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市場調查報告書

商品編碼

1644468

基板：全球市場佔有率分析、產業趨勢與統計、成長預測（2025-2030）

Global Substrate - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)

出版日期: 2025年01月05日 | 出版商:

Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

價格

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簡介目錄

預計2025年全球基板市場規模為43.3億美元，2030年將達55億美元，預測期間（2025-2030年）的複合年成長率為4.88%。

COVID-19 疫情擾亂了電子產業的供應鏈，阻礙了市場成長。由於可支配收入減少和消費者信心低迷，消費者選擇購買食品和清潔產品等必需品，避免購買穿戴式裝置等非必需品。

主要亮點

新冠疫情及其引發的半導體元件短缺給全球經濟和半導體產業帶來了衝擊。這是首次整個世界和幾乎所有經濟部門都受到影響，供應鏈中斷可能會在今年及以後繼續對生產能力產生負面影響。此外，COVID-19 導致對醫療監測設備的需求大幅增加，各種合作也推動了市場的成長。
軟性混合電子（FHE）是一種新的電子電路製造方法，結合了印刷電子和傳統電子的優點。這種靈活性和處理能力的結合是非常理想的，因為它可以減輕重量、實現新外形規格，並保留資料登錄和藍牙連接等理想功能。
印刷電路基板（PCB）產業在過去幾年中取得了顯著成長，這主要歸因於家用電子電器的不斷發展以及所有電子電氣設備對 PCB 的需求不斷增加。
消費性電子產品需要新的和不同的 PCB 功能。這一發展與PCB的形狀以及附著在PCB上的附件有關。 PCB 板相機已經取得了長足的進步，其中照片和視訊影像處理以及耐用性是主要的改進。這些微型相機現在可以輕鬆捕捉高解析度的影像和影片。預計未來幾年板載相機將進一步發展，從而創造出強大的工業和消費性電子解決方案。
從區域來看，台灣、日本、中國等亞太國家佔全球PCB市場的較大比例。然而，近年來台灣的PCB產量呈現下滑趨勢。根據台北市印刷電路板協會（TPCA）統計，台灣印刷基板市場曾一度佔據全球主導地位，擁有較大的邊際市場佔有率。假設政府想要創建一個先進印刷基板製造的全球中心，並尋求印刷基板材料供應的自主權。這樣，台灣就能在未來3至5年維持科技優勢。

基板市場趨勢

工業用途在FHR市場中佔有很大的佔有率

此外，支援FHE的軟性機器人正在工業4.0時代應用。機器人外骨骼旨在幫助移動和舉起物體（例如，板條箱、紙板箱、盒子），以恢復運動喪失的個人的活動能力並減少職場的傷害，這是早期的軟性機器人應用。
FHE 最重要的應用之一是通訊，其中無線技術對於資料傳輸和系統控制（物聯網）至關重要。物聯網 (IoT) 一詞指的是為日常生活帶來未來觀點的新概念。物聯網連接大量智慧設備（內嵌感測器和資訊發送器），實現機器對機器的通訊，並且需要在無需人工干預的情況下與雲端進行頻繁的資料交換和更新，從而實現智慧家庭、智慧醫療、智慧城市、工業和交通系統等領域的成功創新。
FHE的另一個應用領域是環境景觀中的精密農業。調查團隊使用基於幾丁聚醣的墨水將軟性應變感測器直接列印到水果上。感測器能夠很好地黏附在水果上並識別出機械損壞。可調節的膠帶石墨烯感測器可以測量流經植物的水流量。此感測器的開發方法是將石墨烯薄膜滴到預先圖案化的聚二甲基矽氧烷 (PDMS) 表面上，然後將圖案化的石墨烯表面轉移到目標膠帶上。
另一個研究領域是開發具有多種感測能力的軟性和可拉伸設備，用於植物健康監測。此外，報告中的植物穿戴式裝置設計有整合的溫度、濕度和應變感測器。應變感測器是透過在 PDMS基板上沉澱一層薄薄的金金屬薄膜而開發出來的。溫度和濕度感測器是在同一個軟性PI/PDMS平台上製造的。
我們正在開發一種多功能農業監測感測器，可以測量應變、電阻、溫度和光強度。該感測器採用CMOS、可印刷電子和轉印技術相結合的方式製造，具有葉片濕度、溫度、應變和照度感應功能。與其他已報告的感測器不同，這種可拉伸感測器可以隨著葉子生長，適合長期監測。

