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車載用記憶體晶片:產業分析 (2022年)
市場調查報告書
商品編碼
1187318

車載用記憶體晶片:產業分析 (2022年)

Automotive Memory Chip Industry Research Report, 2022
出版日期: | 出版商: ResearchInChina | 英文 270 Pages | 商品交期: 最快1-2個工作天內

價格
簡介目錄

全球車載用儲存的市場規模2021年顯示約45億美元，預計從2021年到2027年以18.6％的年複合成長率發展，2027年成長到125億美元以上的規模。

目前車載用記憶體市場上，DRAM (DDR，LPDDR) 、NAND (MMC，UFS等) 為成為主流。今後預計低功率的LPDDR和NAND成為主要的成長引擎，晶片推出用的NOR Flash的需求也將增加。還有智慧型駕駛等級的提高，帶給作為汽車ADAS用的浮點運算晶片專門RAM的GDDR的需求直接的影響。

本報告提供車載用記憶體晶片產業調查，產業概要，車載用記憶體晶片的類型與用途，記憶體晶片的汽車情境，海外及中國國內的車載用記憶體晶片供應商的分析等彙整資料。

目錄

第1章 車載用記憶體晶片產業概要

  • 記憶體晶片產業現狀
  • 車載用記憶體晶片產業現狀
  • 車載用記憶體晶片的需求與用途的展望
  • 車載用記憶體晶片市場競爭情形
  • 適合汽車儲存的汽車等級的規格與認證
  • 晶片出口法規中的車載用記憶體晶片的供應鏈保全

第2章 車載用記憶體晶片種類與用途

  • 記憶體單位的分類
  • DRAM技術與汽車的應用
  • SRAM技術與汽車的應用
  • NAND快閃記憶體技術和汽車用途
  • NORflash技術和汽車用途
  • EEPROM技術與汽車的應用
  • FRAM技術與汽車的應用

第3章 記憶體晶片的汽車情境

  • 記憶體晶片裝載情境:駕駛座
  • 記憶體晶片裝載情境:自動駕駛
  • 記憶體晶片裝載情境:駕駛資料的記錄
  • 記憶體晶片裝載情境:雲端運算和儲存

第4章 海外的車載用記憶體晶片供應商

  • Samsung
  • SK Hynix
  • Micron
  • Kioxia (Toshiba)
  • Fujitsu
  • Western Digital
  • Dell EMC
  • Silicon Motion

第5章 中國的車載用記憶體晶片供應商

  • Yangtze Memory
  • CXMT
  • XMC
  • GigaDevice
  • Ingenic
  • Giantec Semiconductor
  • Puya Semiconductor
  • Fudan Microelectronics
  • Longsys
  • Macronix
  • BIWIN Storage Technology
簡介目錄
Product Code: YS035

Automotive Memory Chip Research: Localization is imperative amid intense competition

The global smart phone storage market size hit US$46 billion in 2021 when the global automotive storage market size reached about US$4.5 billion, which is only equivalent to 1/10 of the former. Under development trend of intelligent connected vehicles, automobiles will become one of main growth engines of memory IC industry. By 2027, global automotive storage market size will exceed US$12.5 billion, with a CAGR of 18.6% from 2021 to 2027.

According to Micron Technology, the automotive storage market in China amounted to about US$700 million in 2021, and it will jump to US$1.5 billion by 2023. On the one hand, the growth momentum comes from growth of automobile shipments in China; on the other hand, it also benefits from continuous expansion of automotive memory and memory capacity.

High-level autonomous vehicles have posed enormous demand for automotive memory capacity, density and bandwidth

At present, main storage applications in automotive market include DRAM(DDR, LPDDR) and NAND (e.MMC and UFS, etc.). Low-power LPDDR and NAND will be main growth engines, and the demand for NOR Flash, used for chip startup, will continue to increase. In addition, higher intelligent driving levels will have a direct impact on the demand for GDDR, which is RAM specially used for ADAS floating-point computing chips in vehicles.

