The Global Embedded Non-volatile Memory Market size is expected to reach $8.8 billion by 2031, rising at a market growth of 11.3% CAGR during the forecast period.
The United States, in particular, has been a key player in driving innovation in sectors such as information technology, telecommunications, and defense, which heavily rely on eNVM technologies. The growth of smart manufacturing, increasing investments in IoT, and the expanding automotive and aerospace sectors have further propelled the demand for eNVM in North America. Consequently, the North American region would acquire nearly 24% of the total market share by 2031.
The major strategies followed by the market participants are Product Launches as the key developmental strategy to keep pace with the changing demands of end users. For instance, in March, 2024, STMicroelectronics N.V. unveiled an 18nm FD-SOI process with embedded phase change memory (PCM), co-developed with Samsung Foundry. This technology boosts performance and power efficiency for embedded processing, supports larger memory sizes, and integrates more analog and digital peripherals. Moreover, in October, 2023, Micron Technology, Inc. unveiled a 32Gbit dual-layer 3D stacked non-volatile ferroelectric memory. Titled "NVDRAM," it claims to deliver near-DRAM performance with enhanced energy efficiency for AI workloads, supporting faster data movement and larger neural network models.
KBV Cardinal Matrix - Embedded Non-volatile Memory Market Competition Analysis
Based on the Analysis presented in the KBV Cardinal matrix; Samsung Electronics Co., Ltd. is the forerunner in the Market. In January, 2022, Samsung Electronics Co., Ltd. unveiled the world's first in-memory computing using MRAM (Magnetoresistive Random Access Memory). The innovation, detailed in the paper "A crossbar array of magnetoresistive memory devices for in-memory computing," highlights Samsung's advancements in in-memory technology and AI chips. Companies such as NXP Semiconductors N.V., STMicroelectronics N.V., and Infineon Technologies AG are some of the key innovators in Market.
Market Growth Factors
Information and communication technologies are integrated into a variety of city infrastructure components in order to enhance the quality of life for residents and optimize the efficacy of urban services in smart cities. In smart grid applications, eNVM plays a crucial role in managing the vast data generated by energy meters, sensors, and control systems. Hence, as more cities worldwide embrace the smart city model, the demand for this memory is expected to rise.
As digital interconnectivity expands, concerns about data breaches, cyberattacks, and unauthorized access have intensified, particularly in finance, healthcare, and government services. The necessity of secure eNVM is further emphasized by the proliferation of Internet of Things (IoT) devices. Thus, the demand for secure eNVM solutions will grow as digital threats evolve.
Market Restraining Factors
The manufacturing process for eNVM, especially when using sophisticated technologies like FinFET and FD-SOI, requires specialized equipment and high-quality materials, which significantly drive up production costs. The expensive materials required for eNVM production also contribute to manufacturing costs. Hence, the high manufacturing costs associated with eNVM production present a barrier to its widespread adoption.
Wafer Size Outlook
On the basis of wafer size, the market is bifurcated into <100mm and >100mm. The <100mm segment recorded 41% revenue share in the market in 2023. The segment's growth reflects the growing significance of applications that require higher performance, reduced power consumption, and greater data density. Wafers below 100mm are instrumental in cutting-edge technology sectors such as advanced consumer electronics, telecommunications, and IoT devices.
Product Outlook
Based on product, the market is divided into eFlash, eE2PROM, FRAM, and others. The eE2PROM segment procured 34% revenue share in the market in 2023. eE2PROM (Electrically Erasable Programmable Read-Only Memory) is widely utilized in applications where frequent data writing and reprogramming are essential.
Application Outlook
By application, the market is segmented into BFSI, consumer electronics, government, telecommunications, information technology, and others. The information technology segment garnered 20% revenue share in the market in 2023. The IT sector's increasing reliance on eNVM stems from the rising demand for advanced data storage solutions that offer enhanced performance, data security, and reliability.
Regional Outlook
Region-wise, the market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific segment acquired 46% revenue share in the market in 2023. This strong performance is driven by the region's thriving consumer electronics industry, rapid industrialization, and increasing demand for advanced semiconductor technologies.
Recent Strategies Deployed in the Market
- Jan-2024: Intel Corporation signed an agreement with United Microelectronics Corporation to develop a 12-nanometer semiconductor process platform for mobile, communication infrastructure, and networking markets. This long-term agreement combines Intel's U.S. manufacturing with UMC's foundry expertise, enhancing global customer choices and supply chain resilience.
