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市場調查報告書

商品編碼

1410229

液體封裝市場：2023年至2028年預測

Liquid Encapsulation Market - Forecasts from 2023 to 2028

出版日期: 2023年12月06日 | 出版商:

Knowledge Sourcing Intelligence | 英文 132 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

液體封裝市場預計將從 2021 年的 17.03 億美元增至 2028 年的 23.32 億美元，預測期內複合年成長率為 4.59%。

液體封裝是將聚合物、金屬和陶瓷等物質塗布固體或液體設備以保護其免受衝擊和潮濕的方法。此保護層用於維持設備功能並防止電氣組件之間斷開連接。這種封裝製程通常使用環氧樹脂和環氧改質材料。

液體封裝市場的動態成長歸因於幾個關鍵因素。首先，電子設備日益複雜、可操作性不斷提高，加上電氣元件小型化的趨勢，正在推動市場擴張。此外，通訊和電子產業的快速成長以及對感測器設備、無線技術和光電子學的需求不斷成長，導致封裝技術的使用不斷增加。例如，2023年6月，滑鐵盧大學宣布了該大學研究部門開發的一項新封裝技術—液體封裝系統。這項創新將能耗顯著降低了至少 5000 倍，並且在封裝過程中不使用微塑膠。

半導體在各行業的不斷擴大應用正在推動市場成長。

半導體元件小型化的不斷成長趨勢正在推動對液體封裝技術的需求。此方法用於底部填充、空腔填充、先進封裝和球頂封裝等任務，在半導體裝置的生產中至關重要。它可以提高更小、更複雜的電子設備的效率，而不會影響品質。由於電子設備和半導體由需要精確放置的精密元件組成，這些因素預計將推動市場成長。液體封裝對於設備運作也至關重要，可防止電子設備組件發生故障，從而加速成長。

根據半導體產業協會（SIA）按地區分類的全球半導體產業銷售額，2022年中國將引領全球半導體產業銷售額，銷售額達156.7億美元，緊追在後的是美洲，銷售額創歷史新高118.4億。其次是亞太/世界其他地區，其銷售額也很可觀，總合129.1 億美元，反映了全球市場的動態和競爭。半導體銷售成長在加強液體封裝市場方面發揮關鍵作用。

台灣液態封裝市場預計將穩定成長。

液體封裝是MEMS元件的一種開發技術。與環氧樹脂封裝相比，液體封裝更加彈性，因此被用於半導體、板載晶片、IC和電晶體等應用。台灣是主要的半導體製造國家之一，由於電氣電子設備和汽車等終端用戶對IC的需求迅速成長，IC的產量大幅增加。例如，根據台灣半導體工業協會的數據，2022年台灣IC銷售額為新台幣4.837兆，比2021年的新台幣4.82兆成長18.5%。

此外，台灣國家科學技術委員會積極努力加強台灣在全球範圍內的積體電路製造領域的影響力，進一步促進了市場的成長。此外，日東電工公司和台灣 PU 公司等主要液體封裝供應商的強大影響力也是市場的促進因素。此外，汽車MEMS的應用不斷擴大，如慣性感測器、氣體感測器、光學感測器、壓力感測器等，以及這些最終用戶的加速成長，也有助於保護MEMS免受外部環境因素影響的液體膠囊。預計這將同時增加對根據國際汽車工業組織預測，2022年台灣汽車產量為265,320輛，較2020年的245,615輛增加6%。

市場主要發展

2022 年 1 月，TDK 推出了 SmartMotion(TM) 超高效能係列，該系列採用尖端的 BalancedGyro(TM) 技術和適用於消費性應用的最低功耗。 TDK 公司推出 InvenSense ICM-45xxx SmartMotion(TM) 超高性能 (UHP) 6 軸 MEMS 運動感測器系列，為產業性能和效率樹立了新標準。 2021 年 6 月漢高的 Technomelt 低壓成型技術滿足電子和醫療零件封裝的最新要求，並正在獲得各行業的認可。該技術在醫療、電子、電力、工業自動化、暖通空調和照明領域的應用越來越廣泛。與反應性樹脂系統灌封和高壓射出成型等替代方案相比，該技術具有多種經濟、製程控制、設計和環境優勢，因此脫穎而出。

Liquid encapsulation is a method that entails the application of substances such as polymers, metals, and ceramics to solid or liquid devices to shield them from shocks and moisture. This protective layer is employed to maintain device functionality and prevent disconnections among electrical components. Epoxy resin and epoxy-modified substances are commonly employed for this encapsulation process.

The dynamic growth of the liquid encapsulation market can be attributed to several key factors. Firstly, the increasing complexity and operability of electronic devices, coupled with the trend toward miniaturized electrical components, are driving market expansion. Additionally, the rapid growth of the telecommunications and electronics industries, alongside the rising demand for sensor devices, wireless technologies, and optoelectronics, has led to greater utilization of encapsulation methods. For example, in June 2023, the University of Waterloo introduced a novel encapsulation technology developed by its research department known as the liquid-liquid encapsulation system. This innovation boasts significantly lower energy consumption, being at least 5000 times less intensive, and it eliminates the use of microplastics during encapsulation.

The growing application of semiconductors across various industries is propelling the market growth.

