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M2M/IoT的發展 - Sub-1GHz頻帶通訊:技術，市場，用途
市場調查報告書
商品編碼
1282238

M2M/IoT的發展 - Sub-1GHz頻帶通訊:技術，市場，用途

M2M/IoT Development - Sub-1GHz Communications: Technologies, Markets, Applications
出版日期: | 出版商: PracTel, Inc. | 英文 201 Pages | 商品交期: 最快1-2個工作天內

價格

本報告提供M2M/IoT市場相關調查，關於Sub-1GHz頻帶通訊的特徵和特性，IoT/M2M的應用解說。

目錄

第1章 簡介

第2章 配合措施:M2M通訊和IoT的發展

  • M2M通訊開發
    • 特別的需求
    • 標準化- 產業活動
    • 市場
    • 產業:革新
      • Arqiva/Sensus
      • Iota Networks
      • Kore Telematics
      • SigFox/Telit
      • Telensa/Plextek
  • IoT
    • M2M和IoT
    • 開放式互連聯盟
    • 工業網際網路聯盟
    • IoT平台
    • IoT和ITU
    • IoT國際論壇
    • IEEE 2413和IoT
    • ISO/IEC
    • IoT-市場
    • 應用

第3章 Sub-1GHz發送的規格

  • ITU指定
  • Sub-1GHz傳送的優點與限制事項
  • 世代

第4章 Sub-1GHz發送:遠距的IoT/M2M通訊的支援

  • IEEE-802.15.4g-智慧公共事業網路
  • IEEE 802.22-19
  • IEEE 802.11ah(Wi-Fi HaLow)
  • IEEE 802.11af - White-Fi
  • 超窄頻(UNB)
  • 無重量通訊

第5章 Sub-1GHz發送:近距離IoT/M2M通訊的支援

  • ZigBee-IEEE 802.15.4
  • EnOcean:一般
  • Z-Wave

第6章 結論

附錄I:IEEE 802.15.4g的特性

附錄II:802.11ah-相關專利調查(2018年～2022年)

附錄III:Z-Wave-相關專利調查(2018年～2022年)

附錄IV:802.22-相關專利調查(2018年～2022年)

附錄V:EnOcean-相關專利調查(2018年～2022年)

附錄VI:802.11af-相關專利調查(2018年～2022年)

The rapid development of Internet-of-Things (IoT) and Machine-to-Machine (M2M) communications requires plenty of the frequency spectra.

This report addresses features and properties of Sub-1GHz communication, and its applications for IoT/M2M. The report is updated and revised issue of a Practel's report on this subject issued previously.

The Sub-1GHz unlicensed industrial, scientific, and medical (ISM) bands of 315, 433, 800 and 902 to 928 MHz represent a great solution for some uses. Based on pure physics, these lower frequencies naturally deliver more distance than higher frequencies for a given power level, receiver sensitivity, and antenna gain.

The following Sub-1GHz technologies, related markets, standards and applications have been addressed to show their value in the IoT/M2M development:

Short range communications

  • ZigBee/802.15.4
  • Z-Wave
  • EnOcean.

Long range communications

  • IEEE 802.15.4g
  • IEEE 802.11af
  • IEEE 802.11ah
  • IEEE 802.22
  • Weightless
  • UNB (Ultra-narrow Band)
  • Other.

The major attractions of these Sub-1GHz technologies for IoT/M2M communications include:

  • Extended range - they allow 5-10 times longer reaches over 2.4 GHz band transmissions. This is the result of smaller losses when signal is traveling through various obstacles; besides, Sub-1GHz ISM bands are less crowded
  • Low power consumption
  • Support of multiple applications.

The industry and consumers show great interest in the utilization of Sub-1GHz ISM bands for IoT/M2M communications; there are great opportunities that have not been realized until recently.

The report also surveys related to this report industries and patents.

The report is written for a wide audience of technical and managerial staff involved in the development of the IoT/M2M market.

