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1698454

高可靠性半導體市場:未來預測(2025-2030)

High-Reliability Semiconductor Market - Forecasts from 2025 to 2030

出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 149 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計 2025-2030 年預測期內高可靠性半導體市場將以 4.66% 的複合年成長率成長。

航太和國防工業的組件採用高度可靠的半導體,能夠長時間承受高溫。其中包括射頻微波、放大器、資料轉換器和其他高可靠性半導體。影響高可靠性半導體採用的主要因素之一是利用商品組件和高頻率的緊湊、高效和耐用設備的需求。電子戰系統必須對不斷變化的威脅做出快速反應,因此需要快速部署標準化解決方案。高可靠性半導體在這些設備中的應用越來越頻繁,從而增加了市場佔有率。

市場趨勢:

  • 高可靠性半導體的需求不斷增加:高可靠性半導體的日益普及是市場成長的主要驅動力。這些半導體廣泛應用於航空航太和國防等產業的關鍵應用,這些產業在惡劣條件下的耐用性和性能至關重要。這些半導體提高了高溫環境下使用的零件(例如引擎零件)的韌性和使用壽命。此外,材料的強度更高、重量更輕、可承受更高的工作溫度,使得製造更輕的零件成為可能,也使其更具吸引力。
  • 市場參與企業的策略發展:製造商的重大舉措有望推動市場向前發展。例如,2023 年 1 月,Behrman Capital 的投資組合公司、工業、軍事和太空應用高可靠性微電子解決方案的主要企業Micross Components, Inc. 簽署了一項具有約束力的協議,收購英飛凌科技股份公司的高可靠性 DC-DC 轉換器業務。此次收購預計將於 2023 年第一季完成,並將加強 Micross 的市場地位。
  • 按地區分類的市場:高可靠性半導體市場分為美洲、歐洲、中東和非洲以及亞太地區。其中,由於對高可靠性半導體相關研發的積極投資,預計亞太地區將在預測期內佔據市場主導地位。
  • 亞太市場成長:由於航太和國防領域對高可靠性半導體的需求不斷增加,該地區的市場正在擴大。亞太國家擴大使用這些半導體來確保軍事裝備(包括航空電子設備、衛星和作戰車輛)的可靠運作。此外,先進基礎設施技術的採用增加了汽車和航太應用對可靠和安全組件的需求,進一步推動了該地區高可靠性半導體市場的成長。

報告中介紹的主要企業包括 Digitron Semiconductors、Infineon Technologies AG、Microsemi Corporation、Semtech Corporation、KCB Solutions, LLC、Teledyne Technologies Incorporated、Texas Instruments Inc.、Skyworks Solutions Inc.、Vishay Intertechnology, Inc. 和 Fujitsu Limited。

本報告的主要優點

  • 深刻分析:獲得涵蓋主要地區和新興地區的深入市場洞察,重點關注客戶群、政府政策和社會經濟因素、消費者偏好、垂直行業和其他子區隔。
  • 競爭格局:了解全球主要企業所採用的策略策略,並了解正確策略帶來的潛在市場滲透。
  • 市場促進因素和未來趨勢:探索動態因素和關鍵市場趨勢以及它們將如何影響市場的未來發展。
  • 可行的建議:利用洞察力進行策略決策,在動態環境中開闢新的業務流和收益。
  • 適用範圍廣:對於新興企業、研究機構、顧問公司、中小企業和大型企業來說,它都是實用且具有成本效益的。

它有什麼用途?

