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市場調查報告書

商品編碼

1410073

2023年至2028年半導體組裝與測試服務（OSAT）市場預測

Outsourced Semiconductor Assembly And Test Services (OSAT) Market - Forecasts from 2023 to 2028

出版日期: 2023年12月11日 | 出版商:

Knowledge Sourcing Intelligence | 英文 145 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄

預計到 2021 年，半導體組裝和測試服務 (OSAT) 市場規模將達到 225.5138 億美元，預測期內複合年成長率為 16.01%。

半導體組裝和測試服務（OSAT）是指為半導體公司提供專業化製造和測試服務的行業。 OSAT 公司與半導體製造商簽訂契約，組裝、封裝和測試積體電路 (IC) 和其他半導體裝置。我們提供先進封裝技術（例如晶圓層次電子構裝和覆晶鍵合）的專業知識以及全面的測試服務，以確保半導體成品的品質和可靠性。 OSAT 服務使半導體公司專注於核心研發，同時受益於外包合作夥伴提供的專業能力和成本效率。

介紹

半導體組裝和測試服務（OSAT）市場是指以外包方式為半導體公司提供組裝和測試服務的產業。隨著半導體裝置變得越來越複雜、越來越小，市場正在經歷顯著成長，增加了對專業知識和先進封裝解決方案的需求。該市場還提供經濟高效且擴充性的製造和檢驗服務，使半導體公司能夠簡化業務、縮短上市時間並專注於核心競爭力。 OSAT 市場的特點是技術進步、嚴格的品質標準以及由創新和以客戶為中心的解決方案驅動的競爭形勢。

促進因素

半導體裝置的複雜度不斷增加

隨著先進積體電路 (IC) 等半導體裝置變得越來越複雜，組裝和檢查需要專門的知識和專業知識。 OSAT 供應商引領市場，提供滿足複雜封裝要求所需的能力和技術。

對小型化的需求不斷增加

對更小、更緊湊的電子設備的需求持續成長。小型化需要先進的封裝技術，例如晶圓層次電子構裝和覆晶鍵合，而 OSAT 公司擅長這些技術並正在推動市場成長。

成本最佳化和效率

透過將組裝和測試服務委託給 OSAT 供應商，半導體公司可以最佳化成本並提高業務效率。 OSAT 供應商可以利用規模經濟、專業知識和先進設備來提供具有成本效益的製造和測試解決方案。

技術進步

OSAT 公司不斷投資於研發，以保持在組裝和測試技術進步的前沿。隨著半導體製造商為其產品尋求尖端解決方案，我們採用和開發新技術的能力正在推動市場開拓。

專注於核心能力

半導體公司通常更願意將組裝和測試等非核心功能外包給 OSAT 供應商。這使您能夠專注於自己的核心競爭力，例如 IC 設計和創新，同時依靠 OSAT 的專業封裝和測試服務。

上市時間壓力

半導體產業是一個競爭激烈的行業，上市時間至關重要。 OSAT 供應商提供快速的周轉時間和簡化的流程，使半導體公司能夠滿足市場需求並更快地推出產品。

擴充性和彈性

OSAT 供應商擴大生產規模和回應需求變化的能力是一個關鍵促進因素。半導體公司可以利用 OSAT 合作夥伴提供的可擴展性和彈性來快速回應市場波動。

品質和可靠性要求

半導體產業強調品質和可靠性。 OSAT供應商擁有專業的測試能力和品管流程，以確保半導體裝置的完整性和性能，並滿足嚴格的行業標準。

全球趨勢與外包：

半導體產業的全球化導致越來越多的組裝和測試服務外包給 OSAT 供應商。公司受益於全球設施網路、特定地區的成本優勢以及利用 OSAT 在全球的專業知識的能力。

對先進封裝解決方案的需求不斷成長：

隨著半導體裝置變得越來越複雜，對先進封裝解決方案的需求也增加。 OSAT 供應商憑藉其在 2.5D 和 3D 封裝、異質整合和系統級封裝(SiP) 等先進封裝技術方面的專業知識來推動市場成長。

