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全球智慧功率模組市場2024-2031Global Intelligent Power Module Market 2024-2031 |
預計在預測期內(2024-2031年),全球智慧功率模組市場將以10.7%的CAGR成長。隨著各行業終端用戶的不斷增加,智慧功率模組的採用不斷增加,是支持全球市場成長的關鍵因素。汽車行業製造商擴大應用智慧功率模組,使用MOSFET滿足汽車行業嚴格的品質和可靠性標準。市場參與者也致力於推出智慧功率模組解決方案,以進一步促進市場成長。例如,2023 年 10 月,Littelfuse, Inc. 推出了功率模組 IXTY2P50PA,這是首款汽車級 PolarP(TM) P 通道功率 MOSFET。產品設計滿足汽車應用的嚴格要求,提供卓越的性能和可靠性。
全球智慧功率模組市場按功率元件、電壓等級和垂直領域進行細分。根據功率元件,市場分為 IGBT 和 MOSFET。根據電壓額定值,市場分為 0 V 至 599 V、600 V 至 1,199 V 以及 1,200 V 及以上。此外,根據垂直領域,市場細分為消費性電子、ICT、汽車、工業和其他(航空航太)。在功率元件中,由於半導體模組的使用越來越多,這些半導體模組將運行智慧功率模組所需的所有電路整合到單一封裝中,預計 IGBT 細分市場將佔據相當大的市場佔有率。
在垂直產業中,消費電子細分領域預計將在全球智慧功率模組市場中佔據相當大的佔有率。此細分市場的成長歸因於消費性電子產品中擴大使用智慧電源模組來提高電源效率、尺寸和重量更小、更輕、可靠性更高以及電路設計更容易。智慧電源模組非常適合建構智慧計量、智慧照明和智慧追蹤設備。例如,2023 年 11 月,Eoxys System 推出了超低功耗 NB-IoT ML SOM 模組,用於建構智慧、安全的物聯網設備。客戶可以利用 XENO+ NB-IoT ML SOM 的智慧運算和蜂窩連接功能更快地開發物聯網智慧計量和智慧追蹤解決方案。
全球智慧功率模組市場根據地理位置進一步細分,包括北美(美國和加拿大)、歐洲(英國、義大利、西班牙、德國、法國和歐洲其他地區)、亞太地區(印度、中國、日本、韓國和亞洲其他地區)以及世界其他地區(中東和非洲以及拉丁美洲)。其中,亞太地區預計將在全球市場中佔據顯著佔有率,因為採用 SiC MOSFET 模組的智慧功率模組(電動車功率模組的創新材料)擴大被採用,中國的電動車製造商也利用這項技術。
在所有地區中,北美地區預計在預測期內將以相當大的CAGR成長。區域成長歸因於對智慧功率模組的需求不斷成長,以實現節能和降低產品營運成本。市場參與者專注於推出整合式智慧功率模組,該模組提供過電流保護、欠壓保護和溫度感測等保護功能。例如,2023年9月,理想電源公司推出了SymCool(TM) IQ智慧電源模組。 SymCool(TM) IQ 基於雙向 B-TRAN(TM) 多晶片封裝設計,整合了針對雙向操作而最佳化的智慧型驅動器。 SymCool(TM) IQ 的額定電壓為 1200V 和 160A,與 IGBT 模組相比具有顯著優勢,包括更低的損耗和固有的雙向性。
服務全球智慧功率模組市場的主要公司包括英飛凌科技股份公司、三菱電機公司、瑞薩電子公司、Semiconductor Components Industries, LLC、東芝公司等。市場參與者透過各種策略(包括併購、合作、合作、融資和新產品發布),為市場成長做出了巨大貢獻,以保持市場競爭力。例如,2023 年 4 月,賽米控丹佛斯和羅姆半導體合作在功率模組內部實施碳化矽 (SiC)。 Semikron Danfoss 將 ROHM 的新型 1200V RGA IGBT 加入其低功率模組系列中。 ROHM 的新型 1200V RGA IGBT 旨在取代工業環境中最新的第 7 代 IGBT 裝置。
Global Intelligent Power Module Market Size, Share & Trends Analysis Report by Power Device (Insulated-Gate Bipolar Transistor (IGBT) and Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET)), by Voltage Rating (0 V to 599 V, 600 V to 1,199 V, and 1,200 V and Above), and by Vertical (Consumer Electronics, Information and Communication Technology (ICT), Automotive, Industrial, and Others) Forecast Period (2024-2031)
The global intelligent power module market is anticipated to grow at a CAGR of 10.7% during the forecast period (2024-2031). The growing adoption of intelligent power modules with the increasing end users in various industries is the key factor supporting the growth of the market globally. The increasing application of intelligent power modules in the automotive industry manufacturers using MOSFET meets the automotive industry's stringent quality and reliability standards. The market players are also focusing on introducing intelligent power module solutions that further bolster the market growth. For instance, in October 2023, Littelfuse, Inc. launched power module IXTY2P50PA, the first automotive-grade PolarP(TM) P-Channel Power MOSFET. The product design meets the demanding requirements of automotive applications, providing exceptional performance and reliability.
