The Global ASIC Chip Market size is expected to reach $35.5 billion by 2030, rising at a market growth of 8.2% CAGR during the forecast period.
The ever-growing demand for smartphones and tablets is a key driver for the consumer electronics segment. Thus, the consumer electronics segment acquired $2,683.1 million in 2022. ASICs are used in these devices for various functions, including signal processing, graphics rendering, and power management, contributing to enhanced performance and efficiency.
The major strategies followed by the market participants are Partnerships & Collaborations as the key developmental strategy to keep pace with the changing demands of end users. For instance, In Feb 2024, Intel Corporation signed a collaboration with Wipro to accelerate the development of advanced and innovative chip designs. Additionally, In, Jul 2022, Intel Corporation came into partnership with MediaTek to manufacture chips, leveraging the advanced process technologies offered by Intel Foundry Services (IFS).
Based on the Analysis presented in the KBV Cardinal matrix; Samsung Electronics Co., Ltd. and Taiwan Semiconductor Manufacturing Company Limited are the forerunners in the ASIC Chip Market. In Mar 2021, Samsung Electronics Co., Ltd. and Marvell Technology, Inc to accelerate the advancement of high-impact 5G solutions that provide a competitive advantage to their operators. Companies such as Texas Instruments, Inc., NVIDIA Corporation, and Infineon Technologies AG are some of the key innovators in Market.
Market Growth Factors
ASICs are known for their high performance and efficiency in specific applications. As industries demand faster and more specialized processing capabilities, ASICs are preferred to meet these performance requirements. Thus, these factors can assist in the growth of the market.
Additionally, ASICs can be designed to accelerate the computations commonly involved in AI and ML tasks, such as matrix multiplications and convolutions. This targeted optimization results in significantly higher performance than general-purpose processors that may not be as well-suited for these specific workloads. Therefore, these factors can assist in the growth of the market.
Market Restraining Factors
The substantial upfront costs associated with ASIC (application-specific integrated circuit) design and development can be a significant barrier for smaller companies or projects with limited budgets. Thus, owing to these factors, there will be reduced demand for ASIC chips in the coming years.
The leading players in the market are competing with diverse innovative offerings to remain competitive in the market. The above illustration shows the percentage of revenue shared by some of the leading companies in the market. The leading players of the market are adopting various strategies in order to cater demand coming from the different industries. The key developmental strategies in the market are Partnerships & Collaborations.
By Type Analysis
Based on type, the market is segmented into semi-custom ASIC, programmable ASIC, and full custom ASIC. In 2022, the programmable ASIC segment garnered 18% revenue share in the market. Programmable logic devices, especially FPGAs, provide great flexibility and customization.
By End User Analysis
On the basis of end user, the market is divided into data processing systems, consumer electronics, telecommunication systems, aerospace subsystem & sensors, medical instrumentation, and others. The data processing systems segment recorded 34.2% revenue share in the market in 2022.
By Regional Analysis
By region, the market is segmented into North America, Europe, Asia Pacific, and LAMEA. In 2022, the Asia Pacific segment acquired 39% revenue share in the market. The Asia Pacific region, particularly countries like China, Japan, South Korea, and Taiwan, has been at the forefront of technology adoption and innovation.
The ASIC chip market is fiercely competitive across multiple sectors, including cryptocurrency mining, artificial intelligence, networking, and emerging technologies. Companies like BITMAIN Technologies Holding Company and Taiwan Semiconductor Manufacturing Company Limited vie for dominance in cryptocurrency mining, while tech giants such as NVIDIA, Intel, and Samsung Electronics Co., Ltd. compete vigorously in AI, networking, and telecommunications.
Recent Strategies Deployed in the Market
- Feb-2024: Intel Corporation signed a collaboration with Wipro, a multinational corporation specializing in information technology services, consulting, and business process outsourcing. Through this collaboration, both companies would accelerate the development of advanced and innovative chip designs. Moreover, the collaboration seeks to meet the increasing need for AI chip production, as companies compete to introduce products equipped with generative AI capabilities.