More powerful sensors, ADAS/AD integrated systems, central computers, digital cockpits, event recording systems,terminal-cloud computing, vehicle FOTA, etc. all put forward higher requirements for automotive memory. On the one hand, the memory capacity will go up from gigabytes (GB) to terabytes (TB); on the other hand, the memory density and bandwidth will be greatly improved.

For example, NAND Flash mainly store continuous data in ADAS, IVI systems, automotive center console systems, etc. As autonomous driving levels up, the demand for NAND capacity in ADAS has swelled. Generally, L1/L2 ADAS only requires the mainstream 8GB e-MMC, L3 needs 128/256GB, and L5 may involve over 2TBt. In the future, the data production, transmission and recording of advanced autonomous vehicles will require higher density and speed, so that PCIe SSD may be adopted.

Autonomous vehicles boast more and more internal and external perception devices, including front cameras, internal cameras, high-resolution imaging radar, LiDAR, etc., and they will exploit high-density NOR Flash(QSPI, xSPI, etc., for chip startup) and DRAM(LPDDR3/4, LPDDR5, GDDR, etc.) widely.

At present, L1-L2 autonomous vehicles largely use LPDDR3 or LPDDR4, with the bandwidth of 25-50 GB/s. The bandwidth requirement is raised to 200GB/s for L3 autonomous driving, 300GB/s for L4 and 500GB/s for L5. Therefore, LPDDR5 and GDDR6 with higher bandwidth can simplify the system design of high-level autonomous vehicles.

Counterpoint's data shows that in the next decade, the memory capacity of a single vehicle will reach 2TB~11TB, catering to the requirements of different autonomous driving levels.

At the same time, autonomous driving is driven by data. The development of ADAS platforms needs massive road test data from cameras, radar, LiDAR, GPS and the like. These data are uploaded to the cloud for storage, AI training, simulation testing and verification. A one-hour L2 or L4-L5 road test probably generates 2TB or 16-20TB of data correspondingly, so that a single road test will produce 8-60TB of data, and the entire development cycle will churn out exabytes (EB) of data.

This has triggered huge market demand for autonomous driving cloud storage. In China, there are many cloud service providers that offer product solutions for autonomous driving data cloud storage, including Tencent Cloud, Alibaba Cloud, WD My Cloud, Sugon ParaStor, YRCloudFile, XSKY and so on.

As the functions of intelligent cockpits become more and more diversified, larger storage capacity is constantly in demand, and storage technology is constantly innovating

With the wide application of central integrated digital cockpits, DRAM has evolved from DDR2 and DDR3 to LPDDR4, LPDDR5 or GDDR. In addition, the interface of mobile phones has transferred from eMMC to UFS, so will smart cockpit memory chips. It is also possible for high-end models to adopt PCIe SSD.

The cores of both UFS and eMMC interfaces involve NAND flash, but their control interfaces follow different protocols. The maximum communication rate of eMMC is 400MB/s, relative to 1,160 MB/s of UFS. The communication speed directly affects the startup time and software loading time of vehicles, which offer varying experience. In response to the demand for faster startup, reading and writing, the storage in the cockpit field must support UFS2.1 at least. Qualcomm's third-generation 8155 cockpit SoC has already endorsed UFS interfaces.

The intelligent cockpits of newly launched models demonstrate the increasingly powerful storage capacity:

  • Xpeng P7 launched in 2020 is equipped with Qualcomm Snapdragon 820A with 8G memory + 128GB storage, enabling users to download more automotive Apps, supporting applet expansion, and featuring both practicality and fun;
  • The next-generation SA8155P-based ZEEKR intelligent cockpit, available in ZEEKR 001 unveiled in 2021, has an 8-core CPU of the 7 nm process, with 16G memory and 128GB storage.
  • Li L9 which debuted in 2022 comes standard with two Qualcomm Snapdragon 8155 chips with 24G memory and 256GB high-speed storage, which together form a powerful computing platform.

