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市場調查報告書
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1496045

探針卡市場:2024-2029 年預測

Probe Card Market - Forecasts from 2024 to 2029

出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 145 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計2022年探針卡市場規模為26.51億美元,複合年成長率為9.21%,2029年市場規模將達49.12億美元。

預計探針卡市場在預測期內將呈現穩定成長。探針卡是電子晶片製造過程中用於晶片評估的高科技電子設備。晶片由一種稱為矽的薄半導體材料製成。探針卡充當電子機械閘道器,用於表徵晶圓上或單獨封裝之前的晶片操作。

探針卡是根據晶片的機械和電氣要求建造的。探針卡分為針式、立式和電子機械系統(MEMS)三種。先進技術的不斷增加、半導體行業需求的增加以及半導體領域投資的增加正在推動探針卡市場的成長。

探針卡市場促進因素

  • 先進技術的增加推動探針卡市場的成長

5G、人工智慧、自動駕駛和物聯網 (IoT) 等新技術的興起正在推動半導體的使用,從而推動探針卡市場的成長。逼真圖形、人工智慧、自動駕駛汽車和資料中心等進階應用需要高效的性能。上述技術涉及笨重的高速性能晶片,需要先進的探針卡才能進行快速測試。

傳統的探針卡在性能方面一直舉步維艱,而這些新型探針卡與下一代高品質、成熟的半導體的發展保持同步。技術升級需要更快、更強大、更低能耗的晶片,迫使採用複雜的探針卡進行有效的測試。

  • 半導體產業普及推動探針卡市場成長

行動電話和筆記型電腦等家用電子電器的使用不斷增加,推動了對半導體的額外需求。隨著這些電子設備的複雜性增加,需要有效率的測試程序。探針卡在通訊協定中發揮關鍵作用,以確保積體電路在封裝和分發之前的優越性和功能性。

製造商正在優先考慮創新,開發具有增強功能的探針卡,以處理複雜的細節、增加的引腳數和晶圓上的精緻結構。這確保了先進 IC 的精確測試,這對於現代電子設備的無縫運作至關重要。

例如,根據 2023 年半導體產業協會發表的報導,由於日常技術的使用不斷增加,半導體的重要性將在 2023 年飆升。 2022年,全球半導體銷量將達到10億顆。

  • 半導體領域投資的增加將帶動探針卡市場的成長。

對積體電路的需求不斷成長正在推動半導體製造商廣泛擴大其生產設施。探針卡在這些擴充功能中發揮重要作用,這需要在測試設備的安裝方面進行大量投資。

隨著半導體製造商增加積體電路產量,晶片品質成為重中之重。探針卡是在檢測設備和晶圓之間建立電氣連接的重要組件,是晶片封裝前的預處理步驟。對檢測製程的投資和半導體製造中心的建立並進,以提高積體電路的品質。

例如,根據新聞資訊局2023年12月發表的報導,美國政府已核准美光科技設立半導體部門,資本投資2,251.6億盧比(27.5億美元)。

探針卡市場-地域展望

  • 亞太地區預計將出現顯著成長。

亞太地區擁有數量最多的韓國、台灣和日本半導體製造商,推動了探針卡市場的成長。該地區還擁有數量最多的消費性電子產品,例如行動裝置和穿戴式設備,並提供了大量在製造過程中用於這些設備的經過測試的晶片。

各國政府正採取舉措促進本地晶片製造,以實現國內晶片生產,並加強探針卡等測試設備。

例如,根據世界經濟論壇2023年11月發表的報導,日本政府正在透過提供130億美元資金加強國內半導體生產來提振半導體產業。

限制探針卡市場的因素

  • 巨大的投資限制了探針卡市場的成長。

作為製造實施的一部分,製造和創建具有先進功能的複雜的新型探針卡可能會增加高額投資。這是困難且高成本的,因為它涉及晶片設計的不斷發展。

  • 不斷出現的技術問題可能會阻礙探針卡市場的成長。

隨著晶片變得越來越小、越來越複雜,探針卡面臨著與晶片墊片的精確對準和接觸的挑戰。這可能會導致損壞或不正確的對準,從而影響測試期間的準確性。

探針卡市場主​​要產業開拓

  • 2023 年 11 月,Teradyne 和 Technophobia 宣佈建立合作夥伴關係,旨在推動半導體測試介面的創新和快速成長。此次合作將為兩家公司在晶片測試市場提供支援。