- Jun-2023: Advanced Micro Devices, Inc. launched AMD Versal(TM) Premium VP1902, a high-performance system-on-chip (SoC) designed for advanced computing and acceleration applications. The VP1902 adaptive SoC is a chipset-based solution that accelerates semiconductor design verification with double the capacity of its predecessor, enabling faster innovation and validation of ASICs and SoCs for rapid market deployment of next-gen technologies.
- Jul-2022: Intel Corporation came into partnership with MediaTek, a semiconductor company renowned for its innovative system-on-chip solutions for various electronic devices. Through this partnership, both companies would aim to manufacture chips, leveraging the advanced process technologies offered by Intel Foundry Services (IFS).
- Feb-2022: Advanced Micro Devices, Inc. took over Xilinx, a leading provider of adaptive and intelligent computing solutions, specializing in field-programmable gate arrays (FPGAs) and programmable logic devices. Through this acquisition, AMD and Xilinx would expedite their capacity to shape a new era of computing, offering an extensive range of adaptive computing platforms to drive diverse intelligent applications effectively.
- Nov-2021: ON Semiconductor Corporation and GT Advanced Technologies, a manufacturer of advanced materials and equipment for the solar and semiconductor industries. Through this acquisition, onsemi would be able to deliver comprehensive power solutions spanning from SiC crystal growth to fully integrated intelligent power modules.
List of Key Companies Profiled
- Advanced Micro Devices, Inc.
- Samsung Electronics Co., Ltd. (Samsung Group)
- ON Semiconductor Corporation
- Taiwan Semiconductor Manufacturing Company Limited
- NVIDIA Corporation
- Intel Corporation
- Infineon Technologies AG
- Texas Instruments, Inc.
- Seiko Epson Corporation
- BITMAIN Technologies Holding Company
Global ASIC Chip Market Report Segmentation
By Type
- Semi- custom ASIC
- Full custom ASIC
- Programmable ASIC
By End User
- Data Processing Systems
- Telecommunication Systems
- Aerospace Subsystem & Sensors
- Consumer Electronics
- Medical Instrumentation
- Others
By Geography
- North America
- US
- Canada
- Mexico
- Rest of North America
- Europe
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
- Asia Pacific
- China
- Japan
- India
- South Korea
- Taiwan
- Malaysia
- Rest of Asia Pacific
- LAMEA
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Table of Contents
Chapter 1.Market Scope & Methodology
- 1.1Market Definition
- 1.2Objectives
- 1.3Market Scope
- 1.4Segmentation
- 1.4.1Global ASIC Chip Market, by Type
- 1.4.2Global ASIC Chip Market, by End User
- 1.4.3Global ASIC Chip Market, by Geography
- 1.5Methodology for the research
Chapter 2.Market at a Glance
Chapter 3.Market Overview
- 3.1Introduction
- 3.1.1Overview
- 3.1.1.1Market Composition and Scenario
- 3.2Key Factors Impacting the Market
- 3.2.1Market Drivers
- 3.2.2Market Restraints
- 3.2.3Market Opportunities
- 3.2.4Market Challenges
Chapter 4.Competition Analysis - Global
- 4.1KBV Cardinal Matrix
- 4.2Recent Industry Wide Strategic Developments
- 4.2.1Partnerships, Collaborations and Agreements
- 4.2.2Product Launches and Product Expansions
- 4.2.3Acquisition and Mergers
- 4.3Market Share Analysis, 2022
- 4.4Top Winning Strategies
- 4.4.1Key Leading Strategies: Percentage Distribution (2019-2023)
