市場調查報告書
商品編碼
1636033
2025-2033 年按 IC 類型、應用程式和地區分類的音訊 IC 市場Audio IC Market by IC Type, Application, and Region 2025-2033 |
2024年全球音訊ICIMARC Group規模達366億美元。專業音響產業不斷成長的產品需求、設備小型化的不斷發展趨勢以及節能音訊設備製造技術的不斷進步是推動市場發展的一些關鍵因素。
音頻整合電路是一種分離的半導體元件,具有一組整合的電路,可執行音頻換能器或前級放大器的功能。它是一個執行音訊電路所有基本功能的單晶片,包括放大、濾波和輸入/輸出電路。通常,與分離式音訊電路相比,這種單晶片設計可提供增強的音質、更低的功耗和更低的製造成本。音頻 IC 放大器的主要功能是在不影響頻率或任何波長的情況下將訊號的振動增加到最大範圍,並有助於提高系統的效率。該晶片主要由內建音訊放大器、音訊處理器、MEMS麥克風和子系統組成。音訊積體電路 (IC) 種類繁多,例如音訊放大器、音訊 DSP、轉換器和處理器。音訊積體電路有很多用途,例如汽車音訊、專業音訊、智慧家庭和攜帶式設備。
全球市場主要由專業音響產業不斷成長的產品需求所推動。這可以歸因於媒體和通訊行業的大幅成長。與此一致的是,消費性電子設備、智慧家電和高品質音訊設備在大眾中的廣泛採用正在增加產品的使用量。此外,具有更好用戶體驗的節能和創新音訊設備製造領域的技術不斷進步,導致對音訊 IC 的需求不斷增加。設備小型化的不斷發展趨勢導致了專用 CPU 和子系統的開發,以整合電源以適應電腦的緊湊尺寸和重量。此外,互聯設備和物聯網 (IoT) 技術的快速發展導致音訊 IC 擴大整合到各種工業應用中。除此之外,無線和智慧基礎設施的日益普及,以及商業活動對高清音訊的需求不斷增加,也推動了市場的發展。對 SoC 的需求不斷成長以及整合音訊設備所涉及的技術缺陷和問題正在成為音訊 IC 市場成長的主要限制。相較之下,VR技術的眾多創新以及對車載媒體娛樂系統不斷成長的需求正在創造積極的市場前景。推動市場發展的其他一些因素包括快速城市化、工業 4.0 的出現、可支配收入水準的提高以及廣泛的研發 (R&D) 活動。
The global audio IC market size reached USD 36.6 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 62.0 Billion by 2033, exhibiting a growth rate (CAGR) of 5.72% during 2025-2033. Escalating product demand in the professional audio industry, growing trend of device miniaturization, and continual technological advancements in the manufacturing of energy-efficient audio devices represent some of the key factors driving the market.
An audio integrated circuit is a discrete semiconductor device with an integrated set of circuits that perform the function of an audio transducer or a preamplifier. It is a single chip that performs all the essential functions of an audio circuit, including amplification, filtering, and input/output circuitry. Typically, this single-chip design provides enhanced sound quality, lower power consumption, and reduced manufacturing costs as compared to discrete audio circuits. The primary function of audio IC amplifier is to increase vibrations to the maximum range of signals without impacting frequency or any wavelength and help improve the efficiency of a system. The chip is primarily composed of built-in audio amplifier, audio processor, MEMS microphone, and subsystems. There is a wide range of audio integrated circuits (ICs), like audio amplifiers, audio DSPs, converters, and processors. There are many uses for audio integrated circuits, like automotive audio, professional audio, smart homes, and portable devices.
The global market is primarily driven by the escalating product demand in the professional audio industry. This can be attributed to considerable growth in the media and communications sector. In line with this, the widespread adoption of consumer electronics devices, smart home appliances and advanced quality audio devices among the masses are augmenting the product uptake. Moreover, continual technological advancements in the manufacturing of energy-efficient and innovative audio devices with better user experience are resulting in an increased demand for audio ICs. The growing trend of device miniaturization is resulting in the development of application-specific CPUs and subsystems to incorporate the power to accommodate the compact size and weight of the computer. Additionally, rapid advancements in connected devices and the Internet of Things (IoT) technologies are resulting in the growing integration of audio ICs into a variety of industrial applications. Besides this, the increasing penetration of wireless and smart infrastructure, along with increased demand for high-definition audio at commercial events, is also propelling the market. The augmenting demand for SoC and technical flaws and problems involved with integrating audio devices are acting as major growth restraints for the audio IC market. In contrast, numerous innovations in the VR technology and increasing demand for on-board media entertainment systems is creating a positive market outlook. Some of the other factors contributing to the market include rapid urbanization, the advent of Industry 4.0, inflating disposable income levels and extensive research and development (R&D) activities.
IC Type Insights
Audio Amplifier
Audio DSP
Audio Codecs
Microphone IC
Application Insights
Mobile Phones
Computer and Tablets
Headphones
Home Entertainment Systems
Automotive
Smart Home and IoT Devices
Wearables
Others
Regional Insights
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The report has also provided a comprehensive analysis of all the major regional markets that include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and Middle East and Africa. According to the report, Asia Pacific was the largest market for audio IC. Some of the factors driving the Asia Pacific audio IC market include the increasing penetration of wireless and smart infrastructure, rapid urbanization, growing trend of device miniaturization, etc.
Competitive Landscape
The report has also provided a comprehensive analysis of the competitive landscape in the global audio IC market. Detailed profiles of all major companies have also been provided. Some of the companies covered include Analog Devices Inc., Cirrus Logic Inc., Infineon Technologies AG, NXP Semiconductors N.V., onsemi, Renesas Electronics Corporation, ROHM Co. Ltd., STMicroelectronics N.V., Texas Instruments Incorporated, Toshiba Corporation, etc.
Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.