切割設備市場增長、趨勢、COVID-19 的影響、預測2023-2028

在預測期內，切割設備市場預計將以 7.4% 的複合年增長率增長。

推動切割設備市場增長的主要因素是對智能卡、RFID 技術和汽車電源 IC 不斷增長的需求。 由於消費電子市場的擴大以及小型化和技術轉型的趨勢，市場供應商增加了用於小型化和性能改進的研發支出，而隨著 MEMS(微機電系統)和 3D 的出現，這種聯繫正在推動需求用於切丁機。

主要亮點

• 在電子產品製造中，IC(集成電路)封裝是半導體設備製造的最後階段，其中一小塊半導體材料封裝在支撐殼中以防止物理損壞和腐蝕。 電子設備的封裝正變得更加節約資源，並被用於多種用途。
• 封裝尺寸的減小與功耗成反比。 因此，市場參與者正在努力開發能夠在小型化的同時保持功率的半導體。 例如，NXP Semiconductors 的 MaxQFP 封裝以更小的封裝提供相同的 I/O。 比較 16*16mm 172MaxQFP 和 24*24mm 176LQFP，據說實現了約 55% 的佔位面積減少。
• 此外，由於消費者對始終在線連接的需求，汽車和車輛中的電子元件數量正在增加，尤其是在混合動力和電動汽車中。 例如，根據國際能源署 (IEA) 的數據，電動汽車的銷量幾乎翻了一番，達到 660 萬輛。 汽車行業在未來十年內推出自動駕駛汽車和電動汽車的動力也在推動所研究市場的增長。
• 大多數 RFID 都嵌入到一些消費電子產品和 ID 解決方案中，例如 ID 標籤和智能卡，最終用戶需要超光滑的表面和更薄的晶圓以無縫集成到這些設備中。要求越來越高。 這種背景，加上對企業ID管理解決方案和汽車遠程信息處理等RFID應用的強勁需求，將進一步推動對薄晶圓的需求，預計將在預測期內帶動切割設備的正增長。
• 刀片切割是 MEMS 和半導體技術中用於將矽晶圓分離成單個芯片和器件的最廣泛使用的工藝。 此外，刀片切割已作為一種低成本切割技術在許多應用中被採用，預計這將在預測期內提振需求。
• 但隨著微型化的進展，圖案的複雜度增加，製造過程中出現功能性缺陷的可能性增加。
• COVID-19 及其引發的經濟動盪導致多個國家/地區的整體經濟下滑，商業和貿易大幅下滑。 半導體和晶圓市場也不例外，收入、生產和擴張都受到疫情的嚴重影響，切割設備市場也受到類似的影響。 然而，隨著半導體製造商專注於增加產能以滿足市場需求，預計所研究的市場將遵循類似的軌跡。

切粒機市場趨勢

刀片切割佔有較大份額

• 晶圓切割是一種將晶圓上的單個矽芯片(芯片)分開的設備。 切割過程以機械方式切掉芯片之間的多餘空間(稱為切割道或劃線)。 目前主流是切割直徑為200mm或300mm的矽片，0.05mm見方的切割也在考慮中。 該標準使用金剛石刀片將工業鑽石隱藏在樹脂中。 切割矽片時，刀片厚度從 20m 到 35m 不等，具體取決於目標材料。
• 精度和可控性在晶圓切割過程中非常重要。 晶圓基板被送入切割刀片的速度決定了整個過程的產量和生產率。 因此，大多數行業都需要高速、高切割的劃片機，以提高生產率並降低成本。
• 有多家供應商提供切割刀片。 例如，SIMAC 提供用於晶圓切割、CSP、BGA、GaAs、GaP、LED 封裝分割、化合物半導體、陶瓷、玻璃、晶體和其他材料的切割刀片。
• 金剛石刀片通常用於需要持續供應冷卻液的切割機。 因此，需要持續供應冷卻液並獲得均勻的切割質量。 由於噴嘴堵塞、噴嘴調整變化和刀片質量等不可控原因，可能會出現偏差。 因此，需要一種統計方法來連續監測葉片扭矩。 在線監測劃片機性能對於確保工藝穩定性至關重要。
• 半導體芯片需求的增加預計會對刀片切割設備的需求產生積極影響。 例如，據SEMI(國際半導體設備與材料)統計，全球矽晶圓出貨總面積已達141.65億平方英寸。

