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1600330

5G高頻PCB市場分析：趨勢、預測與競爭分析（至2030年）

5G High Frequency PCB Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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簡介目錄

5G高頻PCB趨勢與預測

全球5G高頻PCB市場前景廣闊，通訊、汽車、醫療和航太市場蘊藏機會。預計2024年至2030年全球5G高頻PCB市場將以13.6%的複合年成長率成長。該市場的主要驅動力是5G網路中對高速、低延遲通訊的需求不斷成長、5G基礎設施中毫米波技術的日益採用，以及對具有改進的訊號完整性和溫度控管功能的高頻PCB的需求不斷成長。

  • Lucintel 預測，按類型分類，4-16 級將在預測期內達到最高成長。
  • 以應用來看，通訊預計成長最快。
  • 從地區來看，亞太地區預計將在預測期內實現最高成長。

5G高頻PCB市場的策略成長機會

由於技術進步和市場需求，5G高頻PCB市場為關鍵應用提供了多個策略成長機會。

  • 通訊設備：基地台、天線和網路設備為 5G 基礎設施所需的高頻 PCB 提供了重要的製造機會和商機。
  • 家用電子電器：將 5G 整合到智慧型手機、平板電腦和穿戴式裝置中將為高頻 PCB 鋪平道路，從而實現更好的連接速度和資料傳輸。
  • 汽車應用：隨著汽車連接性的增加，汽車應用對高頻 PCB 的需求也在增加。主要應用領域包括 ADAS（先進駕駛輔助系統）和車載資訊娛樂系統。
  • 工業IoT：智慧工廠和互聯工業設備需要客製化 PCB 來承受惡劣條件，同時確保可靠的效能。
  • 醫療設備：遠端醫療和遠端監控解決方案的興起正在加速高頻 PCB 在醫療設備中的採用，使醫療連接更加複雜和有效。

這些機會展示了5G高頻PCB市場的廣泛成長潛力，並為企業探索新的收益來源提供了切入點。

5G高頻PCB市場促進因素與挑戰

5G高頻PCB市場受到各種促進因素​​和挑戰的影響，了解這些動態對於策略規劃至關重要。

推動5G高頻PCB市場的因素有：

  • 對 5G 網路的需求不斷增加：5G 的全球推出顯著增加了對高頻 PCB 的需求，為製造商創造了強勁的成長前景。
  • 持續的技術改進：PCB 材料和製造流程的進步提高了性能並實現了複雜的設計。
  • 推動基礎設施投資：政府和私營部門正在大力投資通訊基礎設施，推動對高效能 PCB 的需求。
  • 家用電子電器產業：家用電子電器尤其是5G設備的高需求將增加對高頻PCB的需求並擴大市場機會。
  • 轉向物聯網解決方案：隨著物聯網設備的不斷部署，需要更複雜的PCB來有效滿足網路系統的效能要求。

5G高頻PCB市場面臨的挑戰如下：

  • 高製造成本：高製造成本：先進的材料和複雜的製造技術會導致成本高昂，進而導致製造商生產無利可圖。
  • 激烈的競爭：行業內眾多公司之間的激烈競爭迫使不斷創新和差異化以維持市場佔有率。
  • 監管合規性：日益嚴格的環境法規對生產者提出了挑戰，需要對永續實踐進行大量投資。

5G高頻PCB市場為投資者提供了許多機會，但企業必須克服各種挑戰才能取得成功。

目錄

第1章執行摘要

第2章全球5G高頻PCB市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第4章市場趨勢與預測分析：按地區（2018-2030）

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球5G高頻PCB市場趨勢（2018-2023）及預測（2024-2030）
  • 全球 5G 高頻 PCB 市場：按類型
    • 4-16層
    • 16-32層
    • 32層以上
  • 5G高頻PCB市場：依應用分類
    • 通訊
    • 車
    • 醫療保健
    • 航太
    • 其他