Table of Contents

1.0. Introduction

  • 1.1. General
  • 1.2. Specifics
  • 1.3. Scope
  • 1.4. Research Methodology
  • 1.5. Target Audience

2.0. Efforts: Development of M2M Communications and IoT

  • 2.1. M2M Communications Development
    • 2.1.1. Special Needs
      • 2.1.1.1. Spectrum
      • 2.1.1.2. Summary
    • 2.1.2. Standardization - Industry Activities
      • 2.1.2.1. IEEE
      • 2.1.2.2. ETSI
      • 2.1.2.3. ITU
      • 2.1.2.4. oneM2M Alliance
        • 2.1.2.4.1. Service Layer Architecture
        • 2.1.2.4.2. Benefits
      • 2.1.2.5. M2M Alliance
      • 2.1.2.6. Open Mobile Alliance (OMA)
      • 2.1.2.7. Summary
    • 2.1.3. Market
      • 2.1.3.1. Statistics
      • 2.1.3.2. Estimate
    • 2.1.4. Industry: Innovations
      • Arqiva/Sensus
      • Iota Networks
      • Kore Telematics
      • SigFox/Telit
      • Telensa/Plextek
  • 2.2. IoT
    • 2.2.1. M2M and IoT
      • 2.2.1.1. M2M
      • 2.2.1.2. IoT
      • 2.2.1.3. IoT - M2M
    • 2.2.2. Open Interconnect Consortium
    • 2.2.3. Industrial Internet Consortium
    • 2.2.4. IoT Platforms
    • 2.2.5. IoT and ITU
    • 2.2.6. IoT International Forum
    • 2.2.7. IEEE 2413 and IoT
      • 2.2.7.1. 2413.1
      • 2.2.7.2. P2413.2
    • 2.2.8. ISO/IEC
      • 2.2.8.1. Layered Structure
    • 2.2.9. IoT - Market
    • 2.2.10. Applications

3.0. Specifics of Sub-1GHz Transmission

  • 3.1. ITU Designation
  • 3.2. Sub-1GHz Transmission Benefits and Limitations
  • 3.3. Generations
    • 3.3.1. Details

4.0. Sub-1GHz Transmission: Support for Long-reach IoT/M2M Communications

  • 4.1. IEEE-802.15.4g-Smart Utility Network
    • 4.1.1. General
    • 4.1.2. Need
    • 4.1.3. Value
    • 4.1.4. Overview-PHY
    • 4.1.5. Regions
      • 4.1.5.1. Frequencies Allocations
    • 4.1.6. Details
      • 4.1.6.1. Requirements: Major Characteristics
      • 4.1.6.2. Considerations
      • 4.1.6.3. Network Specifics
      • 4.1.6.4. PHY/MAC Modifications
    • 4.1.7. Market
    • 4.1.8. Summary
    • 4.1.9. Wi-SUN
    • 4.1.10. Manufacturers - Examples
      • Analog Devices
      • Elster (a part of Honeywell)
      • Microchip
      • TI
  • 4.2. IEEE 802.22-19
    • 4.2.1. General
    • 4.2.2. Status - IEEE 802.22-19
    • 4.2.3. Developments
    • 4.2.4. IEEE 802.22-2019 Overview
      • 4.2.4.1. Major Characteristics
    • 4.2.5. IEEE 802.22 Details
      • 4.2.5.1. Physical Layer - Major Characteristics
      • 4.2.5.2. MAC Layer
    • 4.2.6. Cognitive Functions
    • 4.2.7. IEEE 802.22 - Marketing Considerations for SG
    • 4.2.8. Major Applications
    • 4.2.9. Usage Models
    • 4.2.10. Benefits
    • 4.2.11. Summary
    • 4.2.12. Group
      • 4.2.12.1. IEEE 802.22.1
      • 4.2.12.2. IEEE 802.22.2
      • 4.2.12.3. IEEE 802.22a-2014
      • 4.2.12.4. IEEE 802.22b-2015
      • 4.2.12.5. IEEE P802.22.3-Standard for Spectrum Characterization and Occupancy Sensing
      • 4.2.12.6. 8802-22:2015/Amd 1-2017
  • 4.3. IEEE 802.11ah (Wi-Fi HaLow)
    • 4.3.1. General
    • 4.3.2. Goal and Schedule
    • 4.3.3. Attributes
    • 4.3.4. Use Cases
    • 4.3.5. PHY
      • 4.3.5.1. Bandwidth
      • 4.3.5.2. Channelization
      • 4.3.5.3. Transmission Modes and MIMO
    • 4.3.6. MAC Layer
    • 4.3.7. Summary
    • 4.3.8. Vendors
      • Methods2Business
      • Morse Micro
      • Newracom-Aviacomm
      • Palma Ceia SemiDesign
      • Silex
  • 4.4. IEEE 802.11af - White-Fi
    • 4.4.1. General: Expectations - White-Fi
    • 4.4.2. Differences
    • 4.4.3. Benefits
    • 4.4.4. Specifics
      • 4.4.4.1. Interference
      • 4.4.4.2. Main Principles
    • 4.4.5. PHY
    • 4.4.6. Architecture
    • 4.4.7. Market
    • 4.4.8. Vendors
      • Aviacomm
      • Carlson Wireless
  • 4.5. Ultra Narrow Band (UNB)
    • 4.5.1. Origin
    • 4.5.2. Support
    • 4.5.3. Major Features
    • 4.5.4. SigFox
      • 4.5.4.1. Company
      • 4.5.4.2. Technology-Details
      • 4.5.4.3. Uplink
      • 4.5.4.4. Downlink
      • 4.5.4.5. SmartLNB
      • 4.5.4.6. Coverage
      • 4.5.4.7. Use Cases
      • 4.5.4.8. Industry
        • Adeunis RF
        • Innocomm
        • Microchip
        • On Semiconductor
        • Telit
        • TI
  • 4.6. Weightless Communications
    • 4.6.1. SIG
    • 4.6.2. Weightless-N
      • 4.6.2.1. General
      • 4.6.2.2. Open Standard
      • 4.6.2.3. Nwave
      • 4.6.2.4. Summary
    • 4.6.3. Weightless-P
      • 4.6.3.1. General
      • 4.6.3.2. Details
      • 4.6.3.3. Vendors
    • 4.6.4. Weightless Technologies and Competition

