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市場調查報告書
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1643138

光連接模組:市場佔有率分析、產業趨勢與統計、成長預測(2025-2030 年)

Optical Interconnect - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)

出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

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簡介目錄

光連接模組市場規模預計在 2025 年為 193.9 億美元,預計到 2030 年將達到 359.7 億美元,預測期內(2025-2030 年)的複合年成長率為 13.15%。

光互連市場-IMG1

由於 COVID-19 對各個行業都產生了負面影響,3M 等公司目前正在生產醫療產品,以幫助全球各相關人員應對 COVID-19。 3M 已在美國、亞洲和歐洲等全球各地的生產基地將 N95 口罩產量加倍,達到每年 11 億隻。這導致光連接模組電纜產量下降。

然而,隨著在家工作已成為絕對必要,新漢(台灣)等市場參與者計劃幫助全球通訊供應商和資料中心虛擬和擴展容量。為了滿足更快網路的需求,NC 220FMS3 模組提供了一個 PCIe3.0 x16 介面和兩個 QSFP28 端口,每個端口支援 100Gb/s 乙太網路連接。此模組提供高速連接,無封包遺失。 100G 光收發器(傳輸 100Gb/s 乙太網路)、其外形類型和標準正在開發中,成本和功耗被視為互連市場發展的主要驅動力,從而有可能推動對光互連的需求。

主要亮點

  • 此外,直接調變的VCSEL陣列、平行光纖帶和偵測器陣列正在被廣泛應用來解決光學背板的容量問題。展望未來,光連接模組的新趨勢預計將包含更強大的功能,包括光域中的交叉連接交換器和資料封包路由。
  • 預計通訊頻寬需求的增加將推動市場的發展。各種通訊類型中大量新服務和加值營業單位的出現對頻寬的需求不斷增加。光連接模組相比電互連可以提供更大的頻寬,在運算效能方面具有顯著優勢。
  • 未來十年,跨晶片通訊預計所需能量將低於0.5 pJ b1,而晶片外和其他通訊技術所需通訊將低於0.1 pJ b1。透過利用廉價行動資料的能力,預計未來多核心處理器系統的功耗和總成本將隨著頻寬的增加而降低。
  • 自 2020 年初以來,Ciena、Infinera、華為和諾基亞等供應商一直在突破現代光學技術的極限。華為 CloudFabric EVN 第 2 層 DCI 解決方案提供高度擴充性且高效的第 2 層互連,可在 IP WAN 上擴展到多達 32 個資料中心。與華為類似,Ciena 和 Infinera 等競爭供應商也致力於開發支援 800G 的相干解決方案,為下一代光學 DCI 平台動力來源。
  • 截至 2020 年第二季度,數百萬人已轉為在家工作,視訊消費量(佔全球資料流量的 60%)達到了歷史最高水準。關鍵服務受到影響,Wi-Fi網路基地台面臨擁塞,FWA 受到限制,並且互連點緊張。
  • 這種狀況也蔓延到了雲端處理活動中,工業和企業領域的投資也大幅增加。所有這些因素,加上為擴展資料中心功能而採用的技術,導致了資料中心市場的蓬勃發展。預計這些趨勢將進一步刺激該市場的成長。

光連接模組市場趨勢

資料通訊通訊預計將刺雷射連接模組的需求

  • 光互連的主要應用之一是資料通訊網路,例如資料中心網路、無線接取網路和有線接取網路。目前的資料中心網路是基於電子分封交換,由於雲端運算的發展,網路流量正在迅速增加。光連接模組已成為一種很有前途的替代方案,具有高吞吐量、低延遲和低功耗的特性。
  • 據 IEEE Communications 稱,全光纖網路可使資料中心節省高達 75% 的能源。在大型資料中心,尤其是企業使用的資料中心,使用節能、高頻寬、低延遲的互連至關重要,並且人們對在這樣的資料中心部署光互連非常感興趣。
  • 目前,資料中心所採用的光纖技術僅限於點對點鏈路,與傳統通訊網路(不透明網路)所使用的點對點光纖鏈路相同。然而,光開關互連仍處於研究階段。