Chinese storage suppliers accelerate deployment in the promising automotive storage market

The requirements for automotive storage products are much higher than those for consumer electronics. Automotive-grade storage products have to take a long R&D and verification cycle, undergo a complicated certification process, comply with IATF16949, ASPCIE and ISO 26262, and satisfy the standards of some automakers, such as GMW3172 and VW80000. As a result, this market poses high barriers to entry and embodies obvious oligopoly.

Overseas storage vendors such as Micron, Samsung, SK Hynix and Microchip still dominate the development of the automotive storage industry as monopolists. Among them, Micron enjoys the global market share of over 45%. In 2021, Micron launched its industry-leading automotive LPDDR5 certified by ISO 26262 ASIL-D, with the maximum capacity of 128GB.

In recent years, Chinese memory chip vendors have made great efforts in automotive storage products:

  • SRAM: Ingenic has been focusing on independent CPU, SoC and AI engines for many years. In 2020, it acquired 100% stake in Beijing ISSI. By virtue of intellectual property rights, it can completely avoid the impact of the sanctions imposed by the United States government, independently develop and produce SRAM in line with automotive regulations, and produce niche DRAM. Ingenic has reached close cooperation with auto parts vendors such as Bosch and Continental.
  • EEPROM: Giantec Semiconductor, a leading EEPROM enterprise in China, launched GT24C512B, a high-reliability automotive A1-grade memory chip, in August 2022, which can withstand erasing and writing for up to 4 million times at room temperature, and has been applied to OBC, VCU and other related fields.
  • NOR Flash: GigaDevice has delved in the field of NOR Flash for many years. By market share, it ranks first in China and third in the world. The GD25 series launched by GigaDevice is the only mass-produced NOR Flash in China that meets AEC-Q100, with the storage capacity of 2Mb~2Gb.

In addition to OEMs, there is another type of storage players in China, like Longsys, BIWIN Storage Technology and Powe, who buy wafers and particles from IDMs and purchase master chips from third-party master chip vendors, then conduct packaging tests through their own or third-party packaging and testing factories, and produce storage products of different storage types, interfaces and standards.