5.0. Sub-1GHz Transmission: Support of Short-reach IoT/M2M Communications

  • 5.1. ZigBee - IEEE 802.15.4
    • 5.1.1. General
    • 5.1.2. Sub-1GHz ZigBee: Specifics
    • 5.1.3. ZigBee Acceptance
    • 5.1.4. Major Features: ZigBee/802.15.4
    • 5.1.5. Device Types
    • 5.1.6. Protocol Stack
      • 5.1.6.1. Physical and MAC Layers - IEEE802.15.4
      • 5.1.6.2. Upper Layers
    • 5.1.7. Security
    • 5.1.8. Power Consumption
    • 5.1.9. ZigBee Technology Benefits and Limitations
    • 5.1.10. Standardization Process
      • 5.1.10.1. Ratifications
      • 5.1.10.2. Alliance
        • 5.1.10.2.1. ZigBee Pro 2017
    • 5.1.11. Applications Specifics - Application Profiles
      • 5.1.11.1. "Green" ZigBee
      • 5.1.11.2. ZigBee Telecom Services
      • 5.1.11.3. Building Automation
      • 5.1.11.4. Smart Energy Profile
        • 5.1.11.4.1. Features
        • 5.1.11.4.2. Smart Energy Profile V.2.0
        • 5.1.11.4.3. ZigBee IP
      • 5.1.11.5. ZigBee Network Devices-IP Gateway
    • 5.1.12. Market
      • 5.1.12.1. Expectations-Technology Stack
      • 5.1.12.2. Segments
      • 5.1.12.3. Forecast
    • 5.1.13. Sub-1GHz ZigBee: Certification
    • 5.1.14. Industry
      • Adaptive Networks Solutions (RF Sub-1GHz)
      • Microchip Technologies (Modules, Sub-1GHz)
      • NXP
      • Renesas (Platforms, AMR, Sub-1GHz)
      • Silicon Laboratories (Chipsets, Modules, Sub-1GHz)
      • TI (Chipsets, Sub-1GHz)
  • 5.2. EnOcean: General
    • 5.2.1. The Company
    • 5.2.2. EnOcean Alliance
    • 5.2.3. Standard
      • 5.2.3.1. Features
      • 5.2.3.2. Drivers
    • 5.2.4. Technology Details
      • 5.2.4.1. Framework
      • 5.2.4.2. Generations
    • 5.2.5. Profiles
    • 5.2.6. Benefits
    • 5.2.7. Market Estimate
    • 5.2.8. Industry
      • BSC Magnum
      • Beckhoff
      • Echoflex
      • Illumra
      • Leviton
      • Thermokon
  • 5.3. Z-Wave
    • 5.3.1. General
    • 5.3.2. Z-Wave Alliance
    • 5.3.3. Benefits
    • 5.3.4. Details
      • 5.3.4.1. General
      • 5.3.4.2. Characteristics
      • 5.3.4.3. ITU G.9959
    • 5.3.5. Advanced Energy Control Framework
    • 5.3.6. Z-Wave and Smart Metering
    • 5.3.7. Selected Vendors
      • Aeon Labs-Aeotec
      • NorthQ
      • Vera Control
    • 5.3.8. Market Estimate
      • 5.3.8.1. Model
      • 5.3.8.2. Results