探針卡市場參與者和產品

  • MT系列:日本電子材料公司提供的產品是一款MEMS探針卡,專門用於測試包含小型銅柱凸塊和墊片的覆晶。結合 MEMS(微機電系統)和多層薄膜的先進技術可實現高精度檢測。
  • V93000:Advantest公司的產品,專門用於半導體評估。本產品有不同型號、不同特點,為不同尺寸提供靈活的解決方案。
  • HFTAP 系列:FormFactor 的這款產品是最先進的探針解決方案,專為動態隨機存取記憶體 (DRAM) 裝置的高速測試而設計。採用先進的 PCB 技術,速度可達 3.2GHz,實現高效能的晶片測試系列。

目錄

第1章簡介

  • 市場概況
  • 市場定義
  • 調查範圍
  • 市場區隔
  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關利益者的主要利益

第2章調查方法

  • 研究設計
  • 調查過程

第3章執行摘要

  • 主要發現
  • 分析師觀點

第4章市場動態

  • 市場促進因素
  • 市場限制因素
  • 波特五力分析
  • 產業價值鏈分析
  • 分析師觀點

第5章探針卡市場:按探針類型

  • 介紹
  • 高度探針卡
    • 市場趨勢和機遇
    • 成長前景
    • 地域獲利能力
  • 標準探針卡
    • 市場趨勢和機遇
    • 成長前景
    • 地域獲利能力

第6章探針卡市場:依技術類型

  • 介紹
  • 垂直的
    • 市場趨勢和機遇
    • 成長前景
    • 地域獲利能力
  • MEMS
    • 市場趨勢和機遇
    • 成長前景
    • 地域獲利能力
  • 懸臂
    • 市場趨勢和機遇
    • 成長前景
    • 地域獲利能力
  • 專業
    • 市場趨勢和機遇
    • 成長前景
    • 地域獲利能力
    • 地域獲利能力

第7章 探針卡市場:依應用分類

  • 介紹
  • DRAM
    • 市場趨勢和機遇
    • 成長前景
    • 地域獲利能力
  • 參數
    • 市場趨勢和機遇
    • 成長前景
    • 地域獲利能力
  • 鑄造廠
    • 市場趨勢和機遇
    • 成長前景
    • 地域獲利能力
  • 其他
    • 市場趨勢和機遇
    • 成長前景
    • 地域獲利能力

第8章探針卡市場:按地區

  • 介紹
  • 北美洲
    • 按探頭類型
    • 依技術類型
    • 按用途
    • 按國家/地區
  • 南美洲
    • 按探頭類型
    • 依技術類型
    • 按用途
    • 按國家/地區
  • 歐洲
    • 按探頭類型
    • 依技術類型
    • 按用途
    • 按國家/地區
  • 中東/非洲
    • 按探頭類型
    • 依技術類型
    • 按用途
    • 按國家/地區
  • 亞太地區
    • 按探頭類型
    • 依技術類型
    • 按用途
    • 按國家/地區

第9章競爭環境及分析

  • 主要企業及策略分析
  • 市場佔有率分析
  • 合併、收購、協議和合作
  • 競爭對手儀表板

第10章 公司簡介

  • Japan Electronic Materials Corporation
  • Advantest Corporation
  • Korea Instruments Co. Ltd
  • FormFactor
  • Feinmetall
  • Nidec SV Probe
  • TSE Co., Ltd.
  • Willtechnology
  • Micronics Japan Co., Ltd.
  • Suzhou Silicon Test System Co., Ltd.
簡介目錄
Product Code: KSI061616867

The probe card market was estimated at US$2.651 billion in 2022, growing at a CAGR of 9.21%, reaching a market size of US$4.912 billion by 2029.

The Probe card market is anticipated to show steady growth during the forecast period. The probe card is a Hitech electronic device used for evaluating the chips during the process of manufacturing the electronic chips. Chips are made up of thin semiconductor material called silicon. A probe card serves as an electromechanical gateway that enables the evaluation of a chip's operation while it is still on the wafer or before it is packed separately.

