全球晶圓加工和組裝設備市場—增長、趨勢、COVID-19 的影響和預測 (2023-2028)

在 2022 年至 2027 年的預測期內，全球晶圓加工和組裝設備市場預計將以 8.4% 的複合年增長率增長。

晶圓加工和組裝設備市場預計會隨著消費電子產品需求的增長而增長。 隨著對電子產品的需求不斷增加，客戶對改進新電子產品質量的期望也越來越高。 一些消費電子產品和 ID 解決方案，例如識別標籤和智能卡，將 RFID 與用於集成電路製造的晶圓相結合。 對無縫集成到電子產品中的超光滑表面和小型晶圓的需求越來越大。

主要亮點

• 根據印度品牌資產基金會的數據，到 2022 年，印度家電和消費電子 (ACE) 行業的產值預計將增長到 3.15 萬億印度盧比(483.7 億美元)，複合年增長率為 9%。 印度的電子製造業預計也將在 2024-25 年達到 3000 億美元(225 萬億)。 此外，消費電子產品的使用和消費增加將刺激對半導體的需求，預計這將在預測期內提振晶圓加工和組裝設備市場收入。
• 晶圓加工和組裝設備行業的一個突出趨勢是對具有更高設備性能的小型化晶圓的需求不斷增加。 例如，晶圓最終被壓平到幾十微米的厚度。 大多數用於存儲器、CIS 和電源系統的半導體晶圓被減薄到 100 um 至 200 um 的厚度。 對於存儲設備，需要最大限度地提高單個封裝中的存儲容量、提高數據傳輸速度和功耗，尤其是在移動應用中，這推動了對更薄設備的需求。 2D NAND/DRAM 等典型的存儲設備使用厚度大於 200 um 的矽晶圓。
• 地區政府機構正計劃投資半導體生產，這可能會為研究目標市場創造增長機會。 例如，2021年9月，德國經濟部宣佈為歐盟歐洲共同利益重點項目倡議撥款30億歐元，這是歐盟刺激投資、降低進口依賴的主要補貼措施之一，您已表示願意投資。 這筆錢將被德國政府用來建造一個新的半導體製造廠。 這項投資的主要目的是為了減少我們未來半導體需求對進口半導體的依賴。 像這樣的政府政策將對研究目標市場產生重大影響。
• 在晶圓製造週期中，晶圓會承受機械負載，□□包括鋸木廠、體力勞動、液體噴射、運輸系統和取放設備。 當今市場上的功率半導體通常是在厚度為 50-100um 的 200mm 晶圓上製造的，儘管路線圖允許更薄的晶圓降至 1um。 該晶圓的背面經過機械拋光。 拋光過程中會出現各種缺陷，如拋光痕跡、拋光不良造成的邊緣缺口、星形裂紋、邊緣顆粒卡在砂輪中的彗星、嵌入顆粒、鑽孔線等。
• 此外，由於 COVID-19 大流行導致全球晶圓半導體短缺，公司正致力於提高產能。 例如，中芯國際(國際半導體製造公司)宣布將於 2021 年 9 月在上海自貿區開設一家新工廠。我們有積極的計劃將其翻一番。

晶圓加工及組裝設備市場趨勢

薄膜沉積是推動市場的因素之一

• CVD(化學氣相沉積)技術通常用於製造半導體和薄膜。 CVD設備市場的增長主要是由於半導體、LED和存儲設備行業的快速增長，原因是基於微電子的消費品需求增加以及電鍍中Cr6的嚴格使用限制。
• 2022 年 1 月，韓國特種真空爐製造商 Thermvac 開發了可在 900度C 至 2400度C 溫度範圍內使用的 CVD 設備的工藝技術、設計和製造技術。繼續滿足 這是為了應對半導體、光伏、手機、航空航天、國防等高科技行業對高溫耐熱CVD材料日益增長的需求。
• 線性濺射設備用於太陽能、顯示器、數據存儲和半導體等應用。 例如，2021年12月，博世開始量產SiC功率半導體，供應全球汽車製造商。 為了滿足對半導體不斷增長的需求，2021 年博世位於羅伊特林根的晶圓廠已經增加了 10,764 平方英尺的潔淨室空間。 到 2023 年底將增加 32,292 平方英尺。 半導體產量的增加推動了所調查的市場。
• 該地區汽車行業的發展有望為市場增長創造重大機遇。 例如，迪拜最近發起了一項運動，到 2030 年在阿聯酋的街道上擁有 42,000 輛電動汽車。 濺射設備用於塗覆傳動系統軸承和部件，隨著電動汽車開發的增加，將顯著推動研究市場。
• 濺射薄膜越來越多地用於生物醫學應用。 例如，圓柱形磁控管濺射已用於在批量醫療支架上沉積保護塗層。 納米薄膜廣泛應用於電子、紡織、製藥、陶瓷和許多其他應用領域。 納米薄膜塗層織物通常通過化學氣相沉積、溶膠-凝膠和磁控濺射方法製成。 例如，磁控濺射法具有膜厚可控、純度高、高速低溫、附著力好、可操作性好、環境友好等優點。