- Aug-2023: Fujitsu Limited unveiled the 512Kbit FeRAM "MB85RC512LY," their highest-density automotive-grade FeRAM with an I2C interface. It offers low operating current, 10 trillion read/write cycles at 125°C, and is ideal for industrial robots and automotive applications like ADAS. Evaluation samples are now available.
- May-2023: NXP Semiconductors N.V. has partnered with TSMC and unveiled the first automotive-embedded MRAM in 16 nm FinFET technology. This advancement supports software-defined vehicles' need for multiple software upgrades on one hardware platform, combining NXP's S32 processors with advanced, reliable non-volatile memory.
- Apr-2023: Infineon Technologies AG unveiled the SEMPER X1 LPDDR Flash memory, the first for automotive E/E architectures. It offers 8 times the performance and 20 times faster random read speeds than NOR Flash, enhancing real-time code execution, safety, and flexibility in software-defined vehicles.
- Nov-2022: Infineon Technologies AG and TSMC are set to unveil TSMC's Resistive RAM (RRAM) Non-Volatile Memory technology into Infineon's next-gen AURIX microcontrollers. RRAM, advancing beyond embedded Flash memory, will enhance automotive ECUs, supporting innovations in electrification, new E/E architectures, and automated driving at 28nm and beyond.
List of Key Companies Profiled
- Samsung Electronics Co., Ltd. (Samsung Group)
- Micron Technology, Inc.
- ROHM Co., Ltd.
- Toshiba International Corporation
- Honeywell International Inc.
- Fujitsu Limited
- Infineon Technologies AG
- Intel Corporation
- NXP Semiconductors N.V.
- STMicroelectronics N.V.
Global Embedded Non-volatile Memory Market Report Segmentation
By Wafer Size
By Product
- eFlash
- eE2PROM
- FRAM
- Other Product
By Application
- BFSI
- Information Technology
- Consumer Electronics
- Telecommunications
- Government
- Others Application
By Geography
- North America
- US
- Canada
- Mexico
- Rest of North America
- Europe
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
- Asia Pacific
- China
- Japan
- India
- South Korea
- Australia
- Malaysia
- Rest of Asia Pacific
- LAMEA
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Table of Contents
Chapter 1. Market Scope & Methodology
- 1.1 Market Definition
- 1.2 Objectives
- 1.3 Market Scope
- 1.4 Segmentation
- 1.4.1 Global Embedded Non-volatile Memory Market, by Wafer Size
- 1.4.2 Global Embedded Non-volatile Memory Market, by Product
- 1.4.3 Global Embedded Non-volatile Memory Market, by Application
- 1.4.4 Global Embedded Non-volatile Memory Market, by Geography
- 1.5 Methodology for the research
Chapter 2. Market at a Glance
Chapter 3. Market Overview
- 3.1 Introduction
- 3.1.1 Overview
- 3.1.1.1 Market Composition and Scenario
- 3.2 Key Factors Impacting the Market
- 3.2.1 Market Drivers
- 3.2.2 Market Restraints
- 3.2.3 Market Opportunities
- 3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
- 4.1 KBV Cardinal Matrix
- 4.2 Recent Industry Wide Strategic Developments
- 4.2.1 Partnerships, Collaborations and Agreements
- 4.2.2 Product Launches and Product Expansions
- 4.3 Market Share Analysis, 2023
- 4.4 Top Winning Strategies
- 4.4.1 Key Leading Strategies: Percentage Distribution (2020-2024)
- 4.4.2 Key Strategic Move: (Product Launches and Product Expansions : 2022, Aug - 2024, Mar) Leading Players
- 4.5 Porter Five Forces Analysis
Chapter 5. Global Embedded Non-volatile Memory Market by Wafer Size
- 5.1 Global >100 mm Market by Region
- 5.2 Global <100 mm Market by Region
Chapter 6. Global Embedded Non-volatile Memory Market by Product
- 6.1 Global eFlash Market by Region
- 6.2 Global eE2PROM Market by Region
- 6.3 Global FRAM Market by Region
- 6.4 Global Other Product Market by Region