- 4.4.2Key Strategic Move: (Partnerships, Collaborations & Agreements: 2024, Feb - 2019, Feb) Leading Players
- 4.5Porter Five Forces Analysis
Chapter 5.Global ASIC Chip Market by Type
- 5.1Global Semi- custom ASIC Market by Region
- 5.2Global Full custom ASIC Market by Region
- 5.3Global Programmable ASIC Market by Region
Chapter 6.Global ASIC Chip Market by End User
- 6.1Global Data Processing Systems Market by Region
- 6.2Global Telecommunication Systems Market by Region
- 6.3Global Aerospace Subsystem & Sensors Market by Region
- 6.4Global Consumer Electronics Market by Region
- 6.5Global Medical Instrumentation Market by Region
- 6.6Global Others Market by Region
Chapter 7.Global ASIC Chip Market by Region
- 7.1North America ASIC Chip Market
- 7.1.1North America ASIC Chip Market by Type
- 7.1.1.1North America Semi- custom ASIC Market by Country
- 7.1.1.2North America Full custom ASIC Market by Country
- 7.1.1.3North America Programmable ASIC Market by Country
- 7.1.2North America ASIC Chip Market by End User
- 7.1.2.1North America Data Processing Systems Market by Country
- 7.1.2.2North America Telecommunication Systems Market by Country
- 7.1.2.3North America Aerospace Subsystem & Sensors Market by Country
- 7.1.2.4North America Consumer Electronics Market by Country
- 7.1.2.5North America Medical Instrumentation Market by Country
- 7.1.2.6North America Others Market by Country
- 7.1.3North America ASIC Chip Market by Country
- 7.1.3.1US ASIC Chip Market
- 7.1.3.1.1US ASIC Chip Market by Type
- 7.1.3.1.2US ASIC Chip Market by End User
- 7.1.3.2Canada ASIC Chip Market
- 7.1.3.2.1Canada ASIC Chip Market by Type
- 7.1.3.2.2Canada ASIC Chip Market by End User
- 7.1.3.3Mexico ASIC Chip Market
- 7.1.3.3.1Mexico ASIC Chip Market by Type
- 7.1.3.3.2Mexico ASIC Chip Market by End User
- 7.1.3.4Rest of North America ASIC Chip Market
- 7.1.3.4.1Rest of North America ASIC Chip Market by Type
- 7.1.3.4.2Rest of North America ASIC Chip Market by End User
- 7.2Europe ASIC Chip Market
- 7.2.1Europe ASIC Chip Market by Type
- 7.2.1.1Europe Semi- custom ASIC Market by Country
- 7.2.1.2Europe Full custom ASIC Market by Country
- 7.2.1.3Europe Programmable ASIC Market by Country
- 7.2.2Europe ASIC Chip Market by End User
- 7.2.2.1Europe Data Processing Systems Market by Country
- 7.2.2.2Europe Telecommunication Systems Market by Country
- 7.2.2.3Europe Aerospace Subsystem & Sensors Market by Country
- 7.2.2.4Europe Consumer Electronics Market by Country
- 7.2.2.5Europe Medical Instrumentation Market by Country
- 7.2.2.6Europe Others Market by Country
- 7.2.3Europe ASIC Chip Market by Country
- 7.2.3.1Germany ASIC Chip Market
- 7.2.3.1.1Germany ASIC Chip Market by Type
- 7.2.3.1.2Germany ASIC Chip Market by End User
- 7.2.3.2UK ASIC Chip Market
- 7.2.3.2.1UK ASIC Chip Market by Type
- 7.2.3.2.2UK ASIC Chip Market by End User
- 7.2.3.3France ASIC Chip Market
- 7.2.3.3.1France ASIC Chip Market by Type
- 7.2.3.3.2France ASIC Chip Market by End User
- 7.2.3.4Russia ASIC Chip Market
- 7.2.3.4.1Russia ASIC Chip Market by Type
- 7.2.3.4.2Russia ASIC Chip Market by End User
- 7.2.3.5Spain ASIC Chip Market
- 7.2.3.5.1Spain ASIC Chip Market by Type
- 7.2.3.5.2Spain ASIC Chip Market by End User
- 7.2.3.6Italy ASIC Chip Market
- 7.2.3.6.1Italy ASIC Chip Market by Type
- 7.2.3.6.2Italy ASIC Chip Market by End User