主要企業提供的產品

Powertech Technology Inc. (PTI) 宣布推出新的「扇出面板級封裝」(FOPLP) 技術，該技術能夠生產用於移動、汽車和其他應用的高密度、高性能半導體封裝。該技術旨在滿足對更小、更有效率的半導體封裝不斷成長的需求。長電科技集團旗下星科金朋宣布推出全新先進晶圓級球柵陣列 (eWLB) 技術，可生產適用於行動、汽車和其他應用的高性能、低成本半導體封裝。該技術旨在滿足對更小、更有效率的半導體封裝不斷成長的需求。台積電宣布推出全新 InFO（整合式扇出）先進封裝技術，可生產適用於行動、汽車和其他應用的高性能、低功耗半導體封裝。該技術旨在滿足對更小、更有效率的半導體封裝不斷成長的需求。

先進封裝領域正成長

半導體組裝和測試服務（OSAT）市場中正在經歷快速正成長的細分市場是先進封裝細分市場。隨著半導體元件的發展，對晶圓層次電子構裝、覆晶接合和封裝等先進封裝解決方案的需求不斷增加。這些先進的封裝技術可實現更高的性能、更小的尺寸和更高的能源效率。隨著半導體公司尋求他們的專業知識來滿足複雜和小型化半導體裝置的要求，專門從事先進封裝解決方案的 OSAT 供應商的需求不斷增加，使他們成為該領域的首選。我們正在推動積極成長。

預計亞太地區將主導 OSAT市場佔有率

亞太地區預計將主導半導體組裝和測試服務（OSAT）市場佔有率。由於成本優勢、熟練勞動力和強大的供應鏈生態系統等因素，該地區已成為半導體製造的重要中心。中國、台灣和韓國等國家已成為半導體產業的主要參與者，吸引了半導體公司和 OSAT 供應商。該地區領先的半導體製造商的存在、高產量和技術專長有助於他們在 OSAT市場佔有率中佔據主導地位。

主要進展

2023年6月，全球最大的半導體公司之一美光科技宣布有意在印度古吉拉突邦建造一座新的組裝和測試工廠。這座新工廠將使美光能夠組裝和測試生產 DRAM 和 NAND 產品，以滿足國內和國際市場的需求。 2022年12月，印度領先企業集團之一塔塔集團宣布透過塔塔電子私人有限公司進軍半導體業務。該公司計劃建立一個半導體組裝和測試（OSAT）部門，也稱為組裝、測試、標記和封裝（ATMP）部門。此舉意義重大，因為它符合印度政府的生產掛鉤激勵（PLI）計劃，該計劃旨在發展印度的半導體和顯示器製造生態系統。

介紹
北美洲
- 美國
- 加拿大
- 墨西哥
南美洲
- 巴西
- 阿根廷
- 其他
歐洲
- 英國
- 德國
- 法國
- 義大利
- 西班牙
- 其他
中東/非洲
- 沙烏地阿拉伯
- 阿拉伯聯合大公國
- 其他
亞太地區
- 日本
- 中國
- 印度
- 韓國
- 台灣
- 泰國
- 印尼
- 其他

第9章競爭環境及分析

主要企業及策略分析
市場佔有率分析
合併、收購、協議和合作

第10章公司簡介

ASE Group（ASE Technology Holdings）
Amkor Technology Inc.
Powertech Technology Inc.
ChipMOS Technologies Inc.
King Yuan Electronics Co. Ltd
Jiangsu Changjiang Electronics Technology Co. Ltd
UTAC Holdings Ltd
Lingsen Precision Industries Ltd
Tongfu Microelectronics Co.

簡介目錄

Product Code: KSI061615732

The Outsourced Semiconductor Assembly and Test Services (OSAT) market was valued at US$22,551.380 million in 2021 and is expected to grow at a CAGR of 16.01% during the forecast period.

Outsourced Semiconductor Assembly and Test Services (OSAT) refer to the industry that provides specialized manufacturing and testing services for semiconductor companies. OSAT companies are contracted by semiconductor manufacturers to handle the assembly, packaging, and testing of integrated circuits (ICs) and other semiconductor devices. They offer expertise in advanced packaging technologies, such as wafer-level packaging and flip-chip bonding, as well as comprehensive testing services to ensure the quality and reliability of the final semiconductor products. OSAT services allow semiconductor companies to focus on core research and development while benefiting from the specialized capabilities and cost-effectiveness offered by these outsourcing partners.

