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市場調查報告書
商品編碼
1522958

高速互連 (HSI) 市場報告：2030 年趨勢、預測與競爭分析

High Speed Interconnect Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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簡介目錄

高速互連 (HSI) 趨勢與預測

預計到 2030 年，全球高速互連 (HSI) 市場規模將達到 5,300 萬美元，2024 年至 2030 年複合年成長率為 7.3%。該市場的關鍵促進因素是隨著數位社會產生和消耗大量資料（從流服務到雲端運算），對資料的需求不斷成長，對高頻寬互連的需求不斷成長，以及對機器人和控制系統的需求通訊成長。全球高速互連 (HSI) 市場的未來前景廣闊，資料中心、電訊、消費性電子產品以及網路和運算市場充滿機會。

高速互連 (HSI) 按細分市場

該研究包括按類型、應用和地區對全球高速互連 (HSI) 的預測。

高速互連 (HSI) 市場洞察

Lucintel 預測 DAC 在預測期內仍將是一個很大的細分市場。

由於電子設備互連需求的不斷成長以及智慧家居趨勢的不斷發展，消費性電子產品將繼續成為該市場的最大細分市場。

由於新技術的使用不斷增加以及對更高頻寬的需求不斷增加，北美在預測期內將繼續成為最大的地區。

常問問題

Q1.市場規模為：

A1. 到 2030 年，全球高速互連 (HSI) 市場預計將達到 5,300 萬美元。

Q2.市場成長預測是多少：

A2. 2024年至2030年，全球高速互連（HSI）市場預計將以7.3%的複合年成長率成長。

Q3.影響市場成長的主要促進因素是：

A3. 隨著數位社會產生和消耗從串流媒體服務到雲端運算的大量資料，該市場的主要驅動力是資料需求的增加，對高頻寬互連、機器人和自動化的需求不斷成長。高速通訊。

Q4.市場的主要細分市場是：

A4. 全球高速互連 (HSI) 市場前景廣闊，資料中心、通訊、消費性電子和網路/運算市場充滿機會。

Q5.市場的主要企業是：

A5. 主要的高速互連 (HSI) 公司是：

  • Molex
  • Nexans
  • Leoni
  • Samtec
  • CBO
  • Cisco Systems
  • Huawei Technologies
  • Intel
  • The Siemon Company
  • Broadcom

Q6.未來最大的細分市場是什麼？

A6.Lucintel 預計 DAC 在預測期內仍將是一個更大的細分市場。

Q7. 未來五年預計哪些地區的市場成長最大？

A7. 由於新技術的使用不斷增加以及對更高頻寬的需求不斷增加，預計北美在預測期內仍將是最大的地區。

Q8. 可以客製化報告嗎？

A8. 是的，Lucintel 提供 10% 的客製化服務，無需額外付費。

目錄

第1章執行摘要

第2章全球高速互連（HSI）市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球高速互連（HSI）市場趨勢（2018-2023）與預測（2024-2030）
  • 全球高速互連 (HSI) 市場（按類型）
    • DAC
    • AOC
  • 全球高速互連 (HSI) 市場（按應用）
    • 資料中心
    • 通訊
    • 消費性電子產品
    • 網路運算
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球高速互連（HSI）市場按地區分類
  • 北美高速互連（HSI）市場
  • 歐洲高速互連（HSI）市場
  • 亞太地區高速互連（HSI）市場
  • 其他地區的高速互連（HSI）市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
  • 全球高速互連（HSI）市場的新興趨勢
  • 戰略分析
    • 新產品開發
    • 全球高速互連（HSI）市場產能擴張
    • 全球高速互連 (HSI) 市場的併購和合資企業
    • 認證和許可

第7章主要企業概況

  • Molex
  • Nexans
  • Leoni
  • Samtec
  • CBO
  • Cisco Systems
  • Huawei Technologies
  • Intel
  • The Siemon Company
  • Broadcom
簡介目錄

High Speed Interconnect Trends and Forecast

The future of the global high speed interconnect market looks promising with opportunities in the data center, telecom, consumer electronics, and networking and computing markets. The global high speed interconnect market is expected to reach an estimated $53.0 million by 2030 with a CAGR of 7.3% from 2024 to 2030. The major drivers for this market are increasing demand for data as digital world generates and consumes massive amounts of data from streaming services to cloud computing, rising demand for high-bandwidth interconnects, and increasing automation in various industries, requiring high-speed communication for robotics and control systems.

A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.

High Speed Interconnect by Segment

The study includes a forecast for the global high speed interconnect by type, application, and region.