Chapter 7. Global Embedded Non-volatile Memory Market by Application
- 7.1 Global BFSI Market by Region
- 7.2 Global Information Technology Market by Region
- 7.3 Global Consumer Electronics Market by Region
- 7.4 Global Telecommunications Market by Region
- 7.5 Global Government Market by Region
- 7.6 Global Others Application Market by Region
Chapter 8. Global Embedded Non-volatile Memory Market by Region
- 8.1 North America Embedded Non-volatile Memory Market
- 8.1.1 North America Embedded Non-volatile Memory Market by Wafer Size
- 8.1.1.1 North America >100 mm Market by Country
- 8.1.1.2 North America <100 mm Market by Country
- 8.1.2 North America Embedded Non-volatile Memory Market by Product
- 8.1.2.1 North America eFlash Market by Country
- 8.1.2.2 North America eE2PROM Market by Country
- 8.1.2.3 North America FRAM Market by Country
- 8.1.2.4 North America Other Product Market by Country
- 8.1.3 North America Embedded Non-volatile Memory Market by Application
- 8.1.3.1 North America BFSI Market by Country
- 8.1.3.2 North America Information Technology Market by Country
- 8.1.3.3 North America Consumer Electronics Market by Country
- 8.1.3.4 North America Telecommunications Market by Country
- 8.1.3.5 North America Government Market by Country
- 8.1.3.6 North America Others Application Market by Country
- 8.1.4 North America Embedded Non-volatile Memory Market by Country
- 8.1.4.1 US Embedded Non-volatile Memory Market
- 8.1.4.1.1 US Embedded Non-volatile Memory Market by Wafer Size
- 8.1.4.1.2 US Embedded Non-volatile Memory Market by Product
- 8.1.4.1.3 US Embedded Non-volatile Memory Market by Application
- 8.1.4.2 Canada Embedded Non-volatile Memory Market
- 8.1.4.2.1 Canada Embedded Non-volatile Memory Market by Wafer Size
- 8.1.4.2.2 Canada Embedded Non-volatile Memory Market by Product
- 8.1.4.2.3 Canada Embedded Non-volatile Memory Market by Application
- 8.1.4.3 Mexico Embedded Non-volatile Memory Market
- 8.1.4.3.1 Mexico Embedded Non-volatile Memory Market by Wafer Size
- 8.1.4.3.2 Mexico Embedded Non-volatile Memory Market by Product
- 8.1.4.3.3 Mexico Embedded Non-volatile Memory Market by Application
- 8.1.4.4 Rest of North America Embedded Non-volatile Memory Market
- 8.1.4.4.1 Rest of North America Embedded Non-volatile Memory Market by Wafer Size
- 8.1.4.4.2 Rest of North America Embedded Non-volatile Memory Market by Product
- 8.1.4.4.3 Rest of North America Embedded Non-volatile Memory Market by Application
- 8.2 Europe Embedded Non-volatile Memory Market
- 8.2.1 Europe Embedded Non-volatile Memory Market by Wafer Size
- 8.2.1.1 Europe >100 mm Market by Country
- 8.2.1.2 Europe <100 mm Market by Country
- 8.2.2 Europe Embedded Non-volatile Memory Market by Product
- 8.2.2.1 Europe eFlash Market by Country
- 8.2.2.2 Europe eE2PROM Market by Country
- 8.2.2.3 Europe FRAM Market by Country
- 8.2.2.4 Europe Other Product Market by Country
- 8.2.3 Europe Embedded Non-volatile Memory Market by Application
- 8.2.3.1 Europe BFSI Market by Country
- 8.2.3.2 Europe Information Technology Market by Country
- 8.2.3.3 Europe Consumer Electronics Market by Country
- 8.2.3.4 Europe Telecommunications Market by Country
- 8.2.3.5 Europe Government Market by Country
- 8.2.3.6 Europe Others Application Market by Country
- 8.2.4 Europe Embedded Non-volatile Memory Market by Country
- 8.2.4.1 Germany Embedded Non-volatile Memory Market
- 8.2.4.1.1 Germany Embedded Non-volatile Memory Market by Wafer Size
- 8.2.4.1.2 Germany Embedded Non-volatile Memory Market by Product
- 8.2.4.1.3 Germany Embedded Non-volatile Memory Market by Application
- 8.2.4.2 UK Embedded Non-volatile Memory Market
- 8.2.4.2.1 UK Embedded Non-volatile Memory Market by Wafer Size