亞太地區佔據很大的市場份額

• 在過去幾十年中，半導體行業經歷了巨大的發展，中國大陸和台灣等國家/地區逐漸成為主要的半導體製造商。 台積電、三星、SK海力士等都是該地區半導體芯片的頂級製造商。
• 中國被認為是世界上增長最快的半導體市場之一。 由於對智能手機和其他消費電子產品的高需求，許多廠商已在中國設立生產基地。 中國政府的中國製造倡議等舉措勢頭強勁，國際企業在當地建立生產基地的關注度也越來越高。
• 根據半導體行業協會 (SIA) 的預測，到 2024 年，中國半導體行業的年收入將達到 1160 億美元，約佔全球市場份額的 17.4%。
• 此外，中國宣佈在代工廠、氮化鎵 (GaN) 和碳化矽 (SiC) 市場開展新的大規模晶圓廠開發活動，以發展國內半導體產業。 據 SEMI 稱，全球芯片製造商將在 2021 年開始建設 19 座新晶圓廠，併計劃在 2022 年再建 10 座。
• 日益嚴重的芯片短缺和不斷增長的需求也鼓勵其他國家率先推動本國半導體產業的發展。 例如，印度政府採取了多項舉措來發展電子製造集群。 去年 12 月，電子和信息技術部 (MeitY) 批准了一項全面的 PLI 計劃，在未來六年內為半導體和顯示器製造商提供價值 92 億美元的激勵措施。

切割設備市場競爭分析

切割設備市場競爭激烈，由幾家大公司組成。 其中，市場份額增長尤為明顯的是那些專注於擴大海外客戶群的公司。 他們利用創新來提高知名度、市場份額和盈利能力。 進入市場的主要參與者包括 Suzhou Delphi Laser、ASM Laser Separation International (ALSI) BV 和 Neon Tech。

2022 年 6 月，晶圓切割鋸製造商 SR Inc. 宣布計劃重點擴大其晶圓切割鋸業務。 作為其中的一部分，該公司正專注於為三星電子提供大量用於相機模塊的切割機。 我們還將專注於進軍新領域。

2021年10月，Northrop Grumman，一家切割、後端晶圓後處理能力、士兵凸塊、鈍化、先進檢測和測試解決方案的供應商，進一步建立國防應用的晶圓後處理和測試來源，擴大我們的立足點在國防微電子系統領域。

其他福利

• Excel 格式的市場預測 (ME) 表
• 三個月的分析師支持

內容

第1章介紹

• 研究假設和市場定義
• 調查範圍

第2章研究方法論

第 3 章執行摘要

第 4 章市場洞察

• 市場概覽
• 產業吸引力 - 波特五力分析
  • 供應商的議價能力
  • 消費者的議價能力
  • 新進入者的威脅
  • 競爭公司之間的敵對關係
  • 替代品的威脅
• 工業價值鏈分析
• 評估 COVID-19 對切割設備市場的影響

第 5 章市場動態

• 市場驅動因素
  • 技術進步，下一代設備的發展
• 市場挑戰
  • 大規模生產的挑戰

第 6 章市場細分

• 通過切割技術
  • 刀片切割
  • 激光消融
  • 等離子切割
• 通過申請
  • 邏輯記憶
  • MEMS 設備
  • 功率器件
  • CMOS 圖像傳感器
  • 無線射頻識別
• 區域信息
  • 中國
  • 台灣
  • 韓國
  • 北美
  • 歐洲
  • 世界其他地方

第7章劃片機潛在主要客戶名單

第八章競爭格局

• 公司簡介
  • Suzhou Delphi Laser Co. Ltd
  • SPTS Technologies Limited (KLA Tencor Corporation)
  • ASM Laser Separation International(ALSI)BV
  • Tokyo Seimitsu Co. Ltd
  • Neon Tech Co. Ltd
  • Nippon Pulse Motor Taiwan(NPM)Group
  • Panasonic Corporation
  • Plasma-Therm LLC

第9章 投資分析

第10章 投資分析市場的將來展望

The Dicing Equipment Market is expected to grow by registering a CAGR of 7.4% over the forecast period. The primary factors driving the growth of the dicing equipment market are the increasing demand for smart cards, RFID technology, and automotive power ICs. The increasing consumer electronics market and the inclination toward miniaturization and technology migration has forced market vendors to increase R&D expenditure to reduce the size and improve performance, leading to the emergence of micro-electro-mechanical systems (MEMS) and 3D packaging, which in turn is driving the demand for dicing equipment.