產業與市場洞察、商業機會評估、產品需求預測、打入市場策略、地理擴張、資本支出決策、法律規範與影響、新產品開發、競爭影響

分析範圍

  • 歷史資料(2022-2024)和預測資料(2025-2030)
  • 成長機會、挑戰、供應鏈前景、法規結構、顧客行為、趨勢分析
  • 競爭對手定位、策略和市場佔有率分析
  • 按部門和地區(國家)分類的收益成長和預測分析
  • 公司概況(策略、產品、財務資訊、主要趨勢等)

高可靠性半導體市場分析涵蓋以下幾個部分:

按類型

  • 離散的
  • 模擬
  • 混合

依技術

  • 表面黏著技術
  • 通孔技術

按包裝材質

  • 塑膠
  • 陶瓷製品

按最終用戶

  • 航太與國防
  • 其他

按地區

  • 美洲
  • 美國
  • 歐洲、中東和非洲
  • 德國
  • 荷蘭
  • 其他
  • 亞太地區
  • 中國
  • 日本
  • 台灣
  • 韓國
  • 其他

目錄

第1章 引言

  • 市場概覽
  • 市場定義
  • 分析範圍
  • 市場區隔
  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要利益

第2章分析方法

  • 分析設計
  • 分析過程

第3章執行摘要

  • 主要發現
  • 分析師觀點

第4章 市場動態

  • 市場促進因素
  • 市場限制
  • 波特五力分析
  • 產業價值鏈分析

第5章高可靠度半導體市場(依類型)

  • 介紹
  • 離散的
  • 模擬
  • 混合

第6章高可靠度半導體市場(依技術)

  • 介紹
  • 表面黏著技術
  • 通孔技術

第7章高可靠度半導體市場(依封裝材料)

  • 介紹
  • 塑膠
  • 陶瓷製品

第8章高可靠性半導體市場(依最終用戶)

  • 介紹
  • 航太與國防
  • 其他

第9章高可靠度半導體市場(按地區)

  • 世界概況
  • 美洲
    • 美國
  • 歐洲、中東和非洲
    • 德國
    • 荷蘭
    • 其他
  • 亞太地區
    • 中國
    • 日本
    • 台灣
    • 韓國
    • 其他

第10章競爭格局及分析

  • 主要企業和策略分析
  • 市場佔有率分析
  • 企業合併、協議、商業合作
  • 競爭儀錶板

第11章 公司簡介

  • Digitron Semiconductors
  • Infineon Technologies AG
  • Microsemi Corporation
  • Semtech Corporation
  • KCB Solutions, LLC
  • Teledyne Technologies Incorporated
  • Texas Instruments Inc.
  • Skyworks Solutions Inc.
  • Vishay Intertechnology, Inc.
  • Fujitsu Limited
簡介目錄
Product Code: KSI061615487

The high-reliability semiconductor market is expected to grow at a CAGR of 4.66% during the forecast period between 2025 and 2030.

Components for the space and defense industries use high-reliability semiconductors designed to endure high temperatures for a longer time. These include RF microwaves, amplifiers, data converters, and other highly reliable semiconductors. One of the key factors influencing the adoption of high-reliability semiconductors is the demand for compact, extremely efficient, and durable devices that utilize common components and high frequencies. Electronic warfare systems must react quickly to continuously changing threats, which requires rapidly deploying standardized solutions. More frequently, high-reliability semiconductors are employed in these devices, leading to a rise in their market share.

Market Trends:

  • Growing demand for high-reliability semiconductors: The increasing adoption of high-reliability semiconductors is a key driver of market growth. These semiconductors are widely used in critical applications across industries such as aviation and defense, where durability and performance under extreme conditions are essential. They enhance the toughness and longevity of components used in high-temperature environments, such as engine parts. Additionally, advancements in materials that are stronger, lighter, and capable of withstanding higher operating temperatures are enabling weight reduction in components, further boosting their appeal.
  • Strategic developments by market players: Key initiatives by manufacturers are expected to propel the market forward. For example, in January 2023, Micross Components, Inc., a portfolio company of Behrman Capital and a leading provider of high-reliability microelectronic solutions for industrial, military, and space applications, entered into a binding agreement to acquire the High-Reliability DC-DC converter business of Infineon Technologies AG. The acquisition is anticipated to be finalized in the first quarter of 2023, strengthening Micross's market position.
  • Regional market segmentation: The high-reliability semiconductor market is segmented into the Americas, Europe, the Middle East and Africa, and Asia Pacific. Among these, Asia Pacific is expected to dominate the market during the forecast period, driven by significant investments in research and development related to high-reliability semiconductors.
  • Asia Pacific's market growth: The region's market is expanding due to rising demand for high-reliability semiconductors from the aerospace and defense sectors. Countries in Asia Pacific are increasingly using these semiconductors to ensure the reliable operation of military equipment, including avionics, satellites, and combat vehicles. Furthermore, the adoption of advanced infrastructure technologies has increased the need for dependable and secure components in automotive and aerospace applications, further fueling the growth of the high-reliability semiconductor market in the region.