High Speed Interconnect Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Direct Attach Cable
  • Active Optical Cable

High Speed Interconnect Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Data Centers
  • Telecom
  • Consumer Electronics
  • Networking And Computing
  • Others

High Speed Interconnect Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of High Speed Interconnect Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies high speed interconnect companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the high speed interconnect companies profiled in this report include-

  • Molex
  • Nexans
  • Leoni
  • Samtec
  • CBO
  • Cisco Systems
  • Huawei Technologies
  • Intel
  • The Siemon Company
  • Broadcom

High Speed Interconnect Market Insights

Lucintel forecasts that direct attach cable will remain larger segment over the forecast period.

Within this market, consumer electronics will remain the largest segment due to growing need to interconnect electronic devices, as well as, growing trend of smart homes.

North America will remain the largest region over the forecast period due to increased use of new technologies and demand for higher bandwidth in the region.

Features of the Global High Speed Interconnect Market

Market Size Estimates: High speed interconnect market size estimation in terms of value ($M).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: High speed interconnect market size by type, application, and region in terms of value ($M).

Regional Analysis: High speed interconnect market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the high speed interconnect market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the high speed interconnect market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the high speed interconnect market size?

Answer: The global high speed interconnect market is expected to reach an estimated $53.0 million by 2030.

Q2. What is the growth forecast for high speed interconnect market?

Answer: The global high speed interconnect market is expected to grow with a CAGR of 7.3% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the high speed interconnect market?

Answer: The major drivers for this market are increasing demand for data as digital world generates and consumes massive amounts of data from streaming services to cloud computing, rising demand for high-bandwidth interconnects, and increasing automation in various industries, requiring high-speed communication for robotics and control systems.

Q4. What are the major segments for high speed interconnect market?

Answer: The future of the global high speed interconnect market looks promising with opportunities in the data center, telecom, consumer electronics, and networking and computing markets.

Q5. Who are the key high speed interconnect market companies?

Answer: Some of the key high speed interconnect companies are as follows:

  • Molex
  • Nexans
  • Leoni
  • Samtec
  • CBO
  • Cisco Systems
  • Huawei Technologies
  • Intel
  • The Siemon Company
  • Broadcom

Q6. Which high speed interconnect market segment will be the largest in future?

Answer: Lucintel forecasts that direct attach cable will remain larger segment over the forecast period.

Q7. In high speed interconnect market, which region is expected to be the largest in next 5 years?

Answer: North America will remain the largest region over the forecast period due to increased use of new technologies and demand for higher bandwidth in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the high speed interconnect market by type (direct attach cable and active optical cable), application (data centers, telecom, consumer electronics, networking and computing, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global High Speed Interconnect Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global High Speed Interconnect Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global High Speed Interconnect Market by Type
    • 3.3.1: Direct Attach Cable
    • 3.3.2: Active Optical Cable
  • 3.4: Global High Speed Interconnect Market by Application
    • 3.4.1: Data Centers
    • 3.4.2: Telecom
    • 3.4.3: Consumer Electronics
    • 3.4.4: Networking and Computing
    • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global High Speed Interconnect Market by Region
  • 4.2: North American High Speed Interconnect Market
    • 4.2.1: North American High Speed Interconnect Market by Type: Direct Attach Cable and Active Optical Cable
    • 4.2.2: North American High Speed Interconnect Market by Application: Data Centers, Telecom, Consumer Electronics, Networking and Computing, and Others
  • 4.3: European High Speed Interconnect Market
    • 4.3.1: European High Speed Interconnect Market by Type: Direct Attach Cable and Active Optical Cable
    • 4.3.2: European High Speed Interconnect Market by Application: Data Centers, Telecom, Consumer Electronics, Networking and Computing, and Others
  • 4.4: APAC High Speed Interconnect Market
    • 4.4.1: APAC High Speed Interconnect Market by Type: Direct Attach Cable and Active Optical Cable
    • 4.4.2: APAC High Speed Interconnect Market by Application: Data Centers, Telecom, Consumer Electronics, Networking and Computing, and Others
  • 4.5: ROW High Speed Interconnect Market
    • 4.5.1: ROW High Speed Interconnect Market by Type: Direct Attach Cable and Active Optical Cable
    • 4.5.2: ROW High Speed Interconnect Market by Application: Data Centers, Telecom, Consumer Electronics, Networking and Computing, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global High Speed Interconnect Market by Type
    • 6.1.2: Growth Opportunities for the Global High Speed Interconnect Market by Application
    • 6.1.3: Growth Opportunities for the Global High Speed Interconnect Market by Region
  • 6.2: Emerging Trends in the Global High Speed Interconnect Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global High Speed Interconnect Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global High Speed Interconnect Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Molex
  • 7.2: Nexans
  • 7.3: Leoni
  • 7.4: Samtec
  • 7.5: CBO
  • 7.6: Cisco Systems
  • 7.7: Huawei Technologies
  • 7.8: Intel
  • 7.9: The Siemon Company
  • 7.10: Broadcom