市場調查報告書
商品編碼
1500566
薄膜封裝市場:按沉積技術、基板類型、應用、最終用途產業分類 - 2024-2030 年全球預測Thin-film Encapsulation Market by Deposition Technologies (Inorganic Layers, Organic Layers), Substrate Type (Glass, Metal, Plastic), Application, End-Use Industry - Global Forecast 2024-2030 |
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薄膜封裝市場規模預計2023年為3.1296億美元,預計2024年將達3.4207億美元,2030年將達5.9908億美元,複合年成長率為9.71%。
薄膜封裝 (TFE) 是指使用超薄層在敏感電子設備周圍形成屏障,例如有機發光二極體(OLED) 顯示器、軟性電子產品和太陽能板。該技術對於保護組件免受濕氣和氧氣侵入至關重要,濕氣和氧氣侵入會顯著降低設備性能和壽命。推動 TFE 擴大使用的關鍵因素包括對軟性和穿戴式電子產品的需求迅速成長、智慧型手機和電視中 OLED 技術的採用增加以及 TFE 材料和製程的持續進步。然而,TFE技術面臨擴充性和高成本,特別是對於大規模生產而言。解決這些限制需要繼續研究更高效的沉積技術,例如原子層沉積 (ALD) 和化學氣相沉積 (CVD),這將降低成本,並且可以提高擴充性。為了與旋轉性和折疊式智慧型手機以及快速成長的物聯網 (IoT) 設備等新技術整合,先進的薄膜封裝可確保在各種操作環境中的靈活性、耐用性和長壽命。
主要市場統計 | |
---|---|
基準年[2023] | 31296萬美元 |
預測年份 [2024] | 34207萬美元 |
預測年份 [2030] | 59908萬美元 |
複合年成長率(%) | 9.71% |
區域洞察
在美國,特別是美國,TFE市場的特點是對穿戴式裝置和軟性顯示器的高需求,這正在推動先進封裝技術的採用。生產尤其以創新主導,重點是由專注於尖端 TFE 解決方案的老牌公司和新創公司主導的新興企業。在龐大的消費性電子產業的推動下,以韓國、日本和中國等國家主導的亞太地區在數量上主導著 TFE 市場。在廣泛的政府措施以及龐大的供應商和製造商生態系統的支持下,該地區展現出快速的生產規模擴大能力、具有競爭力的製造成本和新技術的快速採用率。歐洲、中東和非洲地區在先進技術實施和調查方法之間取得了良好的平衡,歐洲國家在加強 OLED 照明、太陽能發電和軟性電子產品等多種應用的 TFE 方法方面做出了重大貢獻。歐洲、中東和非洲地區的公司經常強調永續和環保的生產流程,以符合該地區嚴格的環境法規。
FPNV定位矩陣
FPNV 定位矩陣對於評估供應商在薄膜封裝市場的定位至關重要。此矩陣提供了對供應商的全面評估,並檢查了與商務策略和產品滿意度相關的關鍵指標。這種詳細的評估使用戶能夠根據自己的要求做出明智的決定。根據評估結果,供應商被分為代表其成功程度的四個像限:前沿(F)、探路者(P)、利基(N)和重要(V)。
市場佔有率分析
市場佔有率分析是一種綜合工具,可對薄膜封裝市場供應商的現狀進行深入而詳細的評估。透過仔細比較和分析供應商的貢獻,您可以更深入地了解每個供應商的績效以及他們在爭奪市場佔有率時面臨的挑戰。這些貢獻包括整體收益、客戶群和其他關鍵指標。此外,該分析還提供了對該行業競爭性質的寶貴見解,包括在研究基準年期間觀察到的累積、分散主導地位和合併特徵等因素。有了這些詳細資訊,供應商可以做出更明智的決策並製定有效的策略,以在市場競爭中保持領先地位。
策略分析與建議
策略分析對於尋求在全球市場站穩腳跟的組織至關重要。對目前在薄膜封裝市場中的地位進行全面評估,使公司能夠做出符合其長期願望的明智決策。此關鍵評估涉及對組織的資源、能力和整體績效進行徹底分析,以確定核心優勢和需要改進的領域。
[199 Pages Report] The Thin-film Encapsulation Market size was estimated at USD 312.96 million in 2023 and expected to reach USD 342.07 million in 2024, at a CAGR 9.71% to reach USD 599.08 million by 2030.
Thin-film encapsulation (TFE) refers to the use of ultra-thin layers to create a barrier around sensitive electronic equipment, such as organic light-emitting diode (OLED) displays, flexible electronics, and solar panels. This technology is pivotal in protecting components from moisture and oxygen infiltration, which can significantly degrade device performance and longevity. The major factors driving the expansion of TFE use include the burgeoning demand for flexible and wearable electronics, the increasing adoption of OLED technology in smartphones and televisions, and the continuous advancements in TFE materials and processes. However, TFE technologies face challenges, particularly in terms of scalability and high cost for high-volume manufacturing. Addressing these restraints requires ongoing research into more efficient deposition techniques, such as atomic layer deposition (ALD) and chemical vapor deposition (CVD), that promise to lower costs and enhance scalability. The integration with emerging technologies such as rollable and foldable smartphones, as well as the burgeoning Internet of Things (IoT) devices, is expected to necessitate advanced thin-film encapsulation solutions to ensure flexibility, durability, and longevity in varying operational environments.