The probe cards are constructed under the mechanical and electrical requirements of the chip. The probe cards are classified into three different categories: needle, vertical, and micro-electro-mechanical system (MEMS). Increased advanced technologies, growing demand for the semiconductor industry, and increased investment in the semiconductor sector are driving the probe cards market growth.

Probe Cards Market Drivers

  • Increased advanced technologies drive probe card market growth

The rise of new technologies like 5G, AI, autonomous driving, and the Internet of Things (IoT) has boosted the use of semiconductors, consequently driving growth in the probe cards market. There is a need for efficient performance in advanced applications, such as realistic graphics, AI, self-driving cars, and data centers. The above technologies involve the tedious and fast-performing chip where advanced probe cards are required for rapid testing purposes.

The previously built cards struggle in the performance level, where these emerging probe cards pace the development of quality and well-developed next-generation semiconductors. The technological upgradations require faster, more powerful, and low energy consumption chips, thus compelling the practice of refined probe cards for effective testing.

  • Growing prevalence of the semiconductor industry enhances probe card market growth

The growing frequency for consumer electronic devices like mobile phones, laptops, and other devices is propelling the additional perquisites for semiconductors. As the intricacy of these electronic devices increases, there is a high requirement for productive testing procedures. Probe cards play a vital role in the protocols as they assure the superiority and functionality of integrated circuits before their wrapping and distribution.

Manufacturers are prioritizing innovation to develop probe cards with enhanced capabilities to handle complex details, increased pin counts, and delicate structures on the wafer. This guarantees accurate testing of advanced ICs, which is crucial for the seamless operation of contemporary electronics.

For instance, according to an article published in the Semiconductor Industry Association in 2023, it states that in 2023, the significance of semiconductors has been on an upsurge due to the growing usage of everyday technologies. In 2022 there were 1 billion semiconductors sold worldwide.

  • Increased investment in the semiconductor sector enhances the probe cards market growth.

The increased demand for Integrated Circuits enhances the manufacturers of semiconductors to expand their production facility in the wide range. As these expansions require a vast amount of investment in installing a testing facility, probe cards play a crucial role.

As semiconductor fabrications increase their production of integrated circuits, its crucial to prioritize the quality of the chips. Probe cards are an essential component in establishing the electrical connection between testing equipment and wafers, which is a prior process before the packaging of chips. The investment in the testing process and establishing the semiconductor fabrication center are aligned with each other for the quality output of the integrated circuit.

For instance, according to an article published by the Press Information Bureau in December 2023, it states that the Government of India has approved to establish a semiconductor unit by Micron with a capital investment of 22,516 crores (2.75 billion dollars)

Probe Card Market - Geographical Outlook

  • Asia Pacific is expected to grow significantly.

Asia Pacific is anticipated to account for a significant share of the probe cards market. due to various factors, such as the regions having the maximum number of semiconductor manufacturers from South Korea, Taiwan, and Japan, which enhances the probe cards market growth. The region also has the highest consumer electronics goods like mobile devices and wearables, which creates a large base for the tested chips that are being used for these devices in the manufacturing process.

The governments from the regions are taking initiatives to boost the local chip manufacturing industries to enable domestic chip production and enhance testing equipment like probe cards as the above-mentioned factors propelling the probe cards market in the region.

For instance, in November 2023 World Economic forum published article, it states that the Government of Japan is fueling the semiconductor industry by providing a funding of $13 billion to enhance the domestic production of semiconductor.

Probe Cards Market Restraints

  • Immense investments curb the probe cards market growth.

The manufacturing and creation of complex new probe cards with advanced features can enhance the investment, which would be high as an introductory part of manufacturing. This creates a greater barrier for new entrants into the market. as it involves constant evolution in chip designing, makes it difficult and ends up with high cost

  • Growing technical issues may hinder the probe cards market growth.

Reduction in size and increased complexity of the chip features, probe cards encounter challenges in ensuring accurate alignment and contact with the chip pads. This can lead to damage and wrong alignment which impacts the accuracy while testing.

Probe Card Market Key Industry Developments

  • November 2023: Teradyne and Technophobe announced the agreement aimed at propelling innovation in semiconductor test interfaces and fostering rapid growth. This partnership helps both companies in the field of chip testing market.

