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市場調查報告書
商品編碼
1373619
主動電子零件全球市場規模、佔有率、產業趨勢分析報告:2023-2030 年按產品類型、最終用戶、地區分類的展望與預測Global Active Electronic Component Market Size, Share & Industry Trends Analysis Report By Product Type, By End User, By Regional Outlook and Forecast, 2023 - 2030 |
主動電子零件市場規模預計到2030年將達到 4,777 億美元,預測期內年複合成長率為 6.4%。2022年市場規模為53.816億台,成長率為5.2%(2019-2022年)。
根據 KBV Cardinal Matrix 發布的分析,Broadcom Inc.、Intel Corporation、Texas Instruments, Inc.是市場推動者。2022年 12月,Broadcom Inc. 與Rohde & Schwarz合作,推出了適用於 Broadcom Wi-Fi 7 晶片組的自動化測試解決方案,支援雙頻 2×2 IEEE 802.11be 相容同步操作。 Analog Devices, Inc.、NXP Semiconductors NV 和 STMicroElectronics NV 等公司是該市場的主要創新者。
市場成長要素
提高各行各業的自動化水準
精度和準確度在工業製程中極為重要。感測器、編碼器和回饋控制系統等主動組件提供必要的資料和控制機制,以確保準確運作。工業自動化系統,包括可程式邏輯控制器、感測器和致動器,可簡化製造流程,提高生產率並縮短生產時間。主動電子零件促進這些系統的操作和通訊。此外,遠端監控和控制工業運作對於提高效率和回應能力非常重要。這些因素可能為未來年度的市場提供有利的前景。
全球汽車電子產品需求不斷成長
電動車使用變頻器和轉換器等電力電子元件來管理電池組和電動馬達之間的電流。這些組件控制電力傳輸、再生煞車和充電。電池管理系統(BMS)元件監控電池組的充電狀態、運作狀況和溫度。它確保安全且高效的運行,同時最大限度地延長電池壽命。電力驅動系統包括電動馬達、電動馬達控制器和感測器。此外,自動駕駛汽車使用各種感測器來感知環境,包括雷達、光達、攝影機和超音波感測器。自動駕駛車輛必須與其他車輛、基礎設施和資料中心通訊。用於車對車(V2V)和車對基礎設施(V2I)通訊的電子零件非常重要。
市場抑制因素
半導體供需平衡惡化
半導體供需失衡肯定會對市場產生重大影響。當半導體的供需平衡變得不平衡且半導體變得稀缺且昂貴時,主動電子零件製造商可能在採購必要的半導體零件方面面臨挑戰。這可能會導致生產延遲並降低主動元件的可得性。半導體價格上漲可能會推高主動電子零件的製造成本,導致最終消費者的價格上漲。這會影響產品競爭並降低製造商的報酬率。半導體零件的交貨時間較長也會導致主動電子零件製造商的交貨時間更長。關鍵半導體的延遲抵達可能會擾亂生產計劃和向客戶的交貨。
產品展望
依產品類型,市場分為半導體裝置、真空管、顯示裝置等。2022年,顯示設備領域在市場中獲得了可觀的收益佔有率。消費性電子產業仍然是智慧型手機、平板電腦、筆記型電腦、電視、遊戲機和穿戴式裝置等顯示裝置需求的主要驅動力。隨著消費者需要高解析度的螢幕、更快的更新率和創新的外形尺寸,製造商面臨著開發先進顯示技術來滿足這些需求的壓力。 OLED(有機發光二極體)顯示器因其鮮豔的色彩、深邃的黑色和彈性而廣受歡迎。 Mini LED 和 micro LED 顯示器也作為傳統 LCD 的替代品出現,提供更高的亮度和對比度。預計這些技術將擴大應用於各種應用。所有這些優勢都可能有助於推動未來年度對顯示設備的需求。
半導體裝置展望
半導體裝置領域細分為二極體、電晶體、積體電路(IC)和光電子元件。2022年,電晶體細分市場在市場中佔據了重要的收益佔有率。汽車電子在引擎控制單元(ECU)、資訊娛樂系統、安全功能等使用電晶體。隨著汽車產業隨著電動車和自動駕駛汽車的發展,對電晶體的需求可能會增加。 5G網路的部署和通訊基礎設施的持續擴展需要各種的電晶體,包括射頻電晶體和放大器。電晶體是執行電壓調節和開關任務的電力電子元件的關鍵零件。
最終用戶前景
依最終用戶分類,可分為消費性電子、網路與通訊、汽車、製造、航太與國防、醫療保健等。到2022年,汽車領域的市場收益佔有率前景廣闊。汽車產業經歷向電動車和混合汽車的重大轉變。這些汽車嚴重依賴先進的主動電子零件,例如電力電子元件、感測器和控制系統。隨著汽車擴大電動車產品組合,對電源逆變器、馬達驅動器和電池管理系統等組件的需求預計將激增。主動式車距維持定速系統、車道維持援助和自動緊急煞車等 ADAS 技術成為現代汽車的標準配備。這些系統嚴重依賴感測器、雷達、光達和攝影機,推動了對高性能感測器的需求。
區域展望
從區域來看,市場分為北美、歐洲、亞太地區、拉丁美洲、中東和非洲。在2022年的市場中,亞太地區的收益佔有率最高。亞太地區,尤其是中國、台灣、韓國和日本等國家,長期以來一直被稱為電子零件和設備的製造地。許多主要的半導體製造商和電子零件供應商都位於該地區。亞太地區是世界上大多數人口的居住地,推動了家用電子電器的高需求。這包括智慧型手機、筆記型電腦、電視和其他依賴主動元件的電子設備。由於這些因素,預計該細分市場未來將快速成長。
The Global Active Electronic Component Market size is expected to reach $477.7 billion by 2030, rising at a market growth of 6.4% CAGR during the forecast period. In the year 2022, the market attained a volume of 5,381.6 million units, experiencing a growth of 5.2% (2019-2022).
The trend of urbanization is linked to population growth. As more people move to urban areas, there's often an increased demand for consumer electronics due to the need for connectivity, entertainment, and productivity tools. Therefore, the Consumer Electronics segment would acquire around 30% share in the market by 2030. The rollout of 5G networks worldwide is expected to impact consumer electronics. Devices will need to support faster data speeds and lower latency, requiring components like RF (Radio Frequency) modules and antennas to enable 5G connectivity. The Internet of Things ecosystem is expanding, developing IoT devices for smart homes, wearables, and connected appliances. These devices require a range of electronic components, including sensors, microcontrollers, and wireless communication modules.