智慧家電和穿戴式裝置需求激增可望推動 SLP 市場發展

家用電子電器主要包括智慧型手機、智慧手環、健身設備和穿戴式裝置。家用電子電器需求的不斷成長預計將為 SLP 市場參與者帶來前景。隨著家用電子電器的功耗增加，電池需要變得更大，基板需要變得更小。
如果沒有小而薄的IC構裝基板，就不會有智慧型手機。小而薄的 IC構裝基板可實現多種電子設備的功能，連接所有設備的多層薄 PCB 也是如此。隨著智慧型手機功能越來越強大，電池越來越大，對主機板的要求也越來越高，密度越來越高，體積越來越小，重量也越來越輕。根據IBIDEN介紹，該公司開發了一種使用精細佈線技術的技術，該技術採用了改進的半自適應製程 (MSAP) 和先前透過全通孔堆疊結構 (FVSS) 提供的填充通孔堆疊結構。
Yoon 表示，扇出型晶圓級封裝主要針對高級產品，也就是行動電話供應商旗艦智慧型手機型號中的高階應用處理器。 SLP 針對的是行動電話主機板，可以減少此類組裝所需的空間。球柵陣列和覆晶封裝通常用於行動電話中的細間距槽。
軟性電子產品通常由安裝在軟性塑膠基板（例如聚酯或聚醚醚酮（PEEK））上的電路組成。為了承受反覆彎曲而不失去電氣接觸，導電跡線必須由具有高疲勞強度的軟性金屬或導電聚酯製成。此項工作的理想材料通常是聚合物。
軟性電子產品將成為這個不斷擴張的行業的積極參與者，其應用包括健身追蹤器、智慧型手錶和微型即時醫療監測設備。軟性電子產品特別適合這種環境，因為每個人的身體都略有不同。無需緊緊佩戴設備以確保接觸，軟性電子產品可使感測器貼合皮膚的自然曲線。軟性電子產品的最新研究集中在醫療應用方面。除了計步器和卡路里計數器，他們還生產血壓計、氧氣監測儀、血糖儀，甚至血液酒精含量計。
隨著重大技術的突破，高效且靈活的太陽能板可能會成為現實。除了屋頂支架外，軟性太陽能板還可安裝在電線杆、井筒、柵欄柱和其他類似結構上。
此外，蘋果供應商之一真鼎科技預計，智慧型手機、穿戴式裝置和其他需要超薄和輕巧的行動裝置對 SLP 的需求將會增加。 SLP 可實現緊湊設計，且不會犧牲運算效能。 Zendine 計劃在其中國工廠增加一條 SLP 生產線。

基板產業概況

全球基板市場高度分散。全球製造商已轉向高密度互連 (HDI) PCB 等設計，以便在有限的空間內裝入更多硬體。 HDI PCB 性能優異，採用無芯結構。與傳統 PCB 相比，它具有更高密度的佈線、更小的雷射過孔、捕獲墊片等特性。行業現有參與者正在利用其製造和研發能力來推動技術創新並保持市場競爭力。

2022 年 10 月，PCB 接點功率元件製造商 Wurth Elektronik ICS 推出了經過試驗的新一代無鉛大電流接點。第二代 PowerPlus，LF PowerPlus 2.0，具有與第一代相同的扭力和載流能力，但更容易加工且組裝效率更高。憑藉其 LF PowerPlus 產品系列，Wurth Elektronik ICS 為壓接技術應用中的 PCB 接點提供可靠、有效的大電流接點。它們是夾緊元件和將電纜和組件連接至 PCB 的理想選擇，特別是在需要高扭力或安裝空間有限時。
2022 年 9 月，TTM Technologies Inc. 的高頻和特殊組件業務部門（一家微波和射頻技術專家）與 RFMW 簽署了分銷協議，RFMW 是一家純粹的射頻（“RF”）和微波組件和半導體的頂級分銷商。透過 RFMW，TTM 提供全系列的 RF&S 產品，包括著名的 Xinger 品牌產品線。這也包括識別和開發銷售機會、提供技術銷售支援和分銷服務。 RFMW 的網路商店也提供 TTM 組件。