Probe Card Market Players and Products

  • MT Series: The product offered by Japan Electronics Materials is a MEMS probe card specifically designed for testing flip chips containing small copper pillar bumps and pads. This advanced technology incorporates MEMS (Micro Electromechanical Systems) and thin-film multilayer to enable accurate testing.
  • V93000: The product introduced by ADVANTEST is specifically designed for the evaluation of semiconductors. The product has various models with different specific features to provide a flexible solution for a variety of sizes. The product has enlisted a range of classes from A class to L class.
  • HFTAP Series: The product offered by Formfactor is a cutting-edge probe solution specifically designed to test dynamic random-access memory (DRAM) devices at high speed. Leveraging advanced PCB technology, it can reach up to 3.2 GHz speed, which facilitates effective chip testing series.

The Probe Cards market is segmented and analyzed as follows:

By Probe Type

  • Advanced Probe Card
  • Standard Probe Card

By Technology Type

  • Vertical
  • MEMS
  • Cantilever
  • Specialty

By Application

  • DRAM
  • Parametric
  • Foundry
  • Others

By Geography

  • North America
  • United States
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • United Kingdom
  • Germany
  • France
  • Italy
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • Japan
  • China
  • India
  • South Korea
  • Taiwan
  • Thailand
  • Indonesia
  • Others
  • North America
  • United States
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • United Kingdom
  • Germany
  • France
  • Italy
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • Japan
  • China
  • India
  • South Korea
  • Taiwan
  • Thailand
  • Indonesia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base and Forecast Years Timeline
  • 1.8. Key Benefits to the Stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Processes

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. PROBE CARD MARKET BY PROBE TYPE

  • 5.1. Introduction
  • 5.2. Advanced Probe Card
    • 5.2.1. Market Trends and Opportunities
    • 5.2.2. Growth Prospects
    • 5.2.3. Geographic Lucrativeness
  • 5.3. Standard Probe Card
    • 5.3.1. Market Trends and Opportunities
    • 5.3.2. Growth Prospects
    • 5.3.3. Geographic Lucrativeness

6. PROBE CARD MARKET BY TECHNOLOGY TYPE

  • 6.1. Introduction
  • 6.2. Vertical
    • 6.2.1. Market Trends and Opportunities
    • 6.2.2. Growth Prospects
    • 6.2.3. Geographic Lucrativeness
  • 6.3. MEMS
    • 6.3.1. Market Trends and Opportunities
    • 6.3.2. Growth Prospects
    • 6.3.3. Geographic Lucrativeness
  • 6.4. Cantilever
    • 6.4.1. Market Trends and Opportunities
    • 6.4.2. Growth Prospects
    • 6.4.3. Geographic Lucrativeness
  • 6.5. Specialty
    • 6.5.1. Market Trends and Opportunities
    • 6.5.2. Growth Prospects
    • 6.5.3. Geographic Lucrativeness
    • 6.5.4. Geographic Lucrativeness

7. PROBE CARD MARKET BY APPLICATION

  • 7.1. Introduction
  • 7.2. DRAM
    • 7.2.1. Market Trends and Opportunities
    • 7.2.2. Growth Prospects
    • 7.2.3. Geographic Lucrativeness
  • 7.3. Parametric
    • 7.3.1. Market Trends and Opportunities
    • 7.3.2. Growth Prospects
    • 7.3.3. Geographic Lucrativeness
  • 7.4. Foundry
    • 7.4.1. Market Trends and Opportunities
    • 7.4.2. Growth Prospects
    • 7.4.3. Geographic Lucrativeness
  • 7.5. Others
    • 7.5.1. Market Trends and Opportunities
    • 7.5.2. Growth Prospects
    • 7.5.3. Geographic Lucrativeness

