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1438380

磷化銦晶圓：市場佔有率分析、產業趨勢與統計、成長預測（2024-2029）

Indium Phosphide Wafer - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 115 Pages | 商品交期: 2-3個工作天內

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簡介目錄

磷化銦晶圓市場規模預計到2024年為1.7703億美元，預計到2029年將達到3.1115億美元，在預測期內（2024-2029年）市場規模將增至1194萬美元，年複合成長率為%。

磷化銦晶圓 - 市場

磷化銦 (InP) 具有可產生高效雷射、調變和高靈敏度檢測器的特性。它還可以產生雷射訊號並將這些訊號轉換為電子形式以進行識別。這些產品用於企業網路、資料中心、遠距光纖連接、3G、5G 和 LTE基地台無線連接以及衛星通訊。這些不斷成長的需求正在推動市場的發展。

主要亮點

  • 磷化銦晶圓擴大被用於製造應用，例如汽車雷射雷達、3D 感測、消費性穿戴設備以及通訊領域資料通訊的成長。預計這將在預測期內推動市場。此外，InPin的主要應用包括5G通訊、使用光和雷射的資料中心連接、光纖雷射和檢測器、矽光電、射頻放大器、軍事和5G通訊中使用的開關以及醫療領域中的紅外線。這包括熱成像等。
  • 稱為光電裝置的電子元件可偵測和調節光。將電訊息轉換為紅外線或可見能量，反之亦然。應用於太陽能發電、光纖通訊系統、監控控制電路、電眼等。光電元件用於量子級聯雷射和用於受激發射的注入雷射二極體。 LED 和影像感測器用於數位成像系統、包裝和安全應用。
  • 根據2020年11月發布的愛立信移動報告，預計到年終，全球行動資料流量將達到每月約51 EB（Exabyte）。預計這一數字將增加近 4.5 倍，達到每月 226 EB。這一數字代表了超過 60 億同時使用智慧型手機、筆記型電腦和大量新設備的人消耗的行動資料。
  • 半導體矽晶圓是電子工業的基礎，也是許多微電子裝置的關鍵零件。由於當前的技術形勢、電子移動性和數位化的進步，這些產品現已廣泛用於各種設備中。對更小型設備的需求也大大增加了對單一設備附加功能的需求，從而推高了矽晶圓的價格。
  • 由於全球大多數地區仍處於封鎖狀態，冠狀病毒感染疾病(COVID-19) 大流行已導致半導體製造設備行業的多種產品停止​​生產。封鎖措施減少了消費性電子產品的需求，影響了全球半導體產業。全球汽車需求和出貨貨量的持續下降對半導體市場產生了負面影響，目前對半導體製造設備的需求低迷。

磷化銦晶圓市場趨勢

消費性電器產品產業可望帶動市場

  • 穿戴式科技是一種發展趨勢，它將電子產品整合到日常活動中，並透過能夠佩戴在身體的任何部位來適應不斷變化的生活方式。連接網際網路的能力以及在網路和設備之間提供資料交換選項等因素正在引領穿戴式技術的趨勢。
  • 據思科系統公司稱，全球連網穿戴裝置數量三年內加倍，從 2016 年的 3.25 億增加到 2019 年的 7.22 億。預計到 2022 年，設備數量將超過 10 億台。
  • 此外，根據日本內務部，截至 2021 年，超過 7% 的日本家庭擁有穿戴式裝置。在整個研究期間（2014-2021年），穿戴式裝置的家庭普及穩定成長，從2014年的0.5%上升到2020年的5%。
  • 全球都市化不斷上升，推動了對先進且具有視覺吸引力的產品的需求，這些產品的功能可以更好地滿足消費者的需求，例如在一台設備上實現多種功能和時間表，並且這種需求正在增加。此外，世界各地大量的千禧世代正在迅速採用智慧型手錶，因為他們追蹤正常工作時間和奢侈消費標準的能力不斷增強。
  • 例如，愛立信的數據顯示，全球智慧型手機用戶數從 2020 年的 59.24 億躍升至 2021 年的 62.59 億。到 2027 年，這一數字預計將達到 76.9 億。
  • 此外，根據諾基亞 2022 年年度行動寬頻指數報告，4G 設備生態系統的成長正在推動 4G用戶和資料消費量的成長。 2021年，印度智慧型手機出貨創下歷史新高，超過1.6億部，其中5G設備3000萬部，活躍4G設備比例超過80%，數量已超過1000萬部。諾基亞的報告也預測，到 2025 年，智慧型手機用戶的採用率將增加至 60-75%。