北美市場正在經歷高速成長

  • 網際網路的快速普及預計將推動該地區的市場成長。此外,根據Cisco的數據,預計 2021 年北美的雲端流量將達到每年約 6,844 Exabyte,是其他任何地區中最高的。根據 2020 年 11 月版愛立信移動報告,預計到 2020年終北美約有 4% 的行動用戶將支援 5G。因此,這種趨勢將為市場創造空間,因為需要強大的互連來使手機訊號塔和其他應用能夠適應 5G 傳輸。
  • 北美也有各種各樣的參與者提供光連接模組產品和解決方案,其中一些參與者也熱衷於創新新的解決方案,以大約低 10 倍的功率來提高互連頻寬密度。例如,2020年3月,Ayar Labs宣布已獲得洛克希德馬丁創投公司的策略投資。這些資金將用於加速 Ayar Labs取得專利的的單片封裝光學 I/O (MIPO) 解決方案的商業化,用於需要高頻寬、低延遲和節能短距離互連的應用。
  • 此外,資料中心內的資料移動正成為一項關鍵功能,越來越多的新業務公司利用美國和加拿大的資料中心服務,這將推動更多的 M2M(機器對機器)流量。 IBM 專注於向資料中心提供光開關作為解決此問題的關鍵解決方案。 IBM 正致力於利用矽光子技術建構可重構光開關。一旦實現,該光學解決方案將會引領光連接模組市場的新潮流。
  • 2020 年 6 月,全球互連和資料中心公司 Equinix 宣布已同意以 7.5 億美元全現金交易的方式從 BCE Inc. 手中收購遍布加拿大的 13 個資料中心組合。這 13 個資料中心(代表 25 個貝爾資料中心)預計年收益約 1.05 億美元。

光互連行業概況

光互連市場是一個分散的市場,其特點是存在幾家主要供應商和其他領先供應商。隨著新的創新和收購,主要供應商越來越注重開發光連接模組並提高人們對其優勢的認知。此外,全球供應商正在尋求透過策略聯盟和投資來穩定市場。主要參與者包括 3M 和工業。

  • 2020年12月,康寧公司投資4.5億美元擴建位於北卡羅來納州康科德市卡巴勒斯縣的光纖電纜工廠,創造475個新工作崗位,使其成為全球規模最大的光纖電纜工廠。
  • 2020 年 11 月:基於 Optical Network Principals 架構生產晶片解決方案的 Ayar Labs 在 B 輪融資中籌集了 3,500 萬美元。根據該公司執行長介紹,這筆資金籌措將用於繼續開發產品並致力於進一步商業化。該公司技術的主要應用是下一代運算,包括航太和政府應用、人工智慧和高效能運算、通訊和雲端應用,以及自動駕駛汽車和其他自主系統的雷射雷達,以及大量資料傳輸的任何地方。

其他福利:

  • Excel 格式的市場預測 (ME) 表
  • 3 個月的分析師支持

目錄

第 1 章 簡介

  • 研究假設和市場定義
  • 研究範圍

第2章調查方法

第3章執行摘要

第4章 市場動態

  • 市場概況
  • 市場促進因素
    • 雲端運算、人工智慧和 HPC 需求推動通訊頻寬需求增加
    • 增加對資料中心互連和光纖通訊的投資
  • 市場限制
    • 光互連相關技術商業化延遲
  • 產業價值鏈分析
  • 產業吸引力-波特五力分析
    • 新進入者的威脅
    • 購買者/消費者的議價能力
    • 供應商的議價能力
    • 替代品的威脅
    • 競爭對手之間的競爭強度
  • COVID-19 市場影響評估

第5章 市場區隔

  • 按類型
    • 光收發器
    • 主動光纜 (AOC)
    • 嵌入式光學模組(EOM)
  • 按應用
    • 電訊
    • 資料通訊
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
    • 歐洲
      • 德國
      • 英國
      • 法國
      • 其他歐洲國家
    • 亞太地區
      • 印度
      • 中國
      • 日本
      • 其他亞太地區
    • 拉丁美洲
    • 中東和非洲

第6章 競爭格局

  • 公司簡介
    • 3M Company
    • Sumitomo Electric Industries Ltd
    • Molex LLC
    • Amphenol Corporation
    • TE Connectivity Ltd.
    • Go!Foton Inc.
    • II-VI Incorporated
    • Corning Incorporated
    • Cisco Systems Inc.
    • Huawei Technologies Co. Ltd

第7章投資分析

第8章 市場機會與未來趨勢

簡介目錄
Product Code: 69940

The Optical Interconnect Market size is estimated at USD 19.39 billion in 2025, and is expected to reach USD 35.97 billion by 2030, at a CAGR of 13.15% during the forecast period (2025-2030).

