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市場調查報告書
商品編碼
1456985

全球低溫鈷燒陶瓷基板市場 - 2024 年至 2029 年預測

Global Low Temperature Co Fired Ceramic Substrate Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 114 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

全球低溫鈷燒陶瓷基板市場預計複合年成長率為7.87%，市場規模從2022年的86.8億美元增加至2029年的147.56億美元。

低溫鈷燒陶瓷（LTCC）是一種多層微晶玻璃基板，透過在低燒成溫度（低於1,000°C）下燒製銀或銅等鈷低電阻金屬導體而製成。小型、輕量且能夠高速運作的電子元件和基板正在變得流行。

市場促進因素：

  • 各種最終用途領域的需求增加。

通訊、醫療、汽車、工業、國防和航太等最終用途產業推動了鈷燒陶瓷的需求。共燒陶瓷相對於傳統印刷電路基板在提高熱穩定性和化學惰性方面的優勢是這些行業偏好 LTCC 和 HTCC 的根本因素。對高階計算系統和奈米技術不斷成長的需求將開闢新的工業前景。

各種好處

LTCC 的優勢，例如低損耗介電材料、易於整合嵌入式被動元件以及可靠的多層功能，正在推動其需求。 LTCC 中使用的陶瓷材料比標準 PCB 材料具有更低的損耗角正切。這些小型設備可以使用 LTCC 低成本製造，增加了對廣泛應用於智慧型手機、電腦、行動裝置和 AR/VR 應用的高頻模組的需求。

市場限制因素

  • 技術問題

影響 LTCC 性能的收縮相關問題以及 LTCC 的低導熱率預計將在預測期內阻礙低溫鈷燒陶瓷基板市場的擴張。

目錄

第1章 簡介

  • 市場概況
  • 市場定義
  • 調查範圍
  • 市場區隔
  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要利益

第2章調查方法

  • 研究設計
  • 調查過程

第3章執行摘要

  • 主要發現
  • 分析師觀點

第4章市場動態

  • 市場促進因素
  • 市場限制因素
  • 波特五力分析
  • 產業價值鏈分析
  • 分析師觀點

第5章全球低溫鈷燒陶瓷基板市場：依類型

  • 介紹
  • 射頻系統級封裝
  • 光電封裝
  • 數組包
  • 其他

第6章全球低溫鈷燒陶瓷基板市場：依最終用戶產業

  • 介紹
  • 家用電器
  • 車
  • 航太和軍事
  • 通訊
  • 其他

第7章全球低溫鈷燒陶瓷基板市場：依地區

  • 介紹
  • 北美洲
  • 南美洲
  • 歐洲
  • 中東/非洲
  • 亞太地區

第8章競爭環境及分析

  • 主要企業及策略分析
  • 市場佔有率分析
  • 合併、收購、協議和合作
  • 競爭對手儀表板

第9章 公司簡介

  • Kyocera Corporation
  • DowDuPont, Inc.
  • Koa Speer Electronics, Inc.
  • Murata Manufacturing Co., Ltd.
  • Selmic Oy
  • TDK Corporation
  • Yokowo Co., Ltd.
  • NGK SPARK PLUG CO., LTD.
  • Adamant Namiki
  • Apitech
簡介目錄
Product Code: KSI061611368

The global low temperature co-fired ceramic substrate market is expected to grow at a CAGR of 7.87%, reaching a market size of US$14.756 billion in 2029 from US$8.68 billion in 2022.

Low-temperature co-fired Ceramics (LTCC) are multilayer glass-ceramic substrates that are co-fired with low resistance metal conductors at a low firing temperature (less than 1000°C) such as silver or copper. Electronic components and substrates that are compact, light, and deliver high speed have become popular.

Market Drivers:

  • Rising demand from various end-use sectors-

Telecommunications, medical, automotive, industrial, defense, and aerospace are among the end-use industries driving demand for co-fired ceramics. The robust benefits profile that co-fired ceramics have over conventional printed circuit boards in terms of improved thermal stability and the nature of their chemical inactivity is a fundamental factor for these sectors preference for LTCC and HTCC. Increased demand for high-end computing systems and nanotechnology would open up new industry prospects.

Various advantages-

The advantages of LTCC, such as low-loss dielectric materials, ease of integrating embedded passive components, and reliable multilayer capabilities have increased their demand. Ceramic material utilized in LTCC has a lower loss tangent than standard PCB material. These small devices may be made using LTCC at a low cost, which has boosted demand for radiofrequency modules, which are widely used in smartphones, personal computers, portable devices, and AR/VR applications.