亞太地區預計將成為成長最快的市場

  • 亞太地區佔據全球半導體代晶圓代工廠佔有率，台積電、三星電子等大公司集中於此。台灣、韓國、日本和中國大陸佔據了該地區的主要市場佔有率。根據美國工業協會（SIA）的數據，從1990年到2020年，美國在全球晶圓廠裝置容量中所佔的佔有率持續下降。同期，亞洲新晶圓廠的開發迅速增加，目前正處於不斷增加的速度。它佔世界產能的很大佔有率。
  • 中國有一個非常雄心勃勃的半導體計劃。在1500億美元資金的支持下，該國正在發展國內積體電路產業，並計劃製造更多晶片。大中華區，包括香港、中國和台灣，是一個地緣政治熱點。中美貿易戰正在加劇這個位置所有主要製程技術的地區的緊張局勢，迫使許多中國公司投資半導體晶圓代工廠。
  • 中國於 2021 年 3 月公佈的新的 2021-2025 年五年計畫將加強基礎研究確定為首要任務。 2021年中央基礎研究經費預估成長11%，遠高於計畫中R&D整體投入7%及GDP成長6%的目標。半導體已被指定為獲得優先資金和資源的七個領域之一。設計公司開發奈米級積體電路，執行電子設備運作的關鍵任務，例如運算、儲存、網路連接和電源管理。由於晶片需求強勁，預計 2021 年利潤將增加一倍以上。中國主要半導體晶圓代工廠已撥出創紀錄的金額用於2022年的產能開發。中芯國際 (SMIC) 今年預留了 50 億美元的資本支出，高於 2021 年的 45 億美元。
  • 中國在 7 奈米晶片生產方面離自力更生越來越近了。據報道，中國在 7 奈米晶片製造製程方面取得了突破性進展，並正在為製造製程的多個環節開發工具和專有技術，以減少對外國設備和材料供應商的依賴。
  • 研究和合作夥伴關係的顯著成長進一步提高了市場成長率。例如，LioniX International (LXI) 和中國科學院微電子研究所 (IMECAS) 正在透過積極支援能力和提供兩個平台來擴大其光子積體電路 (PIC) 平台合作夥伴關係。 PIC形勢的重要平台包括絕緣體上矽 (SOI)、磷化銦 (InP) 和基於氮化矽的 TriPleX 平台。這些平台可透過多計劃晶圓 (MPW) 存取取得。

磷化銦晶圓產業概況

磷化銦晶圓製造領域領先製造商的不斷增加預計將加劇預測期內競爭公司之間的敵對狀態。 JX Nippon Mining 和 Powerway Advanced Materials 等市場老牌企業對整個市場有重大影響。

  • 2022 年 3 月：英特爾公佈了在德國新建第二個「巨型晶圓廠」晶片製造地的計劃，預計在多個歐洲國家投資 880 億美元。此外，2021 年 8 月，ACM Research Inc. 推出了斜角蝕刻產品。該工具進一步擴展了 ACM 的綜合濕式工具產品，最大限度地減少了邊緣污染對後續製程步驟的影響，並提高了晶片製造產量比率。
  • 2022 年 2 月：加拿大政府宣布對加拿大半導體和光電產業進行重大投資。 2.4 億加元的投資將加強加拿大作為光電領域世界領導者的地位，並加強半導體開發和製造。超過100家國內外半導體公司在加拿大從事微晶片研發。擁有30多個應用研究實驗室和5個商業設施，涵蓋化合物半導體、電子機械系統（MEMS）和先進封裝等領域。