Introduction:

The Outsourced Semiconductor Assembly and Test Services (OSAT) Market refers to the industry encompassing the provision of assembly and testing services for semiconductor companies on an outsourced basis. This market has been witnessing significant growth due to the increasing complexity and miniaturization of semiconductor devices, driving the demand for specialized expertise and advanced packaging solutions. This market also offers cost-effective and scalable manufacturing and testing services, allowing semiconductor companies to streamline their operations, reduce time-to-market, and focus on core competencies. The OSAT market is characterized by technological advancements, stringent quality standards, and a competitive landscape driven by innovation and customer-centric solutions.

Drivers:

Increasing Complexity of Semiconductor Devices:

The rising complexity of semiconductor devices, such as advanced integrated circuits (ICs), requires specialized knowledge and expertise in assembly and testing. OSAT providers offer the necessary capabilities and technologies to handle complex packaging requirements, driving the market.

Growing Demand for Miniaturization:

The demand for smaller, more compact electronic devices continues to rise. Miniaturization requires advanced packaging techniques, including wafer-level packaging and flip-chip bonding, which OSAT companies specialize in, driving their market growth.

Cost Optimization and Efficiency:

Outsourcing assembly and testing services to OSAT providers allows semiconductor companies to optimize costs and improve operational efficiency. OSAT providers can leverage economies of scale, expertise, and advanced equipment to provide cost-effective manufacturing and testing solutions.

Technological Advancements:

OSAT companies constantly invest in research and development to stay at the forefront of technological advancements in assembly and testing. Their ability to adopt and develop new technologies drives the market as semiconductor companies seek the latest solutions for their products.

Focus on Core Competencies:

Semiconductor companies often prefer to outsource non-core functions, such as assembly and testing, to OSAT providers. This enables them to focus on their core competencies, such as IC design and innovation, while relying on specialized OSAT services for packaging and testing.

Time-to-Market Pressure:

The semiconductor industry operates in a highly competitive landscape, where time-to-market is critical. OSAT providers offer quick turnaround times and streamlined processes, enabling semiconductor companies to meet market demands and launch products faster.

Scalability and Flexibility:

The ability of OSAT providers to scale production and adapt to changing demand is a significant driver. Semiconductor companies can leverage the scalability and flexibility offered by OSAT partners, allowing them to respond quickly to market fluctuations.

Quality and Reliability Requirements:

The semiconductor industry places a strong emphasis on quality and reliability. OSAT providers are equipped with specialized testing capabilities and quality control processes to ensure the integrity and performance of semiconductor devices, meeting stringent industry standards.

Globalization and Outsourcing Trends:

The globalization of the semiconductor industry has led to increased outsourcing of assembly and testing services to OSAT providers. Companies benefit from access to a global network of facilities, cost advantages in certain regions, and the ability to tap into OSAT expertise worldwide.

Increasing Demand for Advanced Packaging Solutions:

As semiconductor devices become more advanced, the need for sophisticated packaging solutions grows. OSAT providers offer expertise in advanced packaging technologies, such as 2.5D and 3D packaging, heterogeneous integration, and system-in-package (SiP), driving their market growth.

Products offered by key companies:

Powertech Technology Inc. (PTI) launched its new "Fan-Out Panel Level Packaging" (FOPLP) technology, which enables the production of high-density, high-performance semiconductor packages for mobile, automotive, and other applications. The technology is designed to meet the growing demand for smaller, more efficient semiconductor packages.
STATS ChipPAC , a subsidiary of JCET Group launched its new "Advanced Embedded Wafer Level Ball Grid Array" (eWLB) technology, which enables the production of high-performance, low-cost semiconductor packages for mobile, automotive, and other applications. The technology is designed to meet the growing demand for smaller, more efficient semiconductor packages.
TSMC launched its new "Integrated Fan-Out (InFO) Advanced Packaging" technology, which enables the production of high-performance, low-power semiconductor packages for mobile, automotive, and other applications. The technology is designed to meet the growing demand for smaller, more efficient semiconductor packages.

Positive growth in the advanced packaging segment:

The segment that is experiencing rapid positive growth in the Outsourced Semiconductor Assembly and Test Services (OSAT) market is the advanced packaging segment. As semiconductor devices continue to evolve, there is a growing demand for advanced packaging solutions such as wafer-level packaging, flip-chip bonding, and packaging. These advanced packaging technologies enable higher performance, smaller form factors, and improved power efficiency. OSAT providers specializing in advanced packaging solutions are witnessing increased demand as semiconductor companies seek their expertise to meet the requirements of complex and miniaturized semiconductor devices, driving positive growth in this segment.