其他福利：

Excel 格式的市場預測 (ME) 表
3 個月的分析師支持

當前市場概況 - 趨勢/動態/市場估計和預測
市場成長動力
FHE製造流程及技術要求
FHE 的技術進步（製造流程和材料的進步）
FHE 所用材料及其規格
FHE 技術藍圖
用途和使用案例
- 汽車和航空
- 穿戴式裝置和醫療監測
- 消費品
- 工業/環境
- 智慧包裝和 RFID
FHE 供應商分析
市場展望

第7章全球SLP (類基板 PCB) 市場

當前市場概況 - 趨勢/動態/市場估計和預測
市場成長動力
SLP的製造流程及技術要求
SLP 的技術進步（製造流程和材料的進步）
SLP所用材料及其規格
SLP 技術藍圖
市場區隔
- 按應用
  - 消費性電子產品
  - 車
  - 通訊
  - 其他用途
SLP 供應商分析
市場展望

第8章全球系統級封裝（SIP）市場

當前市場概況 - 趨勢/動態/市場估計和預測
市場成長動力
SIP製造流程及技術要求
SIP 的技術進步（製造流程和材料的進步）
SIP所用材料及其規格
SIP 技術藍圖
市場區隔
- 按應用
  - 電信和基礎設施（伺服器和基地台）
  - 汽車和運輸
  - 行動和消費電子
  - 醫療和工業
  - 航太和國防
- SIP 供應商分析
- 市場展望

簡介目錄

Product Code: 72251

The Global Substrate Market size is estimated at USD 4.33 billion in 2025, and is expected to reach USD 5.50 billion by 2030, at a CAGR of 4.88% during the forecast period (2025-2030).

Due to the COVID-19 outbreak, there was a disruption in the electronics industry's supply chain, which challenged market growth. With reduced disposable incomes and depressed consumer sentiment, consumers chose to buy necessities, like food and cleaning products, and avoid non-essential, big-ticket purchases, like wearable devices.

Key Highlights

The COVID-19 pandemic and the ensuing shortage of semiconductor components proved to be a shock to the global economy and the semiconductor industry; for the first time, the entire world and nearly all economic sectors were affected, and supply chain disruptions will continue to impact production capacities negatively even in and beyond the current year. Furthermore, due to COVID-19, the demand for healthcare monitoring devices increased significantly, and various partnerships have led to market growth.
Flexible hybrid electronics (FHE) is a novel electronic circuit manufacturing approach that combines the best of printed and conventional electronics. This combination of flexibility and processing capability is much desired since it reduces weight, enables new form factors, and maintains desirable functionality, such as data logging and Bluetooth connectivity.
The printed circuit board (PCB) industry has experienced significant growth in the last few years, primarily owing to the continuous development of consumer electronics devices and the increasing demand for PCBs in all electronics and electrical equipment.
Consumer electronics have been demanding new and different PCB functions. The development is related to the shape of the PCB or the accessory attached to it. PCB board cameras have developed significantly, with photo and video imaging and durability being the primary areas of improvement. These small cameras could take high-resolution images and videos with ease. Board cameras are poised to develop even further in the next few years, creating robust industry and consumer electronics solutions.
Geographically, Asia-Pacific countries, such as Taiwan, Japan, and China, occupy a significant share of the global PCB landscape. However, PCB production in Taiwan has been on a declining trend for a few years. According to the Taipei Printed Circuit Association (TPCA), Taiwan's printed circuit board market briefly dominated the world with a large marginal market share. Suppose the government creates a hub for sophisticated PCB manufacture on a global scale and pursues autonomy in the supply of PCB materials. In that case, Taiwan can preserve its technological edge for the coming three to five years.