其他福利

  • Excel 格式的市場預測 (ME) 表
  • 3 個月分析師支持

目錄

第1章簡介

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章市場洞察

  • 市場概況
  • 產業吸引力－波特五力分析
    • 供應商的議價能力
    • 買方議價能力
    • 新進入者的威脅
    • 替代產品的威脅
    • 競爭公司之間的敵意強度
  • 產業價值鏈分析
  • 技術簡介
  • 評估 COVID-19 對產業的影響

第5章市場動態

  • 市場促進因素
    • 光電裝置的使用增加
    • 資料通訊業務及5G成長
  • 市場限制因素
    • 與其他替代方案的競爭

第6章市場區隔

  • 依直徑
    • 50.8 毫米或 2 英寸
    • 76.2 毫米或 3 英寸
    • 100 毫米或 4 吋或以上
  • 按最終用戶行業應用
    • 家用電器
    • 電訊
    • 醫療保健
    • 其他最終用戶行業應用
  • 按地區
    • 北美洲
    • 歐洲
    • 亞太地區
    • 世界其他地區

第7章 競爭形勢

  • 公司簡介
    • AXT Inc.
    • Wafer World Inc.
    • Logitech Ltd.
    • Western Minmetals（SC）Corporation
    • Century Goldray Semiconductor Co. Ltd
    • Semiconductor Wafer Inc.
    • Ding Ten Industrial Inc.
    • Sumitomo Electric Semiconductor Materials Inc.（Sumitomo Electric Industries Ltd）
    • Xiamen Powerway Advanced Material Co. Ltd
    • JX Nippon Mining &Metals Corporation（Eneos Holdings Inc.）

第8章投資分析

第9章市場機會與未來趨勢

簡介目錄
Product Code: 66420

The Indium Phosphide Wafer Market size is estimated at USD 177.03 million in 2024, and is expected to reach USD 311.15 million by 2029, growing at a CAGR of 11.94% during the forecast period (2024-2029).

Indium Phosphide Wafer - Market

Indium phosphide (InP) has properties that produce highly efficient lasers, modulators, and sensitive photodetectors. It can also generate laser signals and convert and identify those signals back to the electronic form. These are used for company networks and data centers, long-haul optical fiber connections over far distances, wireless connections for 3G, 5G, and LTE base stations, and satellite communication. The growth in such requirements is driving the market.

Key Highlights

  • Indium phosphide wafers are increasingly adopted in the manufacture of LiDAR for automotive, 3D sensing, consumer wearables, and the growth in datacom in the telecommunication sector. This is expected to drive the market during the forecast period. In addition, some of the major applications of InPinclude 5G communications, data center connectivity that uses lights and lasers, fiber optic lasers and detectors, silicon photonics, RF amplifiers, and switches used in military and 5G communications, and infrared thermal imaging in health.
  • Electronic components known as optoelectronic devices detect and regulate light. They convert electrical information into infrared or visible energy and vice versa. It is utilized in photovoltaic power supply, optical fiber communication systems, monitor and control circuits, and electric eyes. Optoelectronic components are used in quantum cascade lasers and injection laser diodes for stimulated emission. LEDs and image sensors are utilized in digital imaging systems, packaging, and safety applications.
  • According to the Ericsson Mobility Report published in November 2020, the global mobile data traffic was estimated to reach around 51 EB (exabytes) per month by the end of 2020. This was projected to grow by a factor of almost 4.5 to reach 226 EB per month in 2026. This figure represents the mobile data that will be consumed by greater than 6 billion people using smartphones, laptops, and a multitude of new devices at a time.
  • The semiconductor silicon wafer serves as the foundation of the electronics industry and is the main component of many microelectronic devices. With the current advances in the technology landscape, electronic mobility, and digitalization, these items are finding use in a wide range of devices. The requirement for additional capability from a single device has also grown dramatically as a result of the need for small-sized gadgets, which boosts the price of the silicon wafer.
  • The COVID-19 pandemic has halted the manufacturing of several items in the semiconductor production equipment industry owing to the continued lockdown in most regions across the world. Lockdown measures reduced the demand for consumer electronic gadgets, which had a global impact on the semiconductor sector. The continued decline in worldwide demand and export shipments for automobiles caused a negative impact on the semiconductor market, which is currently slowing down the demand for semiconductor manufacturing equipment.

