市場調查報告書
商品編碼
1541440
2024-2032 年有機矽灌封膠市場報告(依固化技術、應用、最終用途產業及地區分類)Silicone Potting Compounds Market Report by Curing Technique, Application, End Use Industry, and Region 2024-2032 |
2023 年,全球有機矽灌封膠市場規模達到 10.828 億美元。 展望未來, IMARC Group預計到 2032 年,市場規模將達到 15.905 億美元,2024-2032 年複合年成長率 (CAGR) 為 4.2%。
有機矽灌封膠是一種液體材料,用於用固體化合物填充電子元件或組件,以保護其免受周圍環境的影響。熱固性塑膠、環氧樹脂、聚氨酯和矽橡膠凝膠是常用的有機矽灌封化合物。這些化合物一旦施加、固化和硬化,就會將電子元件封裝在固體中,從而提供防潮、振動、熱、污染和物理衝擊的屏障。它們可以使用手動或自動計量混合分配 (MMD) 設備應用於電源變壓器、電路板、繼電器、放大器、線圈和鐵氧體磁芯。它們還提供廣泛的工作溫度和硬度範圍,廣泛應用於各個行業,包括電子、航空航太、汽車、能源、船舶和太陽能。
全球電子產業的顯著成長是創造積極市場前景的關鍵因素之一。矽灌封化合物廣泛用於塗覆工業電子元件,例如電容器、螺線管、工業磁鐵、梁黏合元件、微處理器和儲存設備。此外,對消費性電子產品和小型設備不斷成長的需求也推動了市場的成長。導熱灌封膠提供了將熱量從發熱源消散到緊湊設備中金屬外殼的有效方法。與此一致的是,這些複合材料在航空航太工業中廣泛採用的減震和耐腐蝕性也促進了市場的成長。此外,各種產品創新,例如紫外線 (UV) 固化有機矽灌封化合物的開發,也是其他成長誘導因素。這些化合物具有增強的絕緣性能、黏合強度和更低的能耗。其他因素,包括快速工業化以及廣泛的研發(R&D)活動,預計將推動市場成長。
The global silicone potting compounds market size reached US$ 1,082.8 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 1,590.5 Million by 2032, exhibiting a growth rate (CAGR) of 4.2% during 2024-2032.
Silicone potting compounds are liquid materials used to fill electronic components or assemblies with solid compounds for protection against the surrounding environment. Thermosetting plastics, epoxy, polyurethane and silicon rubber gels are among the commonly used silicone potting compounds. These compounds, once applied, cured and hardened, encase the electronic components in a solid mass that provides a barrier against moisture, vibration, heat, contamination and physical shocks. They can be applied to power transformers, circuit boards, relays, amplifiers, coils and ferrite cores using manual or automated meter-mix-dispense (MMD) equipment. They also provide a wide operating temperature and hardness range and are widely used across various industries, including electronics, aerospace, automotive, energy, marine and solar power.
Significant growth in the electronics industry across the globe is one of the key factors creating a positive outlook for the market. Silicon potting compounds are widely used for coating industrial electronic components, such as capacitors, solenoids, industrial magnets, beam bonded components, microprocessors and memory devices. Moreover, the increasing demand for consumer electronics and miniaturized devices is providing a thrust to the growth of the market. Thermally conductive potting compounds offer effective pathways to dissipate the heat from a heat-generating source to a metal enclosure in compact devices. In line with this, the widespread adoption of these composites in the aerospace industry for shock insulation and corrosion resistance is also contributing to the market growth. Additionally, various product innovations, such as the development of ultraviolet (UV)-cured silicone potting compounds, are acting as other growth-inducing factors. These compounds offer enhanced insulation properties, bond strength and lower energy consumption. Other factors, including rapid industrialization, along with extensive research and development (R&D) activities, are anticipated to drive the market toward growth.
IMARC Group provides an analysis of the key trends in each sub-segment of the global silicone potting compounds market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on curing technique, application and end use industry.
UV Curing
Thermal Curing
Room Temperature Curing
Electricals
Capacitors
Transformers
Cable Joints
Industrial Magnets
Solenoids
Others
Electronics
Surface Mount Packages
Beam Bonded Components
Memory Devices and Microprocessors
Others
Consumer Electronics
Aerospace
Automotive
Energy and Power
Others
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The competitive landscape of the industry has also been examined along with the profiles of the key players being Altana AG, CHT Germany GmbH, Dymax Corporation, Henkel AG & Co. KGaA, Hernon Manufacturing Inc, Master Bond Inc., MG Chemicals, Novagard Solutions, Parker-Hannifin Corp. and The Dow Chemical Company (Dow Inc).