- 8.2.4.2.2 UK Embedded Non-volatile Memory Market by Product
- 8.2.4.2.3 UK Embedded Non-volatile Memory Market by Application
- 8.2.4.3 France Embedded Non-volatile Memory Market
- 8.2.4.3.1 France Embedded Non-volatile Memory Market by Wafer Size
- 8.2.4.3.2 France Embedded Non-volatile Memory Market by Product
- 8.2.4.3.3 France Embedded Non-volatile Memory Market by Application
- 8.2.4.4 Russia Embedded Non-volatile Memory Market
- 8.2.4.4.1 Russia Embedded Non-volatile Memory Market by Wafer Size
- 8.2.4.4.2 Russia Embedded Non-volatile Memory Market by Product
- 8.2.4.4.3 Russia Embedded Non-volatile Memory Market by Application
- 8.2.4.5 Spain Embedded Non-volatile Memory Market
- 8.2.4.5.1 Spain Embedded Non-volatile Memory Market by Wafer Size
- 8.2.4.5.2 Spain Embedded Non-volatile Memory Market by Product
- 8.2.4.5.3 Spain Embedded Non-volatile Memory Market by Application
- 8.2.4.6 Italy Embedded Non-volatile Memory Market
- 8.2.4.6.1 Italy Embedded Non-volatile Memory Market by Wafer Size
- 8.2.4.6.2 Italy Embedded Non-volatile Memory Market by Product
- 8.2.4.6.3 Italy Embedded Non-volatile Memory Market by Application
- 8.2.4.7 Rest of Europe Embedded Non-volatile Memory Market
- 8.2.4.7.1 Rest of Europe Embedded Non-volatile Memory Market by Wafer Size
- 8.2.4.7.2 Rest of Europe Embedded Non-volatile Memory Market by Product
- 8.2.4.7.3 Rest of Europe Embedded Non-volatile Memory Market by Application
- 8.3 Asia Pacific Embedded Non-volatile Memory Market
- 8.3.1 Asia Pacific Embedded Non-volatile Memory Market by Wafer Size
- 8.3.1.1 Asia Pacific >100 mm Market by Country
- 8.3.1.2 Asia Pacific <100 mm Market by Country
- 8.3.2 Asia Pacific Embedded Non-volatile Memory Market by Product
- 8.3.2.1 Asia Pacific eFlash Market by Country
- 8.3.2.2 Asia Pacific eE2PROM Market by Country
- 8.3.2.3 Asia Pacific FRAM Market by Country
- 8.3.2.4 Asia Pacific Other Product Market by Country
- 8.3.3 Asia Pacific Embedded Non-volatile Memory Market by Application
- 8.3.3.1 Asia Pacific BFSI Market by Country
- 8.3.3.2 Asia Pacific Information Technology Market by Country
- 8.3.3.3 Asia Pacific Consumer Electronics Market by Country
- 8.3.3.4 Asia Pacific Telecommunications Market by Country
- 8.3.3.5 Asia Pacific Government Market by Country
- 8.3.3.6 Asia Pacific Others Application Market by Country
- 8.3.4 Asia Pacific Embedded Non-volatile Memory Market by Country
- 8.3.4.1 China Embedded Non-volatile Memory Market
- 8.3.4.1.1 China Embedded Non-volatile Memory Market by Wafer Size
- 8.3.4.1.2 China Embedded Non-volatile Memory Market by Product
- 8.3.4.1.3 China Embedded Non-volatile Memory Market by Application
- 8.3.4.2 Japan Embedded Non-volatile Memory Market
- 8.3.4.2.1 Japan Embedded Non-volatile Memory Market by Wafer Size
- 8.3.4.2.2 Japan Embedded Non-volatile Memory Market by Product
- 8.3.4.2.3 Japan Embedded Non-volatile Memory Market by Application
- 8.3.4.3 India Embedded Non-volatile Memory Market
- 8.3.4.3.1 India Embedded Non-volatile Memory Market by Wafer Size
- 8.3.4.3.2 India Embedded Non-volatile Memory Market by Product
- 8.3.4.3.3 India Embedded Non-volatile Memory Market by Application
- 8.3.4.4 South Korea Embedded Non-volatile Memory Market
- 8.3.4.4.1 South Korea Embedded Non-volatile Memory Market by Wafer Size
- 8.3.4.4.2 South Korea Embedded Non-volatile Memory Market by Product
- 8.3.4.4.3 South Korea Embedded Non-volatile Memory Market by Application
- 8.3.4.5 Australia Embedded Non-volatile Memory Market
- 8.3.4.5.1 Australia Embedded Non-volatile Memory Market by Wafer Size
- 8.3.4.5.2 Australia Embedded Non-volatile Memory Market by Product
- 8.3.4.5.3 Australia Embedded Non-volatile Memory Market by Application