8. PROBE CARD MARKET BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. By Probe Type
    • 8.2.2. By Technology Type
    • 8.2.3. By Application
    • 8.2.4. By Country
      • 8.2.4.1. United States
        • 8.2.4.1.1. Market Trends and Opportunities
        • 8.2.4.1.2. Growth Prospects
      • 8.2.4.2. Canada
        • 8.2.4.2.1. Market Trends and Opportunities
        • 8.2.4.2.2. Growth Prospects
      • 8.2.4.3. Mexico
        • 8.2.4.3.1. Market Trends and Opportunities
        • 8.2.4.3.2. Growth Prospects
  • 8.3. South America
    • 8.3.1. By Probe Type
    • 8.3.2. By Technology Type
    • 8.3.3. By Application
    • 8.3.4. By Country
      • 8.3.4.1. Brazil
        • 8.3.4.1.1.1. Market Trends and Opportunities
        • 8.3.4.1.1.2. Growth Prospects
      • 8.3.4.2. Argentina
        • 8.3.4.2.1.1. Market Trends and Opportunities
        • 8.3.4.2.1.2. Growth Prospects
      • 8.3.4.3. Others
        • 8.3.4.3.1.1. Market Trends and Opportunities
        • 8.3.4.3.1.2. Growth Prospects
  • 8.4. Europe
    • 8.4.1. By Probe Type
    • 8.4.2. By Technology Type
    • 8.4.3. By Application
    • 8.4.4. By Country
      • 8.4.4.1. United Kingdom
        • 8.4.4.1.1. Market Trends and Opportunities
        • 8.4.4.1.2. Growth Prospects
      • 8.4.4.2. Germany
        • 8.4.4.2.1. Market Trends and Opportunities
        • 8.4.4.2.2. Growth Prospects
      • 8.4.4.3. France
        • 8.4.4.3.1. Market Trends and Opportunities
        • 8.4.4.3.2. Growth Prospects
      • 8.4.4.4. Italy
        • 8.4.4.4.1. Market Trends and Opportunities
        • 8.4.4.4.2. Growth Prospects
      • 8.4.4.5. Spain
        • 8.4.4.5.1. Market Trends and Opportunities
        • 8.4.4.5.2. Growth Prospects
      • 8.4.4.6. Others
        • 8.4.4.6.1. Market Trends and Opportunities
        • 8.4.4.6.2. Growth Prospects
  • 8.5. Middle East and Africa
    • 8.5.1. By Probe Type
    • 8.5.2. By Technology Type
    • 8.5.3. By Application
    • 8.5.4. By Country
      • 8.5.4.1. Saudi Arabia
        • 8.5.4.1.1. Market Trends and Opportunities
        • 8.5.4.1.2. Growth Prospects
      • 8.5.4.2. UAE
        • 8.5.4.2.1. Market Trends and Opportunities
        • 8.5.4.2.2. Growth Prospects
      • 8.5.4.3. Others
        • 8.5.4.3.1. Market Trends and Opportunities
        • 8.5.4.3.2. Growth Prospects
  • 8.6. Asia Pacific
    • 8.6.1. By Probe Type
    • 8.6.2. By Technology Type
    • 8.6.3. By Application
    • 8.6.4. By Country
      • 8.6.4.1. Japan
        • 8.6.4.1.1. Market Trends and Opportunities
        • 8.6.4.1.2. Growth Prospects
      • 8.6.4.2. China
        • 8.6.4.2.1. Market Trends and Opportunities
        • 8.6.4.2.2. Growth Prospects
      • 8.6.4.3. India
        • 8.6.4.3.1. Market Trends and Opportunities
        • 8.6.4.3.2. Growth Prospects
      • 8.6.4.4. South Korea
        • 8.6.4.4.1. Market Trends and Opportunities
        • 8.6.4.4.2. Growth Prospects
      • 8.6.4.5. Taiwan
        • 8.6.4.5.1. Market Trends and Opportunities
        • 8.6.4.5.2. Growth Prospects
      • 8.6.4.6. Thailand
        • 8.6.4.6.1. Market Trends and Opportunities
        • 8.6.4.6.2. Growth Prospects
      • 8.6.4.7. Indonesia
        • 8.6.4.7.1. Market Trends and Opportunities
        • 8.6.4.7.2. Growth Prospects
      • 8.6.4.8. Others
        • 8.6.4.8.1. Market Trends and Opportunities
        • 8.6.4.8.2. Growth Prospects

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. Japan Electronic Materials Corporation
  • 10.2. Advantest Corporation
  • 10.3. Korea Instruments Co. Ltd
  • 10.4. FormFactor
  • 10.5. Feinmetall
  • 10.6. Nidec SV Probe
  • 10.7. TSE Co., Ltd.
  • 10.8. Willtechnology
  • 10.9. Micronics Japan Co., Ltd.
  • 10.10. Suzhou Silicon Test System Co., Ltd.