市場調查報告書
商品編碼
1422811
2024-2032 年半導體介質蝕刻設備市場報告(按類型(濕蝕刻設備、乾蝕刻設備)、應用(鑄造廠、整合裝置製造商 (IDM))和地區Semiconductor Dielectric Etching Equipment Market Report by Type (Wet Etching Equipment, Dry Etching Equipment), Application (Foundries, Integrated Device Manufacturers (IDMs)), and Region 2024-2032 |
2023年全球半導體介質蝕刻設備市場規模達13億美元。展望未來, IMARC Group預計到2032年市場規模將達到18億美元,2024-2032年複合年成長率(CAGR)為3.26%。電子產業的大幅擴張、半導體需求的不斷成長以及智慧型設備的日益普及是推動市場發展的一些關鍵因素。
半導體介質蝕刻設備(SDEE)是指在半導體製造過程中用於拋光和去除各種介質物質(例如光阻掩模、氧化矽和氮化矽)的專用設備。它包括濕法和乾蝕刻設備,與多種化學品一起使用。在某些情況下,由於更高的輪廓控制,一氧化碳也用於介電蝕刻過程。這些產品有助於雕刻出不同的物理特徵,包括高縱橫比 (HAR)、深溝槽和大空腔。 SDEE 在營運過程中提供更高的精確度,實現流程自動化,減少工作危險,並且更容易處置。
電子產業的大幅擴張以及智慧型手機、平板電腦和桌上型電腦等各種高性能消費性電子產品的購買量不斷增加,是推動市場成長的主要因素。這可以進一步歸因於半導體電路小型化的持續趨勢,這促進了對介電蝕刻設備的需求。此外,最近全球範圍內的工業自動化促使原始設備製造商(OEM)廣泛使用該產品來製造平板顯示器和非與(NAND)閃存,這是另一個成長誘導因素。與此一致的是,重大技術進步,例如用於最佳化半導體生產作業的電介質蝕刻設備能力的發展,正在支持市場成長。此外,機器學習(ML)、人工智慧(AI)功能、物聯網(IoT)和汽車感測器的大規模整合以提供更高的精度,有利於市場成長。此外,自動駕駛汽車的不斷發展進一步加劇了半導體在汽車中的使用,從而推動了市場的成長。鰭狀場效電晶體 (FinFET) 架構的廣泛採用也推動了市場的發展。由於FinFET設計採用電介質蝕刻作為其設計過程中主要的蝕刻步驟之一,因此預計這將促進對半導體電介質蝕刻設備的需求。其他因素,例如主要參與者最近的併購 (M&A)、最近推出更有效的產品變體的創新以及廣泛的研發 (R&D) 活動,正在為市場創造積極的前景。
The global semiconductor dielectric etching equipment market size reached US$ 1.3 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 1.8 Billion by 2032, exhibiting a growth rate (CAGR) of 3.26% during 2024-2032. The significant expansion in the electronics industry, the rising demand for semiconductors, and the increasing penetration of smart devices represent some of the key factors driving the market.
Semiconductor dielectric etching equipment (SDEE) refers to specialized apparatus that is employed to polish and remove various dielectric substances, such as photo-resist mask, silicon oxide, and silicon nitride, during the semiconductor manufacturing procedure. It includes wet and dry etching equipment, which is used with numerous chemicals. In some instances, carbon monoxide is also utilized in the dielectric etching procedure due to higher profile control. These products help carve out varying physical features, including high aspect ratio (HAR), deep trenches, and large cavities. SDEE offers more precision during operations, automates processes, reduces work hazards, and is easier to dispose.
The significant expansion in the electronics sector and the increasing purchase of various high-performance consumer electronic products, such as smartphones, tablets, and desktops, represent a major factor driving the market toward growth. This can be further attributed to the ongoing trend of miniaturizing semiconductor circuits, which is facilitating the demand for dielectric etching equipment. Additionally, the recent industrial automation across the globe has prompted original equipment manufacturers (OEMs) to widely use the product to fabricate flat panel display screens and not-and (NAND) flash memory, which is acting as another growth-inducing factor. In line with this, significant technological advancements, such as the developments in the dielectric etching equipment capabilities to optimize the semiconductor production operations, are supporting the market growth. Moreover, the large-scale integration of machine learning (ML), artificial intelligence (AI) capabilities, Internet of Things (IoT), and automotive sensors to offer more precision is favoring the market growth. Furthermore, the continuous development of autonomous vehicles has further intensified the usage of semiconductors in vehicles, which is propelling the market growth. The market is also being driven by the widespread adoption of fin-shaped field effect transistor (FinFET) architecture. Since FinFET design uses dielectric etching as one of the major etching steps in its designing process, this is expected to facilitate the demand for semiconductor dielectric etching equipment. Other factors, such as the recent mergers and acquisitions (M&A) amongst key players, recent innovations to introduce more effective product variants, and extensive research and development (R&D) activities, are creating a positive outlook for the market.
IMARC Group provides an analysis of the key trends in each segment of the global semiconductor dielectric etching equipment market, along with forecasts at the global, regional, and country level from 2024-2032. Our report has categorized the market based on type and application.
Wet Etching Equipment
Dry Etching Equipment
The report has also provided a detailed breakup and analysis of the semiconductor dielectric etching equipment market based on the type. This includes wet and dry etching equipment. According to the report, dry etching equipment represented the largest segment.
Foundries
Integrated Device Manufacturers (IDMs)
A detailed breakup and analysis of the semiconductor dielectric etching equipment market based on the application has also been provided in the report. This includes foundries and integrated device manufacturers (IDMs). According to the report, IDMs accounted for the largest market share.
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The report has also provided a comprehensive analysis of all the major regional markets that include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific was the largest market for semiconductor dielectric etching equipment. Some of the factors driving the Asia Pacific semiconductor dielectric etching equipment market included extensive research and development (R&D) activities, the increasing demand for smart devices, and significant technological advancements.
The report has also provided a comprehensive analysis of the competitive landscape in the global semiconductor dielectric etching equipment market. Detailed profiles of all major companies have also been provided. Some of the companies covered include Advanced Micro-Fabrication Equipment Inc. China, Applied Materials Inc., Hitachi High-Technologies Corporation (Hitachi Ltd), Lam Research Corporation, Mattson Technology, Oxford Instruments, SPTS Technologies Ltd. (KLA Corporation), Tokyo Electron Limited, etc.