The Asia-Pacific region is expected to dominate the OSAT market share:

Asia-Pacific is expected to dominate the Outsourced Semiconductor Assembly and Test Services (OSAT) market share. The region has emerged as a key hub for semiconductor manufacturing, driven by factors such as cost advantages, a skilled workforce, and a strong supply chain ecosystem. Countries like China, Taiwan, and South Korea have established themselves as major players in the semiconductor industry, attracting semiconductor companies and OSAT providers. The presence of leading semiconductor manufacturers, high production volumes, and technological expertise in the region contribute to its dominance in the OSAT market share.

Key developments:

In June 2023, one of the biggest semiconductor firms in the world, Micron Technology, Inc., revealed intentions to construct a new assembly and testing facility in Gujarat, India. With its new location, Micron will be able to meet demand from both local and foreign markets and conduct assembly and test production for both DRAM and NAND products.
In Dec 2022, Tata Group, one of India's leading conglomerates, announced its entry into the semiconductor business through Tata Electronics Private Limited. The company plans to set up an Outsourced Semiconductor Assembly and Test (OSAT) unit, also known as an Assembly, Testing, Marking, and Packaging (ATMP) unit. This move is significant as it aligns with the Indian government's production-linked incentive (PLI) scheme, aimed at developing the semiconductor and display manufacturing ecosystem in India.

Segmentation

By Service Type

Packaging
Testing

By Packaging Type

Ball Grid Array (BGA) Packaging
Chip-scale Packaging (CSP)
Stacked Die Packaging
Multi-chip Packaging
Quad Flat and Dual-inline Packaging

By Application

Communication
Consumer Electronics
Automotive
Computing and Networking
Industrial
Others

By Geography

North America
United States
Canada
Mexico
South America
Brazil
Argentina
Others
Europe
United Kingdom
Germany
France
Italy
Spain
Others
Middle East and Africa
Saudi Arabia
UAE
Others
Asia Pacific
Japan
China
India
South Korea
Taiwan
Thailand
Indonesia
Others

1. INTRODUCTION

1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Market Segmentation
1.5. Currency
1.6. Assumptions
1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

2.1. Research Data
2.2. Assumptions

3. EXECUTIVE SUMMARY

3.1. Research Highlights

4. MARKET DYNAMICS

4.1. Market Drivers
4.2. Market Restraints
4.3. Porter's Five Force Analysis
- 4.3.1. Bargaining Power of Suppliers
- 4.3.2. Bargaining Power of Buyers
- 4.3.3. Threat of New Entrants
- 4.3.4. Threat of Substitutes
- 4.3.5. Competitive Rivalry in the Industry
4.4. Industry Value Chain Analysis

5. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES (OSAT) MARKET BY SERVICE TYPE

5.1. Introduction
5.2. Packaging
5.3. Testing

6. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES (OSAT) MARKET BY PACKAGING TYPE

6.1. Introduction
6.2. Ball Grid Array (BGA) Packaging
6.3. Chip-scale Packaging (CSP)
6.4. Stacked Die Packaging
6.5. Multi-chip Packaging
6.6. Quad Flat and Dual-inline Packaging

7. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES (OSAT) MARKET BY APPLICATION

7.1. Introduction
7.2. Communication
7.3. Consumer Electronics
7.4. Automotive
7.5. Computing and Networking
7.6. Industrial
7.7. Others

8. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES (OSAT) MARKET BY GEOGRAPHY

8.1. Introduction
8.2. North America
- 8.2.1. United States
- 8.2.2. Canada
- 8.2.3. Mexico
8.3. South America
- 8.3.1. Brazil
- 8.3.2. Argentina
- 8.3.3. Others
8.4. Europe
- 8.4.1. United Kingdom
- 8.4.2. Germany
- 8.4.3. France
- 8.4.4. Italy
- 8.4.5. Spain
- 8.4.6. Others
8.5. The Middle East and Africa
- 8.5.1. Saudi Arabia
- 8.5.2. UAE
- 8.5.3. Others
8.6. Asia Pacific
- 8.6.1. Japan
- 8.6.2. China
- 8.6.3. India
- 8.6.4. South Korea
- 8.6.5. Taiwan
- 8.6.6. Thailand
- 8.6.7. Indonesia
- 8.6.8. Others