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市場調查報告書
商品編碼
1630276
類基板PCB：市場佔有率分析、產業趨勢、成長預測（2025-2030）Substrate-Like-PCB - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030) |
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簡介目錄
基板PCB 市場預計在預測期內複合年成長率為 12%
主要亮點
- PCB基板用作PCB基板和設備主體的其餘部分之間的介質，不會導致設備斷電或故障。兩個單元之間的聯網電纜用於有效地將訊號傳輸到連接的組件，從而減少連接總數，從而減少總功耗。
- 隨著向 5G 的轉變，智慧型手機OEM擴大採用這種 SLP 技術，這是市場成長的關鍵驅動力。為5G提供SoC的聯發科宣布，2020年出貨量將翻倍，生產全球近40%的智慧型手機SoC。這表明對 5G 設備的需求不斷成長，預計將在預測期內推動基板PCB 的成長。
- 隨著汽車產量和銷售量的增加，它們擴大配備先進的安全功能，其中一些是政府機構強制要求的，這產生了對提供更大便利和舒適的系統的需求。混合動力電動車（HEV）和純電動車的需求不斷成長是預測期內推動市場成長的關鍵因素。
- 也存在阻礙整體市場成長的挑戰。缺乏技術純熟勞工、缺乏標準和通訊協定等因素限制了市場成長。此外，複雜的整合系統和與類 PCB基板相關的高成本設定預計將在預測期內減緩成長。
- 隨著物聯網、5G和智慧汽車等技術趨勢的發展，需要更小的PCB尺寸和更高效能的基板。因此，PCB基板將大規模使用，以支援這些技術趨勢。
- 基板製造一直是全球晶片供應鏈的主要障礙。該行業是一個相對較新的領域，利潤率低導致市場投資不足。此外，疫情對現有商業訂單造成嚴重壓力，全球晶片短缺限制了個人電腦銷售，迫使工廠閒置，並在封鎖條件下增加了電子設備的成本。
基板PCB市場趨勢
汽車產業推動市場成長
- 如今，汽車越來越依賴電子元件。與過去電子電路僅用於前燈開關和雨刷不同，今天的汽車使用了許多電子元件。
- 透過將 PCB 融入特定和新穎的應用中，現代汽車受益於不斷進步的電子電路技術。感測器應用在汽車中已經很普遍，通常需要使用射頻、微波和毫米波等高頻訊號運行的 PCB。事實上，雷達技術以前僅用於軍用車輛，現在已廣泛應用於現代汽車中，幫助駕駛員避免碰撞、監控盲點以及在巡航控制期間適應交通狀況。
- 軟硬複合PCB 現在是物聯網設備設計中實現高耐用性的關鍵候選者。使用各種小基板透過軟佈線連接在一起，而不是單一實心基板。汽車的高振動環境會給傳統剛性 PCB 帶來巨大的壓力。因此，許多汽車電子製造商正在用更耐振動、更小、更輕的軟性PCB取代剛性PCB。
- 汽車的高振動環境給傳統剛性PCB帶來了巨大的壓力。因此，許多車載電子製造商正在用更小、更輕、抗振性更好的軟性PCB取代剛性PCB。
- 汽車生產和銷售的增加，以及先進安全功能的增加（其中一些是政府機構強制要求的），需要提供更大便利性和舒適性的系統。混合動力電動車（HEV）和純電動車的需求不斷成長是預測期內推動市場成長的關鍵因素。
亞太地區可望成為快速成長的市場
- 亞太地區已成為基板PCB的新興市場，成為全球關注的主要投資和業務拓展機會。全球超過一半的行動用戶位於亞太地區，包括中國和印度。此外，該地區正在見證用戶從 3G 到 4G 和 5G 技術的模式轉移。
- 推動亞太地區類基板PCB市場成長的關鍵因素包括智慧型手機普及率的提高、對連接解決方案的需求不斷成長、網路用戶數量的增加、頻寬密集型應用的擴展以及該地區通訊基礎設施的擴展。大多數智慧型手機供應商都是亞太地區的公司，預計亞太地區在預測期內對基板PCB 的需求將會很大。
- 來自韓國、台灣和日本的基板PCB 製造商主導著生產活動。例如，台灣 ZD Tech 和日本 Meiko 等公司正在為越南和中國的多個智慧型手機客戶擴建新的基板PCB 生產線。台灣已成為基板PCB技術發展的領先地區之一。人們認為，中國將透過台灣的技術轉移逐步獲得基板PCB的技術訣竅。
- 截至2021年4月，已有70個國家和城市宣佈到2050年100%零排放或淘汰內燃機。例如，為了實現這一目標，日本政府制定了2050年在日本消除使用內燃機汽車的目標。該國已開始向電動車購買者提供臨時補貼。
- 2021年6月，AT&S宣布選擇馬來西亞作為其在東南亞的首個生產設施，生產高階印刷基板（PCB）和積體電路（IC）基板。