The surging trend towards miniaturized semiconductor devices is fueling the demand for liquid encapsulation technology. This method is vital in the production of semiconductor devices, used for tasks like under-filling, cavity filling, advanced packaging, and glob-top encapsulation. It enhances the efficiency of smaller, more intricate electronic devices without compromising quality. As electronics and semiconductors consist of delicate components requiring precise placement, this factor is expected to boost market growth. Liquid encapsulation is also crucial for device operation, preventing component malfunctions in electronic devices, thus accelerating its growth.

According to The Semiconductor Industry Association (SIA) global semiconductor industry sales by region, data shows that in 2022, the global semiconductor industry sales were led by China, with sales figures reaching $15.67 billion, closely followed by the Americas, which recorded sales of $11.84 billion. Subsequently, the Asia-Pacific/all other regions also showed substantial sales, totalling $12.91 billion, reflecting a dynamic and competitive global market. Increased sales of semiconductor plays a pivotal role in bolstering the liquid encapsulation market as they create demand for miniaturized semiconductor devices resulting in a surge in its market growth.

It is projected that the Taiwan liquid encapsulation market will grow steadily.

Liquid encapsulation refers to the technology of developing MEMS devices and in comparison, to epoxy molded compounds liquid encapsulant's high flexibility enables them to be used in semiconductor, chip-on-board, ICs, and transistors applications. Taiwan is one of the leading semiconductor manufacturing countries and with booming end-user demand for ICs in electrical & electronics and automotive, the country is witnessing a significant increase in its ICs production which is expected to provide a positive scope for the usage of liquid encapsulation technology for boosting the mechanical strength of wire-bonded devices. For instance, according to the Taiwan Semiconductor Industry Association, in 2022, Taiwan's IC revenue stood at NT$4,837 billion which represented an 18.5% increase over 2021's revenue figure of NT$4,082 billion.

Moreover, the favorable initiatives undertaken by the National Science and Technology Council, Taiwan to bolster the country's presence in IC manufacturing on a global scale has further augmented the market growth. Furthermore, the well-established presence of major liquid encapsulant providers such as Nitto Denko Corporation and Taiwan PU Corporation is acting as an additional driving factor. Also, the growing applicability of MEMS in automotive for inertia, gas, optical, and pressure sensors coupled with the bolstering growth in such end-users is anticipated to simultaneously increase the demand for liquid encapsulation for safeguarding MEMS from external environment factors. According to the International Organization of Motor Vehicle Manufacturers, in 2022, Taiwan's automotive production stood at 2,65,320 units which signified a 6% increase over 2020's production volume of 2,45,615.

Market Key Developments

In January 2022, TDK introduced its SmartMotion™ ultra-high-performance family, featuring cutting-edge BalancedGyro™ technology and the lowest power consumption available for consumer applications. TDK Corporation unveiled the InvenSense ICM-45xxx SmartMotion™ ultra-high-performance (UHP) family of 6-axis MEMS motion sensors, setting new standards for performance and efficiency in the industry.
In June 2021, Henkel's Technomelt Low-Pressure Molding technology, which aligns with the latest requirements for encapsulating electronics and medical components, is gaining traction in various industries. This technology is finding increased application in medical, electronic components, power, industrial automation, HVAC, and lighting sectors. It stands out by providing several economic, process control, design, and environmental benefits when compared to alternative methods, including potting with reactive resin systems and high-pressure injection molding.

Segmentation:

By Materials

Epoxy Resins
Epoxy-Modified Resins
Others

By Product

Integrated circuit
Optoelectronics
Sensors
Others

By Application

Automotive
Communication and Technology
Consumer Electronics
Manufacturing

By Geography

Americas
USA
Others
Europe, Middle East and Africa
Germany
UK
France
Others
Asia Pacific
China
Japan
Taiwan
South Korea
Others

1. INTRODUCTION

1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Market Segmentation
1.5. Currency
1.6. Assumptions
1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

2.1. Research Data
2.2. Assumptions

3. EXECUTIVE SUMMARY

3.1. Research Highlights

4. MARKET DYNAMICS

4.1. Market Drivers
4.2. Market Restraints
4.3. Porter's Five Force Analysis
- 4.3.1. Bargaining Power of Suppliers
- 4.3.2. Bargaining Power of Buyers
- 4.3.3. Threat of New Entrants
- 4.3.4. Threat of Substitutes
- 4.3.5. Competitive Rivalry in the Industry
4.4. Industry Value Chain Analysis

5. LIQUID ENCAPSULATION MARKET BY MATERIALS

5.1. Introduction
5.2. Epoxy Resins
5.3. Epoxy-Modified Resins
5.4. Others

6. LIQUID ENCAPSULATION MARKET BY PRODUCT

6.1. Introduction
6.2. Integrated circuit
6.3. Optoelectronics
6.4. Sensors
6.5. Others

7. LIQUID ENCAPSULATION MARKET BY APPLICATION

7.1. Introduction
7.2. Automotive
7.3. Communication and Technology
7.4. Consumer Electronics
7.5. Manufacturing

8. LIQUID ENCAPSULATION MARKET BY GEOGRAPHY

8.1. Introduction
8.2. Americas
- 8.2.1. USA
- 8.2.2. Others
8.3. Europe, Middle East and Africa
- 8.3.1. Germany
- 8.3.2. UK
- 8.3.3. France
- 8.3.4. Others
8.4. Asia Pacific
- 8.4.1. China
- 8.4.2. Japan
- 8.4.3. Taiwan
- 8.4.4. South Korea
- 8.4.5. Others