDA Microelectronics
Siemens
Silead
Micron
Mosel
Nanya Technology
Nepes
Nexchip
Novatek
Nuvoton
Nvidia
NXP
Onsemi
Open AI
Orient Semiconductor
Payton Technology
Powertech Technology
PSMC
Qorvo
Qualcomm
Quanta
Realtek
Samsung
SFA
Sigurd Microelectronics
Siliconware
SJ Semiconductor
SK Hynix
Skyworks
SMIC
Sony
Spreadtrum
Synopsys
STATS ChipPAC
STMicroelectronics
Sunplus
Supermicro
Texas Instruments
Tongfu Electronics
Tower
Tsinghua Unigroup
TSMC
UMC
Unimos Microelectronics
Unisem
Unisoc
Unitech Holdings
UTAC
Vanguard
VIS
Walton Advanced Engineering
Will Semiconductor
Winbond
Wise Road Capital
Wistron
Xilinx
YTEC