Table of Contents

1 Overview of Automotive Memory Chip Industry

  • 1.1 Status Quo of Memory Chip Industry
    • 1.1.1 Global Chip Industry Statistics in 2022 and Forecast for 2023
    • 1.1.2 Global Memory Chip Development Trend: Market Size
    • 1.1.3 Global Memory Chip Development Trend: Market Size: ASP (Average Selling Price) over the Years
    • 1.1.4 Size of Memory Chip Market Segments and Market Share of Vendors
    • 1.1.5 Composition of NAND SSD Industry Chain
    • 1.1.6 Composition of Embedded NAND (eMMC, UFS) Industry Chain
    • 1.1.7 Composition of DRAM (DDR memory) Industry Chain
    • 1.1.8 Global Major Flash OEMs (with Fab Capabilities) (1)
    • 1.1.9 Global Major Flash OEMs (with Fab Capabilities) (2)
    • 1.1.10 Global Major Flash OEMs (with Fab Capabilities) (3)
    • 1.1.11 Competition between Chinese Memory Chip Vendors
    • 1.1.12 Comparison between Chinese Memory Chip Vendors in Revenue
    • 1.1.13 Four Types of Chinese Memory Chip Vendors (1)
    • 1.1.14 Four Types of Chinese Memory Chip Vendors (2)
    • 1.1.15 Summary of 30 Chinese Memory and Master Chip Vendors
    • 1.1.16 Details of 30 Chinese Memory and Master Chip Vendors (1)
    • 1.1.17 Details of 30 Chinese Memory and Master Chip Vendors (2)
    • 1.1.18 Details of 30 Chinese Memory and Master Chip Vendors (3)
    • 1.1.19 Details of 30 Chinese Memory and Master Chip Vendors (4)
    • 1.1.20 Details of 30 Chinese Memory and Master Chip Vendors (5)
  • 1.2 Status Quo of Automotive Memory Chip Industry
    • 1.2.1 Classification of Automotive Chips
    • 1.2.2 Classification and Application of Automotive Memory Chips
    • 1.2.3 Application Scenarios of Automotive Memory Chips
    • 1.2.4 Global Automotive Memory Chip Market Size, 2021- 2025E
    • 1.2.5 Application and Forecast of Automotive Memory Chips in ADAS, Cockpits and Other Scenarios
    • 1.2.6 Overall Technical Evolution of Automotive Memory Chips
    • 1.2.7 The Storage Capacity of DRAM and NAND of Various Models Will Double in the Next Few Years
    • 1.2.8 Automotive Storage Technology Transformation (1)
    • 1.2.9 Automotive Storage Technology Transformation (2)
    • 1.2.10 Major Automotive Memory Chip Enterprises at Home and Abroad
  • 1.3 Demand for and Application Prospect of Automotive Memory Chips
    • 1.3.1 Storage Requirements of Intelligent Vehicles by Sub-module
    • 1.3.2 Sources of In-vehicle Data
    • 1.3.3 Requirements of L3-L5 Autonomous Driving for Bandwidth and Capacity of Automotive Memory Chips (1)
    • 1.3.4 Requirements of L3-L5 Autonomous Driving for Bandwidth and Capacity of Automotive Memory Chips (2)
    • 1.3.5 Requirements of Sensor Data for Automotive Memory Chips (1)
    • 1.3.6 Requirements of Sensor Data for Automotive Memory Chips (2)
    • 1.3.7 Requirements of Sensor Data for Automotive Memory Chips (3)
    • 1.3.8 Event Data Recorders (EDR) Require GB Storage (1)
    • 1.3.9 Event Data Recorders (EDR) Require GB Storage (2)
    • 1.3.10 Software-defined Vehicles, E/E Architecture Evolution and Terminal-Roadside-Cloud Collaboration Propose Further Storage Requirements
    • 1.3.11 2TB+ NAND Storage Will Be Required in 2025 under the Trend of Multi-domain Fusion and Centralized EEA
  • 1.4 Competitive Landscape of Automotive Memory Chip Market
    • 1.4.1 Competitive Landscape of Automotive Memory Chip Market
    • 1.4.2 Competitive Landscape of Automotive Memory Chip Market at Home and Abroad (1)
    • 1.4.3 Competitive Landscape of Automotive Memory Chip Market at Home and Abroad (2)
  • 1.5 Automotive-grade Standards and Certification for Automotive Storage
    • 1.5.1 Vehicle Supply Chain Access and Certification Process for Automotive Memory Chips
    • 1.5.2 Automotive-grade Standards and Certification Specifications for Automotive Memory Chips (1)
    • 1.5.3 Automotive-grade Standards and Certification Specifications for Automotive Memory Chips (2)
    • 1.5.4 Vehicle Supply Chain Standard System Specifications for Automotive Memory Chips
    • 1.5.5 AEC-Q100 for Automotive Memory Chips
    • 1.5.6 AEC-Q100 Test Items
    • 1.5.7 ISO 26262 for Automotive Chip Supply Chain
    • 1.5.8 ISO 26262 ASIL for Automotive Chips
    • 1.5.9 Semiconductor Classification by ISO 26262
  • 1.6 Supply Chain Security of Automotive Memory Chips amid Chip Sanctions
    • 1.6.1 The U.S. Restricts Exports of Advanced Computing Chips to China
    • 1.6.2 Status Quo of China's Memory Chip Supply Chain (1): Semiconductor Materials and Equipment
    • 1.6.3 Status Quo of China's Memory Chip Supply Chain (2): Design, Manufacturing, Packaging and Testing
    • 1.6.4 Status Quo of China's Memory Chip Supply Chain (3): Memory Chip IP
    • 1.6.5 The Localization Rate of Memory Chips Gradually Increases (1)
    • 1.6.6 The Localization Rate of Memory Chips Gradually Increases (2)
    • 1.6.7 Xtacking® 3D NAND of Yangtze Memory
    • 1.6.8 Yangtze Memory Mass-produces Xtacking® 3D NAND