Key Highlights

• In electronics manufacturing, IC (integrated circuit) packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion. The increasing efforts to make electronic packaging highly resourceful have amplified usage in myriad applications.
• The reduction in package size is inversely proportional to the power dissipation. Therefore, players in the market strive to develop semiconductors that can retain power with reduced size. For instance, NXP Semiconductors' MaxQFP package delivers the same I/O in a smaller footprint. While comparing 16x16 mm 172 MaxQFP to 24x24 mm 176 LQFP, the company claims a reduction of about 55% in footprint.
• Furthermore, the increasing number of electronic components in vehicles or automobiles is a key driver, particularly in hybrid and electric cars, due to the consumer demand for constant connectivity. For instance, according to the International Energy Agency (IEA), the sales of electric vehicles nearly doubled, reaching 6.6 million. The automotive industry's push to deliver autonomous and electric vehicles in the next decade is also driving the growth of the market studied.
• With most RFIDs being integrated into several consumer electronics and identity solutions, such as identification tags and smart cards, end users increasingly demand ultra-smooth surfaces and thinner wafers to incorporate them seamlessly into these devices. Such scenarios, coupled with the strong demand for RFID applications, such as enterprise identity management solutions and automobile telematics, are expected to create more demand for thin wafers, thus providing positive growth for dicing equipment during the forecast period.
• Blade dicing has been the most widely used process in separating silicon wafers into individual chips/devices, both in MEMS and semiconductor technologies. It is also the low-cost dicing technology in many applications, which is expected to drive its demand during the forecast period.
• However, with the miniaturization trend becoming prevalent, the complexity of patterns has increased significantly, increasing the chances of functional defects in manufacturing processes which is among the major factors challenging the growth of the studied market.
• COVID-19 and the economic disruption caused by it resulted in the overall decline in the economies of several nations and a drastic fall in business and trade. The semiconductor or wafer market was no exception and suffered major falls in revenue, manufacturing, and expansion due to the pandemic, which had a similar impact on the dicing equipment market. However, with the semiconductor manufacturers focusing on expanding their production capabilities to match the market demand, the studied market is also expected to follow a similar trajectory.

Dicing Equipment Market Trends

Blade Dicing to Hold Significant Market Share

• Wafer dicing separates individual silicon chips (die) from one another on a wafer. The wafer is mechanically sawed in the excess spaces between the dies during the dicing process (often referred to as either dicing streets or scribe lines). Mainstream cutting of silicon wafers with a diameter of 200mm or 300mm is currently conceivable, as is a 0.05mm square cut. The standard uses a diamond blade to hide the industrial diamond in the resin. When cutting the silicon wafer, the blade thickness varies depending on the subject material and ranges from 20 m to 35 m.
• The precision and control capabilities of the wafer dicing process are critical. The yield and productivity of the entire process are determined by the rate at which the wafer substrate is fed into the cutting blade. Most industries, therefore, require high-speed, high-cutting dicing machines, which can increase the throughput rate and lower the cost.
• There are several vendors offering dicing blades. For instance, SIMAC offers dicing blades for Wafer Dicing, CSP, BGA, GaAs, GaP, LED Package singulation, compound semiconductors, ceramics, glass, crystals, and other materials.
• Diamond blades are commonly used in dicing machines, which require a constant supply of coolant. Only in this manner can a uniform cut quality be achieved. Deviations can be caused by uncontrollable causes such as nozzle clogging, nozzle adjustment changes, and blade quality. As a result, a statistical technique is required to monitor blade torque continuously. To ensure process stability, online monitoring of dicing machine performance is critical.
• The increasing demand for semiconductor chips is expected to positively impact the demand for blade dicing equipment. For instance, according to Semiconductor Equipment and Materials International (SEMI), the total area of silicon wafers shipped globally reached 14,165 million square inches.