Substrate Market Trends

In FHR Market, Industrial to Account for a Significant Share in the Market

Also, FHE-enabled soft robots have found applications in the Industry 4.0 era. Robotic exoskeletons designed to give mobility back to those who have lost it and assist with moving and lifting objects (e.g., crates, cartons, and boxes) to reduce workplace injury are early soft robotic applications.
One of the most critical uses for FHE is in communication, as wireless technology is essential for data transmission and system control (IoT). The term "Internet of Things" (IoT) refers to an emerging idea that encompasses a futuristic perspective on everyday life. It connects a vast array of intelligent devices (embedded with sensors and information transmitters) to enable machine-to-machine communication, which necessitates frequent data exchange and updates to the cloud without human intervention, allowing successful innovation in areas like smart homes, smart healthcare, smart cities, industry, and transportation systems.
Another application area for FHE is precision agriculture in the environmental landscape. Researchers printed a flexible strain sensor directly on the fruits using chitosan-based ink. These sensors provided good adhesion to the fruit and identified mechanical injuries. A graphene-on-tape adjustable sensor can measure water flow through plants. The sensor is developed by dropping a graphene film on a pre-patterned polydimethylsiloxane (PDMS) surface and then transferring the patterned graphene surface onto a target tape.
Another research area is developing a flexible and stretchable device with multiple sensing capabilities for plant health monitoring. Further, the reported plant wearable is designed by integrating temperature, humidity, and strain sensors. The strain sensors were developed by depositing a thin gold metal film on the PDMS substrate. The temperature and humidity sensors were fabricated on the same flexible PI/PDMS platform.
A multifunctional agricultural monitoring sensor is being developed to measure strain, impedance, temperature, and light intensity. The sensor is fabricated by combining CMOS, printable electronics, and transfer printing techniques, leading to hydration, temperature, strain, and light illuminance sensing capabilities on leaves. Unlike other reported sensors, these stretchable sensors can grow with the leaves, making them compatible with long-term monitoring.

Surge in Demand for Smart Consumer Electronics and Wearable Devices is Expected to Drive the SLP Market

Consumer electronics mostly include smartphones, smart bands, fitness devices, and wearables. Increasing demand for consumer electronics is expected to provide prospects for players in the SLP market. Due to the increasing power consumption in consumer electronics applications, batteries need to get bigger, while boards need to get smaller.
Smartphones would not exist without the compact, thin IC packaging substrates Compact, thin IC packaging substrates enable multiple electronic devices to function, as does the multilayer, thin PCB that connects all the devices. The advancement of smartphone functions and battery capacity requires higher densities and smaller, lighter motherboards. According to IBIDEN, it has achieved a micro-wiring technology employing the Modified Semi-Adaptive Process (MSAP) and a technique using the filled-via stack-up structure they have been offering in conventional full-via stacked structures (FVSS).
According to Yoon, fan-out wafer-level packaging is for high-end application processors going into premium products, the flagship smartphone models for handset vendors. SLP is meant for the motherboard of phones, reducing the space needed for such assemblies. Ball grid arrays or flip-chip packages are typically used for fine-pitch slots in a phone.
Flexible electronics typically consist of electrical circuits installed on a flexible plastic substrate, such as polyester or polyether ether ketone (PEEK). For the electrical contact to remain intact even after numerous flexing cycles, the conductive traces must either be made of a flexible metal with high fatigue strength or conductive polyester. The ideal material for the job is often a polymer.
Flexible electronics will actively participate in this expanding industry with fitness trackers, smartwatches, and tiny, real-time medical monitoring devices. Since every human body is slightly distinct in shape, flexible electronics are especially well adapted to this environment. Instead of being compelled to wear equipment too tightly to ensure contact, sensors may now conform to the skin's natural curves thanks to flexible electronics. Medical applications have been the focus of recent research in flexible electronics. Blood pressure monitors, oxygen monitors, glucose meters, and even blood-alcohol meters are being created in addition to step counters and calorie counters.
Efficient, flexible solar panels might become a reality as technology progresses exponentially. Flexible solar panels can be installed on surfaces other than roof-mounted racks, such as telephone poles, well casings, fence posts, and other similar structures.
Furthermore, Zhen Ding Technology, reportedly among the suppliers of Apple, has discussed its vision of SLP demand for smartphones, wearables, and other mobile devices requiring an ultra-thin and lightweight profile. The use of SLP enables compact design without sacrificing computing performance. Zhen Ding plans to build additional SLP production lines at its factory site in China.

Substrate Industry Overview

The global substrate market is highly fragmented. Manufacturers globally have depended on designs, such as high-density interconnect (HDI) PCBs, to place more hardware in limited space. HDI PCBs use high-performance and coreless construction. Compared to traditional PCBs, they sport more densely packed wiring, miniaturized laser vias, capture pads, and other features. The industry's established players are leveraging their manufacturing capabilities and research and development capabilities to drive innovation and sustain their competitive position in the market.

