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薄晶圓市場：趨勢、機遇、競爭分析 [2023-2028]
市場調查報告書
商品編碼
1285027

薄晶圓市場：趨勢、機遇、競爭分析 [2023-2028]

Thin Wafer Market: Trends, Opportunities and Competitive Analysis [2023-2028]
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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簡介目錄

薄晶圓市場趨勢和預測

到 2028 年，全球薄晶圓市場預計將達到 205 億美元，2023 年至 2028 年復合年增長率為 10.2%。 該市場的主要驅動力是智能手機和手持健康監測設備的普及、電子設備小型化趨勢的增強以及物聯網和人工智能在汽車中的日益融合。 MEMS、CIS、存儲器、射頻器件、LED、中介層和邏輯市場的薄晶圓市場前景看好。

進入薄晶圓市場的公司名單

市場上的公司根據其提供的產品質量進行競爭。 該市場的主要參與者專注於擴大製造設施、投資研發、升級基礎設施以及利用整個價值鏈的整合機會。 這些戰略使晶圓公司能夠滿足不斷增長的需求、保持競爭力、開發創新產品和技術、降低製造成本並擴大客戶群。

薄晶圓市場洞察

  • Lucintel 預計，由於對先進半導體產品的需求增加以及太陽能行業需求的增加，300mm 仍將是預測期內最大的細分市場。
  • 由於 CIS 在手機和其他消費電子設備中的應用不斷增長，預計其仍將是最大的細分市場。
  • 由於消費電子設備的需求增加以及半導體製造商的存在，預計亞太地區仍將是最大的地區。

本報告回答了 11 個關鍵問題：

  • Q.1.您的細分市場中最有前途和高增長的機會是什麼？
  • Q.2.哪些細分市場增長速度更快？原因是什麼？
  • Q.3.您認為哪些地區的增長速度會更快？為什麼？
  • Q.4.影響市場動態的關鍵因素有哪些？ 這個市場的主要挑戰和商業風險是什麼？
  • Q.5.這個市場的業務風險和競爭威脅是什麼？
  • Q.6.這個市場有哪些新趨勢？為什麼？
  • Q.7.這個市場中的客戶需求有哪些變化？
  • Q.8.市場有哪些新發展？ 哪些公司正在引領這些發展？
  • Q.9.這個市場的主要參與者是誰？ 主要參與者採取哪些戰略舉措來發展業務？
  • Q.10.該市場上的競爭產品有哪些？因材料或產品替代而導致市場份額損失的威脅是什麼？
  • Q.11.過去五年發生了哪些類型的併購，對行業產生了哪些影響？

內容

第 1 章執行摘要

第二章全球薄晶圓市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 行業驅動因素和挑戰

第三章2017-2028年市場趨勢及預測分析

  • 宏觀經濟趨勢（2017-2022 年）和預測（2023-2028 年）
  • 全球薄晶圓市場趨勢（2017-2022）及預測（2023-2028）
  • 按晶圓尺寸劃分的全球薄晶圓市場
    • 125mm
    • 200mm
    • 300mm
  • 按工藝劃分的全球薄晶圓市場
    • 暫時粘合/剝離
    • 無載體/TAIKO 工藝
  • 按應用劃分的全球薄晶圓市場
    • MEMS
    • CIS
    • 內存
    • 射頻設備
    • LED
    • 插入器
    • 邏輯
    • 其他

第四章2017-2028年分地區市場趨勢及預測分析

  • 按地區劃分的全球薄晶圓市場
  • 北美薄晶圓市場
  • 歐洲薄晶圓市場
  • 亞太薄晶圓市場
  • 其他區域薄晶圓市場

第五章競爭分析

  • 產品組合分析
  • 運營整合
  • 波特五力分析

第 6 章增長機會和戰略分析

  • 增長機會分析
    • 按晶圓尺寸劃分的全球薄晶圓市場增長機會
    • 按工藝劃分的全球薄晶圓市場增長機會
    • 按應用劃分的全球薄晶圓市場增長機會
    • 按地區劃分的全球薄晶圓市場增長機會
  • 全球薄晶圓市場新趨勢
  • 戰略分析
    • 新產品開發
    • 全球薄晶圓市場產能擴張
    • 全球薄晶圓市場的合併、收購和合資企業
    • 身份驗證和許可

第 7 章主要公司簡介

  • Shin-Etsu Chemical
  • SUMCO Corporation
  • GlobalWafers Co.
  • Siltronic
  • SK Siltron
  • SUSS MicroTec
  • Soitec
  • DISCO Corporation
  • 3M
  • Applied Materials
簡介目錄

Thin Wafer Market Trends and Forecast

The future of the thin wafer market looks promising with in the MEMS, CIS, memory, RF device, LED, interposer, and logic markets. The global thin wafer market is expected to reach an estimated $20.5 billion by 2028 with a CAGR of 10.2% from 2023 to 2028. The major drivers for this market are growing adoption of smartphones and portable health monitoring devices, rising trend of miniaturization of electronic devices, and increasing integration of IoT and AI in vehicles.

A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.

Thin Wafer Market by Segment

The study includes a forecast for the global thin wafer market by wafer size, process, application, and region, as follows.

Thin Wafer Market by Wafer Size [Value ($B) Shipment Analysis from 2017 to 2028]:

  • 125 mm
  • 200 mm
  • 300 mm

Thin Wafer Market by Process [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Temporary Bonding & Debonding
  • Carrier-less/Taiko Process

Thin Wafer Market by Application [Value ($B) Shipment Analysis from 2017 to 2028]:

  • MEMS
  • CIS
  • Memory
  • RF Devices
  • LED
  • Interposer
  • Logic
  • Others

Thin Wafer Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Thin Wafer Market Companie

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies thin wafer companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the thin wafer companies profiled in this report include.