- 從地區情況來看，台灣、日本、中國等亞太國家在全球PCB市場中佔有較大佔有率。根據台灣國家統計局2021年10月發布的數據，2020年PCB產量為5,740萬平方英尺，較2019年成長9.083%。隨著大規模努力和投資繼續配合各自的環境和健康法規，中國和印度預計未來將與台灣競爭。
類基板PCB產業概況
基板PCB市場得到整合，行業主要企業佔據了大部分市場佔有率。主要企業包括景碩科技、Ibiden、華通製造、大德電子、欣興科技、振鼎科技、名光電子、迅達科技和奧特斯。
- 2022 年 5 月—美國TTM Technologies 宣布計劃在馬來西亞檳城開設新的高度自動化印刷電路基板(PCB) 製造工廠。在馬來西亞的擴張是為了回應人們對先進技術、PCB供應鏈彈性和區域多樣性日益成長的擔憂。
其他好處
- Excel 格式的市場預測 (ME) 表
- 3 個月分析師支持
目錄
第1章簡介
- 研究假設和市場定義
- 調查範圍
第2章調查方法
第3章執行摘要
第4章市場洞察
- 市場概況
- 產業吸引力－波特五力分析
- 供應商的議價能力
- 買方議價能力
- 新進入者的威脅
- 替代品的威脅
- 競爭公司之間敵對關係的強度
- 產業價值鏈分析
第5章市場動態
- 市場促進因素
- 家用電子電器和智慧型裝置的需求增加
- 市場限制因素
- 由於採用類基板 PCB，設置成本較高
第6章 市場細分
- 目的
- 家用電子電器
- 車
- 通訊設備
- 其他
- 地區
- 北美洲
- 歐洲
- 亞太地區
- 其他
第7章 競爭格局
- 公司簡介
- Kinsus Interconnect Technology Corp.
- Ibiden Co.Ltd.
- Compeq Manufacturing Co. Ltd.
- Daeduck Electronics Co. Ltd.
- Unimicron Technology Corporation
- Zhen Ding Technology
- TTM Technologies
- Meiko Electronics
- Austria Technologie & Systemtechnik Aktiengesellschaft
（奧特斯）
- Korea Circuit
- LG Innotek Co.Ltd
- Samsung Electro - Mechanics
第8章投資分析
第9章市場的未來
簡介目錄
Product Code: 66813
The Substrate-Like-PCB Market is expected to register a CAGR of 12% during the forecast period.
Key Highlights
- A PCB substrate is used as a medium between the PCB Board and the rest of the device body without the loss of any power or misfiring of the device. Interconnectors between both units are utilized to efficiently transfer signals to connected components, reducing the total number of connections and, consequently, the total power consumption.
- Smartphone OEMs are increasingly using this SLP technology with a shift toward 5G, which is acting as the main driver for the growth of the market. MediaTek, which offers 5G SoCs, announced a doubled shipment in 2020, announcing that they manufactured nearly 40% of global smartphone SoCs. This indicates the growing demand for 5G devices, which is estimated to fuel the growth of substrate-like PCBs during the forecast period.