The major strategies followed by the market participants are Partnerships as the key developmental strategy to keep pace with the changing demands of end users. For instance, In August 2023, Intel Corporation entered into an agreement with Synopsys, Inc., to serve the foundry customers of Intel by developing Intel 3 and Intel 18A using IP (intellectual property) and EDA (electronic design automation). Additionally, In June 2023, Infineon Technologies AG entered into a partnership with Kontrol Technologies Corp, to develop an algorithm-based solution which controls the legal controls and the boundary settings for vehicles.
Based on the Analysis presented in the KBV Cardinal matrix; Broadcom Inc., Intel Corporation and Texas Instruments, Inc. are the forerunners in the Market. In December, 2022, Broadcom Inc. collaborated with Rohde & Schwarz, to launch the automated test solution for Broadcom Wi-Fi 7 chipsets which supports simultaneous dual-band 2×2 IEEE 802.11be compliant operation. Companies such as Analog Devices, Inc., NXP Semiconductors N.V., STMicroelectronics N.V. are some of the key innovators in the Market.
Market Growth Factors
Rising automation in a wide range of industries
Precision and accuracy are critical in industrial processes. Active components like sensors, encoders, and feedback control systems provide the necessary data and control mechanisms to ensure precise operations. Industrial automation systems, including programmable logic controllers, sensors, and actuators, streamline manufacturing processes, increasing productivity and reducing production time. Active electronic components facilitate the operation and communication of these systems. In addition, for efficiency and responsiveness, remotely monitoring and controlling industrial operations is essential. These factors will pose a lucrative prospect for the market in the coming years.
Increasing demand in automotive electronics worldwide
EVs use power electronics components like inverters and converters to manage the flow of electricity between the battery pack and the electric motor. These components control power delivery, regenerative braking, and charging. Battery Management Systems (BMS) components monitor the battery pack's state of charge, health, and temperature. They ensure safe and efficient operation while maximizing battery life. Electric drive systems include electric motors, motor controllers, and sensors. Moreover, autonomous vehicles use a variety of sensors, including radar, LiDAR, cameras, and ultrasonic sensors, to perceive their environment. Autonomous vehicles must communicate with other vehicles, infrastructure, and data centres. Electronic components for vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communication are integral.
