查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
封面
市場調查報告書
商品編碼
1549798

CPO（共封裝光學）的全球市場：市場佔有率分析、產業趨勢/統計、成長預測（2024-2029）

Co-packaged Optics - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

價格

※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

簡介目錄

預計2024年全球CPO（共封裝光學）市場規模為7,020萬美元，2029年達4.8377億美元，在預測期間（2024-2029年）複合年成長率為47.12。

聯合封裝光學市場

主要亮點

  • 由於高速資料傳輸需求的加速以及資料中心和雲端服務的快速成長，CPO（共封裝光學）市場正在迅速擴大。透過將光學和電子元件整合到一個封裝中，CPO 縮短了電訊號的傳播距離，從而最大限度地減少了延遲和功耗。這使您能夠解決傳統銅互連的頻寬限制，並滿足下一代資料中心架構日益成長的要求。
  • 此外，資料中心網路不斷向 400G、800G 及更高標準轉變也是推動 CPO（共封裝光學）市場的關鍵因素。這些高速標準需要 CPO 能夠提供的創新，例如改進的訊號完整性和能源效率。資料中心需要更快、更有效率的資料處理和傳輸能力，而CPO技術可以支援這些資料中心的擴展需求。
  • CPO（共封裝光學）市場受益於光電和半導體製造業領導者之間的合作。英特爾、思科和博通等公司正大力投資 CPO 研發。這種合作對於推進技術、降低成本和確保不同平台之間的互通性至關重要。
  • CPO 的採用得到了行業標準和法律規範的製定的支持，這些標準和監管框架確保了這些解決方案的兼容性和可靠性。電氣和電子工程師協會 (IEEE) 和光網際網路論壇 (OIF) 等標準機構正在努力製定指導方針，以促進 CPO 技術的廣泛部署。

CPO（共封裝光學）市場趨勢

高效能運算的成長

  • 由於對資料中心、複雜模擬、大規模資料處理和先進科學研究的需求不斷成長，高效能運算（HPC）正在快速成長。這種成長在很大程度上推動了協同封裝運算 (CPC) 的趨勢和發展，它將處理器、記憶體和其他關鍵元件整合到一個封裝中。 HPC 應用通常需要大規模資料處理能力，而各個晶片之間的傳統互連可能成為瓶頸。 CPC 透過緊密整合組件、減少延遲和提高資料吞吐量來解決這個問題，這對於 HPC 工作負載至關重要。
  • 透過將計算元素打包在一起，CPC 提高了效能和效率。這種整合縮短了資料傳輸的距離，降低了能耗並提高了整體效能。這對於高功率運作且需要最佳能源利用的 HPC 系統至關重要。 CPC 透過提供更有效率的熱感解決方案來幫助管理這個問題。由於組件封裝緊密，因此可以專門針對 HPC 環境量身訂做更好的散熱策略。
  • 可擴展性是 HPC 系統的另一個重要因素，需要能夠處理不斷增加的計算負載。 CPC 提供了一種模組化方法，可讓您增加處理能力，而無需傳統多晶片設定的複雜性。這種模組化支援 HPC 基礎設施的可擴充性。此外，在 HPC 需求的推動下，半導體製造的進步使 CPC 更加實用且更具成本效益。為了滿足 HPC 嚴格的性能和整合要求，3D 堆疊和高級互連等技術正在開發中，進一步推動了 CPC 的採用。
  • 減少處理器和記憶體之間的通訊開銷對於保持 HPC 的高效能至關重要。 CPC 透過將這些元件整合到一個套件中，顯著減少了這種開銷，從而實現更快、更有效率的資料交換。儘管最初價格昂貴，但 HPC 需求帶來的規模經濟正在降低與 CPC 技術相關的成本。隨著 HPC 的發展，容量的增加和持續的進步有助於降低成本，並使 CPC 更容易獲得和流行。