- 8.3.4.6 Malaysia Embedded Non-volatile Memory Market
- 8.3.4.6.1 Malaysia Embedded Non-volatile Memory Market by Wafer Size
- 8.3.4.6.2 Malaysia Embedded Non-volatile Memory Market by Product
- 8.3.4.6.3 Malaysia Embedded Non-volatile Memory Market by Application
- 8.3.4.7 Rest of Asia Pacific Embedded Non-volatile Memory Market
- 8.3.4.7.1 Rest of Asia Pacific Embedded Non-volatile Memory Market by Wafer Size
- 8.3.4.7.2 Rest of Asia Pacific Embedded Non-volatile Memory Market by Product
- 8.3.4.7.3 Rest of Asia Pacific Embedded Non-volatile Memory Market by Application
- 8.4 LAMEA Embedded Non-volatile Memory Market
- 8.4.1 LAMEA Embedded Non-volatile Memory Market by Wafer Size
- 8.4.1.1 LAMEA >100 mm Market by Country
- 8.4.1.2 LAMEA <100 mm Market by Country
- 8.4.2 LAMEA Embedded Non-volatile Memory Market by Product
- 8.4.2.1 LAMEA eFlash Market by Country
- 8.4.2.2 LAMEA eE2PROM Market by Country
- 8.4.2.3 LAMEA FRAM Market by Country
- 8.4.2.4 LAMEA Other Product Market by Country
- 8.4.3 LAMEA Embedded Non-volatile Memory Market by Application
- 8.4.3.1 LAMEA BFSI Market by Country
- 8.4.3.2 LAMEA Information Technology Market by Country
- 8.4.3.3 LAMEA Consumer Electronics Market by Country
- 8.4.3.4 LAMEA Telecommunications Market by Country
- 8.4.3.5 LAMEA Government Market by Country
- 8.4.3.6 LAMEA Others Application Market by Country
- 8.4.4 LAMEA Embedded Non-volatile Memory Market by Country
- 8.4.4.1 Brazil Embedded Non-volatile Memory Market
- 8.4.4.1.1 Brazil Embedded Non-volatile Memory Market by Wafer Size
- 8.4.4.1.2 Brazil Embedded Non-volatile Memory Market by Product
- 8.4.4.1.3 Brazil Embedded Non-volatile Memory Market by Application
- 8.4.4.2 Argentina Embedded Non-volatile Memory Market
- 8.4.4.2.1 Argentina Embedded Non-volatile Memory Market by Wafer Size
- 8.4.4.2.2 Argentina Embedded Non-volatile Memory Market by Product
- 8.4.4.2.3 Argentina Embedded Non-volatile Memory Market by Application
- 8.4.4.3 UAE Embedded Non-volatile Memory Market
- 8.4.4.3.1 UAE Embedded Non-volatile Memory Market by Wafer Size
- 8.4.4.3.2 UAE Embedded Non-volatile Memory Market by Product
- 8.4.4.3.3 UAE Embedded Non-volatile Memory Market by Application
- 8.4.4.4 Saudi Arabia Embedded Non-volatile Memory Market
- 8.4.4.4.1 Saudi Arabia Embedded Non-volatile Memory Market by Wafer Size
- 8.4.4.4.2 Saudi Arabia Embedded Non-volatile Memory Market by Product
- 8.4.4.4.3 Saudi Arabia Embedded Non-volatile Memory Market by Application
- 8.4.4.5 South Africa Embedded Non-volatile Memory Market
- 8.4.4.5.1 South Africa Embedded Non-volatile Memory Market by Wafer Size
- 8.4.4.5.2 South Africa Embedded Non-volatile Memory Market by Product
- 8.4.4.5.3 South Africa Embedded Non-volatile Memory Market by Application
- 8.4.4.6 Nigeria Embedded Non-volatile Memory Market
- 8.4.4.6.1 Nigeria Embedded Non-volatile Memory Market by Wafer Size
- 8.4.4.6.2 Nigeria Embedded Non-volatile Memory Market by Product
- 8.4.4.6.3 Nigeria Embedded Non-volatile Memory Market by Application
- 8.4.4.7 Rest of LAMEA Embedded Non-volatile Memory Market
- 8.4.4.7.1 Rest of LAMEA Embedded Non-volatile Memory Market by Wafer Size
- 8.4.4.7.2 Rest of LAMEA Embedded Non-volatile Memory Market by Product
- 8.4.4.7.3 Rest of LAMEA Embedded Non-volatile Memory Market by Application
Chapter 9. Company Profiles
- 9.1 Samsung Electronics Co., Ltd. (Samsung Group)
- 9.1.1 Company Overview
- 9.1.2 Financial Analysis
- 9.1.3 Segmental and Regional Analysis
- 9.1.4 Research & Development Expenses
- 9.1.5 Recent strategies and developments:
- 9.1.5.1 Product Launches and Product Expansions:
- 9.1.6 SWOT Analysis
- 9.2 Micron Technology, Inc.