第4章市場趨勢與預測分析：按地區（2018-2030）

  • 全球5G高頻PCB市場：按地區
  • 北美5G高頻PCB市場
  • 歐洲5G高頻PCB市場
  • 亞太5G高頻PCB市場
  • 其他地區5G高頻PCB市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 全球 5G 高頻 PCB 市場成長機會：按類型
    • 全球 5G 高頻 PCB 市場成長機會：按應用分類
    • 全球 5G 高頻 PCB 市場成長機會：按地區
  • 全球5G高頻PCB市場新趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球5G高頻PCB市場產能
    • 全球5G高頻PCB市場企業合併與合資
    • 認證和許可

第7章主要企業概況

  • Nippon Mektron
  • Samsung Electro-Mechanics
  • Young Poong Electronics
  • Daeduck
  • Ibiden
  • AT&S
  • Hannstar Board
  • Shennan Circuits
  • Zhen Ding Tech
  • TTM Technologies
簡介目錄

5G High Frequency PCB Trends and Forecast

The future of the global 5G high frequency PCB market looks promising with opportunities in the communication, automotive, medical, and aerospace markets. The global 5G high frequency PCB market is expected to grow with a CAGR of 13.6% from 2024 to 2030. The major drivers for this market are the increasing demand for high-speed and low-latency communication in 5G networks, the growing adoption of millimeter-wave technology in 5G infrastructure, and the rising demand for high-frequency PCBs with improved signal integrity and thermal management capabilities.

  • Lucintel forecasts that, within the type category, layer 4-16 are expected to witness the highest growth over the forecast period.
  • Within the application category, communication is expected to witness the highest growth.
  • In terms of regions, APAC is expected to witness the highest growth over the forecast period.

Gain Valuable insights for your business decisions with our comprehensive 150+ page report.

Emerging Trends in the 5G High Frequency PCB Market

The 5G high-frequency PCB market is evolving with several trends that symbolize changes in technology and market requirements.

  • Increased Use of Advanced Materials: The shift to high-frequency applications necessitates the use of low-loss dielectrics and high-temperature substrates, representing a trend toward increased performance and reliability in 5G systems.
  • Automation in Manufacturing: Automation is now critical to PCB manufacturing processes, enhancing precision and efficiency. This trend allows manufacturers to meet the high-volume demands of 5G applications with minimal errors.
  • Focus on Miniaturization: The need for miniaturized PCB designs is ever-increasing, driven by shrinking device sizes and complexities. Miniaturization enables the creation of compact, high-performance devices, which are crucial for 5G technologies.
  • Incorporation of RF Components: PCB designs are increasingly incorporating radio frequency (RF) components. This incorporation simplifies designs, thereby enhancing signal integrity, a critical characteristic for most 5G applications.
  • Sustainable Initiatives: The agenda for sustainability is driving the development of environmentally friendly materials and processes in PCB assembly. This trend aligns with global regulatory pressures and consumer demand for greener technologies.

These trends have reshaped the market through innovation, leading to improved performance and sustainability of 5G high-frequency PCBs.

Recent Developments in the 5G High Frequency PCB Market

Recent innovations in the 5G high-frequency PCB market are driving progress and enhancing manufacturing capabilities throughout the industry.

  • New Material Innovations: Recent developments in material science have introduced low-loss substrates that improve signal integrity. These materials are essential for enhancing the performance of high-frequency applications.
  • New Manufacturing Techniques: The adoption of newer manufacturing techniques, such as additive manufacturing and laser processing, is facilitating quicker production and improving the flexibility of PCB design fabrication.
  • Strategic Alliances: Collaborations among PCB manufacturers and technology firms are penetrating R&D to develop PCBs that meet stricter performance requirements for 5G, ensuring faster time-to-market.
  • IoT Devices: As IoT applications increase, the demand for specialized high-frequency PCBs is rising. Manufacturers are designing custom boards that cater to the specific needs of IoT devices operating on 5G networks.
  • Heightened Regulatory Compliance: Due to growing concerns about electronic waste and sustainability, manufacturers are intensifying their research efforts to create solutions that satisfy regulatory compliance without compromising high performance. This trend is reshaping both product development and market approaches.