Optical Interconnect - Market - IMG1

Due to the adverse effects of COVID 19 across industries, players such as 3M are currently manufacturing medical products to assist various stakeholders globally, to combat Covid-19. 3M has doubled production of N95 respirators to 1.1 billion per year at its global manufacturing facilities, including in the U.S., Asia, and Europe. This has led to reduced manufacturing for optical interconnect cables.

However, as the ability to work from home has become an absolute necessity, market players such as Nexcom (Taiwan) plans to help telecom providers and data centers across the world to virtualize and expand capacity. For meeting current network demands for faster speeds, the NC 220FMS3 module provides a PCIe3.0 x16 interface and two QSFP28 ports, each supporting 100Gb/s Ethernet connectivity. The module provides high-speed connectivity without any packet loss. The 100 G optical transceivers (providing 100Gb/s ethernet), their form factor type, and standard are developed according to the cost and power consumption, which are regarded as the main drive in the development for interconnect market, which potentially drives the demand of optical interconnect.

Key Highlights

  • Moreover, directly modulated VCSEL arrays, parallel fiber ribbons, along with detector arrays, are highly being applied to optical backplane capacity issues. In the future, additional higher functionality is highly expected as an emerging trend for optical interconnects, which includes features such as cross-connect switches and data packet routing in the optical domain.
  • The increasing demand for communication bandwidth is expected to drive the market. Due to the emergence of a large number of new services in different types of communications and their value-added entities, the demand for bandwidth has gone up more than ever before. Optical interconnect drive it possible in providing more bandwidth and bring great advantage to computing performance, compared to electrical interconnects.
  • With optics, over the next decade, it is believed that the energy-requiring for cross-chip communication would approach less than 0.5 pJ b1 and to 0.1 pJ b1 for communication, such as off-chip communication technology. By utilizing the ability to move data affordably, both the power consumption and the total cost for such future multicore processor systems are expected to be reduced with improving bandwidth.
  • Since the beginning of 2020, vendors, like Ciena, Infinera, Huawei, and Nokia, have been pushing the limits of modern optics. Huawei CloudFabric EVN Layer 2 DCI solution provides highly permits scalable, efficient layer 2 interconnection that allows expansion of up to 32 data centers across IP WANs. Like Huawei, competing vendors, like Ciena or Infinera, are also working on their 800G-capable coherent solutions, which may power next-generation optical DCI platforms.
  • By the second quarter of 2020, millions of people switched to work from home, and video consumption (which amounts to 60% of the global data traffic) was at an all-time high. Critical services were being impacted, and Wi-Fi access points were facing congestion; FWA witnessed limitations, and interconnect points were burdened.
  • These scenarios also surge the cloud computing activities, along with significantly increasing investments from the industrial and enterprises segment. All these factors made a massive boom in the data center market along with technologies incorporated to expand the capabilities of data centers. Such trends are expected to further stimulate the growth of the market studied.

Optical Interconnect Market Trends

Data Communication is Expected to Spur the Demand for Optical Interconnects

  • One of the major applications of optical interconnectivity is within data communication networks which include datacenter networks, wireless access networks, and wired access networks. Current data center networks, which are based on electronic packet switches, experiences an exponential increase in network traffic due to cloud computing development. Optical interconnects emerged as a promising alternative that offers high throughput, low latency, and reduced power consumption.
  • According to IEEE Communications, all-optical networks could provide up to 75% energy savings in the data centers. Especially in large data centers used in enterprises, the use of power efficient, high bandwidth, and low latency interconnects is of paramount importance, and there is significant interest in the deployment of optical interconnects in these data centers.
  • Currently, optical technology is utilized in data centers is only for point-to-point links, which is in the same way as point-to-point optical links that were used in older telecommunication networks (opaque networks). However, optically switched interconnects are still in the research phase.