Market Restraint-

  • Technical Issue-

Shrinkage-related problems affecting LTCC Performance and the low thermal conductivity of LTCC are expected to stifle the expansion of the Low-Temperature Co-fired ceramics substrate market in the projected period.

Market Segmentation:

By type, the global Low-Temperature Co-Fired ceramic substrate market is segmented into RF System Level Package, Optoelectronic Packages, Array Packages, and others. By end-user industry, the global Low-Temperature Co-Fired ceramic substrate market is segmented into consumer electronics, automotive, aerospace and military, telecommunication, and others. Due to the incorporation of sensors in many elements of cars, such as engines and power transmissions, the automotive segment holds a significant share. The consumer electronics industry has been also employing LTCC technology due to miniaturization, causing smaller electronic circuit boards to overheat.

Geographical segments:

The Asia-Pacific market is expected to the significant growth in demand for electronic devices, combined with technological developments and improvements in electronics. The country has a large number of market participants at each stage of the supply chain and has been spending heavily on new inventions and research and development. During the projected period, North America is also expected to account for a significant portion of the global market. The expansion of the electronic and automotive industries and R&D investments in North America is a major driver of the low-temperature co-fired ceramic (LTCC) substrate industry.

Market Developments:

  • March 2023- TMY Technology Inc. (TMYTEK) and Celanese collaborated to showcase an innovative Ultra-Low Size, Weight, and Power (SWaP) Electronically Steered Antenna (ESA) solution featuring Antenna-on-Chip (AoC) technology at Satellite 2023. TMYTEK, a leading provider of millimeter-wave solutions, joined forces with Celanese, a global chemical and specialty materials company, to unveil their latest advancement. The dual-polarization AoC technology was crafted using Micromax(R) GreenTape(TM) low-temperature co-fired ceramic (LTCC).

Market Segmentation:

By Type

  • RF System Level Package
  • Optoelectronic Package
  • Array Package
  • Others

By End-User Industry

  • Consumer Electronics
  • Automotive
  • Aerospace and Military
  • Telecommunication
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • UK
  • Germany
  • France
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • Israel
  • Others
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Taiwan
  • Indonesia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline
  • 1.8. Key benefits to the stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. GLOBAL LOW-TEMPERATURE CO-FIRED CERAMIC SUBSTRATE MARKET BY TYPE

  • 5.1. Introduction
  • 5.2. RF System Level Package
    • 5.2.1. Market opportunities and trends
    • 5.2.2. Growth prospects
    • 5.2.3. Geographic lucrativeness
  • 5.3. Optoelectronic Package
    • 5.3.1. Market opportunities and trends
    • 5.3.2. Growth prospects
    • 5.3.3. Geographic lucrativeness
  • 5.4. Array Package
    • 5.4.1. Market opportunities and trends
    • 5.4.2. Growth prospects
    • 5.4.3. Geographic lucrativeness
  • 5.5. Others
    • 5.5.1. Market opportunities and trends
    • 5.5.2. Growth prospects
    • 5.5.3. Geographic lucrativeness

6. GLOBAL LOW-TEMPERATURE CO-FIRED CERAMIC SUBSTRATE MARKET BY END-USER INDUSTRY

  • 6.1. Introduction
  • 6.2. Consumer Electronics
    • 6.2.1. Market opportunities and trends
    • 6.2.2. Growth prospects
    • 6.2.3. Geographic lucrativeness
  • 6.3. Automotive
    • 6.3.1. Market opportunities and trends
    • 6.3.2. Growth prospects
    • 6.3.3. Geographic lucrativeness
  • 6.4. Aerospace and Military
    • 6.4.1. Market opportunities and trends
    • 6.4.2. Growth prospects
    • 6.4.3. Geographic lucrativeness
  • 6.5. Telecommunication
    • 6.5.1. Market opportunities and trends
    • 6.5.2. Growth prospects
    • 6.5.3. Geographic lucrativeness
  • 6.6. Others
    • 6.6.1. Market opportunities and trends
    • 6.6.2. Growth prospects
    • 6.6.3. Geographic lucrativeness