亞太地區佔據主要市場份額

• 亞太地區是全球增長最快的半導體市場。 許多供應商已在該地區設立生產設施，以滿足中國、韓國和新加坡等國家對智能手機和消費電子產品的強勁需求。
• 為了滿足廣泛的客戶需求，每家公司都啟動了新項目並擴大了在該地區的業務。 例如，2021 年 9 月，UTAC Holding, Ltd. 在其先進的半導體製造解決方案套件中增加了最先進的等離子切割和多項目晶圓 (MPW) 功能。 等離子切割縮小了芯片之間的劃線寬度並增加了每個晶圓的芯片數量。 它還提供了近乎完美的切割質量，沒有碎屑或裂紋，與長期存在側壁質量問題的傳統機械鋸切工藝相比具有明顯優勢。
• 此外，公共機構和私營公司還對新產品和研發設施進行投資。 例如，2021 年 9 月，中國最大的合同芯片製造商中芯國際 (SMIC) 宣布已與上海自由貿易區的臨港特區達成協議。 根據協議，中芯國際將建立一個新的晶圓代工廠，每月生產10萬片12英寸晶圓。 此外，2021 年 3 月，我們將與深圳市政府合作，投資 23.5 億美元建設月產 40,000 片 12 英寸晶圓的製造工廠，該工廠將生產 28 納米(納米)或以上的集成電路。
• 同樣，2021 年 10 月，新南威爾士州政府認識到全球半導體行業缺少澳大利亞主要參與者，並宣布了該中心的一項新計劃 該樞紐，即半導體行業服務管理局 (S3B)，將設在悉尼的 Tech Central，並將由州政府資助。 此外，首席科學家和工程師辦公室指出，在對國內半導體場景進行調研後，目前澳洲還沒有一家主要以半導體設計或半導體開發為核心業務的公司。 新基地利用國內的晶圓加工和劃片設備市場。
• 隨著 TSV(矽通孔)技術在手機和無線/網絡設備等低功耗、高性能設備中的普及，對隱形切割設備的需求不斷增加。 由於 TSV 能夠進行上述應用中的 2.5D/3D 封裝，因此它是 TSV 組裝/封裝(使用隱形切割的芯片到芯片/芯片到晶圓組裝等)的有效系統。 對於存儲器和邏輯，激光切割和刀片切割結合使用。

晶圓加工及組裝設備市場競爭分析

全球晶圓加工組裝設備市場適度集中。 玩家傾向於投資於提供創新的產品，以滿足不同行業不斷變化的需求。 此外，參與者正在採取戰略活動，如合作夥伴關係、合併和收購，以擴大他們的影響力。 市場的最新發展包括:

• 2022 年 3 月 - SK siltron 宣布其位於美國密歇根州貝城的碳化矽 (SiC) 半導體晶圓製造工廠開始運營。 我們計劃每年生產約 60,000 件。 此外，6英寸SiC晶圓是主要產品。
• 2021 年 9 月 - Infineon Technologies AG 在其位於奧地利菲拉赫的工廠啟動了一家高科技芯片工廠，用於在 300 毫米薄晶圓上製造功率半導體器件。 16億歐元的投資將成為歐洲微電子領域最大的項目之一。 據該公司稱，該工廠的工業半導體年產能據說足以支持產生約 1,500 TWh 電力的光伏系統，大約是德國年用電量的三倍。

