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市場調查報告書
商品編碼
1416380

電子組裝材料市場報告：2030 年趨勢、預測與競爭分析

Electronic Assembly Material Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

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簡介目錄

電子組裝材料趨勢與預測

預計2024年至2030年全球電子組裝材料市場將以9.5%的年複合成長率成長。該市場的主要促進因素是電子設備需求的不斷成長、電子設備的小型化以及新興國家擴大採用5G無線網路通訊。全球電子組裝材料市場的未來看起來充滿希望，汽車、消費和工業、國防和航太以及行動通訊和運算市場都充滿機會。

電子組裝材料市場洞察

Lucintel 預測，在整個預測期內，導電材料仍將是最大的細分市場。

在這個市場中，由於對輕質、緊湊、製造成本效益高和低功耗材料的需求不斷成長，汽車預計將出現最高的成長。

由於汽車行業的顯著成長以及該地區主要電子供應商的存在，預計亞太地區在預測期內將出現最高的成長。

常問問題

Q1.市場成長預測是多少：

A1. 2024年至2030年，全球電子組裝材料市場預計將以9.5%的年複合成長率成長。

Q2. 影響市場成長的關鍵促進因素是：

A2. 該市場的主要促進因素是電子設備需求的成長、電子設備的小型化以及新興國家擴大採用5G無線網路通訊。

Q3.市場的主要細分市場是：

A3. 電子組裝材料市場的未來前景廣闊，汽車、消費和工業、國防和航太以及行動通訊和運算市場都有機遇。

Q4.市場的主要企業是：

A4. 一些主要的電子組裝材料公司是：

  • Kelly Services
  • Hisco
  • Henkel Corporation
  • HB Fuller
  • ITW

Q5.未來最大的細分市場是什麼？

A5.Lucintel 預計導電材料在整個預測期內仍將是其最大的細分市場。

Q6.未來五年預計哪些地區的市場成長最大？

A6.由於汽車行業的顯著成長以及主要電子供應商在該地區的存在，預計亞太地區在預測期內將出現最高的成長。

Q7. 可以客製化報告嗎？

A7。

目錄

第1章執行摘要

第2章全球電子組裝材料市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球電子組裝材料市場趨勢（2018-2023）與預測（2024-2030）
  • 按材料類型分類的全球電子組裝材料市場
    • 黏劑
    • 助焊劑
    • 導電材料
    • 熱感界面材料
  • 全球電子組裝材料市場（依最終用途）
    • 車
    • 消費和工業用途
    • 國防和航太
    • 行動通訊和計算
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球電子組裝材料市場區域分佈
  • 北美電子組裝材料市場
  • 歐洲電子組裝材料市場
  • 亞太地區電子組裝材料市場
  • 其他地區電子組裝材料市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 按材料類型分類的全球電子組裝材料市場成長機會
    • 全球電子組裝材料市場成長機會（依最終用途）
    • 全球電子組裝材料市場成長機會（按地區）
  • 全球電子組裝材料市場的新興趨勢
  • 戰略分析
    • 新產品開發
    • 全球電子組裝材料市場產能擴張
    • 全球電子組裝材料市場的合併、收購與合資
    • 認證和許可

第7章主要企業概況

  • Kelly Services
  • Hisco
  • Henkel Corporation
  • HB Fuller
  • ITW
簡介目錄

Electronic Assembly Material Trends and Forecast

The future of the global electronic assembly material market looks promising with opportunities in the automotive, consumer & industrial, defense & aerospace, and handheld communications & computing markets. The global electronic assembly material market is expected to grow with a CAGR of 9.5% from 2024 to 2030. The major drivers for this market are rise in demand for electronic devices, miniaturization of electronic devices, and increasing deployment of 5G wireless network communications in the developing countries.

A more than 150-page report is developed to help in your business decisions.

Electronic Assembly Material by Segment

The study includes a forecast for the global electronic assembly material by material type, end use, and region.

Electronic Assembly Material Market by Material Type [Shipment Analysis by Value from 2018 to 2030]:

  • Adhesives
  • Paste Fluxes
  • Electrically Conductive Materials
  • Thermal Interface Materials

Electronic Assembly Material Market by End Use [Shipment Analysis by Value from 2018 to 2030]:

  • Automotive
  • Consumer & Industrial
  • Defense & Aerospace
  • Handheld Communications & Computing
  • Other

Electronic Assembly Material Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Electronic Assembly Material Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies electronic assembly material companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the electronic assembly material companies profiled in this report include-

  • Kelly Services
  • Hisco
  • Henkel Corporation
  • H.B. Fuller
  • ITW

Electronic Assembly Material Market Insights

Lucintel forecasts that electrically conductive material will remain the largest segment over the forecast period.