亞太地區預計將佔據主要市場佔有率

  • 由於資料中心、通訊和高效能運算領域的快速發展，亞太地區 CPO（共封裝光學）市場正在顯著成長。
  • 中國、日本和韓國等國家處於領先地位，大力投資下一代網路基礎設施，以支持資料流量的指數成長以及對更快、更有效率的資料傳輸解決方案的需求。例如，2023年11月，中國三大通訊業者公佈的5G套餐用戶總合增加約2,600萬戶。至此，5G套餐用戶總數達到約13.48億戶。截至11月底，5G套餐用戶佔中國通訊和中國電信行動用戶總數的比例分別為78.6%和77.3%。
  • 該地區強大的製造基礎，加上支持性的政府政策和大量的研發投資，正在推動原棕油技術的創新。此外，亞太地區是主要高科技公司和半導體製造商的所在地，加速了這些先進光學解決方案的採用和開發。
  • 5G 網路部署的增加、雲端服務的擴展以及人工智慧和物聯網應用的持續發展將進一步推動這一市場成長，使亞太地區成為全球共封裝光學 (CPO) 領域的關鍵參與者。愛立信預計，到2028年終，東南亞和大洋洲的5G用戶數將達到約6.2億。

CPO（共封裝光學）產業概覽

全球 CPO（共封裝光學）市場高度分散，有許多重要公司。從市場佔有率來看，目前大公司佔據市場主導地位。憑藉顯著的市場佔有率，這些領先公司專注於擴大全球客戶群。這些公司利用策略合作舉措來提高市場佔有率和盈利。

  • 2024 年 3 月：在 2024 年光纖通訊大會（OFC）上，AI/ML 基礎設施先進光電互連解決方案領先開發商 Lanovas 宣布與聯發科合作推出聯發科下一代 ASIC 設計平台，宣布將提供 6.4。 （共封裝光學）解決方案該解決方案旨在支援 AI/ML SoC 和乙太網路應用的 6.4Tbps 高基數光連接模組。
  • 2023 年 3 月：思科宣布其共封裝光學 (CPO) 願景，不僅展示了其可行性，還展示了其克服實施挑戰的必要性和策略。

其他好處：

  • Excel 格式的市場預測 (ME) 表
  • 3 個月分析師支持

目錄

第1章簡介

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章市場洞察

  • 市場概況
  • 產業價值鏈分析
  • 產業吸引力－波特五力分析
    • 新進入者的威脅
    • 買方議價能力
    • 供應商的議價能力
    • 替代品的威脅
    • 競爭公司之間敵對關係的強度
  • 評估 COVID-19 對產業的影響
  • 延遲敏感流量對 CPO 需求的影響
    • 資料中心中的人工智慧和機器學習
    • 對 5G、CPO 和資料中心的影響
    • 視訊會議和線上活動

第5章市場動態

  • 市場促進因素
    • 智慧型設備的普及和資料流量的增加
    • 超級資料中心的重要性日益成長
    • 高效能運算的成長
  • 市場限制因素
    • 網路複雜度
    • 設備相容性和永續性問題

第6章 市場細分

  • 按資料速率
    • 1.6T以下
    • 1.6T
    • 3.2T
    • 6.4T
  • 按地區
    • 北美洲
    • 歐洲
    • 亞洲
    • 澳洲/紐西蘭
    • 拉丁美洲
    • 中東/非洲

第7章 競爭格局

  • 公司簡介
    • Ayar Labs Inc.
    • Broadcom Inc.
    • Cisco Systems Inc.
    • IBM Corporation
    • Intel Corporation
    • Microsoft Corporation
    • TE Connectivity
    • Furukawa Electric Co. Ltd
    • Hisense Broadband Multimedia Technology Co. Ltd
    • POET Technologies
    • Kyocera Corporation
    • Huawei Technologies Co. Ltd
    • SENKO Advanced Components Inc.
    • Sumitomo Electric Industries Ltd

第8章投資分析

第9章 市場未來展望

簡介目錄
Product Code: 5000073

The Co-packaged Optics Market size is estimated at USD 70.20 million in 2024, and is expected to reach USD 483.77 million by 2029, growing at a CAGR of 47.12% during the forecast period (2024-2029).