其他好處

• Excel 格式的市場預測 (ME) 表
• 三個月的分析師支持

內容

第1章介紹

• 研究假設和市場定義
• 調查範圍

第2章研究方法論

第 3 章執行摘要

第 4 章市場洞察

• 市場概覽
• 產業吸引力 - 波特五力分析
  • 供應商的議價能力
  • 買家的議價能力
  • 新進入者的威脅
  • 替代品的威脅
  • 競爭公司之間的敵對關係
• 評估 COVID-19 對市場的影響

第 5 章市場動態

• 市場驅動力
  • 不斷增加的消費者需求

對電子設備的需求不斷增長

促進製造業發展

• 人工智能的擴散

人工智能、物聯網、互聯設備

各行業設備的激增

• 市場挑戰
  • 技術的動態特性

需要對生產設備進行幾處改動

生產設備

第 6 章市場細分

• 按設備類型
  • 化學機械拋光

(中醫)

• 蝕刻
• 薄膜形成
  • 化學氣相沉積
  • 濺射
  • 其他
• 光刻膠處理
• 裝配設備
  • 貼片
  • 引線鍵合
  • 包裝
  • 檢查和切割

電鍍等

• 區域信息
  • 亞太地區
  • 北美
  • 世界其他地區
• 按產品 - 晶圓加工設備
  • 動態隨機存取存儲器
  • 與非
  • 鑄造/邏輯
  • 其他產品

第7章廠商排名分析

第8章競爭格局

• 公司簡介
  • Applied Materials Inc
  • ASML Holding Semiconductor Company
  • Tokyo Electron Limited
  • Lam Research Corporation
  • KLA Corporation
  • Hitachi High-Technologies Corporation
  • Disco Corporation
  • ASM Pacific Technology
  • Kulicke and Soffa Industries, Inc
  • BE Semiconductor Industries N.V
  • Towa Corporation

第9章 投資分析

第10章 投資分析市場將來性

The Global Wafer Processing and Assembly Equipment Market is expected to grow at a CAGR of 8.4% during the forecast period of 2022 to 2027. The wafer processing and assembly equipment market is expected to grow in response to rising consumer electronics demand. Customer expectations for improved qualities of new electronic gadgets have risen as demand for electronic products has increased. Several consumer electronics and identity solutions, such as identification tags, smart cards, and others, combine RFIDs with wafers for integrated circuit fabrication. Customers increasingly demand ultra-smooth surfaces and smaller wafers for seamless integration into electronic products.

Key Highlights

• According to the Indian Brand Equity Foundation, In 2022, the Indian appliance and consumer electronics (ACE) sector is predicted to grow at a 9% compound annual growth rate (CAGR) to INR 3.15 trillion (USD 48.37 billion). The Indian electronics manufacturing sector is expected to reach USD 300 billion (INR 22.5 lakh crore) by 2024-25. Furthermore, increased consumer electronics device usage and consumption are predicted to fuel semiconductor demand, boosting wafer processing and assembly equipment market revenues throughout the projection period.
• A prominent trend in the wafer processing and assembly equipment industry is the growing demand for miniaturized wafers with higher device performance. Wafers, for example, are flattened down to final thicknesses of tens of micrometers. Most semiconductor wafers used in memory, CIS, and power applications are reduced to 100 µm-200 µm in thickness. In the case of memory devices, further thickness reduction is required due to the need to maximize the memory capacity of single packages, increased data transmission rates, and power consumption fueled mostly by mobile applications. Silicon wafers thicker than 200 µm are used in standard memory devices like 2D NAND/DRAM.
• The government bodies in the different regions are planning to invest in the production of semiconductors, which may create an opportunity for the studied market to grow. For instance, in September 2021, Germany's economy ministry stated that the country is willing to invest EUR 3 billion in the EU's "Important Projects of Common European Interest" initiative, which is one of the EU's primary subsidy tools for stimulating investment and reducing import dependency. The money will be used by the German government to build new semiconductor manufacturing factories. This investment is primarily aimed at reducing dependency on imported semiconductors for future semiconductor needs. Government policies like this will significantly drive the studied market.
• Wafers are subjected to mechanical loads induced by sawing, manual handling, liquid jets, transport systems, and pick and place equipment during the wafer manufacturing cycle. Power semiconductors on the market now are generally made on 200-mm wafers with thicknesses ranging from 50 to 100 µm, although their roadmaps allow for wafers as thin as 1 µm. Mechanical polishing thins the backside of these wafers. Grinding marks, grinding failures resulting in edge chips, star cracks, and comets generated by edge particles caught in the grinding wheel, embedded particles, cleavage lines, and a variety of other faults are all defects caused by the polishing process.
• Furthermore, the global shortage of wafer semiconductors led by the COVID-19 pandemic has encouraged players to focus on increasing production capacity. For instance, Semiconductor Manufacturing International Corp (SMIC) has indulged in aggressive plans to double its production capacity by 2025 by constructing new chip fabrication plants in different cities, including its announcement in September 2021 to establish a new factory in Shanghai's free trade zone.