Within this market, automotive is expected to witness the highest growth due to increasing demand of materials that are lighter in weight, smaller in size, more cost-effective to manufacture, and have lower power consumption.

APAC is expected to witness highest growth over the forecast period due to significantly growing automotive sector and presence of major electronic suppliers in the region.

Features of the Global Electronic Assembly Material Market

Market Size Estimates: Electronic assembly material market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Electronic assembly material market size by material type, end use, and region in terms of value ($B).

Regional Analysis: Electronic assembly material market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different material types, end uses, and regions for the electronic assembly material market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the electronic assembly material market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the growth forecast for electronic assembly material market?

Answer: The global electronic assembly material market is expected to grow with a CAGR of 9.5% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of the electronic assembly material market?

Answer: The major drivers for this market are rise in demand for electronic devices, miniaturization of electronic devices, and increasing deployment of 5G wireless network communications in the developing countries.

Q3. What are the major segments for electronic assembly material market?

Answer: The future of the electronic assembly material market looks promising with opportunities in the automotive, consumer & industrial, defense & aerospace, and handheld communications & computing markets.

Q4. Who are the key electronic assembly material market companies?

Answer: Some of the key electronic assembly material companies are as follows:

  • Kelly Services
  • Hisco
  • Henkel Corporation
  • H.B. Fuller
  • ITW

Q5. Which electronic assembly material market segment will be the largest in future?

Answer: Lucintel forecasts that electrically conductive material will remain the largest segment over the forecast period.

Q6. In electronic assembly material market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to significantly growing automotive sector and presence of major electronic suppliers in the region.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the electronic assembly material market by material type (adhesives, paste fluxes, electrically conductive materials, and thermal interface materials), end use (automotive, consumer & industrial, defense & aerospace, handheld communications & computing, and other), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Electronic Assembly Material Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Electronic Assembly Material Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Electronic Assembly Material Market by Material Type
    • 3.3.1: Adhesives
    • 3.3.2: Paste Fluxes
    • 3.3.3: Electrically Conductive Materials
    • 3.3.4: Thermal Interface Materials
  • 3.4: Global Electronic Assembly Material Market by End Use
    • 3.4.1: Automotive
    • 3.4.2: Consumer & Industrial
    • 3.4.3: Defense & Aerospace
    • 3.4.4: Handheld Communications & Computing
    • 3.4.5: Other

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Electronic Assembly Material Market by Region
  • 4.2: North American Electronic Assembly Material Market
    • 4.2.2: North American Electronic Assembly Material Market by End Use: Automotive, Consumer & Industrial, Defense & Aerospace, Handheld Communications & Computing, and Other
  • 4.3: European Electronic Assembly Material Market
    • 4.3.1: European Electronic Assembly Material Market by Material Type: Adhesives, Paste Fluxes, Electrically Conductive Materials, and Thermal Interface Materials
    • 4.3.2: European Electronic Assembly Material Market by End Use: Automotive, Consumer & Industrial, Defense & Aerospace, Handheld Communications & Computing, and Other
  • 4.4: APAC Electronic Assembly Material Market
    • 4.4.1: APAC Electronic Assembly Material Market by Material Type: Adhesives, Paste Fluxes, Electrically Conductive Materials, and Thermal Interface Materials
    • 4.4.2: APAC Electronic Assembly Material Market by End Use: Automotive, Consumer & Industrial, Defense & Aerospace, Handheld Communications & Computing, and Other
  • 4.5: ROW Electronic Assembly Material Market
    • 4.5.1: ROW Electronic Assembly Material Market by Material Type: Adhesives, Paste Fluxes, Electrically Conductive Materials, and Thermal Interface Materials
    • 4.5.2: ROW Electronic Assembly Material Market by End Use: Automotive, Consumer & Industrial, Defense & Aerospace, Handheld Communications & Computing, and Other

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Electronic Assembly Material Market by Material Type
    • 6.1.2: Growth Opportunities for the Global Electronic Assembly Material Market by End Use
    • 6.1.3: Growth Opportunities for the Global Electronic Assembly Material Market by Region
  • 6.2: Emerging Trends in the Global Electronic Assembly Material Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Electronic Assembly Material Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Electronic Assembly Material Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Kelly Services
  • 7.2: Hisco
  • 7.3: Henkel Corporation
  • 7.4: H.B. Fuller
  • 7.5: ITW