2 Types and Application of Automotive Memory Chips

  • 2.1 Classification of Memory Units
    • 2.1.1 Classification of Storage Technologies (1)
    • 2.1.2 Positions of Different Memory Units in the Computing Unit
    • 2.1.3 Type 1: Volatile Memory (RAM)
    • 2.1.4 Type 2: Non-Volatile Memory (ROM)
    • 2.1.5 Type 2: Non-Volatile Memory (ROM): Classification of Flash Memory
    • 2.1.6 Application of Memory Chips in Automobiles by Type (1)
    • 2.1.7 Application of Memory Chips in Automobiles by Type (2)
    • 2.1.8 Application of Memory Chips in Automobiles by Type (3)
  • 2.2 DRAM Technology and Its Application in Automobiles
    • 2.2.1 Technical Principle of DRAM
    • 2.2.2 Three Development Directions of DRAM
    • 2.2.3 Automotive DRAM Demand and Value in a Single Vehicle
    • 2.2.4 The Demand for Automotive DRAM Capacity Is Constantly Increasing
    • 2.2.5 Global Automotive DRAM Market Size (1)
    • 2.2.6 Global Automotive DRAM Market Size (2)
    • 2.2.7 Competitive Landscape of Automotive DRAM Market
    • 2.2.8 Main Vendors and Product Layout in Automotive DRAM Market
    • 2.2.9 Evolution of Automotive DRAM Technology
    • 2.2.10 Evolution of Automotive DRAM Technology: Technology Roadmap of Suppliers
    • 2.2.11 Application of In-vehicle DRAM: (1)
    • 2.2.12 Application of In-vehicle DRAM: (2)
    • 2.2.13 Application of In-vehicle DRAM: (3)
    • 2.2.14 Application of In-vehicle DRAM: (4)
    • 2.2.15 Application of In-vehicle DRAM: (5)
    • 2.2.16 Application of In-vehicle DRAM: (6)
    • 2.2.17 Application of In-vehicle DRAM: (7)
    • 2.2.18 Application of In-vehicle DRAM: (8)
    • 2.2.19 Application of In-vehicle DRAM: (9)
    • 2.2.20 Application of In-vehicle DRAM: (10)
  • 2.3 SRAM Technology and Its Application in Automobiles
    • 2.3.1 Technical Principle of SRAM
    • 2.3.2 Technical Features, Clock Frequency and Power Consumption of SRAM
    • 2.3.3 In-vehicle application of SRAM: Application in Automotive ECU
    • 2.3.4 In-vehicle Application of SRAM: Advantages of NXP S32G2 adopting on-chip SRAM
    • 2.3.5 In-vehicle Application of SRAM: NXP S32G3 adopts on-chip SRAM
    • 2.3.6 In-vehicle Application of SRAM: NPU core of Tesla FSD chip
  • 2.4 NAND Flash Technology and Automotive Application
    • 2.4.1 Classification and Technical Features of four NAND Flash Technologies.
    • 2.4.2 Purposes of NAND Flash with Different Architectures
    • 2.4.3 NAND Storage Architecture: Flash Storage Particle + Externally Packaged Controller
    • 2.4.4 Evolution Direction of NAND Technology (1)
    • 2.4.5 Evolution Direction of NAND Technology (2)
    • 2.4.6 Competitive Landscape of Global NAND Flash market
    • 2.4.7 Yangtze Memory Has Mass-produced 128-layer NAND Flash
    • 2.4.8 Demand of Intelligent Cockpits and ADAS for NAND
    • 2.4.9 NAND: A Single Vehicle Requires 2TB
    • 2.4.10 Types of Mainstream NAND Flash Products
    • 2.4.11 NAND: Technical Innovation Is Accelerating, and Domestic Vendors Are Dabbling in Automotive-grade Application
    • 2.4.12 Global Automotive NAND Flash Market Space Estimation
    • 2.4.13 Competitive Landscape of Global Automotive NAND Flash Market
  • 2.5 NOR Flash Technology and Automotive Application
    • 2.5.1 Technical Principle of NOR Flash
    • 2.5.2 Technical features of NOR Flash
    • 2.5.3 NOR Flash Finds a Huge Application Space in ADAS
    • 2.5.4 Global Automotive-grade NOR Flash Market Size Estimation
    • 2.5.5 Competitive Landscape of Global NOR Flash Market (1)
    • 2.5.6 Competitive Landscape of Global NOR Flash Market (2)
    • 2.5.7 Layout of Global NOR Flash Giants
    • 2.5.8 GigaDevice's GD25SPI NOR Flash Automotive Digital Combined Cluster Solution
  • 2.6 EEPROM Technology and Its Application in Automobiles
    • 2.6.1 Technical Principle and Classification of ROM
    • 2.6.2 Technical Advantages of EEPROM
    • 2.6.3 Broad Automotive Application Prospect of EEPROM
    • 2.6.4 Chinese Vendors Speed up the Layout in the Relatively Small Global EEPROM Market
    • 2.6.5 Competitive Landscape of Global Automotive EEPROM Market (1)
    • 2.6.6 Competitive Landscape of Global Automotive EEPROM Market (2)
  • 2.7 FRAM Technology and Its Application in Automobiles
    • 2.7.1 Technical Advantages of FRAM
    • 2.7.2 Automotive Application Scenarios of FRAM (1)
    • 2.7.3 Automotive Application Scenarios of FRAM (2)
    • 2.7.4 Application of FRAM in VCU

