市場調查報告書
商品編碼
1557674
全球半導體產業鏈發展及策略定位Development and Strategic Position of the Global Semiconductor Industry Chain |
由於地緣政治風險加大、衝突持續、西方貨幣政策緊縮、全國選舉和自然災害帶來的不確定性等因素變化,全球經濟表現與2023年相比可能繼續保持持平或疲軟。儘管面臨更廣泛的經濟挑戰,半導體市場仍接近完成去庫存。在汽車、高效能運算 (HPC) 和物聯網 (AIoT) 領域長期需求的支撐下,隨著終端產品需求逐漸復甦,半導體市場重回成長軌道,達到兩位數。本報告概述了全球半導體市場,分析了三大 DRAM 供應商 (Samsung、SK Hynix、Micron) 的競爭格局,並考察了 3D NAND 和主要晶圓代工廠的未來發展 (截至2025年) 。
With escalating geopolitical risks, ongoing conflicts, tighter monetary policies in Europe and the U.S., and variables such as uncertainties from national elections and natural disasters, global economic performance is expected to remain flat or subdued compared to 2023. Despite the broader economic challenges, the semiconductor market is seeing a nearing completion of inventory adjustments. As demand for terminal products gradually recovers and long-term needs in automotive, high-performance computing (HPC), and Artificial Intelligence of Things (AIoT) sectors provide support, the semiconductor market is anticipated to return to a growth trajectory, with potential for double-digit growth. This report offers an overview of the global semiconductor market performance, analyzes the competitive landscape of three dynamic random access memory (DRAM) suppliers—Samsung, SK Hynix, and Micron—and explores the future development of 3D NAND and major wafer foundries through 2025.