These developments further enhance the capabilities and competencies of 5G high-frequency PCBs, allowing companies to meet growing demand effectively.

Strategic Growth Opportunities for 5G High Frequency PCB Market

The 5G high-frequency PCB market offers several strategic growth opportunities across key applications driven by advancements in technology and market needs.

  • Telecommunications Equipment: Base stations, antennas, and network equipment present significant manufacturing opportunities for high-frequency PCBs, essential for 5G infrastructure, representing a substantial revenue opportunity.
  • Consumer Electronics: Integrating 5G with smartphones, tablets, and wearables creates avenues for high-frequency PCBs that enable better connectivity speeds and data transfer.
  • Automotive Applications: As vehicle connectivity increases, the demand for high-frequency PCBs in automotive applications is also growing. Key application areas include advanced driver assistance systems and car infotainment.
  • Industrial IoT: Smart factories and connected industrial equipment require bespoke PCBs that can withstand tough conditions while ensuring reliable performance.
  • Medical Devices: The rise of telemedicine and remote monitoring solutions is boosting the adoption of high-frequency PCBs in medical devices, making healthcare connectivity more sophisticated and effective.

These opportunities illustrate the broad spectrum of growth potential in the 5G high-frequency PCB market, providing companies with entry points to explore new revenue streams.

5G High Frequency PCB Market Driver and Challenges

The 5G high-frequency PCB market is influenced by various driving factors and challenges, making it crucial to understand these dynamics for strategic planning.

The factors driving the 5G high-frequency PCB market include:

  • Growing Need for 5G Networks: The global rollout of 5G is significantly increasing the demand for high-frequency PCBs, creating intense growth prospects for manufacturers.
  • Continuous Technological Improvements: Advances in PCB materials and manufacturing processes enhance performance and enable complex designs.
  • Infrastructure Investment Push: Governments and private sectors are heavily investing in telecommunication infrastructure, driving demand for high-performance PCBs.
  • Consumer Electronics Sector: The high demand for consumer electronics, particularly 5G-enabled devices, drives the need for high-frequency PCBs and expands market opportunities.
  • Shift Towards IoT Solutions: The increasing deployment of IoT devices requires more sophisticated PCBs that can effectively meet the performance requirements of networked systems.

Challenges in the 5G high-frequency PCB market include:

  • High Production Costs: Advanced materials and sophisticated manufacturing techniques may incur high costs, potentially making production unprofitable for manufacturers.
  • Intense Competition: High competition among numerous players in the industry compels constant innovation and differentiation to sustain market share.
  • Regulatory Compliance: Stricter environmental regulations pose challenges for producers, necessitating significant investments in sustainable practices.

The 5G high-frequency PCB market presents numerous opportunities for investors, but companies must navigate various challenges to succeed.

List of 5G High Frequency PCB Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. Through these strategies 5G high frequency PCB companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the 5G high frequency PCB companies profiled in this report include-

  • Nippon Mektron
  • Samsung Electro-Mechanics
  • Young Poong Electronics
  • Daeduck
  • Ibiden
  • AT&S
  • Hannstar Board
  • Shennan Circuits
  • Zhen Ding Tech
  • TTM Technologies

5G High Frequency PCB by Segment

The study includes a forecast for the global 5G high frequency PCB by type, application, and region.

5G High Frequency PCB Market by Type [Analysis by Value from 2018 to 2030]:

  • Layer 4-16
  • Layer 16-32
  • More than 32 layers

5G High Frequency PCB Market by Application [Analysis by Value from 2018 to 2030]:

  • Communication
  • Automotive
  • Medical
  • Aerospace
  • Others

5G High Frequency PCB Market by Region [Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

Country Wise Outlook for the 5G High Frequency PCB Market

Advancements in the 5G high-frequency PCB market are occurring rapidly, driven by the need for faster and more reliable communication networks. Key countries leading these advancements include the United States, China, Germany, India, and Japan, each bringing a unique approach.