Some of the major players covered in this report Digitron Semiconductors, Infineon Technologies AG, Microsemi Corporation, Semtech Corporation, KCB Solutions, LLC, Teledyne Technologies Incorporated, Texas Instruments Inc., Skyworks Solutions Inc., Vishay Intertechnology, Inc., Fujitsu Limited, among others.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

The High-Reliability Semiconductor Market is analyzed into the following segments:

By Type

  • Discrete
  • Analog
  • Mixed

By Technology

  • Surface Mount Technology
  • Through Hole Technology

By Packaging Material

  • Plastic
  • Ceramic

By End-User

  • Automotive
  • Aerospace & Defence
  • Others

By Geography

  • Americas
  • § US
  • Europe, the Middle East, and Africa
  • § Germany
  • § Netherlands
  • § Others
  • Asia Pacific
  • § China
  • § Japan
  • § Taiwan
  • § South Korea
  • § Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study

1.4. Market Segmentation

  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base and Forecast Years Timeline
  • 1.8. Key benefits for the stakeholders

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. The Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis

5. HIGH-RELIABILITY SEMICONDUCTOR MARKET BY TYPE

  • 5.1. Introduction
  • 5.2. Discrete
  • 5.3. Analog
  • 5.4. Mixed

6. HIGH-RELIABILITY SEMICONDUCTOR MARKET BY TECHNOLOGY

  • 6.1. Introduction
  • 6.2. Surface Mount Technology
  • 6.3. Through Hole Technology

7. HIGH-RELIABILITY SEMICONDUCTOR MARKET BY PACKAGING MATERIAL

  • 7.1. Introduction
  • 7.2. Plastic
  • 7.3. Ceramic

8. HIGH-RELIABILITY SEMICONDUCTOR MARKET BY END-USER

  • 8.1. Introduction
  • 8.2. Automotive
  • 8.3. Aerospace & Defence
  • 8.4. Others

9. HIGH-RELIABILITY SEMICONDUCTOR MARKET BY GEOGRAPHY

  • 9.1. Global Overview
  • 9.2. Americas
    • 9.2.1. US
  • 9.3. Europe, Middle East, and Africa
    • 9.3.1. Germany
    • 9.3.2. Netherlands
    • 9.3.3. Others
  • 9.4. Asia-Pacific
    • 9.4.1. China
    • 9.4.2. Japan
    • 9.4.3. Taiwan
    • 9.4.4. South Korea
    • 9.4.5. Others

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 10.1. Major Players and Strategy Analysis
  • 10.2. Market Share Analysis
  • 10.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 10.4. Competitive Dashboard

11. COMPANY PROFILES

  • 11.1. Digitron Semiconductors
  • 11.2. Infineon Technologies AG
  • 11.3. Microsemi Corporation
  • 11.4. Semtech Corporation
  • 11.5. KCB Solutions, LLC
  • 11.6. Teledyne Technologies Incorporated
  • 11.7. Texas Instruments Inc.
  • 11.8. Skyworks Solutions Inc.
  • 11.9. Vishay Intertechnology, Inc.
  • 11.10. Fujitsu Limited