- Increasing automobile production and sales and the increased incorporation of advanced safety features, some of which are mandated by government bodies, demand convenience and comfort systems. The growing demand for hybrid electric vehicles (HEV) and battery electric vehicles are the major factors that may drive the market growth during the forecast period.
- Certain challenges will hinder the overall market growth. Factors such as a shortage of skilled labor and the absence of standards and protocols limit the market growth. Furthermore, complicated integrated systems and high-cost setups associated with substrate-like PCB are expected to slow growth during the forecast period.
- With the rising trends in technologies such as IoT, 5G, and smart cars, it is required that the size of the PCB would be miniaturized and the substrates become much more powerful. Thus, substrate-like PCB will be used at a massive scale to support these technological trends.
- Substrate manufacturing has been a massive restraint on the global chip supply chain. The sector's relatively newer origins paired with low margins have forced underinvestment in the market. Moreover, the pandemic forced a severe strain on the existing order of operations, enforced a global chip shortage that constricted personal computer sales, enforced idle plants, and raised costs for electronic devices under lockdown conditions.
Substrate Like PCB Market Trends
Automotive Industry to Drive the Market Growth
- Currently, automobiles increasingly rely on electronic components. Unlike in the past, when electronic circuits were solely used for headlight switches and windshield wipers, current automobiles make extensive use of electronics.
- By incorporating PCBs into certain novel applications, the latest autos take the benefit of ever-advancing electronic circuit technology. Sensor applications, which are already popular in autos, frequently require PCBs that work with high-frequency signals, such as RF, microwave, or millimeter-wave frequencies. In fact, radar technology, which was formerly only used in military vehicles, is also widely used in modern automobiles to help drivers avoid collisions, monitor blind spots, and adjust to traffic conditions when on cruise control.
- Currently, rigid-flex PCBs have been witnessing significant traction candidates for achieving high durability in IoT device design. Instead of one solid board, they feature various smaller ones joined with flexible wiring. The high-vibration environment of an automobile can put a conventional rigid PCB under a lot of stress. As a result, many automotive electronics manufacturers are employing flexible PCBs instead of rigid PCBs, which are more vibration resistant while being smaller and lighter.
- The high-vibration environment of an automobile can put a conventional rigid PCB under a lot of stress. As a result, many automotive electronics manufacturers are employing flexible PCBs instead of rigid PCBs, which are more vibration resistant while being smaller and lighter.
- Increasing automobile production and sales and the increased incorporation of advanced safety features, some of which are mandated by government bodies, demand convenience and comfort systems. The growing demand for hybrid electric vehicles (HEV) and battery electric vehicles are the major factors that will drive market growth during the forecast period.
Asia Pacific is Expected to be the Fastest Growing Market
- Asia-Pacific is an emerging market for substrate-like PCBs as it has become a global focal point for significant investments and business expansion opportunities. Globally, more than half of the mobile subscribers are present in Asia-Pacific, such as in China and India. Moreover, there has been a paradigm shift of users from 3G to 4G and 5G technology in this region.
- Key factors that are driving the substrate-like-PCB market growth in the Asia-Pacific region include the increasing adoption of smartphones, rising demand for connectivity solutions, a growing number of internet users, expanding bandwidth-intensive applications, and expansion of telecommunications infrastructure in the region. The majority of the smartphone providers are from the Asia-Pacific region; it is expected that there will be a significant demand for substrate-like-PCB in the Asia-Pacific region during the forecast period.
- Substrate-like-PCB manufacturers from South Korea, Taiwan, and Japan are dominating production activities. For instance, players like Taiwan-headquartered ZD Tech and japan-headquartered Meiko are expanding new substrate-like-PCB production lines in Vietnam and China for more than one smartphone customer. Taiwan has become one of the major places for the development of substrate-like-PCB technology. Certainly, China will gain substrate-like-PCB technical know-how progressively with technology transfer from the major player.