North America To Witness High Market Growth

  • The rapid penetration of the internet is expected to raise the growth of the market in this region. Moreover, according to Cisco Systems, the cloud traffic in 2021 is estimated to be around 6844 exabytes per year in North America, which is highest in comparison to other regions. According to the November 2020 edition of the Ericsson Mobility Report, North America was expected to end 2020 with about 4% of its mobile subscriptions being 5G. Hence, such trends create scope for the market, as a powerful interconnect is required to enable cell towers and other applications to handle 5G transmissions.
  • Also, North America has various players that provide optical interconnect products and solutions, along with players who are also keen to innovate new solutions for the improvement in interconnect bandwidth density at around 10x lower power. For instance, in March 2020, Ayar Labs announced that it had received a strategic investment from Lockheed Martin Ventures, where the funds will be used to accelerate the commercialization of Ayar Labs' patented monolithic in-package optical I/O (MIPO) solution for applications that require high bandwidth, low latency, and power-efficient short-reach interconnects.
  • Moreover, data movement within the data center is becoming a critical feature, and the rise in the ample of new businesses leveraging data center services in the United States, and Canada will leverage more machine-to-machine (M2M) traffic. To overcome this problem, IBM focuses on providing optical switches in the data center as a key to resolve the problem. IBM is undertaking to build reconfigurable optical switches using silicon-photonic technology. If implemented, this optical solution becomes a new trend in the optical interconnect market.
  • In June 2020, Equinix Inc., the global interconnection and data center company, announced its agreement to purchase a portfolio of 13 data centers across Canada from BCE Inc for USD 750 million in an all-cash transaction. The 13 data center sites representing 25 Bell data center facilities are likely to generate approximately USD 105 million annualized revenue.

Optical Interconnect Industry Overview

The Optical Interconnect Market is fragmented in nature and is characterized by the presence of several key vendors and other prominent vendors. The key vendors are increasingly focusing on creating awareness about the optical Interconnect development courses and their benefits, along with new innovation and acquisitions. Further, global vendors are trying to stabilize themselves in the market, through strategic collaborations and investements. Key players are 3M, Sumitomo Electric Industries, etc.

  • December 2020 - Corning Inc. spent USD 450 million to expand its Cabarrus County fiber optic cable plant in Concord, N.C., generating 475 new jobs and making it the largest such facility in the world.
  • November 2020 - Ayar Labs, which makes chip solutions based on optical networking principal's architecture raised USD 35 million in a Series B round of funding. According to the company's CEO, the funding will be used to continue developing its product and working on further commercialization. The main application area for the company's technology is next-generation computing, anywhere that there is a massive movement of data, including aerospace and government applications, artificial intelligence and high-performance computing, telecoms and cloud applications, and lidar for self-driving car and other autonomous systems.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Increasing Demand for Communication Bandwidth Owing to Demand for Cloud Computing, AI, and HPC
    • 4.2.2 Increasing Investment in Data Centers Interconnect and Fiber Optic Communication
  • 4.3 Market Restraints
    • 4.3.1 Slow Commercialization of Optical Interconnection Related Technologies
  • 4.4 Industry Value Chain Analysis
  • 4.5 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.5.1 Threat of New Entrants
    • 4.5.2 Bargaining Power of Buyers/Consumers
    • 4.5.3 Bargaining Power of Suppliers
    • 4.5.4 Threat of Substitute Products
    • 4.5.5 Intensity of Competitive Rivalry
  • 4.6 Assessment of Impact of Covid-19 on the Market

5 MARKET SEGMENTATION

  • 5.1 Type
    • 5.1.1 Optical Transceivers
    • 5.1.2 Active Optical Cables (AOCs)
    • 5.1.3 Embedded Optical Modules (EOMs)
  • 5.2 Application
    • 5.2.1 Telecommunication
    • 5.2.2 Data Communication
  • 5.3 Geography
    • 5.3.1 North America
      • 5.3.1.1 United States
      • 5.3.1.2 Canada
    • 5.3.2 Europe
      • 5.3.2.1 Germany
      • 5.3.2.2 United Kingdom
      • 5.3.2.3 France
      • 5.3.2.4 Rest of Europe
    • 5.3.3 Asia Pacific
      • 5.3.3.1 India
      • 5.3.3.2 China
      • 5.3.3.3 Japan
      • 5.3.3.4 Rest of Asia Pacific
    • 5.3.4 Latin America
    • 5.3.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 3M Company
    • 6.1.2 Sumitomo Electric Industries Ltd
    • 6.1.3 Molex LLC
    • 6.1.4 Amphenol Corporation
    • 6.1.5 TE Connectivity Ltd.
    • 6.1.6 Go!Foton Inc.
    • 6.1.7 II-VI Incorporated
    • 6.1.8 Corning Incorporated
    • 6.1.9 Cisco Systems Inc.
    • 6.1.10 Huawei Technologies Co. Ltd

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS