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市場調查報告書
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1521006

FFC/FPC基板連接器市場-2024年至2029年預測

Ffc And Fpc Circuit Board Connector Market - Forecasts from 2024 to 2029

出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 140 Pages | 商品交期: 最快1-2個工作天內

價格
簡介目錄

FFC/FPC基板連接器市場預計將從2024年的1,604,555,000美元的估計值成長到2029年的2,444,664,000美元,複合年成長率為8.79%。

FFC(軟性扁平電纜)/FPC(軟性印刷電路)連接器是將軟性扁平電纜或印刷電路連接到印刷電路基板(PCB)或其他電子元件的電子設備連接器。

FFC 連接將軟性扁平電纜(帶狀電纜)連接到印刷基板等電子設備。通常用於空間有限或需要彎曲靈活性的地方。它們廣泛用於電腦、印表機、掃描器、相機和行動裝置等消費性電子產品的內部連接和訊號傳輸。

需要 FPC 連接來將 FPC基板連接到電子元件並提供適當的電訊。它用於多種電子產品,包括智慧型手機、平板電腦、穿戴式裝置、汽車電子、醫療設備和工業機械。這些連接以緊湊、靈活的設計提供可靠的訊號傳輸和配電。

市場促進因素

  • 小型化和節省空間有助於 FFC/FPC基板連接器的全球市場成長

在消費性電子、汽車、醫療保健和航太等領域,電子設備需要更小、更輕,並且需要更小、節省空間的組件。 FFC/FPC 連接具有扁平、靈活、薄的外形規格,使其適合需要有限空間的應用,並支援穿戴式裝置的小型化目標。

美國國際貿易委員會資料顯示,美國電子產品出口額從2021年的2,861.45億美元增加至2022年的3,028.5億美元。

在市面上提供的各種產品中,有一種由 PE 和尼龍製成的多層護套光纜 AFOAH。此電纜的中心強度部分採用玻璃增強塑膠,可承受囓齒動物和潮濕等惡劣環境。

總體而言,為了滿足對更小、更輕、更有效率的電子設備日益成長的需求,FFC/FPC 連接器由於小型化和節省空間而不斷增加市場佔有率。隨著對緊湊設計和創新應用的持續關注,預計將進一步採用。

  • 更快的資料傳輸有助於 FFC/FPC基板連接器的全球市場成長

FFC/FPC 連接器旨在支援高資料傳輸速率,適用於高效能電子系統。它們用於需要可靠、高速訊號完整性的應用,例如顯示器、相機、資料儲存設備和消費性電子產品。

其中一款產品是 Q2(TM) 堅固型高速連接器,它具有邊緣速率 (R) 觸點、深插入深度以及在插配和拔出過程中提供連接保護的堅固設計。它具有高達 25Gbps NRZ 性能、兩級熱插拔、整合接地/電源層、隔離和電源組合選項。

來自 DTU 和查爾姆斯理工大學的調查團隊使用單一雷射和光學晶片實現了世界上首次超過每秒 1 拍比特的傳輸。研究團隊成功傳輸了1.8 Pbit/s,這是世界網路流量的兩倍,使他們成為世界上第一個完成這項壯舉的人。

總體而言,由於技術進步、行業對更快、更可靠的資料傳輸的需求、資料密集型應用以及對更小、更密集的互連解決方案的需求,全球 FFC 和 FPC 連接市場正在成長。

市場限制因素

  • 製造和組裝複雜性阻礙市場成長

FFC/FPC 連接器的製造和組裝方法比傳統連接器的製造和組裝方法更加複雜。靈活的物料輸送、精確對準、用於端接和焊接的專用設備可能需要生產設備方面的知識和投資,這對於小型企業和新興企業來說可能是令人望而卻步的。

FFC/FPC基板連接器的全球市場按類型細分。

全球FFC/FPC基板連接器市場按類型分為30個以下接點、30至60個接點和60個以上接點。少於 30 個連接的 FFC/FPC 連接非常適合為智慧型手機、數位相機、手持式小工具、物聯網感測器和可攜式醫療設備等小型電子設備提供輕鬆的連接解決方案,從而實現緊湊的設計和低連線需求。

30 至 60 接腳 FFC/FPC 連接適用於筆記型電腦、平板電腦、遊戲機、汽車電子、工業控制系統和通訊設備等電子設備中的中等連接應用。它在尺寸、複雜性和功能之間取得了良好的平衡。

具有 60 多個連接的連接器可支援更多訊號、資料通道和連接,使其成為先進電子系統、高解析度顯示器、多用途設備、醫療影像處理和航太應用的理想選擇。

預計北美將在全球 FFC/FPC基板連接器市場中佔據較大佔有率

北美,尤其是美國,是電子創新中心。 FFC/FPC連接器的大型生產商、供應商和新興國家正在透過技術力和基礎設施為該國在全球市場的主導地位做出貢獻。

北美公司專注於創新、客製化和研發,以創建新的 FFC 和 FPC 連接解決方案,透過改進材料、設計、訊號完整性和高速資料傳輸來幫助他們在全球市場中競爭。

整體而言,由於技術開拓、產業多樣性、強大的製造能力、創意文化和關鍵產業的需求,北美可能會引領FFC/FPC連接器市場。

公司產品

  • 四路 LC 適配器 - Molex 的四路 LC 適配器是一種高密度解決方案,具有四個 LC 端口,可用於大量連接。提供卡扣式或螺絲式安裝方式,並具有獨立的百葉窗以保護眼睛。可以使用磷青銅或氧化鋯陶瓷對準套筒,也可以用來代替雙 SC 適配器。
  • SUPERNOVA(TM) LOW - SUPERNOVA(TM) LOW 的一體式壓縮連接器是一種耐用、抗衝擊和抗振動的中介層,具有堅固的設計、機械壓緊裝置、螺絲緊固裝置和各種尺寸。它具有薄型外形和小間距尺寸。低熱膨脹使其成為低成本基板堆疊、模組間和 LGA 介面的理想選擇。

目錄

第1章簡介

  • 市場概況
  • 市場定義
  • 調查範圍
  • 市場區隔
  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關利益者的主要利益

第2章調查方法

  • 研究設計
  • 調查過程

第3章執行摘要

  • 主要發現
  • 分析師觀點

第4章市場動態

  • 市場促進因素
  • 市場限制因素
  • 波特五力分析
  • 產業價值鏈分析
  • 分析師觀點

第5章 FFC/FPC基板連接器市場:依類型

  • 介紹
  • 30 個或更少連接
    • 市場機會和趨勢
    • 成長前景
    • 地域獲利能力
  • 30-60 個連接
    • 市場機會和趨勢
    • 成長前景
    • 地域獲利能力
  • 60+ 連接
    • 市場機會和趨勢
    • 成長前景
    • 地域獲利能力

第6章 FFC/FPC基板連接器市場:依最終用戶分類

  • 介紹
    • 市場機會和趨勢
    • 成長前景
    • 地域獲利能力
  • 消費性電子產品
    • 市場機會和趨勢
    • 成長前景
    • 地域獲利能力
  • 家用設備
    • 市場機會和趨勢
    • 成長前景
    • 地域獲利能力
  • 其他
    • 市場機會和趨勢
    • 成長前景
    • 地域獲利能力

第7章FFC/FPC基板連接器市場:依地區分類

  • 介紹
  • 北美洲
    • 按類型
    • 按最終用戶
    • 按國家/地區
  • 南美洲
    • 按類型
    • 按最終用戶
    • 按國家/地區
  • 歐洲
    • 按類型
    • 按最終用戶
    • 按國家/地區
  • 中東/非洲
    • 按類型
    • 按最終用戶
    • 按國家/地區
  • 亞太地區
    • 按類型
    • 按最終用戶
    • 按國家/地區

第8章競爭環境及分析

  • 主要企業及策略分析
  • 市場佔有率分析
  • 合併、收購、協議和合作
  • 競爭對手儀表板

第9章 公司簡介

  • Molex
  • Hirose(HRS)
  • Panasonic
  • Samtec
  • Omron Electronic Components
  • Kyocera
  • TE Connectivity
  • GCT(Global Connector Technology)
  • Avx Interconnect
  • Amphenol Icc
  • Wurth Elektronik
簡介目錄
Product Code: KSI061616937

The FFC And FPC Circuit Board Connector market is projected to grow at a CAGR of 8.79% from estimated value of US$1,604.555 million in 2024 to US$2,444.664 million in 2029.

FFC (Flexible Flat Cable) and FPC (Flexible Printed Circuit) connections are electronic device connectors that link flexible flat cables or printed circuits to printed circuit boards (PCBs) or other electronic components.

FFC connections link flexible flat cables (ribbon cables) to electronic equipment such as printed circuit boards. They are generally employed in situations requiring limited space or bending flexibility. They are widely used in consumer electronics, including computers, printers, scanners, cameras, and mobile devices, for internal connections and signal transfer.

FPC connections are required for attaching FPC boards to electronic components, providing proper electrical communication. They are utilized in a variety of electronic products, including smartphones, tablets, wearables, automotive electronics, medical devices, and industrial machinery. These connections provide dependable signal transmission and power distribution in small, adaptable designs.

Market Drivers

  • Miniaturization and space-saving are contributing to the global FFC and FPC Circuit board connector market growth

The demand for smaller, lighter electronic equipment in areas such as consumer electronics, automotive, healthcare, and aerospace demands compact, space-saving parts. FFC and FPC connections have a flat, flexible, and thin form factor, making them appropriate for applications that need limited space and assist miniaturization goals in wearable devices.

According to data from the United States International Trade Commission US exports of electronic products increased from 286,145 million USD in 2021 to 302,850 million USD in 2022.

Among various products available in the market, one is the AFOAH, a multi-jacket optical cable constructed of PE and nylon that contains up to 60 optical fibers in water-blocked loose tubes with solid polyethylene fillers. It is built to endure extreme circumstances such as rodents and dampness, having a glass-reinforced plastic center strength part.

Overall, FFC and FPC connectors are gaining market share as a result of their miniaturization and space-saving capabilities, which cater to the growing demand for smaller, lighter, and more efficient electronic devices. Their continued emphasis on compact designs and innovative applications is anticipated to encourage further adoption.

  • Increasing speed data transmission is contributing to the global FFC and FPC circuit board connector market growth

FFC and FPC connectors are designed to support high-speed data transmission rates, making them suitable for use in high-performance electronic systems. They are used in applications such as displays, cameras, data storage devices, and consumer electronics where reliable and high-speed signal integrity is essential.

One of the products is the Q2(TM) robust high-speed connectors that have Edge Rate(R) contacts, deeper insertion depths, and robust designs for contact protection during mating and unmating. They offer a maximum NRZ performance of 25 Gbps, are two-stage hot-pluggable, have an integrated ground/power plane, are insulated, and have a power combo option.

Researchers from DTU and Chalmers University of Technology have achieved the world's first transmission of over 1 petabit per second using a single laser and optical chip. The team successfully transmitted 1.8 Pbit/s, twice the total global Internet traffic, making them the first to achieve this feat.

Overall, the global FFC and FPC connection market is growing as a result of technological improvements, the industry's need for quicker, more reliable data transfer, data-intensive applications, and the requirement for small, high-density interconnect solutions.

Market Restraints

  • Complexity in manufacturing and assembly hamper the market growth

FFC and FPC connector production and assembly methods can be more sophisticated than those used in conventional connectors. Handling flexible materials, precise alignment, and specialized equipment for termination and soldering may necessitate knowledge and investment in production facilities, which might be prohibitive for smaller businesses or startups.

Global Ffc And Fpc circuit board connector market is segmented based on different types-

The global FFC And Fpc Circuit board connector market is segmented based on different types into below 30 contacts, 30-60 contacts, and above 60 contacts. FFC and FPC connections with less than 30 contacts are perfect for providing easy connectivity solutions in tiny electronic devices such as smartphones, digital cameras, handheld gadgets, IoT sensors, and portable medical equipment, resulting in compact designs and low connection needs.

FFC and FPC connections with 30-60 contacts are appropriate for moderate connectivity applications in electronic devices such as laptops, tablets, game consoles, automotive electronics, industrial control systems, and communication devices. They provide a balance of size, complexity, and capability.

These connectors with more than 60 connections can support a greater number of signals, data channels, or connections, making them ideal for sophisticated electronic systems, high-resolution displays, multipurpose devices, medical imaging, and aerospace applications.