  • Shin-Etsu Chemical
  • SUMCO Corporation
  • GlobalWafers Co.
  • Siltronic
  • SK Siltron
  • SUSS MicroTec
  • Soitec
  • DISCO Corporation
  • 3M
  • Applied Materials

Thin Wafer Market Insights

  • Lucintel forecasts that 300 mm will remain the largest segment over the forecast period due to increasing demand for advanced semiconductor products and growing demand from the solar energy sector.
  • CIS is expected to remain the largest segment due to its increasing application in mobile phones and other consumer electronic devices.
  • APAC will remain the largest region due to increasing demand for consumer electronics and presence of semiconductor manufacturers in the region.

Features of the Thin Wafer Market

  • Market Size Estimates: Thin wafer market size estimation in terms of value ($B)
  • Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis: Thin wafer market size by various segments, such as by wafer size, process, application, and region
  • Regional Analysis: Thin wafer market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different by wafer size, process, application, and regions for the thin wafer market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the thin wafer market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the thin wafer market size?

Answer: The global thin wafer market is expected to reach an estimated $20.5 billion by 2028.

Q2. What is the growth forecast for thin wafer market?

Answer: The global thin wafer market is expected to grow with a CAGR of 10.2% from 2023 to 2028.

Q3. What are the major drivers influencing the growth of the thin wafer market?

Answer: The major drivers for this market are growing adoption of smartphones and portable health monitoring devices, rising trend of miniaturization of electronic devices, and increasing integration of IoT and AI in vehicles.

Q4. What are the major segments for thin wafer market?

Answer: The future of the thin wafer market looks promising with opportunities in the MEMS, CIS, memory, RF device, LED, interposer, and logic markets.

Q5. Who are the key thin wafer companies?

Answer: Some of the key thin wafer companies are as follows:

  • Shin-Etsu Chemical
  • SUMCO Corporation
  • GlobalWafers Co.
  • Siltronic
  • SK Siltron
  • SUSS MicroTec
  • Soitec
  • DISCO Corporation
  • 3M
  • Applied Materials

Q6. Which thin wafer segment will be the largest in future?

Answer: Lucintel forecasts that 300 mm will remain the largest segment over the forecast period due to increasing demand for advanced semiconductor products and growing demand from the solar energy sector.

Q7. In thin wafer market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region due to increasing demand for consumer electronics and presence of semiconductor manufacturers in the region.

Q8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10.2% Customization Without any Additional Cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the thin wafer market by wafer size (125 mm, 200 mm, and 300 mm), process (temporary bonding & debonding and carrier-less/taiko process), application (MEMS, CIS, memory, RF devices, LED, interposer, logic, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Thin Wafer Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

  • 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
  • 3.2: Global Thin Wafer Market Trends (2017-2022) and Forecast (2023-2028)
  • 3.3: Global Thin Wafer Market by Wafer Size
    • 3.3.1: 125 mm
    • 3.3.2: 200 mm
    • 3.3.3: 300 mm
  • 3.4: Global Thin Wafer Market by Process
    • 3.4.1: Temporary Bonding & Debonding
    • 3.4.2: Carrier-less/Taiko Process
  • 3.5: Global Thin Wafer Market by Application
    • 3.5.1: MEMS
    • 3.5.2: CIS
    • 3.5.3: Memory
    • 3.5.4: RF Devices
    • 3.5.5: LED
    • 3.5.6: Interposer
    • 3.5.7: Logic
    • 3.5.8: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

  • 4.1: Global Thin Wafer Market by Region
  • 4.2: North American Thin Wafer Market
    • 4.2.1: North American Thin Wafer Market by Wafer Size: 125 mm, 200 mm, and 300 mm: 125 mm, 200 mm, and 300 mm
    • 4.2.2: North American Thin Wafer Market by Application: CIS, Memory, RF Devices, LED, Interposer, Logic, and Others
  • 4.3: European Thin Wafer Market
    • 4.3.1: European Thin Wafer Market by Wafer Size: 125 mm, 200 mm, and 300 mm
    • 4.3.2: European Thin Wafer Market by Application: CIS, Memory, RF Devices, LED, Interposer, Logic, and Others
  • 4.4: APAC Thin Wafer Market
    • 4.4.1: APAC Thin Wafer Market by Wafer Size: 125 mm, 200 mm, and 300 mm
    • 4.4.2: APAC Thin Wafer Market by Application: CIS, Memory, RF Devices, LED, Interposer, Logic, and Others
  • 4.5: ROW Thin Wafer Market
    • 4.5.1: ROW Thin Wafer Market by Wafer Size: 125 mm, 200 mm, and 300 mm
    • 4.5.2: ROW Thin Wafer Market by Application: CIS, Memory, RF Devices, LED, Interposer, Logic, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Thin Wafer Market by Wafer Size
    • 6.1.2: Growth Opportunities for the Global Thin Wafer Market by Process
    • 6.1.3: Growth Opportunities for the Global Thin Wafer Market by Application
    • 6.1.4: Growth Opportunities for the Global Thin Wafer Market by Region
  • 6.2: Emerging Trends in the Global Thin Wafer Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Thin Wafer Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Thin Wafer Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Shin-Etsu Chemical
  • 7.2: SUMCO Corporation
  • 7.3: GlobalWafers Co.
  • 7.4: Siltronic
  • 7.5: SK Siltron
  • 7.6: SUSS MicroTec
  • 7.7: Soitec
  • 7.8: DISCO Corporation
  • 7.9: 3M
  • 7.10: Applied Materials