Indium Phosphide Wafer Market Trends

Consumer Electronics Segment Expected to Drive the Market

  • Wearable technology, a developing trend, integrates electronics into daily activities and addresses the changing lifestyles with the ability to be worn on any part of the body. Factors such as the ability to connect to the internet and provide data exchange options between a network and a device are leading to the trend of wearable technology.
  • According to Cisco Systems, the number of connected wearable devices globally has doubled in the span of three years, increasing from 325 million in 2016 to 722 million in 2019. The number of devices is forecasted to be over 1 billion by 2022.
  • Further, according to the Ministry of Internal Affairs and Communications (Japan), as of 2021, over 7% of households in Japan owned a wearable device. The household penetration rate of wearable devices steadily increased throughout the surveyed period (2014-2021), rising from 0.5% in 2014 to 5% in 2020.
  • The rising rates of urbanization in various parts of the world have driven the demand for advanced, aesthetically appealing products that possess the ability to serve the consumers' requirements better, such as multiple features in one device and time schedules. Moreover, the vast millennial population across the globe has been quick to adopt smartwatches, owing to the increased spending ability on their regular work hours tracking and luxury standards.
  • For instance, according to Ericsson, the number of smartphone subscriptions worldwide witnessed an upsurge from 5,924 million in 2020 to 6,259 million in 2021. The number is estimated to reach 7,690 million in 2027.
  • Further, according to the Nokia annual mobile broadband index report 2022, the growing ecosystem of 4G-capable devices is driving the growth in 4G subscribers and data consumption. India recorded the highest-ever shipment of over 160 million smartphones, including 30 million 5G devices, in 2021, with active 4G capable devices crossing 80% and the number of active 5G capable devices crossing 10 million. The Nokia report also forecasted that user adoption will increase to 60-75% of the smartphone user base by 2025.

Asia-Pacific Expected to be the Fastest-growing Market

  • The Asia-Pacific region commands a prominent share of semiconductor foundries globally, with major companies such as TSMC and Samsung Electronics. Taiwan, South Korea, Japan, and China have a significant market share in the region. According to the US Semiconductor Industry Association (SIA), the US share of the global installed wafer fab capacity constantly declined from 1990 to 2020. During the same period, Asia saw a meteoric rise in developing new fabs to the point where it now accounts for a significant share of the world's capacity.
  • China has a very ambitious semiconductor agenda. Backed by USD 150 billion in funding, the country is developing its domestic IC industry and plans to make more of its chips. Greater China, which encompasses Hong Kong, China, and Taiwan, is a geopolitical hotspot. The US-China trade war is compounding tensions in an area where all the leading process technology is located, forcing many Chinese companies to invest in their semiconductor foundries.
  • China's new five-year plan for 2021-2025, announced in March 2021, established that boosting basic research was a critical priority. The central government's spending on basic research was expected to increase by 11% in 2021, well above the 7% planned for the overall R&D investment and the 6% target for GDP growth. Semiconductors were designated as one of the seven areas that will be given priority in terms of funding and resources. Firms involved in design develop nanometer-scale integrated circuits that perform the critical tasks that make electronic devices work, such as computing, storage, network connectivity, and power management. The profit was estimated to more than double in 2021 because of the robust chip demand. China's leading semiconductor foundry set aside a record sum for capacity development in 2022. This year, Semiconductor Manufacturing International Corp (SMIC) set aside USD 5 billion for capital spending, up from USD 4.5 billion in 2021.
  • China is moving significantly closer to self-reliance in 7 nm chip production. China has made breakthroughs in its 7 nm chip-making process, reportedly developing tools and know-hows for several segments of the manufacturing process amid efforts to reduce reliance on foreign equipment and material vendors.
  • The significant research and partnership growth further bolsters the market growth rate. For instance, LioniXInternational (LXI) and the Institute of Microelectronics Chinese Academy of Science (IMECAS) agreed to expand their Photonic Integrated Circuit (PIC) platform partnership by actively supporting the functionality and offering both platforms. The critical platforms in the PIC landscape include Silicon On Insulator (SOI), Indium Phosphide (InP), and the silicon nitride-based TriPleXplatform. These platforms are available through Multi-Project Wafer (MPW) access.