- 9.2.1 Company Overview
- 9.2.2 Financial Analysis
- 9.2.3 Segmental and Regional Analysis
- 9.2.4 Research & Development Expenses
- 9.2.5 Recent strategies and developments:
- 9.2.5.1 Partnerships, Collaborations, and Agreements:
- 9.2.5.2 Product Launches and Product Expansions:
- 9.2.6 SWOT Analysis
- 9.3 ROHM Co., Ltd.
- 9.3.1 Company Overview
- 9.3.2 Financial Analysis
- 9.3.3 Segmental and Regional Analysis
- 9.3.4 Research & Development Expense
- 9.3.5 SWOT Analysis
- 9.4 Toshiba International Corporation
- 9.4.1 Company Overview
- 9.4.2 Financial Analysis
- 9.4.3 Segmental and Regional Analysis
- 9.4.4 Research and Development Expense
- 9.4.5 Recent strategies and developments:
- 9.4.5.1 Product Launches and Product Expansions:
- 9.4.6 SWOT Analysis
- 9.5 Honeywell International, Inc.
- 9.5.1 Company Overview
- 9.5.2 Financial Analysis
- 9.5.3 Segmental and Regional Analysis
- 9.5.4 Research & Development Expenses
- 9.5.5 SWOT Analysis
- 9.6 Fujitsu Limited
- 9.6.1 Company Overview
- 9.6.2 Financial Analysis
- 9.6.3 Segmental and Regional Analysis
- 9.6.4 Research & Development Expenses
- 9.6.5 Recent strategies and developments:
- 9.6.5.1 Product Launches and Product Expansions:
- 9.6.6 SWOT Analysis
- 9.7 Infineon Technologies AG
- 9.7.1 Company Overview
- 9.7.2 Financial Analysis
- 9.7.3 Segmental and Regional Analysis
- 9.7.4 Research & Development Expense
- 9.7.5 Recent strategies and developments:
- 9.7.5.1 Product Launches and Product Expansions:
- 9.7.6 SWOT Analysis
- 9.8 Intel Corporation
- 9.8.1 Company Overview
- 9.8.2 Financial Analysis
- 9.8.3 Segmental and Regional Analysis
- 9.8.4 Research & Development Expenses
- 9.8.5 Recent strategies and developments:
- 9.8.5.1 Partnerships, Collaborations, and Agreements:
- 9.8.6 SWOT Analysis
- 9.9 NXP Semiconductors N.V.
- 9.9.1 Company Overview
- 9.9.2 Financial Analysis
- 9.9.3 Regional Analysis
- 9.9.4 Research & Development Expenses
- 9.9.5 Recent strategies and developments:
- 9.9.5.1 Product Launches and Product Expansions:
- 9.9.6 SWOT Analysis
- 9.10. STMicroelectronics N.V.
- 9.10.1 Company Overview
- 9.10.2 Financial Analysis
- 9.10.3 Segmental and Regional Analysis
- 9.10.4 Research & Development Expenses
- 9.10.5 Recent strategies and developments:
- 9.10.5.1 Product Launches and Product Expansions:
- 9.10.6 SWOT Analysis
Chapter 10. Winning Imperatives for Embedded Non-volatile Memory Market