Asia-Pacific to Hold a Major Market Share

• In the last few decades, the semiconductor industry witnessed tremendous growth, with countries like China and Taiwan emerging among the leading semiconductor manufacturers. TSMC, Samsung, SK Hynix, etc., are among the region's top manufacturers of semiconductor chips.
• China is considered one of the world's fastest-growing semiconductor markets. Significant demand for smartphones and other consumer electronics devices encourages many vendors to set up production establishments in the country. Increasing initiatives, such as 'Made in China' by the Chinese government, are increasingly drawing attention from international players to set up local production establishments.​
• According to the Semiconductor Industry Association (SIA) forecasts, the Chinese semiconductor industry could generate USD 116 billion in annual revenue by 2024, capturing about 17.4% of the global market share.
• Furthermore, China also announced a new and enormous fab development campaign in the foundry, gallium-nitride (GaN), and silicon carbide (SiC) markets, among other steps, to advance its domestic semiconductor industry. According to SEMI, chipmakers worldwide were scheduled to begin construction on 19 new fabs in 2021, with another ten planned for 2022.
• The ongoing chip shortage and the growing demand have also encouraged other countries to take the initiative to promote local semiconductor industry. For instance, the government of India took several initiatives to develop its electronics manufacturing cluster. In December last year, the Ministry of Electronics and Information Technology (MeitY) approved a comprehensive PLI scheme involving incentives worth USD 9.2 billion for semiconductor and display manufacturers to be distributed over the next six years.

Dicing Equipment Market Competitive Analysis

The dicing equipment market is competitive and consists of several major players. These players, with a prominent share of the market, are focused on expanding their customer base across foreign countries. They leverage innovations to increase their recognition, market share, and profitability. Some major players operating in the market include Suzhou Delphi Laser Co. Ltd, ASM Laser Separation International (ALSI) BV, and Neon Tech Co. Ltd, among others.

In June 2022, SR, a wafer dicing saw machine maker, announced its plans wherein the company would focus on expanding the wafer dicing saw machine business. As part of its expansion plans, the company focused on supplying many saws to Samsung Electronics to dice camera modules. The company would also focus on expanding its presence to new sectors.

In October 2021, Northrop Grumman, the provider of dicing, backend wafer post-processing capabilities, soldier bumping, passivation, advanced inspection, and test solution, established wafer post-processing and test source tailored for defense applications further to expand its footprint into the defense microelectronics systems sector.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

• 4.1 Market Overview
• 4.2 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.2.1 Bargaining Power of Suppliers​
  • 4.2.2 Bargaining Power of Consumers​
  • 4.2.3 Threat of New Entrants​
  • 4.2.4 Intensity of Competitive Rivalry​
  • 4.2.5 Threat of Substitutes​
• 4.3 Industry Value Chain Analysis
• 4.4 Assessment of the Impact of COVID-19 on the Dicing Equipment Market

5 MARKET DYNAMICS

• 5.1 Market Drivers
  • 5.1.1 Technological Advancements, and Evolution of Next Generation Devices
• 5.2 Market Challenges
  • 5.2.1 Mass Manufacturing Challenges

6 MARKET SEGMENTATION

• 6.1 By Dicing Technology
  • 6.1.1 Blade Dicing
  • 6.1.2 Laser Ablation
  • 6.1.3 Plasma Dicing
• 6.2 By Application
  • 6.2.1 Logic & Memory
  • 6.2.2 MEMS Devices
  • 6.2.3 Power Devices
  • 6.2.4 CMOS Image Sensor
  • 6.2.5 RFID
• 6.3 By Geography
  • 6.3.1 China
  • 6.3.2 Taiwan
  • 6.3.3 South Korea
  • 6.3.4 North America
  • 6.3.5 Europe
  • 6.3.6 Rest of the World

7 POTENTIAL LIST OF KEY CUSTOMERS FOR DICING EQUIPMENT

8 COMPETITIVE LANDSCAPE

• 8.1 Company Profiles
  • 8.1.1 Suzhou Delphi Laser Co. Ltd
  • 8.1.2 SPTS Technologies Limited (KLA Tencor Corporation)
  • 8.1.3 ASM Laser Separation International (ALSI) BV
  • 8.1.4 Tokyo Seimitsu Co. Ltd
  • 8.1.5 Neon Tech Co. Ltd
  • 8.1.6 Nippon Pulse Motor Taiwan (NPM) Group
  • 8.1.7 Panasonic Corporation
  • 8.1.8 Plasma-Therm LLC

9 INVESTMENT ANALYSIS

10 FUTURE OUTLOOK OF THE MARKET