3 Automotive Application Scenarios of Memory Chips

  • 3.1 Memory Chip Application Scenario: Cockpit
    • 3.1.1 Requirements of Liquid Crystal Cluster for eMMC Storage Capacity
    • 3.1.2 Requirements of Center Console Navigation Host for eMMC Storage Capacity
    • 3.1.3 Requirements of Cockpit Domain Controller for Storage Capacity
    • 3.1.4 Cockpit Domain Controller System Framework and Storage Requirements
    • 3.1.5 Intelligent Cockpit Storage Requirements: Memory Chips Must Meet Automotive Regulations
    • 3.1.6 Intelligent Cockpit Storage Requirements: The Reading Speed Should Be Faster, and the Memory Chip Interface of the Intelligent Cockpit Should Be Gradually Upgraded to UFS (1)
    • 3.1.7 Intelligent Cockpit Storage Requirements: The Reading Speed Should Be Faster, and the Memory Chip Interface of the Intelligent Cockpit Should Be Gradually Upgraded to UFS (2)
    • 3.1.8 Intelligent Cockpit Storage Requirements: Comparison between eMMC and UFS (1)
    • 3.1.9 Intelligent Cockpit Storage Requirements: Comparison between eMMC and UFS (2)
    • 3.1.10 Intelligent Cockpit Storage Requirements: Comparison between eMMC and UFS (3)
    • 3.1.11 Intelligent Cockpit Storage Requirements: Comparison between eMMC and UFS (4)
    • 3.1.12 Intelligent Cockpit Storage Requirements: Comparison between eMMC and UFS (5): Measured Performance Comparison between UFS and eMMC
    • 3.1.13 Intelligent Cockpit Storage Requirements: Storage Requirements of Driving Recorder (Event Data Recorder) (1)
    • 3.1.14 Intelligent Cockpit Storage Requirements: Storage Requirements of Driving Recorder (Event Data Recorder) (2)
    • 3.1.15 Intelligent Cockpit Storage Requirements: Repeatable Erasing & Writing and Dynamic Wear Leveling
    • 3.1.16 Cockpit Storage Case: Tesla Recalls Vehicles to Replace eMMC Memory (1)
    • 3.1.17 Cockpit Storage Case: Tesla Recalls Vehicles to Replace eMMC Memory (2)
    • 3.1.18 Cockpit Storage Case: Tesla Recalls Vehicles to Replace eMMC Memory (3)
  • 3.2 Memory Chip Application Scenario: Autonomous Driving
    • 3.2.1 ADAS Storage Requirements Generated by ADAS Sensors
    • 3.2.2 Data Storage Requirements of L4 Autonomous Vehicles
    • 3.2.3 Local Data Storage Requirements of Different Autonomous Driving Levels (GB)
    • 3.2.4 Autonomous Driving Data Flow and Types
    • 3.2.5 Autonomous Driving Hierarchical Storage Solutions
    • 3.2.6 Storage Capacity Requirements of Different Autonomous Driving Levels
  • 3.3 Memory Chip Application Scenario: Driving Data Recording
    • 3.3.1 Development Trend of Global EDR Standards
    • 3.3.2 Implementation Roadmap of Compulsory National EDR Standards (1)
    • 3.3.3 Implementation Roadmap of Compulsory National EDR Standards (2)
    • 3.3.4 Implementation Roadmap of Compulsory National EDR Standards (3)
    • 3.3.5 Local EDR Laws and Regulations
    • 3.3.6 Application of FRAM in EDR
  • 3.4 Memory Chip Application Scenarios: Cloud Computing and Storage
    • 3.4.1 Automotive Cloud Storage Facilitates Data Processing in Autonomous Driving R&D
    • 3.4.2 Cloud Storage of Vehicle Data May Face Regulatory Issues in "Data Privacy and Security"
    • 3.4.3 Limitations of Automotive Cloud Storage: Traffic Costs and Data Security Regulatory Issues
    • 3.4.4 Workflow of Autonomous Driving AI Learning Scenario
    • 3.4.5 Challenges for Data Storage in Autonomous Driving AI Learning System
    • 3.4.6 XSKY's Cloud Storage Solution and Efficient Data Platform for Autonomous Driving
    • 3.4.7 Autonomous Driving Distributed Storage Product of Yan Rong Tech: YRCloudFile
    • 3.4.8 Cases of WD My Cloud
    • 3.4.9 "Storage + Computing" Autonomous Driving Solution of Sugon ParaStor