Co-packaged Optics - Market

Key Highlights

  • The co-packaged optics (CPO) market is growing rapidly due to the accelerating demand for high-speed data transmission and the exponential growth of data centers and cloud services. Co-packaged optics integrate optical and electronic components into a single package, reducing the distance that electrical signals need to travel and minimizing latency and power consumption. This addresses the bandwidth limitations of traditional copper interconnects and meets the growing requirements of next-generation data center architectures.
  • Moreover, the ongoing shift toward 400 G, 800 G, and beyond in data center networking is a key factor propelling the co-packaged optics market. These higher-speed standards require innovations that CPOs can deliver, such as improved signal integrity and energy efficiency. Data centers require faster, more efficient data processing and transmission capabilities, and CPO technology can support the scaling needs of these data centers.
  • The co-packaged optics market is benefiting from collaborations between industry leaders in photonics and semiconductor manufacturing. Companies such as Intel, Cisco, and Broadcom are investing heavily in CPO research and development. These collaborations are essential for advancing the technology, reducing costs, and ensuring interoperability across different platforms.
  • The adoption of co-packaged optics is supported by the development of industry standards and regulatory frameworks that ensure the compatibility and reliability of these solutions. Standards associations, including the Institute of Electrical and Electronics Engineers (IEEE) and the Optical Internetworking Forum (OIF), are working to establish guidelines that facilitate the broader deployment of CPO technology.

Co-packaged Optics Market Trends

Growth in High-performance Computing

  • High-performance computing (HPC) is rapidly growing due to increasing demands for data centers, complex simulations, large-scale data processing, and advanced scientific research. This growth significantly drives the trend and development in co-packaged computing (CPC), where processors, memory, or other critical components are integrated into a single package. HPC applications often require massive data processing capabilities, and traditional interconnects between separate chips can become bottlenecks. CPC addresses this by integrating components closely, reducing latency, and increasing data throughput, which is essential for HPC workloads.
  • By packaging computing elements together, CPC enhances performance and efficiency. This integration reduces the distance data needs to travel, cutting energy consumption and improving overall performance, which is crucial for HPC systems that operate at high power and require optimal energy utilization. High-performance computations generate significant heat, and CPC helps manage this by allowing for more efficient thermal solutions. Since components are packaged in proximity, better heat dissipation strategies can be tailored specifically for HPC environments.
  • Scalability is another critical factor for HPC systems, which demand the ability to handle increasing computational loads. CPC offers a modular approach where additional processing power can be added without the complexities associated with traditional multi-chip setups. This modularity supports the scalable nature of HPC infrastructures. Moreover, advances in semiconductor fabrication, driven by the needs of HPC, are making CPC more viable and cost-effective. Techniques like 3D stacking and advanced interconnects are being developed to meet the stringent performance and integration requirements of HPC, further propelling the adoption of CPC.
  • Reducing communication overhead between processors and memory is crucial for maintaining high performance in HPC. CPC significantly reduces this overhead by integrating these components within a single package, enabling faster and more efficient data exchanges. While initially expensive, the economies of scale driven by HPC demand are reducing the costs associated with CPC technologies. As HPC grows, the larger volumes and continuous advancements help reduce costs, making CPC more accessible and widespread.