Wafer Processing & Assembly Equipment Market Trends

Thin Film Deposition is One of the Factor Driving the Market

• The Chemical Vapor Deposition (CVD) technology is commonly employed in the fabrication of semiconductors and thin films. The expansion of the CVD equipment market is primarily driven by increasing demand for microelectronics-based consumer items, which is resulting in quicker growth of the semiconductor, LED, and storage device industries, as well as severe limits on the use of Cr6 for electroplating.
• In January 2022, ThermVac Inc., a Korean manufacturer of special vacuum furnaces, continues to respond to the needs of domestic and international clients by developing process technology and design and manufacturing technology for CVD equipment that can be used at temperatures ranging from 900°C to 2,400°C. This corresponds to the growing demand for high-temperature heat-resistant CVD components in high-tech industries like semiconductors, solar power, mobile phones, aerospace, and defense.
• The linear sputtering equipment is used in applications like solar energy, display, Data storage, semiconductor, and many more. For instance, in December 2021, Bosch started the volume production of Sic-based power semiconductors supplying automotive manufacturers worldwide. To meet the increasing demand for such semiconductors, an extra 10,764 square feet were already added to the clean-room space at the Bosch wafer fab in Reutlingen in 2021. Another 32,292 square feet will be added by the end of 2023. Such an increase in the production of semiconductors will drive the studied market.
• The advancements in the regional automotive industry are expected to create significant opportunities for market growth. For instance, Dubai recently launched a campaign to have 42,000 EVs on the streets of Emirates by 2030. The sputtering equipment is used in the coating of Drive train bearings and components as the increase in the developments of EV vehicles will significantly drive the studied market.
• Sputtered thin films are increasingly being used in biomedical applications. An example is a cylindrical magnetron sputtering to deposit protective coatings on batches of medical stents. Nano-films are widely employed in electronics, textiles, pharmaceuticals, ceramics, and various other applications. Fabrics coated with Nanofilm are often created by chemical vapor deposition, sol-gel technique, and magnetron sputtering. The magnetron sputtering method, for example, offers the benefits of controlled film thickness, high purity, high speed and low temperature, excellent adhesion, ease of operation, and environmental friendliness, among others.

Asia Pacific Holds the Major Share of the Market

• Asia-Pacific has the world's fastest-growing semiconductor market. Many vendors are setting up production facilities in the region in response to strong demand for smartphones and other consumer electronics gadgets from nations including China, the Republic of Korea, and Singapore.
• The companies are expanding their presence in the region by starting new projects to cater to the wide need of the customer. For instance, in September 2021, UTAC Holding, Ltd. added state-of-the-art plasma dicing and multi-project wafer (MPW) capabilities to a range of advanced semiconductor manufacturing solutions. Plasma dicing narrows the scribe line width between chips and increases the number of chips per wafer. Also, it provides "nearly perfect" cutting quality with no chips or cracks, which is a clear advantage over traditional mechanical sawing processes that lead to chronic sidewall quality issues.
• Further public agencies and private companies are investing in new products and research & development facilities. For instance, In September 2021, China's largest contract chipmaker Semiconductor Manufacturing International Corp (SMIC) announced the company's agreement with the Lin-Gang Special area-part of Shanghai's free trade zone. This agreement enables SMIC to establish a new foundry with a monthly planned capacity of 100,000 12-inch wafers. Also, in March 2021, the company announced an investment of USD 2.35 billion in coordination with the Shenzhen government for a manufacturing facility to produce 28nanometre (nm) and above integrated circuits with a monthly capacity of 40,000 12-inch wafers.
• Similarly, in October 2021, the Government of New South Wales is aware that the global semiconductor industry lacks Australia's major players and plans a new center to improve the feasibility of critical jobs in this sector. The hub, the Semiconductor Sector Service Bureau (S3B), will be based in Sydney's Tech Central and be funded by the state government. Further, Chief Scientist and Engineer Office, after researching the national semiconductor scene, mentioned there are currently no major Australian companies with semiconductor design or semiconductor development as their core business. The new hub leverages the country's wafer processing and dicing equipment market.
• The demand for stealth dicing equipment is growing as TSV (Through Silicon Via) technology becomes more prevalent for low-power, high-performance devices such as mobile phones and other wireless and networking devices. As TSV can package 2.5/3D for the applications listed above, the equipment is useful for TSV Assembly/Packaging (chip-to-chip and chip-to-wafer assembly with stealth dicing and other processes). In Memory and Logic, a combination of laser dicing and blade dicing is used.