North America is anticipated to hold a significant share of the global FFC And Fpc Circuit board connector market

North America, notably the United States, is a center of electronics innovation. Large producers, suppliers, and developers of FFC and FPC connectors contribute to the country's worldwide market domination via technological skills and infrastructure.

North American companies are focused on innovation, customization, and R&D to produce new FFC and FPC connection solutions that will help them compete in the worldwide market by improving materials, designs, signal integrity, and high-speed data transfer.

Overall, North America is likely to lead the FFC and FPC connector markets because of technological developments, industry diversity, strong manufacturing capabilities, an inventive culture, and demand from important industries.

Key Developments

  • February 2024 - Samtec's EdgeRate(R) board-to-board connections range then included a greater density mated set and a lower-profile 5 mm mated height (ERF6 & ERM6 Series). These connections are appropriate for 56 Gbps PAM4 rugged mezzanine applications like as industrial, embedded vision, instrumentation, monitoring, drones, and robotics.
  • November 2023 - DigiKey collaborated with Ambiq to offer their ultra-low power semiconductors, including Apollo4 Blue Plus, which supports Bluetooth(R) Low Energy, graphics, and audio on IoT endpoints. This low dynamic power microcontroller allows designers of next-generation wearables and battery-powered smart products to speed up innovation.

Company Products

  • QUAD LC ADAPTER- Molex's quad LC adapter is a high-density solution that has four LC ports to accommodate numerous connections. It is available in snap-mount or screw-mount installation techniques, with independent shutters for eye protection. It is available with Phosphor Bronze or Zirconia Ceramic alignment sleeves and may be used to replace the duplex SC adapter.
  • SUPERNOVA(TM) LOW- SUPERNOVA(TM) LOW one-piece compression connectors are durable, high-shock, and vibration-resistant interposers with strong designs, mechanical hold downs, screw downs, and a low profile in a variety of pitch sizes. They are ideal for low-cost board stacking, module-to-board, and LGA interfaces, as they reduce thermal expansion.

Market Segmentation

By Type

  • Below 30 Contacts
  • 30-60 Contacts
  • Above 60 Contacts

By End-User

  • Automotive
  • Consumer Electronics
  • Household Appliances
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • UK
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Others
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Indonesia
  • Taiwan
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base and Forecast Years Timeline
  • 1.8. Key benefits to the stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. FFC AND FPC CIRCUIT BOARD CONNECTOR MARKET BY TYPE

  • 5.1. Introduction
  • 5.2. Below 30 Contacts
    • 5.2.1. Market opportunities and trends
    • 5.2.2. Growth prospects
    • 5.2.3. Geographic lucrativeness
  • 5.3. 30-60 Contacts
    • 5.3.1. Market opportunities and trends
    • 5.3.2. Growth prospects
    • 5.3.3. Geographic lucrativeness
  • 5.4. Above 60 Contacts
    • 5.4.1. Market opportunities and trends
    • 5.4.2. Growth prospects
    • 5.4.3. Geographic lucrativeness

6. FFC AND FPC CIRCUIT BOARD CONNECTOR MARKET BY END-USER

  • 6.1. Introduction
  • 6.2. Automotive
    • 6.2.1. Market opportunities and trends
    • 6.2.2. Growth prospects
    • 6.2.3. Geographic lucrativeness
  • 6.3. Consumer Electronics
    • 6.3.1. Market opportunities and trends
    • 6.3.2. Growth prospects
    • 6.3.3. Geographic lucrativeness
  • 6.4. Household Appliances
    • 6.4.1. Market opportunities and trends
    • 6.4.2. Growth prospects
    • 6.4.3. Geographic lucrativeness
  • 6.5. Others
    • 6.5.1. Market opportunities and trends
    • 6.5.2. Growth prospects
    • 6.5.3. Geographic lucrativeness