4 Overseas Automotive Memory Chip Vendors

  • 4.1 Samsung
    • 4.1.1 Operation
    • 4.1.2 Automotive Storage Product Line
    • 4.1.3 Roadmap of DRAM and NAND
  • 4.2 SK Hynix
    • 4.2.1 Operation
    • 4.2.2 Automotive Storage Product Line
    • 4.2.3 Automotive LPDDR5
    • 4.2.4 Mass Production of HBM3
  • 4.3 Micron
    • 4.3.1 Operation
    • 4.3.2 Automotive Storage Product Line
    • 4.3.3 Automotive-grade LPDDR5X Certified by ASIL D
    • 4.3.4 Automotive-grade UFS 3.1 Is Widely Used in ADAS and IVI Systems
    • 4.3.5 Latest Automotive Application Cases
  • 4.4 Kioxia (Toshiba)
    • 4.4.1 Operation
    • 4.4.2 Automotive Storage Products
    • 4.4.3 Technical Features of Automotive UFS2.1 Products
    • 4.4.4 Technical Features of Automotive UFS3.1 Products
    • 4.4.5 Automotive-grade UFS3.1 Uses BiCS Flash 3D Technology.
    • 4.4.6 Technical Features of Automotive eMMC Products
  • 4.5 Fujitsu
    • 4.5.1 Product Lineup: FRAM, ReRAM and NRAM
    • 4.5.2 Technical Advantages of FRAM
    • 4.5.3 Wide Application of FRAM
    • 4.5.4 Technical Features of Automotive-grade FRAM Products
    • 4.5.5 Application of FRAM in Battery Management System (BMS)
    • 4.5.6 Application of FRAM in Vehicle Control Unit (VCU)
    • 4.5.7 4Mbit High-capacity FRAM Empowers Future Cars
    • 4.5.8 Novel NRAM Has the Advantages of Both FRAM and NOR Flash.
    • 4.5.9 Novel Non-volatile ReRAM (Resistive Memory)
    • 4.5.10 Parameter comparison between EEPROM, NOR Flash, FRAM, NRAM and ReRAM.
  • 4.6 Western Digital
    • 4.6.1 Automotive Storage Product Line (1)
    • 4.6.2 Automotive Storage Product Line (2)
    • 4.6.3 iNAND AT EU312 UFS (mainly used for intelligent cockpit storage)
  • 4.7 Dell EMC
    • 4.7.1 Automotive Storage Business
    • 4.7.2 PowerScale Storage System (used in ADAS/AD R&D platforms)
  • 4.8 Silicon Motion
    • 4.8.1 Operation
    • 4.8.2 Automotive Storage Solutions
    • 4.8.1 Automotive Storage Product Line (1)
    • 4.8.2 Automotive Storage Product Line (2)
    • 4.8.5 Automotive PCIe NVMe SSD Controller
    • 4.8.6 Ferri Automotive Single Chip Storage Solution