In October 2022, the manufacturer of Powerelements for PCB contacting, Wurth Elektronik ICS, launched a new generation of its tried-and-true lead-free high-current contacts: the second PowerPlus generation, LF PowerPlus 2.0, has the same torque and current-carrying capacity as the first generation but is now even easier to process and more effective to assemble. Wurth Elektronik ICS provides reliable and effective high-current contacts for PCB contact in press-fit technology applications with the LF PowerPlus product family. They are perfect for fastening elements or attaching cables and components to the PCB, especially when high torques are needed or there is limited installation space.
In September 2022, TTM Technologies Inc.'s Radio Frequency & Specialty Components Business Unit, a microwave and RF-based technology specialist, signed a distribution agreement with RFMW, a pure play premier distributor for radio frequency ("RF") and microwave components and semiconductors. TTM will make available through RFMW the entirety of its line of RF&S goods, including its well-known Xinger brand product lineup. Opportunities will be identified and developed, technical sales support will be provided, and distribution will be included in the distribution services. The RFMW online store will also provide the TTM components.

Additional Benefits:

The market estimate (ME) sheet in Excel format
3 months of analyst support

1 INTRODUCTION

1.1 Study Assumptions and Market Definition
1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 GLOBAL PCB MARKET

4.1 Current Market Overview - Trends/Dynamics/Market Demand Estimates and Projections
4.2 Factors Driving Market Growth
4.3 PCB Manufacturing Process and Technical Requirements
4.4 Technological Advancements in PCBs (Manufacturing Process and Materials Advancements)
4.5 Materials Used for PCBs along with their Specifications and Applications

5 MARKET SEGMENTATION

5.1 By Application
- 5.1.1 Computing
- 5.1.2 Consumer
- 5.1.3 Industrial/Medical
- 5.1.4 Communication
- 5.1.5 Automotive
- 5.1.6 Military/Aerospace
5.2 Analysis of Top 10 PCB Vendors
5.3 Market Outlook

6 GLOBAL FLEXIBLE HYBRID ELECTRONICS (FHE) MARKET

6.1 Current Market Overview - Trends/Dynamics/Market Demand Estimates & Projections
6.2 Factors Driving the Market Growth
6.3 FHE Manufacturing Process and Technical Requirements
6.4 Technological Advancement in FHE (Manufacturing Process and Materials Advancements)
6.5 Materials Used for FHEs along with their Specifications
6.6 Technological Roadmap of FHE
6.7 Applications and Use Cases
- 6.7.1 Automotive and Aeronautical
- 6.7.2 Wearable and Healthcare Monitoring
- 6.7.3 Consumer Goods
- 6.7.4 Industrial/Environmental
- 6.7.5 Smart Packaging and RFID
6.8 Analysis of FHE Vendors
6.9 Market Outlook

7 GLOBAL SUBSTRATE LIKE PCB (SLP) MARKET

7.1 Current Market Overview - Trends/Dynamics/Market Demand Estimates and Projections
7.2 Factors Driving the Market Growth
7.3 SLP Manufacturing Process and Technical Requirements
7.4 Technological Advancement in SLP (Manufacturing Process and Materials Advancements)
7.5 Materials Used for SLP with their Specifications
7.6 Technological Roadmap of SLP
7.7 MARKET SEGMENTATION
- 7.7.1 By Application
  - 7.7.1.1 Consumer Electronics
  - 7.7.1.2 Automotive
  - 7.7.1.3 Communication
  - 7.7.1.4 Other Applications
7.8 Analysis of SLP Vendors
7.9 Market Outlook

8 GLOBAL SYSTEM-IN-PACKAGE (SIP) MARKET

8.1 Current Market Overview - Trends/Dynamics/Market Demand Estimates and Projections
8.2 Factors Driving the Market Growth
8.3 SIP Manufacturing Process and Technical Requirements
8.4 Technological Advancement in SIP (Manufacturing Process and Materials Advancements)
8.5 Materials Used for SIP along with their Specifications
8.6 Technological Roadmap of SIP
8.7 MARKET SEGMENTATION
- 8.7.1 By Application
  - 8.7.1.1 Telecom and Infrastructure (Servers and Base Stations)
  - 8.7.1.2 Automotive and Transportation
  - 8.7.1.3 Mobile and Consumer
  - 8.7.1.4 Medical and Industrial
  - 8.7.1.5 Aerospace and Defense
- 8.7.2 Analysis of SIP Vendors
- 8.7.3 Market Outlook