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半導體生產設備

市場調查報告書

商品編碼

1457078

半導體導線架市場：2024年至2029年預測

Semiconductor Lead Frame Market - Forecasts from 2024 to 2029

出版日期: 2024年02月09日 | 出版商:

Knowledge Sourcing Intelligence | 英文 135 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄

半導體導線架市場預計將以 4.99% 的複合年成長率成長，從 2022 年的 31.74 億美元增至 2029 年的 44.62 億美元。

半導體導線架是一種由金屬製成的小型扁平結構，用於支撐和連接積體電路 (IC)、分離元件和半導體裝置中的其他組件。導線架描述了 IC 與周圍環境之間電訊號的途徑。它是半導體裝置製造中的重要組成部分，因為它可確保可靠的連接和高效的性能。半導體導線架市場成長的驅動力是對電子設備的需求不斷成長，以及隨著電子設備變得更小、更複雜，電子元件的小型化趨勢日益增強。

市場驅動力

先進封裝技術的越來越多的使用正在推動市場的擴張。

引線接合法等先進封裝技術的日益使用是推動半導體導線架市場成長的主要因素。隨著引線接合法技術精度的提高，整個半導體產業的需求預計將增加。例如，2022 年 9 月，Henniker Plasma 公司宣布推出一種基於等離子體的新工藝，可提高引線接合法技術的效率。此外，汽車照明和其他顯示器對 LED 的需求不斷成長，刺激了對半導體導線架的需求。半導體導線架通常用於LED構裝，因為它們可以精確放置和佈線，以確保最佳的電氣連接和性能。例如，2022 年 9 月，德國照明解決方案製造商 Osram Licht AG 將基於導線架的 LED 照明組件引入其用於汽車照明的 Oslon Black Flat S 產品系列。因此，隨著 LED 需求的增加，對焊線封裝技術的需求不斷成長，預計將在整個預測期內推動半導體導線架市場的發展。

從技術角度來看，沖壓預計將佔據顯著的市場佔有率。

沖壓技術涉及將金屬板或金屬箔壓入模具中以形成所需的圖案或型態。這是一種快速、經濟高效的工藝，可以快速有效地生產大量導線架，使其主要用於生產智慧型手機和平板電腦等家用電子電器的導線架。智慧型手機和平板電腦設備的需求不斷成長，預計將增加沖壓技術的消耗。此外，半導體導線架市場的沖壓技術領域受到對高性能和小型化電子設備的需求以及對小型和輕量化導線架的高需求的推動，以滿足各種電子產品的精確要求。

亞太地區在半導體導線架市場佔據主要佔有率

亞太各國半導體產業的擴張預計將推動半導體導線架市場。這是因為，隨著半導體需求的增加，對用於製造此類半導體的各種設備（例如導線架）的需求也在增加。例如，根據世界半導體貿易協會公佈的資料，台灣半導體產業2022年第三季實現銷售額6,255.3億元新台幣。此外，國際貿易局宣布，2020年至2021年日本半導體產業成長19.8%，佔全球半導體產量的近9%。此外，根據印度政府新聞資訊局2022年發布的聲明，印度半導體市場將從2020年的150億美元成長到2026年的630億美元。

市場挑戰

替代供應和半導體元件短缺仍然是市場成長的主要挑戰。

扇出晶圓級封裝 (FOWLP) 和系統級封裝(SiP) 解決方案等替代封裝技術的使用越來越多，但這些技術比傳統基於導線架的封裝具有顯著優勢，例如更高的整合度和更高的導線架度。例如，三星電子宣布將於2023年4月投資7,500萬美元在其日本生產設施實施扇出晶圓級封裝。因此，多家半導體和電子公司正在從基於導線架的封裝解決方案轉向這些替代方案，預計這將在預測期內放緩市場發展。

此外，半導體元件的持續短缺正在影響對半導體元件及其製造中使用的元件（包括導線架）的整體需求，從而影響半導體導線架市場。這種短缺導致價格上漲，並使某些製造商更難獲得生產產品所需的材料和資源。

產品供應

凸版公司負責凸版公司的半導體導線架印刷業務，生產細間距構裝基板導線架、下置式導線架、帶散熱器的導線架、改良樹脂粘合劑封裝、填縫導線架，我們生產六種類型的引線框架。
Advanced Assembly Materials International Ltd. 的半導體導線架-Advanced Assembly Materials International Ltd. 是一家總部位於香港的特殊產品供應商，可滿足各種半導體封裝要求，生產導線架。
SDI Group, Inc. 的半導體導線架SDI Group Inc. 是一家生產各種專業科學產品的台灣公司，為 IC、分立/電晶體和其他半導體晶片應用生產三種類型的導線架。本公司生產的分離式導線架廣泛應用於汽車電腦控制系統。

A semiconductor lead frame is a small, flat structure made of metal that supports and connects the integrated circuit (IC), discrete devices, and other components in semiconductor devices. The lead frame provides a pathway for electrical signals to pass between the IC and the peripheral environment. They are an essential component in the manufacturing of semiconductor devices as they ensure reliable connectivity and efficient performance. The growth of the semiconductor lead frame market is driven by the increasing demand for electronic devices and the growing trend towards miniaturization of electronic components since the reduction in the size and increasing complexity of electronic devices are creating a high demand for smaller and precise lead frames.

Market Drivers

Increasing use of advanced packaging technologies is driving the market expansion.

The increasing use of advanced packaging technologies, such as wire bonding, is a significant factor driving the growth of the semiconductor lead frame market. Improving the accuracy of wire bonding technology is expected to increase its demand across the semiconductor industry. For instance, in September 2022, Henniker Plasma Company announced a new treatment based on plasma to improve the efficiency of wire bonding technology. In addition, the rising demand for LEDs driven by automotive lighting and other displays is stimulating the demand for semiconductor lead frames as semiconductor lead frames are often used in LED packaging due to their ability to accommodate the precise placement and routing of the wires to ensure the optimal electrical connectivity and performance. For instance, in September 2022, a German-based light solutions manufacturing company, OSRAM Licht AG, introduced lead-frame-based LED lighting components to its Oslon Black Flat S product range used for automotive lighting. Therefore, the rising demand for wire bonding packaging technologies driven by increasing demand for LEDs is expected to drive the semiconductor lead frame market over the forecast period.

By technology, the stamping is expected to hold a prominent market share.

Stamping technology involves pressing a metal sheet or foil against a die to create the desired pattern or shape. It is a fast and cost-effective process that can produce large volumes of lead frames quickly and efficiently and, therefore, is majorly utilized in producing lead frames for consumer electronics such as smartphones and tablets. The rising demand for smartphones and tablets is anticipated to increase the consumption of stamping technology. Further, the stamping technology sector in the semiconductor lead frame market is driven by the demand for high-performance and miniaturized electronic devices and the high demand for lead frames that are small and lightweight to accommodate the precise requirements of various electronic products.

Asia Pacific region held a substantial share in the semiconductor lead frame market

The expansion of the semiconductor industry in different countries in the Asia Pacific region is expected to drive the semiconductor lead frame market as the increasing demand for semiconductors is followed by a rise in demand for various equipment used to manufacture such semiconductors as lead frames. For instance, the semiconductor industry in Taiwan achieved sales revenues of TWD625.53 billion in the third quarter of 2022, according to data released by the World Semiconductor Trade. In addition, the Japanese semiconductor sector, as reported by the International Trade Administration, witnessed a 19.8% rise between 2020 and 2021, accounting for nearly 9% of the total world semiconductor production. Further, according to a statement released by the Press Information Bureau of the Indian government in 2022, India's semiconductor market will increase from US$15 billion in 2020 to US$63 billion by 2026.

Market Challenge

Alternative availability and the scarcity of semiconductor components remains significant challenge to the market growth.

The increasing use of alternative packaging technologies, such as fan-out wafer-level packaging (FOWLP) and system-in-package (SiP) solutions, is limiting the semiconductor lead frame market growth since these technologies offer several advantages over traditional lead frame-based packaging, such as higher levels of integration and improved thermal performance. For instance, Samsung Electronics announced an investment of US$75 million to deploy fan-out wafer-level packaging at its production facility in Japan in April 2023. Consequently, several semiconductor and electronics companies are shifting from lead frame-based packaging solutions to these alternatives is expected to slow down the market over the forecast period.

In addition, the ongoing shortage of semiconductor components is impacting the semiconductor lead frame market as it is affecting the overall demand for semiconductor devices and the components used to manufacture them, including lead frames. The shortage is rising the prices and increasing production difficulty for certain manufacturers to secure the necessary materials and resources to produce their products.

Product Offerings:

Semiconductor lead frame by Toppan Inc. - Toppan Inc., a Japan-based company involved in the printing business, manufactures six different lead frame products, namely Fine Pitch Leadframe, Downset Leadframe, Leadframe with Heat Spreader, Resin Adhesion Improved Package, Caulking Leadframe, and QFN Substrate under its semiconductor package substrates product division to meet the varying needs of different semiconductor processes.
Semiconductor lead frame by Advanced Assembly Materials International Ltd. - Advanced Assembly Materials International Ltd., a Hong-Kong-based company offering specialty products to various semiconductor packaging requirements, manufactures lead frames of high-density and cost-effective nature of varying sizes up to 100x300mm as per the specifications of its customers.
Semiconductor lead frame by SDI Group, Inc. - SDI Group Inc., a Taiwanese company generating various specialty scientific products, manufactures three different lead frame types for ICs, discrete/transistors, and other semiconductor chip applications. The discrete lead frames manufactured by the company are extensively adopted in control systems of auto-computers.

Segmentation:

By Technology

Chemical Etching
Stamping

By Application

Integrated Circuit (IC)
Discrete Devices
Others

By Geography

North America
USA
Canada
Mexico
South America
Brazil
Argentina
Others
Europe
Germany
France
United Kingdom
Spain
Others
Middle East and Africa
Saudi Arabia
UAE
Israel
Others
Asia Pacific
China
Japan
India
South Korea
Taiwan
Others

1. INTRODUCTION

1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Market Segmentation
1.5. Currency
1.6. Assumptions
1.7. Base, and Forecast Years Timeline
1.8. Key Benefits for the stakeholder

2. RESEARCH METHODOLOGY

2.1. Research Design
2.2. Research Processes

3. EXECUTIVE SUMMARY

3.1. Key Findings
3.2. Analyst View

4. MARKET DYNAMICS

4.1. Market Drivers
4.2. Market Restraints
4.3. Porter's Five Forces Analysis
- 4.3.1. Bargaining Power of Suppliers
- 4.3.2. Bargaining Power of Buyers
- 4.3.3. Threat of New Entrants
- 4.3.4. Threat of Substitutes
- 4.3.5. Competitive Rivalry in the Industry
4.4. Industry Value Chain Analysis
4.5. Analyst View

5. SEMICONDUCTOR LEAD FRAME MARKET BY TECHNOLOGY

5.1. Introduction
5.2. Chemical Etching
- 5.2.1. Market Trends and Opportunities
- 5.2.2. Growth Prospects
- 5.2.3. Geographic Lucrativeness Insights
5.3. Stamping
- 5.3.1. Market Trends and Opportunities
- 5.3.2. Growth Prospects
- 5.3.3. Geographic Lucrativeness Insights

6. SEMICONDUCTOR LEAD FRAME MARKET BY APPLICATION

6.1. Introduction
6.2. Integrated Circuits
- 6.2.1. Market Trends and Opportunities
- 6.2.2. Growth Prospects
- 6.2.3. Geographic Lucrativeness Insights
6.3. Discrete Devices
- 6.3.1. Market Trends and Opportunities
- 6.3.2. Growth Prospects
- 6.3.3. Geographic Lucrativeness Insights
6.4. Others
- 6.4.1. Market Trends and Opportunities
- 6.4.2. Growth Prospects
- 6.4.3. Geographic Lucrativeness Insights

7. SEMICONDUCTOR LEAD FRAME MARKET BY GEOGRAPHY

7.1. Introduction
7.2. North America
- 7.2.1. By Technology
- 7.2.2. By Application
- 7.2.3. By Country
  - 7.2.3.1. USA
    - 7.2.3.1.1. Market Trends and Opportunities
    - 7.2.3.1.2. Growth Prospects
  - 7.2.3.2. Canada
    - 7.2.3.2.1. Market Trends and Opportunities
    - 7.2.3.2.2. Growth Prospects
  - 7.2.3.3. Mexico
    - 7.2.3.3.1. Market Trends and Opportunities
    - 7.2.3.3.2. Growth Prospects
7.3. South America
- 7.3.1. By Technology
- 7.3.2. By Application
- 7.3.3. By Country
  - 7.3.3.1. Brazil
    - 7.3.3.1.1. Market Trends and Opportunities
    - 7.3.3.1.2. Growth Prospects
  - 7.3.3.2. Argentina
    - 7.3.3.2.1. Market Trends and Opportunities
    - 7.3.3.2.2. Growth Prospects
  - 7.3.3.3. Others
    - 7.3.3.3.1. Market Trends and Opportunities
    - 7.3.3.3.2. Growth Prospects
7.4. Europe
- 7.4.1. By Technology
- 7.4.2. By Application
- 7.4.3. By Country
  - 7.4.3.1. Germany
    - 7.4.3.1.1. Market Trends and Opportunities
    - 7.4.3.1.2. Growth Prospects
  - 7.4.3.2. France
    - 7.4.3.2.1. Market Trends and Opportunities
    - 7.4.3.2.2. Growth Prospects
  - 7.4.3.3. United KIngdom
    - 7.4.3.3.1. Market Trends and Opportunities
    - 7.4.3.3.2. Growth Prospects
  - 7.4.3.4. Spain
    - 7.4.3.4.1. Market Trends and Opportunities
    - 7.4.3.4.2. Growth Prospects
  - 7.4.3.5. Others
    - 7.4.3.5.1. Market Trends and Opportunities
    - 7.4.3.5.2. Growth Prospects
7.5. Middle East and Africa
- 7.5.1. By Technology
- 7.5.2. By Application
- 7.5.3. By Country
  - 7.5.3.1. Saudi Arabia
    - 7.5.3.1.1. Market Trends and Opportunities
    - 7.5.3.1.2. Growth Prospects
  - 7.5.3.2. UAE
    - 7.5.3.2.1. Market Trends and Opportunities
    - 7.5.3.2.2. Growth Prospects
  - 7.5.3.3. Israel
    - 7.5.3.3.1. Market Trends and Opportunities
    - 7.5.3.3.2. Growth Prospects
  - 7.5.3.4. Others
    - 7.5.3.4.1. Market Trends and Opportunities
    - 7.5.3.4.2. Growth Prospects
7.6. Asia Pacific
- 7.6.1. By Technology
- 7.6.2. By Application
- 7.6.3. By Country
  - 7.6.3.1. China
    - 7.6.3.1.1. Market Trends and Opportunities
    - 7.6.3.1.2. Growth Prospects
  - 7.6.3.2. Japan
    - 7.6.3.2.1. Market Trends and Opportunities
    - 7.6.3.2.2. Growth Prospects
  - 7.6.3.3. India
    - 7.6.3.3.1. Market Trends and Opportunities
    - 7.6.3.3.2. Growth Prospects
  - 7.6.3.4. South Korea
    - 7.6.3.4.1. Market Trends and Opportunities
    - 7.6.3.4.2. Growth Prospects
  - 7.6.3.5. Taiwan
    - 7.6.3.5.1. Market Trends and Opportunities
    - 7.6.3.5.2. Growth Prospects
  - 7.6.3.6. Others
    - 7.6.3.6.1. Market Trends and Opportunities
    - 7.6.3.6.2. Growth Prospects