- 7.2.3.7Rest of Europe ASIC Chip Market
- 7.2.3.7.1Rest of Europe ASIC Chip Market by Type
- 7.2.3.7.2Rest of Europe ASIC Chip Market by End User
- 7.3Asia Pacific ASIC Chip Market
- 7.3.1Asia Pacific ASIC Chip Market by Type
- 7.3.1.1Asia Pacific Semi- custom ASIC Market by Country
- 7.3.1.2Asia Pacific Full custom ASIC Market by Country
- 7.3.1.3Asia Pacific Programmable ASIC Market by Country
- 7.3.2Asia Pacific ASIC Chip Market by End User
- 7.3.2.1Asia Pacific Data Processing Systems Market by Country
- 7.3.2.2Asia Pacific Telecommunication Systems Market by Country
- 7.3.2.3Asia Pacific Aerospace Subsystem & Sensors Market by Country
- 7.3.2.4Asia Pacific Consumer Electronics Market by Country
- 7.3.2.5Asia Pacific Medical Instrumentation Market by Country
- 7.3.2.6Asia Pacific Others Market by Country
- 7.3.3Asia Pacific ASIC Chip Market by Country
- 7.3.3.1China ASIC Chip Market
- 7.3.3.1.1China ASIC Chip Market by Type
- 7.3.3.1.2China ASIC Chip Market by End User
- 7.3.3.2Japan ASIC Chip Market
- 7.3.3.2.1Japan ASIC Chip Market by Type
- 7.3.3.2.2Japan ASIC Chip Market by End User
- 7.3.3.3India ASIC Chip Market
- 7.3.3.3.1India ASIC Chip Market by Type
- 7.3.3.3.2India ASIC Chip Market by End User
- 7.3.3.4South Korea ASIC Chip Market
- 7.3.3.4.1South Korea ASIC Chip Market by Type
- 7.3.3.4.2South Korea ASIC Chip Market by End User
- 7.3.3.5Taiwan ASIC Chip Market
- 7.3.3.5.1Taiwan ASIC Chip Market by Type
- 7.3.3.5.2Taiwan ASIC Chip Market by End User
- 7.3.3.6Malaysia ASIC Chip Market
- 7.3.3.6.1Malaysia ASIC Chip Market by Type
- 7.3.3.6.2Malaysia ASIC Chip Market by End User
- 7.3.3.7Rest of Asia Pacific ASIC Chip Market
- 7.3.3.7.1Rest of Asia Pacific ASIC Chip Market by Type
- 7.3.3.7.2Rest of Asia Pacific ASIC Chip Market by End User
- 7.4LAMEA ASIC Chip Market
- 7.4.1LAMEA ASIC Chip Market by Type
- 7.4.1.1LAMEA Semi- custom ASIC Market by Country
- 7.4.1.2LAMEA Full custom ASIC Market by Country
- 7.4.1.3LAMEA Programmable ASIC Market by Country
- 7.4.2LAMEA ASIC Chip Market by End User
- 7.4.2.1LAMEA Data Processing Systems Market by Country
- 7.4.2.2LAMEA Telecommunication Systems Market by Country
- 7.4.2.3LAMEA Aerospace Subsystem & Sensors Market by Country
- 7.4.2.4LAMEA Consumer Electronics Market by Country
- 7.4.2.5LAMEA Medical Instrumentation Market by Country
- 7.4.2.6LAMEA Others Market by Country
- 7.4.3LAMEA ASIC Chip Market by Country
- 7.4.3.1Brazil ASIC Chip Market
- 7.4.3.1.1Brazil ASIC Chip Market by Type
- 7.4.3.1.2Brazil ASIC Chip Market by End User
- 7.4.3.2Argentina ASIC Chip Market
- 7.4.3.2.1Argentina ASIC Chip Market by Type
- 7.4.3.2.2Argentina ASIC Chip Market by End User
- 7.4.3.3UAE ASIC Chip Market
- 7.4.3.3.1UAE ASIC Chip Market by Type
- 7.4.3.3.2UAE ASIC Chip Market by End User
- 7.4.3.4Saudi Arabia ASIC Chip Market
- 7.4.3.4.1Saudi Arabia ASIC Chip Market by Type
- 7.4.3.4.2Saudi Arabia ASIC Chip Market by End User
- 7.4.3.5South Africa ASIC Chip Market
- 7.4.3.5.1South Africa ASIC Chip Market by Type
- 7.4.3.5.2South Africa ASIC Chip Market by End User
- 7.4.3.6Nigeria ASIC Chip Market
- 7.4.3.6.1Nigeria ASIC Chip Market by Type
- 7.4.3.6.2Nigeria ASIC Chip Market by End User
- 7.4.3.7Rest of LAMEA ASIC Chip Market
- 7.4.3.7.1Rest of LAMEA ASIC Chip Market by Type
- 7.4.3.7.2Rest of LAMEA ASIC Chip Market by End User
Chapter 8.Company Profiles
- 8.1Advanced Micro Devices, Inc.