5 Chinese Automotive Memory Chip Vendors

  • 5.1 Yangtze Memory
    • 5.1.1 Business
    • 5.1.2 Global Market Share
    • 5.1.3 UFS 3.1
    • 5.1.4 3D NAND technology
  • 5.2 CXMT
    • 5.2.1 Business
    • 5.2.2 DRAM Technology Roadmap
  • 5.3 XMC
    • 5.3.1 Business
    • 5.3.2 NOR Flash Foundry Business
    • 5.3.3 NOR Flash Products
  • 5.4 GigaDevice
    • 5.4.1 Business
    • 5.4.2 NOR Flash Product Series
    • 5.4.3 Automotive-grade NOR Flash GD25
    • 5.4.4 DRAM DDR4 Products
  • 5.5 Ingenic
    • 5.5.1 Business
    • 5.5.2 Overview of Segmented Business
    • 5.5.3 Automotive-grade DDR4 SDRAM Products
    • 5.5.4 Automotive-grade SRAM Products
  • 5.6 Giantec Semiconductor
    • 5.6.1 Semiconductor Business
    • 5.6.2 Automotive-grade EEPROM Product Series
    • 5.6.3 Automotive-grade A1 EEPROM GT24C512B
    • 5.6.4 Automotive-grade EEPROM GT25A1024A
    • 5.6.5 Automotive-grade SPI NOR Flash Memory Chip
    • 5.6.6 SPD Product Series
  • 5.7 Puya Semiconductor
    • 5.7.1 Business
    • 5.7.2 Automotive-grade NOR Flash Product Line
    • 5.7.3 Automotive-grade EEPROM Product Line
  • 5.8 Fudan Microelectronics
    • 5.8.1 Business
    • 5.8.2 Automotive-grade Storage Product Planning
    • 5.8.3 Automotive EEPROM Memory Chip
  • 5.9 Longsys
    • 5.9.1 Business
    • 5.9.2 Self-developed Low and Medium-capacity Memory Chips
    • 5.9.3 Automotive Memory Chip Product Line
    • 5.9.4 FORESEE Automotive-grade UFS (1)
    • 5.9.5 FORESEE Automotive-grade UFS (2)
    • 5.9.6 FORESEE Automotive-grade eMMC Certified by AEC-Q100
    • 5.9.7 Automotive Electronic Storage - Overall Solution for Personal Cloud Services
    • 5.9.8 Automotive Electronic Storage - Automotive Data Backup Disk
    • 5.9.9 Open Innovation Lab Boosts Automotive Storage Business
    • 5.9.10 Self-developed 10nm ASIC Memory Chip Test System
    • 5.9.11 Total Quality Management Creates High-quality Automotive-grade Storage
  • 5.10 Macronix
    • 5.10.1 Business
    • 5.10.2 Automotive-grade NOR Flash Product Line
    • 5.10.3 Automotive-grade NAND Product Line
    • 5.10.4 ArmorFlash Memory Application
  • 5.11 BIWIN Storage Technology
    • 5.11.1 Storage Business
    • 5.11.2 Automotive Storage Solutions (1)
    • 5.11.3 Automotive Storage Solutions (2)
    • 5.11.4 Automotive Storage Product Line