Wafer Processing & Assembly Equipment Market Competitor Analysis

The Global Wafer Processing and Assembly Equipment market is moderately consolidated. Players tend to invest in innovating their product offerings to cater to the different industry's changing demands. Moreover, players adopt strategic activities like partnerships, mergers, and acquisitions to expand their presence. Some of the recent developments in the market are:

• March 2022 - SK siltron announced the beginning of the operation of the Silicon carbide (SiC) semiconductor wafer manufacturing plant in Bay City, Michigan, US. The company has a plan to produce around 60,000 annually. Also, a 6-inch SiC wafer is the main product of the company.
• September 2021 - Infineon Technologies AG launched its high-tech chip factory for power semiconductor devices on 300-millimeter thin wafers at its Villach site in Austria. At EUR 1.6 billion, the investment made by the company represents one of the largest such projects in the microelectronics sector in Europe. According to the company, the annual capacity planned for industrial semiconductors from the facility is sufficient to equip solar systems producing a total of around 1,500 TWh of electricity, which is around three times the annual power consumption of Germany.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumption And Market Defination
• 1.2 Scope of the study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

• 4.1 Market Overview
• 4.2 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.2.1 Bargaining Power Of Suppliers
  • 4.2.2 Bargaining Power Of Buyers
  • 4.2.3 Threat Of New Entrants
  • 4.2.4 Threat Of Substitutes
  • 4.2.5 Intensity Of Competitive Rivalry
• 4.3 Assessment of the Impact of Covid-19 on the Market

5 MARKET DYNAMICS

• 5.1 Market Drivers
  • 5.1.1 Increasing Needs of Consumer

Electronic Devices Boosting the

Manufacturing Prospects

• 5.1.2 Proliferation of Artificial

Intelligence, IoT and Connected

Devices across Industry Verticals

• 5.2 Market Challenges
  • 5.2.1 Dynamic Nature of Technologies

Requires Several Changes in

Manufacturing Equipment

6 MARKET SEGMENTATION

• 6.1 By Equipment Type
  • 6.1.1 Chemical Mechanical Polishing

(CMP)

• 6.1.2 Etching
• 6.1.3 Thin Film Deposition
  • 6.1.3.1 CVD
  • 6.1.3.2 Sputter
  • 6.1.3.3 Other Type
• 6.1.4 Photoresist Processing
• 6.1.5 Assembly Equipment
  • 6.1.5.1 Die Attach
  • 6.1.5.2 Wire Bonding
  • 6.1.5.3 Packaging
  • 6.1.5.4 Inspection, Dicing,

Plating and Others

• 6.2 By Geography
  • 6.2.1 Asia-Pacific
  • 6.2.2 North America
  • 6.2.3 Rest of the World
• 6.3 By Product - Wafer Processing Equipment
  • 6.3.1 DRAM
  • 6.3.2 NAND
  • 6.3.3 Foundry/Logic
  • 6.3.4 Other Products

7 VENDOR RANKING ANALYSIS

8 COMPETITIVE LANDSCAPE

• 8.1 Company Profiles
  • 8.1.1 Applied Materials Inc
  • 8.1.2 ASML Holding Semiconductor Company
  • 8.1.3 Tokyo Electron Limited
  • 8.1.4 Lam Research Corporation
  • 8.1.5 KLA Corporation
  • 8.1.6 Hitachi High-Technologies Corporation
  • 8.1.7 Disco Corporation
  • 8.1.8 ASM Pacific Technology
  • 8.1.9 Kulicke and Soffa Industries, Inc
  • 8.1.10 BE Semiconductor Industries N.V
  • 8.1.11 Towa Corporation

9 INVESTMENT ANALYSIS

10 FUTURE OF THE MARKET