Market Restraining Factors
Rising semiconductor supply-demand imbalance
The semiconductor supply-demand imbalance can indeed have a significant impact on the market. As semiconductors become scarcer and more expensive due to supply imbalances, manufacturers of active electronic components may face challenges in sourcing the necessary semiconductor components. This can lead to production delays and reduced availability of active components. The rising prices of semiconductors can drive up manufacturing costs for active electronic components, potentially leading to higher prices for end consumers. This can affect the competitiveness of products and reduce profit margins for manufacturers. Longer lead times for semiconductor components can also extend the lead times for active electronic component manufacturers. Delays in receiving critical semiconductor inputs can disrupt production schedules and customer deliveries.
Product Outlook
Based on product type, the market is divided into semiconductor devices, vacuum tube, display devices, and others. In 2022, the display devices segment garnered a considerable revenue share in the market. The consumer electronics industry continues to be a significant driver of demand for display devices, which includes smartphones, tablets, laptops, TVs, gaming consoles, and wearables. As consumers seek higher-resolution screens, faster refresh rates, and innovative form factors, manufacturers are under pressure to develop advanced display technologies to meet these demands. OLED (Organic Light-Emitting Diode) displays have gained popularity for their vibrant colors, deep blacks, and flexibility. Mini-LED and Micro-LED displays are also emerging as alternatives to traditional LCDs, offering improved brightness and contrast. These technologies are likely to witness increased adoption in various applications. All these benefits will help to boost the demand for display devices in the coming years.
Semiconductor Devices Outlook
The semiconductor devices segment is sub-segmented into diode, transistors, integrated circuits (ICs), and optoelectronics. In 2022, the transistors subsegment recorded a substantial revenue share in the market. Automobile electronics use transistors for engine control units (ECUs), infotainment systems, and safety features. The demand for transistors may increase as the automotive industry evolves with electric and autonomous vehicles. The rollout of 5G networks and the ongoing expansion of telecommunications infrastructure require a wide range of transistors, including RF transistors and power amplifiers. Transistors are key components in power electronics for voltage regulation and switching tasks.
End user Outlook
On the basis of end-user, the market is segmented into consumer electronics, networking & telecommunication, automotive, manufacturing, aerospace & defense, healthcare, and others. The automotive segment witnessed a promising revenue share in the market in 2022. The automotive industry is undergoing a major shift toward electric and hybrid vehicles. These vehicles rely heavily on advanced active electronic components, including power electronics, sensors, and control systems. The demand for components like power inverters, motor drives, and battery management systems is expected to surge as automakers expand their electric vehicle portfolios. ADAS technologies, such as adaptive cruise control, lane-keeping assistance, and automated emergency braking, are becoming standard features in modern vehicles. These systems heavily rely on sensors, radar, LiDAR, and cameras, driving the demand for high-performance sensors.
Regional Outlook
Based on region, the market is divided into North America, Europe, Asia Pacific, and LAMEA. In 2022, the Asia Pacific segment procured the highest revenue share in the market in 2022. Asia Pacific, particularly countries like China, Taiwan, South Korea, and Japan, has long been known as a manufacturing hub for electronic components and devices. Many leading semiconductor manufacturers and electronic component suppliers are based in this region. The Asia Pacific region is home to a significant portion of the world's population, driving high demand for consumer electronics. This includes smartphones, laptops, televisions, and other electronic devices relying on active components. Owing to these factors, the segment will proliferate in the future.
The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Technologies AG, Advanced Micro Devices, Inc., STMicroelectronics N.V., Microchip Technology, Inc., Analog Devices, Inc., Broadcom Inc., NXP Semiconductors N.V., Intel Corporation, Texas Instruments, Inc., Toshiba Corporation
Recent Strategies Deployed in Active Electronic Component Market
Partnerships, Collaborations, and Agreements:
Aug-2023: Intel Corporation entered into an agreement with Synopsys, Inc., an American electronic design automation company. Through this agreement, the companies intend to serve the foundry customers of Intel by developing Intel 3 and Intel 18A using IP (intellectual property) and EDA (electronic design automation).
Jun-2023: Infineon Technologies AG entered into a partnership with Kontrol Technologies Corp., a leader in smart energy solutions. Through this partnership, autonomous driving technology enhanced to develop an algorithm-based solution which controls the legal controls and the boundary settings for vehicles.
Jun-2023: STMicroelectronics signed an agreement with Sanan Optoelectronics, a compound semiconductor company. Through this agreement, the companies would be releasing a 200mm silicon carbide device in Chongqing, China. The company's' aim to support the demand for car electrification, industrial power and energy applications.
Jun-2023: STMicroelectronics came into an agreement with Airbus, a European multinational aerospace corporation. Through this agreement, the companies aimed to construct well-structured power electronics that are lighter and necessary for future hybrid powered aircraft, facilitating electric urban air vehicles.
May-2023: NXP Semiconductors N.V. teamed up with Taiwan Semiconductor Manufacturing Company Limited, a Taiwanese multinational semiconductor contract manufacturing and design company. Through this collaboration, the companies would impart an automotive embedded MRAM (Magnetic Random Access Memory) involving 16 nm FinFET technology.
Feb-2023: Advanced Micro Devices, Inc. collaborated with Renesas Electronics Corporation, a Japanese semiconductor manufacturer. With this collaboration, Advanced Micro Devices exhibited a full RF front-end solution for 5G Active Antenna Systems (AAS) radios. The RF front end includes switches, pre-drivers, and low-noise amplifiers when paired with the Zynq UltraScale+ RFSoC Digital Front End OpenRAN Radio (O-RU) Reference Design.
Dec-2022: Broadcom Inc. collaborated with Rohde &Schwarz, an international electronics group specializing in the fields of electronic test equipment. Under this collaboration, the automated test solution for Broadcom Wi-Fi 7 chipsets was released which supports simultaneous dual-band 2×2 IEEE 802.11be compliant operation. The IEEE 802.11be amendment satisfies the working of Wi-Fi 7 in bands of 2.4 GHz, 5 GHz and 6 GHz and meets the requirements of upgraded applications on mobile handsets.
Dec-2022: Broadcom Inc. collaborated with Skyworks Solutions, Inc., an American semiconductor company. Through this collaboration, Wi-Fi front-end modules (FEMs) were introduced which enhanced the execution of the needs of the Wi-Fi 6/6E-enabled devices. Additionally, this collaboration has supplied high-speed connectivity to the customers.
Dec-2022: NXP Semiconductors N.V. signed an agreement with Delta Electronics, Inc., a Taiwanese electronics manufacturing company. Through this agreement, the companies introduced traction inverter and a platform for power conversion for use in electric vehicles.
Nov-2022: Infineon Technologies AG teamed up with Taiwan Semiconductor Manufacturing Company Limited, a Taiwanese multinational semiconductor contract manufacturing and design company. Through this partnership, the Resistive RAM (RRAM) Non-Volatile Memory (NVM) technology was launched and integrated into the AURIX microcontrollers (MCU) of Infineon Technologies. Additionally, RRAM offers the services of immunization against disturbance as well as writing in parts without the needed for erasing.
Oct-2022: Analog Devices, Inc. teamed up with Keysight Technologies, Inc., an American company. Through this collaboration, the companies promoted the use of their phased array platforms in those communications and sensing solutions involving higher data rate.
Jul-2022: Infineon Technologies AG extended their collaboration with Delta Electronics, Inc., a Taiwanese electronics manufacturing company. Through this collaboration, the Delta's 1.4 kW server power supply and a 1.6 kW Titanium gaming power platform was launched. Additionally, Delta's proficiency in electronics and Infineon's CoolSiC MOSFET technology, helps these products to achieve 96 percent power efficiency.
May-2022: Analog Devices, Inc. collaborated with Synopsys, Inc., an American electronic design automation company, to offer model libraries for DC/DC ICs and µModule (micromodule) regulators. The new library enables powertrain designers working on products like electric vehicles, avionics, instruments, and supercomputers to conduct precise and speedy multi-domain simulations. This accelerates the design process and reduces time-to-market.
Apr-2020: Broadcom Inc. extended its collaboration with Synopsys, Inc., an American electronic design automation company. Through this collaboration, the companies manufactured semiconductors using the Fusion Design Platform of Synopsys. Additionally, this collaboration helped Broadcom to take advantage of the silicon-process offerings and better serve their customers.
Mar-2022: Analog Devices, Inc. joined hands with Gridspertise, an energy transition enabler. Through this collaboration, the quality of smart grids was improved, along with hardware and software were developed that facilitate self-healing and adaptation of distribution grids in the event of changes in energy supply.
Product Launches and Product Expansions:
Jun-2023: Analog Devices, Inc. announced to unveil Apollo MxFE, a front-end platform having advanced software, direct Rf sampling and a wideband mixed signal. Apollo MxFE offers next generation applications and instantaneous bandwidths of 10GHz while it synthesizes frequencies up to 18GHz.
May-2023: STMicroelectronics introduced the STM32 MPUs (microprocessors), which enhance performance and security for applications. The STM32MP2 Series devices help to integrate advanced security features in hardware and for opportunities in secure Industry 4.0, IoT, and rich user-interface applications.
Mar-2023: Texas Instruments, Inc. launched an active electromagnetic interface (EMI) filter integrated circuits (ICs) which magnifies functionality while reducing costs and maintaining regulatory standards. The active EMI filter ICs solved the designing challenges of the engineers and at the same time bettered performance and power density.
Oct-2022: NXP Semiconductors N.V. introduced the OrangeBox automotive-grade development platform which helps connection of NXP wireless technologies. The OrangeBox presents a single interface between the wired and wireless technologies of vehicles and thus makes communication of cars with the world outside easier.
Oct-2022: NXP Semiconductors N.V. launched Matter-enabled development platforms, facilitating Matter devices for smart homes and buildings. The Matter development platforms consist of a range of IoT devices with Thread Border Router and Matter Controller capabilities.
Oct-2022: Infineon Technologies AG revealed the XENSIV connected sensor kit (CSK), an IoT platform facilitating prototyping and formation of personalized solutions. The CSK is an amalgamation of several XENSIV sensors which offer power efficient and high performance for cases based on PSoC 6 microcontroller.
Sep-2021: STMicroelectronics unveiled two products, the VN9D30Q100F and VN9D5D20FN. The VN9D30Q100F comprises two 33mΩ and four 90mΩ channels while the VN9D5D20FN consists of two 7.6mΩ and two 20mΩ channels. The six output channels and a 4-wire SPI interface of the two devices reduces the number of microcontroller I/O pins that is required to facilitate interaction with the device.
Aug-2022: Microchip Technology Inc. added new features to its memory controller portfolio through the SMC 2000 series of Compute Express Link (CXL™)-based Smart Memory Controllers. The two products, SMC 2000 16×32G*and SMC 2000 8×32G memory controllers are set to specifications of CXL 1.1 and CXL 2.0, have DDR4 and DDR5 JEDEC standards and support speeds of PCIe 5.0 specifications.
Jun-2022: Toshiba Corporation released a superconducting motor which satisfies the requirements of the mobility sector. The superconducting motor is of light weight, has high-output density and high-speed rotation.
May-2021: Analog Devices, Inc. has unveiled an extended range of battery management system (BMS) products, incorporating ASIL-D functional safety and innovative low-power capabilities for continuous battery monitoring. These improvements boost ADI's BMS platform, famous for accuracy and compatibility with various battery types, including zero-Cobalt LFP.
Acquisition and Mergers:
Aug-2021: Analog Devices, Inc. completed the acquisition of Maxim Integrated Products, Inc., an integrated analog and mixed-signal semiconductor provider. With this acquisition, innovations in analog semiconductors were carried out, and better solutions were extended to the customers.
Apr-2020: Infineon Technologies AG completed the acquisition of Cypress Semiconductor Corporation, an American semiconductor design and manufacturing company. Through this acquisition, Infineon strengthened its structural growth drivers on a wide variety of applications. Additionally, Infineon boosted its hold on the customers across the world through its foothold on U.S. and Japan.
Market Segments covered in the Report:
By Product Type (Volume, Million Units, USD Million, 2019 to 2030)
By End User (Volume, Million Units, USD Million, 2019 to 2030)
By Geography (Volume, Million Units, USD Million, 2019 to 2030)
Companies Profiled
Unique Offerings from KBV Research