6.0. Conclusions

Appendix I: IEEE 802.15.4g Characteristics

Appendix II: 802.11ah - related Patents Survey (2018-2022)

Appendix III: Z-Wave - related Patents Survey (2018-2022)

Appendix IV: 802.22 - related Patents Survey (2018-2022)

Appendix V: EnOcean - related Patents Survey (2018-2022)

Appendix VI: 802.11af - related Patents Survey (2018-2022)

List of Figures

  • Figure 1: Regions: Sub-1GHz Band
  • Figure 2: IoT Environment
  • Figure 3: Key M2M Elements
  • Figure 4: ETSI Activity
  • Figure 5: Use Cases
  • Figure 6: ETSI-High-level M2M Architecture
  • Figure 7: oneM2M Layered Model
  • Figure 8: Service Layer Positioning
  • Figure 9: Summary - M2M Standardization
  • Figure 10: M2M Major Applications
  • Figure 11: Estimate: M2M Traffic Growth (PB/Month)
  • Figure 12: Estimate-M2M Service Market - Global ($B)
  • Figure 13: Estimate: Cellular Operators Revenue - M2M Services - Global ($B)
  • Figure 15: IoT - Layered Structure
  • Figure 16: Estimate: IoT Technologies and Applications Market - Global ($T)
  • Figure 17: Estimate - Total Number of Smart Devices in Smart Homes - Global (Bil. Units)
  • Figure 18: M2M/IoT Spectrum of Applications
  • Figure 19: Bands - ITU Designation
  • Figure 20: Range
  • Figure 21: Power Consumption
  • Figure 22: Rates
  • Figure 23: Global Sub-1GHz Frequencies
  • Figure 24: Sub-1GHz Transmission Characteristics
  • Figure 25: ZigBee-2.4 GHz vs. 900 MHz
  • Figure 26: Properties Comparison
  • Figure 27: SUN Connectivity
  • Figure 28: 802.15.4g Radio Operating Bands
  • Figure 29: Estimate: Global Market - Smart Grid SUN ($B)
  • Figure 30: Estimate: 802.22 Technology- U.S. Market Size ($B)
  • Figure 31: IEEE 802.22 Usage Scenarios
  • Figure 32: Major Characteristics: IEEE 802.22
  • Figure 33: Standardized Frequency Spectrum (sub-1 GHz)
  • Figure 34: 802.11ah - Channelization Plan in U.S.
  • Figure 35: 802.11ah Features Summary
  • Figure 36: 802.11af Network Setup
  • Figure 37: Comparison
  • Figure 38: Uplink Frame Format
  • Figure 39: Downlink Frame Format
  • Figure 40: ZigBee Characteristics
  • Figure 41: ZigBee/802.15.4 Protocol Stack
  • Figure 42: ZigBee/802.15.4 Characteristics
  • Figure 43: Profiles
  • Figure 44: ZigBee IP Gateway Protocol Stack
  • Figure 45: Technology Stack
  • Figure 46: Estimate - U.S. Market Size - ZigBee Chips Shipped ($B)
  • Figure 47: Estimate - U.S. Market Size - ZigBee Chips - Sub-1GHz Shipped ($B)
  • Figure 48: ZigBee Market Segmentation (2022)
  • Figure 49: ZigBee Market Segmentation (2026)
  • Figure 50: Functionalities
  • Figure 51: Major Features
  • Figure 52: Energy Consumption Requirements
  • Figure 53: Estimate: EnOcean Equipment Sales - Global ($B)
  • Figure 54: Estimate: EnOcean Industry Modules Sales - Global (Mil. Units)
  • Figure 55: Estimate: U.S. Small SH Z-Wave IC Market Size ($B)
  • Figure 56: Estimate: U.S. Large SH Z-Wave IC Market ($B)