Asia-Pacific is Expected to Hold Significant Market Share

  • The co-packaged optics market in Asia-Pacific is experiencing significant growth, driven by rapid advancements in data centers, telecommunications, and high-performance computing sectors.
  • Countries like China, Japan, and South Korea are at the forefront, investing heavily in next-generation network infrastructure to support the exponential increase in data traffic and the demand for faster, more efficient data transmission solutions. For instance, in November 2023, China's three main telecom operators reported a combined net increase of around 26 million 5G package subscribers. This brought their total 5G package subscriber base to nearly 1.348 billion. By the end of November, 5G package subscribers made up 78.6% and 77.3% of China Mobile's and China Telecom's total mobile subscriber bases, respectively.
  • The region's strong manufacturing base, coupled with supportive government policies and substantial R&D investments, is fostering innovation in co-packaged optics technology. Additionally, the presence of major tech companies and semiconductor manufacturers in Asia-Pacific is accelerating the adoption and development of these advanced optical solutions.
  • This market's growth is further propelled by the increasing implementation of 5G networks, the expansion of cloud services, and the continuous evolution of AI and IoT applications, positioning Asia-Pacific as a critical player in the global co-packaged optics landscape. According to Ericsson, 5G is projected to reach approximately 620 million subscriptions in Southeast Asia and Oceania by the end of 2028.

Co-packaged Optics Industry Overview

The global co-packaged optics market is highly fragmented due to several significant players. In terms of market share, the major players currently dominate the market. These major players with prominent shares in the market are focusing on expanding their customer base worldwide. These companies leverage strategic collaborative initiatives to increase their market shares and profitability.

  • March 2024: At the 2024 Optical Fiber Communication Conference (OFC), Ranovus, a leading developer of advanced photonics interconnect solutions for AI/ML infrastructure, announced its collaboration with MediaTek to deliver a 6.4 Tbps co-packaged optics solution for MediaTek's next-generation ASIC design platform. This solution is designed to support a 6.4 Tbps high-radix optical interconnect for AI/ML SoC and ethernet applications.
  • March 2023: Cisco presented its vision for co-packaged optics, demonstrating not only their feasibility but also the necessity for them and the strategies to overcome deployment challenges.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumption and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Value Chain Analysis
  • 4.3 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.3.1 Threat of New Entrants
    • 4.3.2 Bargaining Power of Buyers
    • 4.3.3 Bargaining Power of Suppliers
    • 4.3.4 Threat of Substitute Products
    • 4.3.5 Intensity of Competitive Rivalry
  • 4.4 Assessment of Impact of COVID-19 on the Industry
  • 4.5 Impact of Latency-Sensitive Traffic on Demand for CPO
    • 4.5.1 AI and Machine Learning in Data Centers
    • 4.5.2 5G, CPO, and the Impact on Data Centers
    • 4.5.3 Video Conferencing and Online Events

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increase in Adoption of Smart Devices and Rise in Data Traffic
    • 5.1.2 Growth in the Importance of Mega Data Centers
    • 5.1.3 Growth in High-performance Computing
  • 5.2 Market Restraints
    • 5.2.1 Increase in Network Complexity
    • 5.2.2 Device Compatibility and Sustainability Issues

6 MARKET SEGMENTATION

  • 6.1 By Data Rates
    • 6.1.1 Less than 1.6 T
    • 6.1.2 1.6 T
    • 6.1.3 3.2 T
    • 6.1.4 6.4 T
  • 6.2 By Geography
    • 6.2.1 North America
    • 6.2.2 Europe
    • 6.2.3 Asia
    • 6.2.4 Australia and New Zealand
    • 6.2.5 Latin America
    • 6.2.6 Middle East and Africa

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Ayar Labs Inc.
    • 7.1.2 Broadcom Inc.
    • 7.1.3 Cisco Systems Inc.
    • 7.1.4 IBM Corporation
    • 7.1.5 Intel Corporation
    • 7.1.6 Microsoft Corporation
    • 7.1.7 TE Connectivity
    • 7.1.8 Furukawa Electric Co. Ltd
    • 7.1.9 Hisense Broadband Multimedia Technology Co. Ltd
    • 7.1.10 POET Technologies
    • 7.1.11 Kyocera Corporation
    • 7.1.12 Huawei Technologies Co. Ltd
    • 7.1.13 SENKO Advanced Components Inc.
    • 7.1.14 Sumitomo Electric Industries Ltd

8 INVESTMENT ANALYSIS

9 FUTURE OUTLOOK OF THE MARKET