- As of April 2021, 70 subnational and city governments announced 100% zero-emission vehicle targets or the phaseout of internal combustion engine vehicles before 2050. For instance, Japan's government has set a goal of eliminating the use of internal combustion engine vehicles in the country by 2050 to help achieve this goal. The country has begun granting one-time subsidies to buyers of electric vehicles.
- In June 2021, AT&S announced that it chose Malaysia as its first production plant in Southeast Asia for the manufacturing of high-end printed circuit boards (PCB) and integrated circuit (IC) substrates.
- Geographically, Asia-Pacific countries, such as Taiwan, Japan, and China, occupy a significant share of the global PCB landscape. According to Taiwan National Statistics published in October 2021, PCB production in 2020 increased by 57.4 million square feet, or 9.083%, as compared to 2019. China and India are expected to match Taiwan in the future, as massive efforts and investments have been ongoing in parallel with environmental and health-based regulations placed by China and India, respectively.
Substrate Like PCB Industry Overview
The Substrate-Like-PCB Market is consolidated because the majority of the market share is owned by top players in the industry. Some of the key players include Kinsus Interconnect Technology Corp., Ibiden Co.Ltd., Compeq Manufacturing Co. Ltd., Daeduck Electronics Co. Ltd., Unimicron Technology Corporation, Zhen Ding Technology, Meiko Electronics, TTM Technologies, AT&S, among others.
- May 2022 - TTM Technologies Inc (TTM), located in the United States, announced a plan to establish a new, highly automated printed circuit board (PCB) manufacturing factory in Penang, Malaysia, with a proposed capital investment of USD 130 million by 2025. The Malaysian expansion addresses rising concerns about advanced technology, PCB supply chain resilience, and regional diversity.
Additional Benefits:
- The market estimate (ME) sheet in Excel format
- 3 months of analyst support
TABLE OF CONTENTS
1 INTRODUCTION
- 1.1 Study Assumptions and Market Definition
- 1.2 Scope of the Study
2 RESEARCH METHODOLOGY
3 EXECUTIVE SUMMARY
4 MARKET INSIGHTS
- 4.1 Market Overview
- 4.2 Industry Attractiveness - Porter's Five Forces Analysis
- 4.2.1 Bargaining Power of Suppliers
- 4.2.2 Bargaining Power of Buyers
- 4.2.3 Threat of New Entrants
- 4.2.4 Threat of Substitute Products
- 4.2.5 Intensity of Competitive Rivalry
- 4.3 Industry Value Chain Analysis
5 MARKET DYNAMICS
- 5.1 Market Drivers
- 5.1.1 Increasing Demand for Consumer Electronics and Smart Devices
- 5.2 Market Restraints
- 5.2.1 Higher Setup Cost Associated with Substrate-like-PCB
6 MARKET SEGMENTATION
- 6.1 Application
- 6.1.1 Consumer Electronics
- 6.1.2 Automotives
- 6.1.3 Communication
- 6.1.4 Other Applications
- 6.2 Geography
- 6.2.1 North America
- 6.2.2 Europe
- 6.2.3 Asia Pacific
- 6.2.4 Rest of the World
7 COMPETITIVE LANDSCAPE
- 7.1 Company Profiles
- 7.1.1 Kinsus Interconnect Technology Corp.
- 7.1.2 Ibiden Co.Ltd.
- 7.1.3 Compeq Manufacturing Co. Ltd.
- 7.1.4 Daeduck Electronics Co. Ltd.
- 7.1.5 Unimicron Technology Corporation
- 7.1.6 Zhen Ding Technology
- 7.1.7 TTM Technologies
- 7.1.8 Meiko Electronics
- 7.1.9 Austria Technologie & Systemtechnik Aktiengesellschaft
(AT&S)
- 7.1.10 Korea Circuit
- 7.1.11 LG Innotek Co.Ltd
- 7.1.12 Samsung Electro - Mechanics