KEY MARKET STATISTICS | |
---|---|
Base Year [2023] | USD 312.96 million |
Estimated Year [2024] | USD 342.07 million |
Forecast Year [2030] | USD 599.08 million |
CAGR (%) | 9.71% |
Regional Insights
In the Americas, particularly the United States, the TFE market is characterized by a high demand for wearable devices and flexible displays, which drives the adoption of advanced encapsulation technologies. Production is notably innovation-driven, with a strong emphasis on R&D, led by established companies and startups focusing on cutting-edge TFE solutions. APAC, led by countries including South Korea, Japan, and China, dominates the TFE market in terms of volume, fueled by the massive consumer electronics industry. The region showcases a rapid production scale-up capability, competitive manufacturing costs, and a fast adoption rate of new technologies, supported by extensive government initiatives and a vast ecosystem of suppliers and manufacturers. The EMEA region presents a balanced mix of advanced technological adoption and research-oriented approaches, with significant contributions from European countries in enhancing TFE methodologies for diverse applications, including OLED lighting, photovoltaics, and flexible electronics. Companies in EMEA often emphasize sustainable and eco-friendly production processes, aligning with stringent regional environmental regulations.
Market Insights
The market dynamics represent an ever-changing landscape of the Thin-film Encapsulation Market by providing actionable insights into factors, including supply and demand levels. Accounting for these factors helps design strategies, make investments, and formulate developments to capitalize on future opportunities. In addition, these factors assist in avoiding potential pitfalls related to political, geographical, technical, social, and economic conditions, highlighting consumer behaviors and influencing manufacturing costs and purchasing decisions.
FPNV Positioning Matrix
The FPNV positioning matrix is essential in evaluating the market positioning of the vendors in the Thin-film Encapsulation Market. This matrix offers a comprehensive assessment of vendors, examining critical metrics related to business strategy and product satisfaction. This in-depth assessment empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success, namely Forefront (F), Pathfinder (P), Niche (N), or Vital (V).
Market Share Analysis
The market share analysis is a comprehensive tool that provides an insightful and in-depth assessment of the current state of vendors in the Thin-film Encapsulation Market. By meticulously comparing and analyzing vendor contributions, companies are offered a greater understanding of their performance and the challenges they face when competing for market share. These contributions include overall revenue, customer base, and other vital metrics. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With these illustrative details, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.
Recent Developments
Trio Partners to Commercialize Encapsulation on Perovskite Solar Cells
Verde Technologies Inc. established a visionary partnership with Northern Illinois University (NIU) and the esteemed U.S. based Department of Energy's National Renewable Energy Laboratory (NREL) to commercialize a cutting-edge encapsulation solution, leveraging atomic layer deposition (ALD) and spatial atomic layer deposition (sALD) technologies. The cutting-edge solution stands out for its potential to deliver unparalleled thin-film encapsulations with remarkable performance improvements. [Published On: 2023-08-29]
NICHICON Announces Partnership with PowerFilm Inc. to Use Thin-Film Solar Technology to Power the SLB Battery
Nichicon Corporation collaborated with PowerFilm, Inc., to harness the potential of thin-film solar technology in combination with our cutting-edge SLB Series Lithium Titanate Oxide (LTO) Batteries. This collaboration signifies providing an integrated energy solution optimized for IoT edge devices that enhances efficiency and convenience in power management. [Published On: 2023-06-13]
Strategy Analysis & Recommendation
The strategic analysis is essential for organizations seeking a solid foothold in the global marketplace. Companies are better positioned to make informed decisions that align with their long-term aspirations by thoroughly evaluating their current standing in the Thin-film Encapsulation Market. This critical assessment involves a thorough analysis of the organization's resources, capabilities, and overall performance to identify its core strengths and areas for improvement.
Key Company Profiles
The report delves into recent significant developments in the Thin-film Encapsulation Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Aixtron SE, AMS Technologies AG, Angstrom Engineering Inc., Applied Materials, Inc., BASF SE, Beneq Oy, Coat-X SA, Encapsulix SAS, Ergis S.A., Kateeva, Inc., LG Chem Ltd., Lotus Applied Technology, Meyer Burger Technology AG, Samsung Electronics Co., Ltd., SNU PRECISION CO., LTD, Tesa SE by Beiersdorf AG, Toppan Printing Co., Ltd., Toray Industries Inc., Universal Display Corporation, and Veeco Instruments Inc..
Market Segmentation & Coverage