Indium Phosphide Wafer Industry Overview

The growing presence of large manufacturers in the indium phosphide wafer manufacturing sector is expected to intensify competitive rivalry during the forecast period. Market incumbents, such as JX Nippon Mining & Metals Corporation and Powerway Advanced Material Co. Ltd, considerably influence the overall market.

  • March 2022: Intel revealed plans for a second new 'Megafab," a chipmaking site in Germany, with an expected USD 88 billion in investments across several European countries. Further, in August 2021, ACM Research Inc. launched its Bevel Etch product, which further expanded ACM's comprehensive offering of wet tools. This tool minimizes the impact of edge contamination for subsequent process steps and improves chip manufacturing yield.
  • February 2022: The Government of Canada announced a significant investment in the Canadian semiconductor and photonics industries. The investment of CAD 240 million will help solidify Canada's role as a global leader in photonics and will bolster the development and manufacturing of semiconductors. Over 100 domestic and international semiconductor companies work on microchip research and development in Canada. There are over 30 applied research laboratories and five commercial facilities for areas including compound semiconductors, microelectromechanical systems (MEMS), and advanced packaging.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers/Consumers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis
  • 4.4 Technology Snapshot
  • 4.5 Assessment of the Impact of COVID-19 on the Industry

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increasing Use of Optoelectronic Devices
    • 5.1.2 Growth of Datacom Business and 5G
  • 5.2 Market Restraints
    • 5.2.1 Competition from Other Substitutes

6 MARKET SEGMENTATION

  • 6.1 By Diameter
    • 6.1.1 50.8 mm or 2 "
    • 6.1.2 76.2 mm or 3 "
    • 6.1.3 100 mm or 4" and Above
  • 6.2 By End-user Industry Application
    • 6.2.1 Consumer Electronics
    • 6.2.2 Telecommunications
    • 6.2.3 Medical
    • 6.2.4 Other End-user Industry Applications
  • 6.3 By Geography
    • 6.3.1 North America
    • 6.3.2 Europe
    • 6.3.3 Asia-Pacific
    • 6.3.4 Rest of the world

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 AXT Inc.
    • 7.1.2 Wafer World Inc.
    • 7.1.3 Logitech Ltd.
    • 7.1.4 Western Minmetals (SC) Corporation
    • 7.1.5 Century Goldray Semiconductor Co. Ltd
    • 7.1.6 Semiconductor Wafer Inc.
    • 7.1.7 Ding Ten Industrial Inc.
    • 7.1.8 Sumitomo Electric Semiconductor Materials Inc. (Sumitomo Electric Industries Ltd)
    • 7.1.9 Xiamen Powerway Advanced Material Co. Ltd
    • 7.1.10 JX Nippon Mining & Metals Corporation (Eneos Holdings Inc.)

8 INVESTMENT ANALYSIS

9 MARKET OPPORTUNITIES AND FUTURE TRENDS