  • United States: The U.S. is upgrading manufacturing capacity for high-frequency PCBs through investments in advanced materials and processes. Collaborations between technology companies and various institutions focus on developing next-generation PCBs to meet 5G requirements.
  • China: Numerous projects have been initiated in China to aggressively expand 5G networks. The growing 5G infrastructure necessitates high-frequency PCBs. Local efforts in research and development aim to create substrate materials compatible with 5G technologies and support the government's ambitious rollout plans.
  • Germany: Germany emphasizes sustainability in PCB fabrication, focusing on research related to environmentally friendly materials while complying with European regulatory laws. This approach has led to a range of high-frequency PCBs that meet both environmental and performance standards.
  • India: The Indian government is positioning the country as a 5G hub, encouraging local manufacturing of high-frequency PCBs. Investments in training and infrastructure are improving local manufacturers' competitiveness in the global market.
  • Japan: The Japanese advanced telecommunications sector fosters innovations in high-frequency PCB designs. Companies are researching and developing new materials and manufacturing techniques to enhance performance, particularly in urban areas where 5G networks are rapidly being deployed.

Features of the Global 5G High Frequency PCB Market

Market Size Estimates: 5G high frequency PCB market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: 5G high frequency PCB market size by type, application, and region in terms of value ($B).

Regional Analysis: 5G high frequency PCB market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the 5G high frequency PCB market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the 5G high frequency PCB market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

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This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the 5G high frequency PCB market by type (layer 4-16, layer 16-32, and more than 32 layers), application (communication, automotive, medical, aerospace, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global 5G High Frequency PCB Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global 5G High Frequency PCB Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global 5G High Frequency PCB Market by Type
    • 3.3.1: Layer 4-16
    • 3.3.2: Layer 16-32
    • 3.3.3: More than 32 layers
  • 3.4: Global 5G High Frequency PCB Market by Application
    • 3.4.1: Communication
    • 3.4.2: Automotive
    • 3.4.3: Medical
    • 3.4.4: Aerospace
    • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global 5G High Frequency PCB Market by Region
  • 4.2: North American 5G High Frequency PCB Market
    • 4.2.1: North American Market by Type: Layer 4-16, Layer 16-32, and More than 32 layers
    • 4.2.2: North American Market by Application: Communication, Automotive, Medical, Aerospace, and Others
  • 4.3: European 5G High Frequency PCB Market
    • 4.3.1: European Market by Type: Layer 4-16, Layer 16-32, and More than 32 layers
    • 4.3.2: European Market by Application: Communication, Automotive, Medical, Aerospace, and Others
  • 4.4: APAC 5G High Frequency PCB Market
    • 4.4.1: APAC Market by Type: Layer 4-16, Layer 16-32, and More than 32 layers
    • 4.4.2: APAC Market by Application: Communication, Automotive, Medical, Aerospace, and Others
  • 4.5: ROW 5G High Frequency PCB Market
    • 4.5.1: ROW Market by Type: Layer 4-16, Layer 16-32, and More than 32 layers
    • 4.5.2: ROW Market by Application: Communication, Automotive, Medical, Aerospace, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global 5G High Frequency PCB Market by Type
    • 6.1.2: Growth Opportunities for the Global 5G High Frequency PCB Market by Application
    • 6.1.3: Growth Opportunities for the Global 5G High Frequency PCB Market by Region
  • 6.2: Emerging Trends in the Global 5G High Frequency PCB Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global 5G High Frequency PCB Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global 5G High Frequency PCB Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Nippon Mektron
  • 7.2: Samsung Electro-Mechanics
  • 7.3: Young Poong Electronics
  • 7.4: Daeduck
  • 7.5: Ibiden
  • 7.6: AT&S
  • 7.7: Hannstar Board
  • 7.8: Shennan Circuits
  • 7.9: Zhen Ding Tech
  • 7.10: TTM Technologies