The global intelligent power module market is segmented on the power device, voltage rating, and vertical. Based on the power device, the market is sub-segmented into IGBT and MOSFET. Based on the voltage rating, the market is sub-segmented into 0 V to 599 V, 600 V to 1,199 V, and 1,200 V and above. Further, based on vertical, the market is sub-segmented into consumer electronics, ICT, automotive, industrial and others (aerospace). Among the power devices, the IGBT sub-segment is anticipated to hold a considerable share of the market owing to the increasing use of semiconductor modules that integrate into a single package all the circuitry required to operate an intelligent power module.
Among the verticals, the consumer electronics sub-segment is expected to hold a considerable share of the global intelligent power module market. The segmental growth is attributed to the increasing use of intelligent power modules in consumer electronics to increase power efficiency, smaller and lighter size and weight, higher reliability, and easier circuit design. Intelligent power modules with are perfect for constructing smart metering, smart lighting, and smart tracking devices. For instance, in November 2023, Eoxys System launched an Ultra-Low Power NB-IoT ML SOM Module for building intelligent and secure IoT devices. Customers can develop their IoT smart metering and smart tracking solutions more quickly by utilizing the XENO+ NB-IoT ML SOM's intelligent computing and cellular connectivity functionalities.
The global intelligent power module market is further segmented based on geography including North America (the US, and Canada), Europe (UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia), and the Rest of the World (the Middle East & Africa, and Latin America). Among these, Asia-Pacific is anticipated to hold a prominent share of the market across the globe, owing to the growing adoption of intelligent power modules with SiC MOSFET modules, an innovative material for EV power modules, China-based EV, manufacturers are also utilizing this technology.
Among all regions, the North American region is anticipated to grow at a considerable CAGR over the forecast period. Regional growth is attributed to increasing demand for intelligent power modules for energy savings and lower product operating costs. Market players focusing on introducing an integrated intelligent power module that provides protection features such as overcurrent protection, under-voltage protection, and temperature sensing. For instance, in September 2023, Ideal Power Inc. launched SymCool(TM) IQ Intelligent Power Module. SymCool(TM) IQ builds on the bidirectional B-TRAN(TM) multi-die packaging design to integrate intelligent driver optimized for bidirectional operation. The SymCool(TM) IQ, rated at 1200V and 160A, has significant advantages compared to IGBT modules, including lower losses and inherent bi-directionality.
The major companies serving the global intelligent power module market include Infineon Technologies AG, Mitsubishi Electric Corp., Renesas Electronics Corp., Semiconductor Components Industries, LLC, Toshiba Corp., and others. The market players are considerably contributing to the market growth by the adoption of various strategies including mergers and acquisitions, partnerships, collaborations, funding, and new product launches, to stay competitive in the market. For instance, in April 2023, Semikron Danfoss and ROHM Semiconductor collaborated on the implementation of silicon carbide (SiC) inside power modules. The new 1200V RGA IGBT from ROHM was added by Semikron Danfoss to their lineup of low-power modules. The new 1200V RGA IGBT from ROHM is intended to serve as a substitute for the most recent Generation 7 IGBT devices in industrial settings.