- 8.1.1Company Overview
- 8.1.2Financial Analysis
- 8.1.3Segmental and Regional Analysis
- 8.1.4Research & Development Expenses
- 8.1.5Recent strategies and developments:
- 8.1.5.1Product Launches and Product Expansions:
- 8.1.5.2Acquisition and Mergers:
- 8.1.6SWOT Analysis
- 8.2Samsung Electronics Co., Ltd. (Samsung Group)
- 8.2.1Company Overview
- 8.2.2Financial Analysis
- 8.2.3Segmental and Regional Analysis
- 8.2.4Recent strategies and developments:
- 8.2.4.1Partnerships, Collaborations, and Agreements:
- 8.2.5SWOT Analysis
- 8.3ON Semiconductor Corporation
- 8.3.1Company Overview
- 8.3.2Financial Analysis
- 8.3.3Segmental and Regional Analysis
- 8.3.4Research & Development Expense
- 8.3.5Recent strategies and developments:
- 8.3.5.1Partnerships, Collaborations, and Agreements:
- 8.3.5.2Acquisition and Mergers:
- 8.3.6SWOT Analysis
- 8.4Taiwan Semiconductor Manufacturing Company Limited
- 8.4.1Company overview
- 8.4.2Financial Analysis
- 8.4.3Regional Analysis
- 8.4.4Research & Development Expenses
- 8.4.5SWOT Analysis
- 8.5NVIDIA Corporation
- 8.5.1Company Overview
- 8.5.2Financial Analysis
- 8.5.3Segmental and Regional Analysis
- 8.5.4Research & Development Expenses
- 8.5.5Recent strategies and developments:
- 8.5.5.1Acquisition and Mergers:
- 8.6Intel Corporation
- 8.6.1Company Overview
- 8.6.2Financial Analysis
- 8.6.3Segmental and Regional Analysis
- 8.6.4Research & Development Expenses
- 8.6.5Recent strategies and developments:
- 8.6.5.1Partnerships, Collaborations, and Agreements:
- 8.6.5.2Product Launches and Product Expansions:
- 8.6.5.3Acquisition and Mergers:
- 8.6.6SWOT Analysis
- 8.7Infineon Technologies AG
- 8.7.1Company Overview
- 8.7.2Financial Analysis
- 8.7.3Segmental and Regional Analysis
- 8.7.4Research & Development Expense
- 8.7.5Recent strategies and developments:
- 8.7.5.1Partnerships, Collaborations, and Agreements:
- 8.7.5.2Product Launches and Product Expansions:
- 8.7.5.3Acquisition and Mergers:
- 8.7.6SWOT Analysis
- 8.8Texas Instruments, Inc.
- 8.8.1Company Overview
- 8.8.2Financial Analysis
- 8.8.3Segmental and Regional Analysis
- 8.8.4Research & Development Expense
- 8.8.5SWOT Analysis
- 8.9Seiko Epson Corporation
- 8.9.1Company Overview
- 8.9.2Financial Analysis
- 8.9.3Segmental and Regional Analysis
- 8.9.4Research & Development Expenses
- 8.9.5SWOT Analysis
- 8.1BITMAIN Technologies Holding Company
- 8.10.1Company Overview
- 8.10.2Recent strategies and developments:
- 8.10.2.1Partnerships, Collaborations, and Agreements:
- 8.10.2.2Product Launches and Product Expansions:
- 8.10.3SWOT Analysis
Chapter 9.Winning imperatives of ASIC Chip Market