7. FFC AND FPC CIRCUIT BOARD CONNECTOR MARKET BY GEOGRAPHY

  • 7.1. Introduction
  • 7.2. North America
    • 7.2.1. By Type
    • 7.2.2. By End-user
    • 7.2.3. By Country
      • 7.2.3.1. United States
        • 7.2.3.1.1. Market Trends and Opportunities
        • 7.2.3.1.2. Growth Prospects
      • 7.2.3.2. Canada
        • 7.2.3.2.1. Market Trends and Opportunities
        • 7.2.3.2.2. Growth Prospects
      • 7.2.3.3. Mexico
        • 7.2.3.3.1. Market Trends and Opportunities
        • 7.2.3.3.2. Growth Prospects
  • 7.3. South America
    • 7.3.1. By Type
    • 7.3.2. By End-user
    • 7.3.3. By Country
      • 7.3.3.1. Brazil
        • 7.3.3.1.1. Market Trends and Opportunities
        • 7.3.3.1.2. Growth Prospects
      • 7.3.3.2. Argentina
        • 7.3.3.2.1. Market Trends and Opportunities
        • 7.3.3.2.2. Growth Prospects
      • 7.3.3.3. Others
        • 7.3.3.3.1. Market Trends and Opportunities
        • 7.3.3.3.2. Growth Prospects
  • 7.4. Europe
    • 7.4.1. By Type
    • 7.4.2. By End-user
    • 7.4.3. By Country
      • 7.4.3.1. Germany
        • 7.4.3.1.1. Market Trends and Opportunities
        • 7.4.3.1.2. Growth Prospects
      • 7.4.3.2. France
        • 7.4.3.2.1. Market Trends and Opportunities
        • 7.4.3.2.2. Growth Prospects
      • 7.4.3.3. United Kingdom
        • 7.4.3.3.1. Market Trends and Opportunities
        • 7.4.3.3.2. Growth Prospects
      • 7.4.3.4. Spain
        • 7.4.3.4.1. Market Trends and Opportunities
        • 7.4.3.4.2. Growth Prospects
      • 7.4.3.5. Others
        • 7.4.3.5.1. Market Trends and Opportunities
        • 7.4.3.5.2. Growth Prospects
  • 7.5. Middle East and Africa
    • 7.5.1. By Type
    • 7.5.2. By End-user
    • 7.5.3. By Country
      • 7.5.3.1. Saudi Arabia
        • 7.5.3.1.1. Market Trends and Opportunities
        • 7.5.3.1.2. Growth Prospects
      • 7.5.3.2. UAE
        • 7.5.3.2.1. Market Trends and Opportunities
        • 7.5.3.2.2. Growth Prospects
      • 7.5.3.3. Israel
        • 7.5.3.3.1. Market Trends and Opportunities
        • 7.5.3.3.2. Growth Prospects
      • 7.5.3.4. Others
        • 7.5.3.4.1. Market Trends and Opportunities
        • 7.5.3.4.2. Growth Prospects
  • 7.6. Asia Pacific
    • 7.6.1. By Type
    • 7.6.2. By End-user
    • 7.6.3. By Country
      • 7.6.3.1. China
        • 7.6.3.1.1. Market Trends and Opportunities
        • 7.6.3.1.2. Growth Prospects
      • 7.6.3.2. Japan
        • 7.6.3.2.1. Market Trends and Opportunities
        • 7.6.3.2.2. Growth Prospects
      • 7.6.3.3. India
        • 7.6.3.3.1. Market Trends and Opportunities
        • 7.6.3.3.2. Growth Prospects
      • 7.6.3.4. South Korea
        • 7.6.3.4.1. Market Trends and Opportunities
        • 7.6.3.4.2. Growth Prospects
      • 7.6.3.5. Indonesia
        • 7.6.3.5.1. Market Trends and Opportunities
        • 7.6.3.5.2. Growth Prospects
      • 7.6.3.6. Taiwan
        • 7.6.3.6.1. Market Trends and Opportunities
        • 7.6.3.6.2. Growth Prospects
      • 7.6.3.7. Others
        • 7.6.3.7.1. Market Trends and Opportunities
        • 7.6.3.7.2. Growth Prospects

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 8.1. Major Players and Strategy Analysis
  • 8.2. Market Share Analysis
  • 8.3. Mergers, Acquisition, Agreements, and Collaborations
  • 8.4. Competitive Dashboard

9. COMPANY PROFILES

  • 9.1. Molex
  • 9.2. Hirose (HRS)
  • 9.3. Panasonic
  • 9.4. Samtec
  • 9.5. Omron Electronic Components
  • 9.6. Kyocera
  • 9.7. TE Connectivity
  • 9.8. GCT (Global Connector Technology)
  • 9.9. Avx Interconnect
  • 9.10. Amphenol Icc
  • 9.11. Wurth Elektronik