7. GLOBAL LOW-TEMPERATURE CO-FIRED CERAMIC SUBSTRATE MARKET BY GEOGRAPHY

  • 7.1. Introduction
  • 7.2. North America
    • 7.2.1. By Type
    • 7.2.2. By End-user
    • 7.2.3. By Country
      • 7.2.3.1. United States
        • 7.2.3.1.1. Market Trends and Opportunities
        • 7.2.3.1.2. Growth Prospects
      • 7.2.3.2. Canada
        • 7.2.3.2.1. Market Trends and Opportunities
        • 7.2.3.2.2. Growth Prospects
      • 7.2.3.3. Mexico
        • 7.2.3.3.1. Market Trends and Opportunities
        • 7.2.3.3.2. Growth Prospects
  • 7.3. South America
    • 7.3.1. By Type
    • 7.3.2. By End-user
    • 7.3.3. By Country
      • 7.3.3.1. Brazil
        • 7.3.3.1.1. Market Trends and Opportunities
        • 7.3.3.1.2. Growth Prospects
      • 7.3.3.2. Argentina
        • 7.3.3.2.1. Market Trends and Opportunities
        • 7.3.3.2.2. Growth Prospects
      • 7.3.3.3. Others
        • 7.3.3.3.1. Market Trends and Opportunities
        • 7.3.3.3.2. Growth Prospects
  • 7.4. Europe
    • 7.4.1. By Type
    • 7.4.2. By End-user
    • 7.4.3. By Country
      • 7.4.3.1. Germany
        • 7.4.3.1.1. Market Trends and Opportunities
        • 7.4.3.1.2. Growth Prospects
      • 7.4.3.2. France
        • 7.4.3.2.1. Market Trends and Opportunities
        • 7.4.3.2.2. Growth Prospects
      • 7.4.3.3. United Kingdom
        • 7.4.3.3.1. Market Trends and Opportunities
        • 7.4.3.3.2. Growth Prospects
      • 7.4.3.4. Others
        • 7.4.3.4.1. Market Trends and Opportunities
        • 7.4.3.4.2. Growth Prospects
  • 7.5. Middle East and Africa
    • 7.5.1. By Type
    • 7.5.2. By End-user
    • 7.5.3. By Country
      • 7.5.3.1. Saudi Arabia
        • 7.5.3.1.1. Market Trends and Opportunities
        • 7.5.3.1.2. Growth Prospects
      • 7.5.3.2. Israel
        • 7.5.3.2.1. Market Trends and Opportunities
        • 7.5.3.2.2. Growth Prospects
      • 7.5.3.3. Others
        • 7.5.3.3.1. Market Trends and Opportunities
        • 7.5.3.3.2. Growth Prospects
  • 7.6. Asia Pacific
    • 7.6.1. By Type
    • 7.6.2. By End-user
    • 7.6.3. By Country
      • 7.6.3.1. China
        • 7.6.3.1.1. Market Trends and Opportunities
        • 7.6.3.1.2. Growth Prospects
      • 7.6.3.2. Japan
        • 7.6.3.2.1. Market Trends and Opportunities
        • 7.6.3.2.2. Growth Prospects
      • 7.6.3.3. India
        • 7.6.3.3.1. Market Trends and Opportunities
        • 7.6.3.3.2. Growth Prospects
      • 7.6.3.4. South Korea
        • 7.6.3.4.1. Market Trends and Opportunities
        • 7.6.3.4.2. Growth Prospects
      • 7.6.3.5. Indonesia
        • 7.6.3.5.1. Market Trends and Opportunities
        • 7.6.3.5.2. Growth Prospects
      • 7.6.3.6. Taiwan
        • 7.6.3.6.1. Market Trends and Opportunities
        • 7.6.3.6.2. Growth Prospects
      • 7.6.3.7. Others
        • 7.6.3.7.1. Market Trends and Opportunities
        • 7.6.3.7.2. Growth Prospects

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 8.1. Major Players and Strategy Analysis
  • 8.2. Market Share Analysis
  • 8.3. Mergers, Acquisition, Agreements, and Collaborations
  • 8.4. Competitive Dashboard

9. COMPANY PROFILES

  • 9.1. Kyocera Corporation
  • 9.2. DowDuPont, Inc.
  • 9.3. Koa Speer Electronics, Inc.
  • 9.4. Murata Manufacturing Co., Ltd.
  • 9.5. Selmic Oy
  • 9.6. TDK Corporation
  • 9.7. Yokowo Co., Ltd.
  • 9.8. NGK SPARK PLUG CO., LTD.
  • 9.9. Adamant Namiki
  • 9.10. Apitech